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The Trenz Electronic TE0823 (3PIU1FA /3PIU1FL)  is an industrial-grade MPSoC module integrating a low power Xilinx Zynq UltraScale+ ZU3CGMPSoC, 1 GByte LPDDR4 SDRAM, 128 MByte , 8 GB eMMC chip, 2x 64 MB Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections. The module is equipped with a Lattice Mach XO2 CPLD for system controlling. 3x Robust high-speed connectors provide a large number of inputs and outputs.

The highly integrated modules are All this on a tiny footprint, smaller than a credit card , at the most competitive price. Modules in and are offered in several variants at an affordable price-performance ratio. Modules with a 4 x 5 cm form factor are fully completely mechanically and largely electrically compatible among with each other.

All parts are at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Refer to http://trenz.org/te0823-info for the current online version of this manual and other available documentation.

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Note:
 'description: Important components and connector or other Features of the module
→ please sort and indicate assembly options

Key Features'  must be split into 6 main groups for modules and mainboards:

  • SoC/FPGA
    • Package: SFVC784
    • Device: ZU2...ZU5*
    • Engine: CG, EG, EV*
    • Speed: -1LI, -2LE,*, **
    • Temperature: I, E,*, **
  • RAM/Storage
    • Low Power DDR4 on PS
      • Data width: 32bit
      • Size: def. 2GB*
      • Speed:***
    • eMMC
      • Data width: 8Bit
      • size: def. 8GB *
    • QSPI boot Flash in dual parallel mode (size depends on assembly version)
      • Data width: 8bit
      • size: def. 128MB *
    • HyperRAM/Flash (optional, default not assembled)
      • size:*
    • MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48)
  • On Board
    • Lattice LCMXO2
    • PLL SI5338
    • Gigabit Ethernet transceiver PHY (Marvell Alaska 88E1512)
    • Hi-speed USB2 ULPI transceiver with full OTG support (Microchip USB3320C)
  • Interface
    • 132 x HP PL I/Os (3 banks)
    • ETH
    • USB
    • 4 GTR (for USB3, Sata, PCIe, DP)
    • MIO for UART
    • MIO for SD
    • MIO for PJTAG
    • JTAG
    • Ctrl
  • Power
    • 3.3V-5V Main Input
    • 3.3V Controller Input
    • Variable Bank IO Power Input
  • Dimension
    • 4 cm x 5 cm
  • Notes
    • * depends on assembly version
    • ** also non low power assembly options possible
    • *** depends on used U+ Zynq and DDR4 combination


Key Features'  must be split into 6 main groups for carrier:

  • Modules
    • TE0808, TE807, TE0803,...
  • RAM/Storage
    • E.g. SDRAM, SPI
  • On Board
    • E.g. CPLD, PLL
  • Interface
    • E.g. ETH, USB, B2B, Display port
  • Power
    • E.g. Input supply voltage
  • Dimension


  • SoC/FPGA
    • Package: SFVC784, SFRC784
    • Device: ZU2 ...ZU5, *
    • Engine:  EG, CG, EV, *
    • Speed: -1, -1L, -2, -2L, 3, *, **
    • Temperature: I, E, *, **
  • RAM/Storage
    • 2x  DDR4 SDRAM,
      • Data Width: 32 Bit
      • Size: 16 Gb, *
      • Speed: 3733 Mbps, ***
    • 2x QSPI boot Flash in dual parallel mode
      • Data Width: 8 Bit
      • Size: 512 Mb Gb, *
    • 1x e.MMC Memory
      • Data Width: 8 Bit
      • Size: 32 Gb, *
    • MAC address serial EEPROM
  • On Board
    • Lattice MachXO2 CPLD
    • Programmable Clock Generator
    • Hi-speed USB2 ULPI Transceiver
    • 4x LEDS
  • Interface
    • 1x GB/s serial GMII interface
    • 1x Hi-speed USB2 ULPI transceiver with full OTG support
    • 154 x High Performance (HP) und 96 x High Density (HD) I/Os
    • 78 x PS MIOs
    • 4 x serial PS GTR transceivers
      • PCI Express interface version 2.1 compliant
      • SATA 3.1 specification compliant interface
      • DisplayPort source-only interface with video resolution up to 4k x 2k

      • USB 3.0 specification compliant interface implementing a 5 Gbit/s line rate
  • Power
    • All power regulators on board
  • Dimension
    • 40 x 50 mm
  • Note
    • * depends on assembly version
    • ** also non low power assembly options possible
    • *** depends on used U+ Zynq and DDR4 combination
    • Rugged for shock and high vibration

BlockDiagram

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Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .


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titleTE0823 block diagram


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Main Components

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MODE Signal State

Boot Mode
LowHigh

QSPI*

HighLowSD Card*

*changable also with other CPLD Firmware:TE0823 CPLD



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Signal

B2BI/ONote

ENRESIN

JM1JM2-2818InputCPLD Enable Pin


Signals, Interfaces and Pins

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EEPROM, U25
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Test PointSignalConnected toNotes
1
I2C
PS_
SCL
LP0V85
EEPROM
Regulator,
U25
U12
2
I2C_SDA
3
SRST_BFPGA Bank 503, U1HPSCONFIG
4
3PS_
CLK
AVCCRegulator, U9
4+1.1V_LPDDR4Regulator, U15
FPGA Bank 503PSCONFIG

5
PROG
PS_
BFPGA Bank 503
AVTTRegulator, U13
PSCONFIG

6
INIT_BFPGA Bank 503
--
PSCONFIG

7
DONERed LED, D1
PS_FP0V85Regulator, U26
8PS_LP0V85Voltage Regulator, U12
9
DDR
POR_
2V5
BVoltage Regulator,
U4
U19
10PS_
AVCC
PLLVoltage Regulator,
U9
U23
11
DDR
PL_
1V2
VCCINTVoltage Regulator,
U15
U5
12...15--
12PS_AVTTVoltage Regulator, U313PS_FP0V85Voltage Regulator, U2614POR_BVoltage Translator, U1915PS_PLLVoltage Regulator, U23

16PL_
VCCINT
VCUVoltage Regulator,
U5
U24


On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs

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The TE0821 is equipped with dual Flash Memory, U7, U17.  Two quad SPI compatible serial bus flash MT25QU512ABB8E12-0SIT flash memory chips are provided for FPGA configuration file and data storage. After configuration completes the remaining free memory can be used for application data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths to be used. The maximum data transfer rate depends on the bus width and clock frequency.

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titleQuad SPI interface MIOs and pins

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MIO
PinSchematicU?? PinNotes
QSPI, U7QSPI, U17Notes
nCSMIO5MIO7
CLKMIO0MIO12
DI/IO0MIO4MIO8
DO/IO1MIO1MIO9
nHOLD/IO3MIO3MIO11
WP/IO2MIO2MIO10


EEPROM

There is a 2Kb EEPROM provided on the module TE0821.

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titleI2C EEPROM interface MIOs and pins

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MIO PinSchematicU?? PinNotes
MIO39I2C_SDASDA
MIO38I2C_SCLSCL



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titleI2C address for EEPROM

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MIO PinI2C AddressDesignatorNotes
MIO38-MIO390x50U25


LEDs

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DesignatorColorConnected toActive LevelNote
D1RedDONELow
D2GreenUSR_LEDHigh
D3RedERR_OUTHigh
D4GreenERR_STATUSHigh


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Notes :

Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3)

The TE0821 TE0823 SoM has dual 8 Gb volatile DDR4 a 1 GB volatile LPDDR4 SDRAM IC for storing user application code and data.

  • Part number: K4A8G165WB-BIRC IS43LQ32256A
  • Supply voltage: 1.7V ~ 1.2V95V
  • Speed: 2400 3200 Mbps
  • Temperature: -40 ~ 95 °C

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titlePower Distribution


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Power-On Sequence

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titlePower Sequency


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Power Rails

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Power Rail Name

B2B Connector

JM1 Pin

B2B Connector

JM2 Pin

B2B Connector

JM3 Pin

DirectionNotes
VIN

1, 3, 5

2, 4, 6, 8InputSupply voltage from the carrier board
3.3V-10, 12OutputInternal 3.3V voltage level
3.3VIN13, 15-InputSupply voltage from the carrier board
1.8V39-OutputInternal 1.8V voltage level
JTAG VREF-91OutputJTAG reference voltage.
Attention: Net name on schematic is "3.3VIN"

VCCO_64-7, 9InputHigh performance I/O bank voltage
VCCO_65-5InputHigh performance I/O bank voltage
VCCO_669, 11-InputHigh performance I/O bank voltage


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  • This section is optional and only for modules.
  • use "include page" macro and link to the general B2B connector page of the module series,

    For example: 6 x 6 SoM LSHM B2B Connectors

    Include Page
    PD:6 x 6 SoM LSHM B2B ConnectorsPD:
    6 x 6 SoM LSHM B2B Connectors

Include Page
PD:4 x 5 SoM LSHM B2B ConnectorsPD:
4 x 5 SoM LSHM B2B Connectors

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Scroll Title
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titleRecommended operating conditions.

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ParameterMinMaxUnitsReference Document
VIN supply voltage3.36VSee TPS82085S datasheet
3.3VIN supply voltage3.33.465VSee LCMXO2-256HC, Xilinx DS925 datasheet
PS I/O supply voltage, VCCO_PSIO1.7103.465VXilinx document DS925
PS I/O input voltage–0.20VCCO_PSIO + 0.20VXilinx document DS925
HP I/O banks supply voltage, VCCO0.9501.9VXilinx document DS925
HP I/O banks input voltage-0.20VCCO + 0.20VXilinx document DS925
Voltage on SC CPLD pins-0.33.6VLattice Semiconductor MachXO2 datasheet
Operating Temperature Range085°CXilinx document DS925, extended grade Zynq temperarure range


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titlePhysical Dimension


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titleBoard hardware revision number.


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titleDocument change history.

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DateRevisionContributorDescription

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  • Bugfix document style

2021-08-23v.42Pedram Babakhani
  • Bugfix Boot mode
2020-11-02v.40Pedram Babakhani
  • Initial Release

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