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The Trenz Electronic TEI0015 is a commercial-grade, low cost and small size module integrated with Intel® MAX 10.  Intel MAX 10 devices are the ideal solution for system management, I/O expansion, communication control planes, industrial, automotive, and consumer applications.

Refer to https://wiki.trenz-electronic.de/display/PD/TEI0023+Resources for the current online version of this manual and other available documentation.

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Note:
 'description: Important components and connector or other Features of the module
→ please sort and indicate assembly options

Key Features'  must be split into 6 main groups for modules and mainboards:

  • SoC/FPGA
    • Package: SFVC784
    • Device: ZU2...ZU5*
    • Engine: CG, EG, EV*
    • Speed: -1LI, -2LE,*, **
    • Temperature: I, E,*, **
  • RAM/Storage
    • Low Power DDR4 on PS
      • Data width: 32bit
      • Size: def. 2GB*
      • Speed:***
    • eMMC
      • Data width: 8Bit
      • size: def. 8GB *
    • QSPI boot Flash in dual parallel mode (size depends on assembly version)
      • Data width: 8bit
      • size: def. 128MB *
    • HyperRAM/Flash (optional, default not assembled)
      • size:*
    • MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48)
  • On Board
    • Lattice LCMXO2
    • PLL SI5338
    • Gigabit Ethernet transceiver PHY (Marvell Alaska 88E1512)
    • Hi-speed USB2 ULPI transceiver with full OTG support (Microchip USB3320C)
  • Interface
    • 132 x HP PL I/Os (3 banks)
    • ETH
    • USB
    • 4 GTR (for USB3, Sata, PCIe, DP)
    • MIO for UART
    • MIO for SD
    • MIO for PJTAG
    • JTAG
    • Ctrl
  • Power
    • 3.3V-5V Main Input
    • 3.3V Controller Input
    • Variable Bank IO Power Input
  • Dimension
    • 4 cm x 5 cm
  • Notes
    • * depends on assembly version
    • ** also non low power assembly options possible
    • *** depends on used U+ Zynq and DDR4 combination


Key Features'  must be split into 6 main groups for carrier:

  • Modules
    • TE0808, TE807, TE0803,...
  • RAM/Storage
    • E.g. SDRAM, SPI
  • On Board
    • E.g. CPLD, PLL
  • Interface
    • E.g. ETH, USB, B2B, Display port
  • Power
    • E.g. Input supply voltage
  • Dimension
  • <Replace for module use "SoC/FPGA" for Carrier "Modules">
    • ...
  • RAM/Storage
    • ...
  • On Board
    • ...
  • Interface
    • ...
  • Power
    • ...
  • Dimension
    • ...
  • Notes
    • ...


  • Intel® MAX 10 Commercial [10M08SAU169C8G]

    • Package: UBGA-169

    • Speed Grade: C8 (Slowest)

    • Temperature: 0°C to 85°C

    • Package compatible device 10M02...10M16 as assembly variant on request possible

  • SDRAM Memory up to 64Mb, 166MHz

  • Dual High Speed USB to Multipurpose UART/FIFO IC

  • 64 Mb Quad SPI Flash

  • 4Kb EEPROM Memory

  • 8x User LED 

  • Micro USB2 Receptacle 90

  • 18 Bit 2MSPS Analog to Digital Converter

  • 2x SMA Female Connector

  • I/O interface: 23x GPIO

  • Power Supply:

    • 5V

  • Dimension: 86.5mm x 25mm

  • Others:

    • Instrumentation Amplifier

    • Differential Amplifier

    • Operational Amplifier

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