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Overview

The Trenz Electronic TE0xxx-xx ... is TE0823 (3PIU1FA /3PIU1FL)  is an industrial-grade ... module ... based on Xilinx ...

Refer to http://trenz.org/tec0850-info for the current online version of this manual and other available documentation.

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short description of the PCB

Short Link of the wiki resources reference:

MPSoC module integrating a low power Xilinx Zynq UltraScale+ MPSoC, 1 GByte LPDDR4 SDRAM, 8 GB eMMC chip, 2x 64 MB Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.  The module is equipped with a Lattice Mach XO2 CPLD for system controlling. 3x Robust high-speed connectors provide a large number of inputs and outputs.

The highly integrated modules are smaller than a credit card and are offered in several variants at an affordable price-performance ratio. Modules with a 4 x 5 cm form factor are completely mechanically and largely electrically compatible with each other.

All parts are at least industrial temperature range. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

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Refer to 

http://trenz.org/

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te0823-info for the current online version of this manual and other available documentation.

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Note:
 'description: Important components and connector or other Features of the module
→ please sort and indicate assembly options

Key Features'  must be split into 6 main groups for modules and mainboards:

  • SoC/FPGA
    • Package: SFVC784
    • Device: ZU2...ZU5*
    • Engine: CG, EG, EV*
    • Speed: -1LI, -2LE,*, **
    • Temperature: I, E,*, **
  • RAM/Storage
    • Low Power DDR4 on PS
      • Data width: 32bit
      • Size: def. 2GB*
      • Speed:***
    • eMMC
      • Data width: 8Bit
      • size: def. 8GB *
    • QSPI boot Flash in dual parallel mode (size depends on assembly version)
      • Data width: 8bit
      • size: def. 128MB *
    • HyperRAM/Flash (optional, default not assembled)
      • size:*
    • MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48)
  • On Board
    • Lattice LCMXO2
    • PLL SI5338
    • Gigabit Ethernet transceiver PHY (Marvell Alaska 88E1512)
    • Hi-speed USB2 ULPI transceiver with full OTG support (Microchip USB3320C)
  • Interface
    • 132 x HP PL I/Os (3 banks)
    • ETH
    • USB
    • 4 GTR (for USB3, Sata, PCIe, DP)
    • MIO for UART
    • MIO for SD
    • MIO for PJTAG
    • JTAG
    • Ctrl
  • Power
    • 3.3V-5V Main Input
    • 3.3V Controller Input
    • Variable Bank IO Power Input
  • Dimension
    • 4 cm x 5 cm
  • Notes
    • * depends on assembly version
    • ** also non low power assembly options possible
    • *** depends on used U+ Zynq and DDR4 combination


Key Features'  must be split into 6 main groups for carrier:

  • Modules
    • TE0808, TE807, TE0803,...
  • RAM/Storage
    • E.g. SDRAM, SPI
  • On Board
    • E.g. CPLD, PLL
  • Interface
    • E.g. ETH, USB, B2B, Display port
  • Power
    • E.g. Input supply voltage
  • Dimension


  • <Replace for module use "SoC/FPGA" for Carrier "Modules">
    • Package: SFVC784, SFRC784
    • Device: ZU2
    • ...
  • RAM/Storage
    • ...
  • On Board
    • ...
  • Interface
    • ...
  • Power
    • ...
  • Dimension
    • ...
  • Notes
    • ...

Block Diagram

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Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .

    • ZU5, *
    • Engine:  EG, CG, EV, *
    • Speed: -1, -1L, -2, -2L, 3, *, **
    • Temperature: I, E, *, **
  • RAM/Storage
    • 2x  DDR4 SDRAM,
      • Data Width: 32 Bit
      • Size: 16 Gb, *
      • Speed: 3733 Mbps, ***
    • 2x QSPI boot Flash in dual parallel mode
      • Data Width: 8 Bit
      • Size: 512 Mb Gb, *
    • 1x e.MMC Memory
      • Data Width: 8 Bit
      • Size: 32 Gb, *
    • MAC address serial EEPROM
  • On Board
    • Lattice MachXO2 CPLD
    • Programmable Clock Generator
    • Hi-speed USB2 ULPI Transceiver
    • 4x LEDS
  • Interface
    • 1x GB/s serial GMII interface
    • 1x Hi-speed USB2 ULPI transceiver with full OTG support
    • 154 x High Performance (HP) und 96 x High Density (HD) I/Os
    • 78 x PS MIOs
    • 4 x serial PS GTR transceivers
      • PCI Express interface version 2.1 compliant
      • SATA 3.1 specification compliant interface
      • DisplayPort source-only interface with video resolution up to 4k x 2k

      • USB 3.0 specification compliant interface implementing a 5 Gbit/s line rate
  • Power
    • All power regulators on board
  • Dimension
    • 40 x 50 mm
  • Note
    • * depends on assembly version
    • ** also non low power assembly options possible
    • *** depends on used U+ Zynq and DDR4 combination
    • Rugged for shock and high vibration

BlockDiagram

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titleTE0823 block diagram

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Main Components

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Notes :

  • Picture of the PCB (top and bottom side) with labels of important components
  • Add List below
Note

For more information regarding how to add board photoesdraw a diagram, Please refer to "Diagram Drawing Guidline" .


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Scroll Title
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titleTE0823 main componentsblock diagram


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  1. ...
  2. ...
  3. ...

Initial Delivery State

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Notes :

Only components like EEPROM, QSPI flash can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty

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anchorTable_OV_IDS
titleInitial delivery state of programmable devices on the module
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Main Components

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Notes :

  • Picture of the PCB (top and bottom side) with labels of important components
  • Add List below


Note

For more information regarding how to add board photoes, Please refer to "Diagram Drawing Guidline"

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Storage device name

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Content

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Notes

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Quad SPI Flash

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Configuration Signals

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Overview of Boot Mode, Reset, Enables

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titleBoot process.TE0823 main components


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MODE Signal State

Boot Mode
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titleReset process.
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Signal

B2BI/ONote

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  1. Xilinx Zynq UltraScale+ XCZU3EG, U1
  2. Red LED (ERR_OUT), D3
  3. Green User LED, D2
  4. Green LED (ERR_STATUS), D4
  5. Red LED (DONE), D1
  6. 10/100/1000 Mbps energy efficient ethernet transceiver, U8
  7. 8Gb DDR4, U2-U3
  8. 512 Mbit QSPI flash memory, U7-U17
  9. B2B connector Samtec Razor Beam, JM1
  10. B2B connector Samtec Razor Beam, JM3
  11. Programmable clock generator, U10
  12. USB2.0 Transceiver,  U18
  13. B2B connector Samtec Razor Beam, JM2
  14. 8 GByte eMMC memory, U6
  15. Lattice Semiconductor MachXO2 System Controller CPLD, U21

Initial Delivery State

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Notes :

  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

Board to Board (B2B) I/Os

...

Only components like EEPROM, QSPI flash can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty


Scroll Title
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titleGeneral PL I/O to B2B connectors informationInitial delivery state of programmable devices on the module

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FPGA BankB2B ConnectorI/O Signal CountVoltage LevelNotes

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Storage device name

Content

Notes

QSPI Flash Memory

Not programmed


eMMC Memory

Not programmed


Programmable Clock GeneratorNot programmed
CPLD (LCMXO2-256HC)SC0820-02 QSPI Firmware


Configuration Signals

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  • Overview of Boot Mode, Reset, Enables.


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titleBoot process.

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JTAG access to the TExxxx SoM through B2B connector JMX.

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titleJTAG pins connection

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JTAG

MODE Signal State

B2B Connector
Boot Mode
TMS
High
TDI

QSPI*

TDO
Low
TCKJTAG_EN

MIO Pins

SD Card*

*changable also with other CPLD Firmware:TE0823 CPLD



you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

Example:

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titleReset process.

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MIO PinConnected toB2BNotes
MIO12...14

SPI_CS , SPI_DQ0... SPI_DQ3

SPI_SCK

J2QSPI
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titleMIOs pins

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MIO PinConnected toB2BNotes

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Signal

B2BI/ONote

RESIN

JM2-18Input


Signals, Interfaces and Pins

you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

Example:

J2-120
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Test PointSignalB2BNotes
10PWR_PL_OK

Notes :

  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

Board to Board (B2B) I/Os

FPGA bank number and number of I/O signals connected to the B2B connector:

Connected to
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titleTest Points InformationGeneral PL I/O to B2B connectors information

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FPGA BankB2B ConnectorI/O Signal CountVoltage Level
Test PointSignal
Notes

On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs
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Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection

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anchorTable_OBP
titleOn board peripherals

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Quad SPI Flash Memory

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24HDJM224x I/O, 12x  LVDS PairsVariable Max voltage 3.3V
25HDJM124x I/O, 12x  LVDS PairsVariable Max voltage 3.3V
26HDJM124x I/O, 12x  LVDS PairsVariable Max voltage 3.3V
44HDJM224x I/O, 12x  LVDS PairsVariableMax voltage 3.3V
65

HP

JM2

18x I/O, 9x LVDS Pairs

VariableMax voltage 1.8V

65

HP

JM3

16x I/O, 8x LVDS Pairs

Variable

Max voltage 1.8V
505GTRJM316x I/O, 8x LVDS Pairs-4x lanes
505GTR CLKJM31x Diff Clock-

501

MIO

JM1

15 I/O

3.3V




JTAG Interface

JTAG access to the Xilinx Zynq UltraScale+ is applicable by using Lattice MachXO CPLD  through B2B connector JM2.

U?? Pin
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JTAG Signal

B2B Connector

MIO PinSchematic

Notes

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scrolltitle
TMS
JM2-
93
anchorTable_OBP_RTC
titleI2C interface MIOs and pins
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TDIJM2-95
TDOJM2-97
TCKJM2-99 
JTAGENJM1-89Pulled Low: Xilinx Zynq UltraScale+ MPSoC
Pulled High: Lattice MachXO CPLD


MGT Lanes

There are 4x MGT Lanes connected to FPGA Bank 505-GTR.

MIO PinSchematicU? PinNotes
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titleI2C Address for RTCMGT Lanes connection

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MIO Pin

Lane

I2C Address
Schematic
Designator
B2B
Notes
Note

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anchorTable_OBP_EEP
titleI2C EEPROM interface MIOs and pins
0
  • B505_RX0_P
  • B505_RX0_N
  • B505_TX0_P
  • B505_TX0_N
  • JM3-26
  • JM3-28
  • JM3-25
  • JM3-27

1
  • B505_RX1_P
  • B505_RX1_N
  • B505_TX1_P
  • B505_TX1_N
  • JM3-20
  • JM3-22
  • JM3-19
  • JM3-21

2
  • B505_RX2_P
  • B505_RX2_N
  • B505_TX2_P
  • B505_TX2_N
  • JM3-14
  • JM3-16
  • JM3-13
  • JM3-15

3
  • B505_RX2_P
  • B505_RX2_N
  • B505_TX2_P
  • B505_TX2_N
  • JM3-8
  • JM3-10
  • JM3-7
  • JM3-9


Gigabit Ethernet

On-board Gigabit Ethernet PHY is provided with Marvell Alaska 88E1512 chip. The Ethernet PHY RGMII interface is connected to the Zynq Ethernet0 PS GEM0. I/O voltage is fixed at 1.8V for HSTL signaling. SGMII (SFP copper or fiber) can be used directly with the Ethernet PHY, as the SGMII pins are available on the B2B connector JM3. The reference clock input of the PHY is supplied from an on-board 25MHz oscillator (U11), the 125MHz output clock is left unconnected.

Scroll Title
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titleGigaBit Ethernet connection

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anchorTable_OBP_I2C_EEPROM
titleI2C address for EEPROM

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LEDs

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anchorTable_OBP_LED
titleOn-board LEDs

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DDR3 SDRAM

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Notes :

Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3)

The TE???? SoM has ??? GByte volatile DDR3 SDRAM IC for storing user application code and data.

  • Part number: 
  • Supply voltage:
  • Speed: 
  • NOR Flash
  • Temperature: 

Ethernet

Signal Name
Scroll Title
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titleEthernet PHY to Zynq SoC connections

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PinSchematic
U?? Pin 
Connected to
Signal DescriptionNote