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Scroll Title
anchorTable_SIP_GIOs
titleGeneral PL I/O to B2B connectoGeneral I/Os to Pin Headers and connectors informationrs information

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FPGA BankConnector DesignatorI/O Signal CountVoltage LevelNotes
Bank 1AJ173.3VAIN0...6
Bank 1BJ453.3VJTAG interface
Bank 2J143.3VDIO2...5
Bank 5J293.3VDIO6...14
J123.3VDIO0...1
Bank 8J213.3VRESET


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hiddentrue
idComments

you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

Example:

MIO PinConnected toB2BNotes
MIO12...14

SPI_CS , SPI_DQ0... SPI_DQ3

SPI_SCK

J2QSPI



Scroll Title
anchorTable_SIPOBP_MIOsIOs
titleMIOs pinsFPGA I/O Banks

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FPGA BankI/O Signal Count
MIO Pin
Connected to
B2BNotes

Test Points

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hiddentrue
idComments

you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

Example:

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anchorTable_SIP_TPs
titleTest Points Information

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On-board Peripherals

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hiddentrue
idComments

Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs
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hiddentrue
idComments

Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection

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anchorTable_OBP
titleOn board peripherals

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Quad SPI Flash Memory

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idComments

Notes :

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Notes
Bank 1A71x14 Pin header, J1AIN0...6
1Jumper, J3AIN7
Bank 1B51x6 Pin header, J4JTAG_EN, TDI, TDO, TMS, TCK
Bank 2


112MHz Oscillator, U7CLK12M
41x14 Pin header, J1D2...5
4A2D, U6ADC_SDI, ADC_SDO, ADC_SCK, ADC_CNV
3Amplifier, U12AMP_A0, AMP_A1, AMP_A2
1A2D, U6ADC_PWR_EN1
1100MHz Oscillator, U19CLK_EN
Bank 322SDRAM, U2RAM_ADDR_CMD
2A2D, U6ADC_PWR_EN1, PDB_AMP
Bank 59

1x14 Pin header, J2

DIO6...14
21x14 Pin header, J1DIO0...1
1D12_RDIO12
Bank 616SDRAM, U2DQ0...15
2SDRAM, U2DQM0...1
1D11_RDIO11
1A2D, U6PDB_REF
Bank 8



8User Red LEDs, D2...9LED1...8
6SPI Flash, U5F_CS, F_CKL, F_DI, F_DO, nSTATUS, DEVCLRn
1Red LED, D10CONF_DONE
6FTDI JTAG/UART Adapter, U3BDBUS0...5
1Push Button, S2USER_BTN


Micro-USB2 Connector

The Micro-USB2 connector J9 provides an interface to access the UART and JTAG functions via FTDI FT2232 chip. The use of this feature requires that USB driver is installed on your host PC.

Scroll Title
anchorTable_OBP_SPIUSB
titleQuad SPI interface MIOs and Micro USB-2 connector pins

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MIO PinSchematicU?? PinNotes

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PinsConnected toNote
VBUSUSB_VBUS
D+

FTDI FT2232H U3, DP pin


D-

FTDI FT2232H U3, DM pin



JTAG Interface

JTAG access to the TEI0023 FPGA through pin header connector J4.

Scroll Title
anchorTable_OBPSIP_RTCJTG
titleI2C interface MIOs and JTAG pins connection

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JTAG Signal

MIO

Pin Header Connector

Schematic
Note
U? PinNotes
Scroll Title
anchorTable_OBP_I2C_RTC
titleI2C Address for RTC
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MIO PinI2C AddressDesignatorNotes

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TMSJ4-6
TDIJ4-5
TDOJ4-4
TCK

J4-3


JTAG_ENJ4-2Pulled-up to 3.3V


Test Points

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hiddentrue
idComments

you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

Example:

Test PointSignalB2BNotes
10PWR_PL_OKJ2-120



U?? Pin
Scroll Title
anchorTable_OBPSIP_EEPTPs
titleI2C EEPROM interface MIOs and pinsTest Points Information

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MIO Pin
Test Point
Schematic
SignalConnected toNotes
Scroll Title
anchorTable_OBP_I2C_EEPROM
titleI2C address for EEPROM
Scroll Table LayoutorientationportraitsortDirectionASCrepeatTableHeadersdefaultstylewidthssortByColumn1sortEnabledfalsecellHighlightingtrueMIO PinI2C AddressDesignatorNotes

LEDs

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anchorTable_OBP_LED
titleOn-board LEDs
TP1+1.8 VV_Lin, U13   ↔   A2D, U12
TP2VREF_OUTV_Lin, U8   ↔   A2D, U6
TP6+14V_AV_Lin, U10   ↔   Amplifier, U12
TP7-14V_AV_Lin, U10   ↔   Amplifier, U12
TP8+14.5VV_Switch, U11 / D11   ↔   L6 / V_Lin u10
TP9-14.5VV_Switch, U11 / L12   ↔   L7 / V_Lin u10
TP10+5V5_Au16   ↔   V_Lin, U8 / A2D, U12


On-board Peripherals

Page properties
hiddentrue
idComments

Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs


Page properties
hiddentrue
idComments

Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection


Scroll Title
anchorTable_OBP
titleOn board peripherals

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Chip/InterfaceDesignatorNotes
TRM TEI0023U2
FTDI FT2232HU3JTAG/UART Adapter
SPI FlashU5
TRM TEI0023U9
OscillatorU712 MHz clock source
TRM TEI0023U12Analog to Digital Converter
Push ButtonsS1...2
8x User LEDsD2...9Red LEDs



SDRAM

TEI0015 is equipped with a Winbond 64 MBit (8 MByte) SDRAM chip in standard configuration, variants with 256 Mbit (32 MByte) memory density are also available. The SDRAM chip is connected to the FPGA bank 3 and 6 via 16-bit memory interface with 166MHz clock frequency and CL3 CAS latency.

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idComments

Notes :

Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.


Scroll Title
anchorTable_OBP_SDRAM
titleSDRAM interface IOs and pins

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SDRAM I/O Signals

Signal Schematic Name

Connected toNotes
Address inputs

A0 ... A13

bank 3-
Bank address inputs

BA0 / BA1

bank 3

-
Data input/output

DQ0 ... DQ15

bank 6

-
Data mask

DQM0 ... DQM1

bank 6

-
ClockCLKbank 3-
Control Signals

CS

bank 3

Chip select

CKE

bank 3

Clock enable

RAS

bank 3

Row Address Strobe

CAS

bank 3

Column Address Strobe

WEbank 3Write Enable


FTDI FT2232H

The FTDI chip U3 converts signals from USB2 to a variety of standard serial and parallel interfaces. Refer to the FTDI data sheet to get information about the capacity of the FT2232H chip. FTDI FT2232H chip is used in MPPSE mode for JTAG, 6 I/O's of Channel B are routed to FPGA bank 8 of the FPGA SoC and are usable for example as GPIOs, UART or other standard interfaces.

The configuration of FTDI FT2232H chip is pre-programmed on the EEPROM U9.

Scroll Title
anchorTable_OBP_FTDI
titleFTDI chip interfaces and pins

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FTDI Chip U3 PinSignal Schematic NameConnected toNotes
ADBUS0TCKFPGA bank 1B, pin G2JTAG interface
ADBUS1TDIFPGA bank 1B, pin F5
ADBUS2TDOFPGA bank 1B, pin F6
ADBUS3TMS

FPGA bank 1B, pin G1

BDBUS0BDBUS0FPGA bank 8, pin A4User configurable
BDBUS1BDBUS1FPGA bank 8, pin B4User configurable
BDBUS2BDBUS2FPGA bank 8, pin B5User configurable
BDBUS3BDBUS3FPGA bank 8, pin A6User configurable
BDBUS4BDBUS4FPGA bank 8, pin B6User configurable
BDBUS5BDBUS5FPGA bank 8, pin A7User configurable


SPI Flash

On-board serial configuration memory (U5) is provided by Winbond with 64 MBit (8 MByte) storage capacity. This non volatile memory is used to store initial FPGA configuration via JTAG interface. The memory is connected to FPGA bank 8 via SPI interface.

Scroll Title
anchorTable_OBP_QSPI
titleQuad SPI Flash memory interface

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Signal Schematic NameConnected toNotes
F_CSFPGA bank 8, pin B3Chip select
F_CLKFPGA bank 8, pin A3Clock
F_DIFPGA bank 8, pin A2Data in / out
nSTATUS

FPGA bank 8, pin C4

Data in / out, configuration dual-purpose pin of FPGA
DEVCLRNFPGA bank 8, pin B9Data in / out, configuration dual-purpose pin of FPGA
F_DOFPGA bank 8, pin B2Data in / out


EEPROM

The configuration of FTDI FT2232H chip is pre-programmed on the EEPROM U9.

Scroll Title
anchorTable_OBP_EEP
titleI2C EEPROM interface MIOs and pins

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SchematicConnected toNotes

EECS

FTDI U3, Pin EECS
EECLKFTDI U3, Pin EECLK
EEDATAFTDI U3, Pin EEDATA


ADC

The TEI0023 board is equipped with the Analog Devices ADAQ4003BBCZ 18-bit 2MSPS ADC.

Scroll Title
anchorTable_OBP_A2D
titleA2D converter interface and pins

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PinsConnected toNotes

IN+

Instrumentation Amplifier U14, VOUT-
IN-Instrumentation Amplifier U14, VOUT+
SDIFPGA, Bank 2, pin M2, ADC_SDI
SDOFPGA, Bank 2, pin M1,  ADC_SDO
SCKFPGA, Bank 2, pin N3,  ADC_SCK
CNVFPGA, Bank 2, pin N2, ADC_CNV


LEDs

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DDR3 SDRAM

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Notes :

Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3)

The TE???? SoM has ??? GByte volatile DDR3 SDRAM IC for storing user application code and data.

  • Part number: 
  • Supply voltage:
  • Speed: 
  • NOR Flash
  • Temperature: 

Ethernet

Scroll Title
anchorTable_OBP_ETHLED
titleEthernet PHY to Zynq SoC connectionsOn-board LEDs

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U?? Pin Signal NameConnected toSignal DescriptionNote

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DesignatorColorConnected toActive LevelNote
D2...9RedLED1...8Active HighUser LEDs
D10RedCONF_DONEActive LowConfiguration DONE LED
D1Green3.3V Active HighAfter power on it will be on.


Push Bottuns

Reciever Output
Scroll Title
anchorTable_OBP_CANLED
titleCAN Tranciever interface MIOsOn-board Push Buttons

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DesignatorConnected toFunctionalityNote
S1RESETGeneral reset
S2USER_BTNUser push buttonConnected to FPGA Bank 8.
BankSchematicU?? PinNotes
D-TxDriver InputR-Rx


Clock Sources

KHz

Scroll Title
anchorTable_OBP_CLK
titleOsillators

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DesignatorDescriptionFrequencyNote
MHzMHz
1
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Clock SourceSchematic NameFrequencyNote
Microchip MEMS Oscillator, U7CLK12M12.00 MHz

Connected to FTDI FT2232 U3, pin 3.

Connected to FPGA Bank 2, pin H6.


DDR3 SDRAM

Page properties
hiddentrue
idComments

Notes :

Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3)

The TE???? SoM has ??? GByte volatile DDR3 SDRAM IC for storing user application code and data.

  • Part number: 
  • Supply voltage:
  • Speed: 
  • NOR Flash
  • Temperature: 


Programmable Clock Generator

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