Page History
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- <Replace for module use "SoC/FPGA" for Carrier "Modules">
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- RAM/Storage
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- On Board
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- Interface
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- Power
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- Dimension
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- Notes
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Block Diagram
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Intel® MAX 10 Commercial [10M08SAU169C8G]
Package: UBGA-169
Speed Grade: C8 (Slowest)
Temperature: 0°C to 85°C
Package compatible device 10M02...10M16 as assembly variant on request possible
SDRAM Memory up to 64Mb, 166MHz
Dual High Speed USB to Multipurpose UART/FIFO IC
64 Mb Quad SPI Flash
4Kb EEPROM Memory
8x User LED
Micro USB2 Receptacle 90
18 Bit 2MSPS Analog to Digital Converter
2x SMA Female Connector
I/O interface: 23x GPIO
Power Supply:
5V
Dimension: 86.5mm x 25mm
Others:
Instrumentation Amplifier
Differential Amplifier
Operational Amplifier
Block Diagram
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Main Components
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SMA Connector, J5...6
Amplifier, U12
Series Voltage Reference, U8
Analog to Digital Converter, U6
Voltage Regulator, U10 - U13 - U1
6Switching Voltage Regulator, U11 - U4
SDRAM Memory, U2
- Intel® MAX 10, U1
SPI Flash Memory, U5
12.00 MHz MEMS oscillator, U7
FTDI USB2 to JTAG/UART adapter, U3
User LEDs, D2...9
FTDI configuration EEPROM, U9
Configuration/Status LED (Red) , D10
Power-on LED (Green), D1
Push button, S1...2
Micro USB Connector, J9
1x14 pin header, J2 (Not assembled)
1x6 pin header, J4 (Not assembled)
1x4 Header, J3 (Not assembled)
1x14 pin header, J1 (Not assembled)
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Initial Delivery State
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Notes : Only components like EEPROM, QSPI flash can be initialized by default at manufacture. If there is no components which might have initial data ( possible on carrier) you must keep the table empty |
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Power and Power-On Sequence
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