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Table of Contents

Table of Contents

Overview

The Trenz Electronic TE0823

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(3PIU1FA /3PIU1FL)  is an industrial-grade MPSoC module integrating a low power Xilinx Zynq UltraScale+

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MPSoC, 1 GByte LPDDR4 SDRAM

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, 8 GB eMMC chip, 2x 64 MB Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections

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 The module is equipped with a Lattice Mach XO2 CPLD for system controlling. 3x Robust high-speed connectors provide a large number of inputs and outputs.

The highly integrated modules are All this on a tiny footprint, smaller than a credit card , at the most competitive price. Modules in and are offered in several variants at an affordable price-performance ratio. Modules with a 4 x 5 cm form factor are fully completely mechanically and largely electrically compatible among with each other.

All parts are at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Refer to http://trenz.org/te0823-info for the current online version of this manual and other available documentation.

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Note:
 'description: Important components and connector or other Features of the module
→ please sort and indicate assembly options

Key Features'  must be split into 6 main groups for modules and mainboards:

  • SoC/FPGA
    • Package: SFVC784
    • Device: ZU2...ZU5*
    • Engine: CG, EG, EV*
    • Speed: -1LI, -2LE,*, **
    • Temperature: I, E,*, **
  • RAM/Storage
    • Low Power DDR4 on PS
      • Data width: 32bit
      • Size: def. 2GB*
      • Speed:***
    • eMMC
      • Data width: 8Bit
      • size: def. 8GB *
    • QSPI boot Flash in dual parallel mode (size depends on assembly version)
      • Data width: 8bit
      • size: def. 128MB *
    • HyperRAM/Flash (optional, default not assembled)
      • size:*
    • MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48)
  • On Board
    • Lattice LCMXO2
    • PLL SI5338
    • Gigabit Ethernet transceiver PHY (Marvell Alaska 88E1512)
    • Hi-speed USB2 ULPI transceiver with full OTG support (Microchip USB3320C)
  • Interface
    • 132 x HP PL I/Os (3 banks)
    • ETH
    • USB
    • 4 GTR (for USB3, Sata, PCIe, DP)
    • MIO for UART
    • MIO for SD
    • MIO for PJTAG
    • JTAG
    • Ctrl
  • Power
    • 3.3V-5V Main Input
    • 3.3V Controller Input
    • Variable Bank IO Power Input
  • Dimension
    • 4 cm x 5 cm
  • Notes
    • * depends on assembly version
    • ** also non low power assembly options possible
    • *** depends on used U+ Zynq and DDR4 combination


Key Features'  must be split into 6 main groups for carrier:

  • Modules
    • TE0808, TE807, TE0803,...
  • RAM/Storage
    • E.g. SDRAM, SPI
  • On Board
    • E.g. CPLD, PLL
  • Interface
    • E.g. ETH, USB, B2B, Display port
  • Power
    • E.g. Input supply voltage
  • Dimension


  • SoC/FPGAXilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
    • Application Processor: Dual-core ARM Cortex-A53 MPCore
    • Real-Time Processor: Dual-core ARM Cortex-R5 MPCore
    • Package: SFVC784, SFRC784
    • Device: ZU3ZU2 ...ZU5, *
    • Engine:  EG, CG, EV, *
    • Speed: -1LI (also non-low power assembly options possible)1, -1L, -2, -2L, 3, *, **
    • Temperature: I, E, *, **Temperature range: industrial
  • RAM/Storage
    • Low power DDR4 on PS with 32 bit data width
    • 2x  DDR4 SDRAM,
      • Data Width: 32 Bit
      • Size: 16 Gb, *
      • Speed: 3733 Mbps, ***
    • 2x 128 MByte QSPI boot Flash in dual parallel mode
      • Data Width: 8 Bit
      • Size: 512 Mb Gb, *
    • 1x 8 GByte e.MMC memory with 8 bit data widthMemory
      • Data Width: 8 Bit
      • Size: 32 Gb, *
    • MAC address serial EEPROM with EUI-48 node identity
  • On Board
    • Lattice LCMXO2
    • PLL SI5338
    • Gigabit Ethernet transceiver PHY
    • MachXO2 CPLD
    • Programmable Clock Generator
    • Hi-speed USB2 ULPI Transceiver
    • 4x LEDS
  • Interface
    • 1x GB/s serial GMII interface
    • 1x Hi-speed USB2 ULPI transceiver with full OTG support
    Interface
    • 132 x HP PL 154 x High Performance (HP) und 96 x High Density (HD) I/Os (3 banks)
    • ETH
    • USB
    • 78 x PS MIOs
    • 4 x serial PS GTR transceivers
      • PCI Express interface version 2.1 compliant
      • SATA 3.1 specification compliant interface
      • DisplayPort

      4 GTR (for USB3, SATA, PCIe, DP)
      Four high-speed serial I/O (HSSIO) interfaces supporting following protocols:
      • PCI Express interface version 2.1 compliant
      • SATA 3.1 specification compliant interface
      • DisplayPort source-only interface with video resolution up to 4k x 2k

      • USB 3.0 specification compliant interface implementing a 5 Gbit/s line rate
      • 1 GB/s serial GMII interface
    • 14 x PS MIOs
      • MIO for UART
      • thereof 6 MIO for SD card interface (default configuration)
      • MIO for PJTAG
    • JTAG
    • Ctrl
  • Power
    • 132 x HP PL I/Os (3 banks)
    • ETH
    • USB
    • 4 GTR (for USB3, SATA, PCIe, DP)
      Four high-speed serial I/O (HSSIO) interfaces supporting following protocols:
      • PCI Express interface version 2.1 compliant
      • SATA 3.1 specification compliant interface
      • DisplayPort source-only interface with video resolution up to 4k x 2k

      • USB 3.0 specification compliant interface implementing a 5 Gbit/s line rate
      • 1 GB/s serial GMII interface
    • 14 x PS MIOs
      • MIO for UART
      • thereof 6 MIO for SD card interface (default configuration)
      • MIO for PJTAG
    • JTAG
    • Ctrl
  • Dimension
    • 4 x 5 cm
  • Notes
    • Rugged for shock and high vibration
    • Evenly spread supply pins for good signal integrity
    • Plug-on module with 2 x 100 pin and 1 x 60 pin Razor Beam High-Speed hermaphroditic Terminal/Socket Strips (low profile, 2,5 mm)

Block Diagram

  • Power
    • All power regulators on board
  • Dimension
    • 40 x 50 mm
  • Note
    • * depends on assembly version
    • ** also non low power assembly options possible
    • *** depends on used U+ Zynq and DDR4 combination
    • Rugged for shock and high vibration

BlockDiagram

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Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .



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Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .

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Main Components

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titleTE0823 main components


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  1. Xilinx Zynq UltraScale+ XCZU3EG, U1
  2. Red LED (ERR_OUT), D3
  3. Green User LED, D2
  4. Green LED (ERR_STATUS), D4
  5. Red LED (DONE), D1
  6. 10/100/1000 Mbps energy efficient ethernet transceiver, U8
  7. 8Gb DDR4, U2-U3
  8. 512 Mbit QSPI flash memory, U7-U17
  9. B2B connector Samtec Razor Beam, JM1
  10. B2B connector Samtec Razor Beam, JM3
  11. Programmable clock generator, U10
  12. USB2.0 Transceiver,  U18
  13. B2B connector Samtec Razor Beam,

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  1. JM2
  2. 8 GByte

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  1. eMMC memory, U6
  2. Lattice Semiconductor MachXO2 System Controller CPLD, U21

Initial Delivery State

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Notes :

Only components like EEPROM, QSPI flash can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty

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Storage device name

Content

Notes

Quad SPI Flash

QSPI Flash Memory

Not programmed


eMMC Memory

Not programmed


Programmable Clock GeneratorNot programmed
CPLD (LCMXO2-256HC)SC0820-02 QSPI FirmwareEEPROMSystem Controller CPLD


Configuration Signals

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  • Overview of Boot Mode, Reset, Enables.

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titleBoot process.

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MODE Signal State

Boot Mode
High

QSPI*

LowSD Card*

*changable also with other CPLD Firmware:TE0823 CPLD



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titleReset process.

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Signal

B2BI/ONote

RESIN

JM2-18Input


Signals, Interfaces and Pins

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FPGA BankB2B ConnectorI/O Signal CountVoltage LevelNotes

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JTAG access to the TExxxx SoM through B2B connector JMX.

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titleJTAG pins connection

24HDJM224x I/O, 12x  LVDS PairsVariable Max voltage 3.3V
25HDJM124x I/O, 12x  LVDS PairsVariable Max voltage 3.3V
26HDJM124x I/O, 12x  LVDS PairsVariable Max voltage 3.3V
44HDJM224x I/O, 12x  LVDS PairsVariableMax voltage 3.3V
65

HP

JM2

18x I/O, 9x LVDS Pairs

VariableMax voltage 1.8V

65

HP

JM3

16x I/O, 8x LVDS Pairs

Variable

Max voltage 1.8V
505GTRJM316x I/O, 8x LVDS Pairs-4x lanes
505GTR CLKJM31x Diff Clock-

501

MIO

JM1

15 I/O

3.3V




JTAG Interface

JTAG access to the Xilinx Zynq UltraScale+ is applicable by using Lattice MachXO CPLD  through B2B connector JM2.

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JTAG Signal

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B2B Connector

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MIO Pins

you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

Example:

Connected to
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MIO PinConnected toB2BNotes
MIO12...14

SPI_CS , SPI_DQ0... SPI_DQ3

SPI_SCK

J2QSPI
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MIO Pin

JTAG Signal

B2B Connector

Notes

Test Points

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you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

Example:

TMSJM2-93
TDIJM2-95
TDOJM2-97
TCKJM2-99 
JTAGENJM1-89Pulled Low: Xilinx Zynq UltraScale+ MPSoC
Pulled High: Lattice MachXO CPLD


MGT Lanes

There are 4x MGT Lanes connected to FPGA Bank 505-GTR.

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Test Point

Lane

Signal
Schematic
Connected to
B2B
Notes

On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs
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Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection

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titleOn board peripherals

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Quad SPI Flash Memory

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Notes :

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Note
0
  • B505_RX0_P
  • B505_RX0_N
  • B505_TX0_P
  • B505_TX0_N
  • JM3-26
  • JM3-28
  • JM3-25
  • JM3-27

1
  • B505_RX1_P
  • B505_RX1_N
  • B505_TX1_P
  • B505_TX1_N
  • JM3-20
  • JM3-22
  • JM3-19
  • JM3-21

2
  • B505_RX2_P
  • B505_RX2_N
  • B505_TX2_P
  • B505_TX2_N
  • JM3-14
  • JM3-16
  • JM3-13
  • JM3-15

3
  • B505_RX2_P
  • B505_RX2_N
  • B505_TX2_P
  • B505_TX2_N
  • JM3-8
  • JM3-10
  • JM3-7
  • JM3-9


Gigabit Ethernet

On-board Gigabit Ethernet PHY is provided with Marvell Alaska 88E1512 chip. The Ethernet PHY RGMII interface is connected to the Zynq Ethernet0 PS GEM0. I/O voltage is fixed at 1.8V for HSTL signaling. SGMII (SFP copper or fiber) can be used directly with the Ethernet PHY, as the SGMII pins are available on the B2B connector JM3. The reference clock input of the PHY is supplied from an on-board 25MHz oscillator (U11), the 125MHz output clock is left unconnected.

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PinSchematicConnected toNote
MDIP0...3

PHY_MDI0...3

B2B, JM1


MDC

ETH_MDC

MIO76


MDIOETH_MDIOMIO77
S_INS_INB2B, JM3
S_OUTS_OUTB2B, JM3
TXD0..3ETH_TXD0...3MIO65...68
TX_CTRLETH_TXCTLMIO69
TX_CLKETH_TXCKMIO64
RXD0...3ETH_RXD0...3MIO71...74
RX_CTRLETH_RXCTLMIO75
RX_CLKETH_RXCKMIO70
LED0...2PHY_LED0...2FPGA Bank 66
RESETnETH_RSTMIO24


System Controller CPLD

Special purpose pins are connected to System Controller CPLD and have following default configuration:

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Pin NameModeFunctionDefault Configuration
EN1InputPower Enable

No hard wired function on PCB. When forced low, PGOOD goes low without effect on power management

PGOODOutputPower GoodOnly indirect used for power status, see CPLD description
NOSEQ--No used for Power sequencing, see CPLD description
RESINInputReset

Active low reset, gated to POR_B

JTAGENInputJTAG SelectLow for normal operation, high for CPLD JTAG access


USB Interface

USB PHY is provided by Microchip USB3320. The ULPI interface is connected to the Zynq PS USB0. I/O voltage is fixed at 1.8V. Reference clock input for the USB PHY is supplied by the on-board 52.00 MHz oscillator (U14).

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 PHY PinZYNQ PinB2B NameNotes
ULPIMIO52..63-Zynq USB0 MIO pins are connected to the USB PHY.
REFCLK--52.000000 MHz from on-board oscillator (U14).
REFSEL[0..2]--Reference clock frequency select, all set to GND selects 52.000000 MHz.
RESETBMIO25-Active low reset.
CLKOUTMIO52-Connected to 1.8V, selects reference clock operation mode.
DP, DM-OTG_D_P, OTG_D_NUSB data lines routed to B2B connector JM3 pins 47 and 49.
CPEN-VBUS_V_ENExternal USB power switch active high enable signal, routed to JM3 pin 17.
VBUS-USB_VBUSConnect to USB VBUS via a series of resistors, see reference schematics, routed to JM3 pin 55.
ID-OTG_IDFor an A-device connect to ground, for a B-device left floating. routed from JM3 pin 23.


I2C Interface

On-board I2C devices are connected to MIO38 (SCL) and MIO39 (SDA) which are configured as I2C0 by default. Addresses for on-board I2C slave devices are listed in the table below:

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I2C DeviceI2C AddressNotes

Si5338A PLL

0x70-
EEPROM0x50-


MIO Pins

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Example:

MIO PinConnected toB2BNotes
MIO12...14

SPI_CS , SPI_DQ0... SPI_DQ3

SPI_SCK

J2QSPI



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MIO PinConnected toB2BNotes
0...5QSPI Flash, U7-SPI Flash
7...12QSPI Flash, U17-SPI Flash
13...23eMMC, U6

24ETH Transceiver, U8-ETH_RST
25USB2.0 Transceiver, U18-OTG_RST
26...33User MIOJM1
34...37N.C-N.C
38...39EEPROM, U25-I2C_SDA/SCL
40...45N.C
N.C
46...51SD CardJM1
52...63USB2.0 Transceiver, U18-
63...77Ethernet Transceiver, U8-


Test Points

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you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

Example:

Test PointSignalB2BNotes
10PWR_PL_OKJ2-120



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Test PointSignalConnected toNotes
1PS_LP0V85Regulator, U12
2SRST_BFPGA Bank 503, U1HPSCONFIG
3PS_AVCCRegulator, U9
4+1.1V_LPDDR4Regulator, U15
5PS_AVTTRegulator, U13
6--
7PS_FP0V85Regulator, U26
8PS_LP0V85Voltage Regulator, U12
9POR_BVoltage Regulator, U19
10PS_PLLVoltage Regulator, U23
11PL_VCCINTVoltage Regulator, U5
12...15--
16PL_VCUVoltage Regulator, U24


On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs


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In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection


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Quad SPI Flash Memory

The TE0821 is equipped with dual Flash Memory, U7, U17.  Two quad SPI compatible serial bus flash memory chips are provided for FPGA configuration file and data storage. After configuration completes the remaining free memory can be used for application data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths to be used. The maximum data transfer rate depends on the bus width and clock frequency.

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Notes :

Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.


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PinSchematicNotes
QSPI, U7QSPI, U17
nCSMIO5MIO7
CLKMIO0MIO12
DI/IO0MIO4MIO8
DO/IO1MIO1MIO9
nHOLD/IO3MIO3MIO11
WP/IO2MIO2MIO10


EEPROM

There is a 2Kb EEPROM provided on the module TE0821.

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MIO PinSchematicU?? PinNotes
MIO39I2C_SDASDA
MIO38I2C_SCLSCL



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titleI2C address for EEPROM

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MIO PinI2C AddressDesignatorNotes
MIO38-MIO390x50U25


LEDs

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DesignatorColorConnected toActive LevelNote
D1RedDONELow
D2GreenUSR_LEDHigh
D3RedERR_OUTHigh
D4GreenERR_STATUSHigh


DDR4 SDRAM

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Notes :

Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3)

The TE0823 SoM has a 1 GB volatile LPDDR4 SDRAM IC for storing user application code and data.

  • Part number: IS43LQ32256A
  • Supply voltage: 1.7V ~ 1.95V
  • Speed: 3200 Mbps
  • Temperature: -40 ~ 95 °C

Gigabyte Ethernet

On-board Gigabit Ethernet PHY (U8) is provided with Marvell Alaska 88E1512 IC (U8). The Ethernet PHY RGMII interface is connected to the ZynqMP Ethernet3 PS GEM3. I/O voltage is fixed at 1.8V for HSTL signaling. The reference clock input of the PHY is supplied from an on-board 25.00 MHz oscillator (U11).

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U8 Pin SchematicConnected toNote
MDIP0...3

PHY_MDI0...3

B2B, JM1


MDC

ETH_MDC

MIO76


MDIOETH_MDIOMIO77
S_INS_INB2B, JM3
S_OUTS_OUTB2B, JM3
TXD0..3ETH_TXD0...3MIO65...68
TX_CTRLETH_TXCTLMIO69
TX_CLKETH_TXCKMIO64
RXD0...3ETH_RXD0...3MIO71...74
RX_CTRLETH_RXCTLMIO75
RX_CLKETH_RXCKMIO70
LED0...2PHY_LED0...2FPGA Bank 66
RESETnETH_RSTMIO24



Clock Sources

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DesignatorDescriptionFrequencyNote
U11MEMS Oscillator25 MHz
U14MEMS Oscillator52 MHz
U32MEMS Oscillator80 MHz


USB2.0 Transceiver

Hi-speed USB ULPI PHY (U18) is provided with USB3320 from Microchip. The ULPI interface is connected to the Zynq PS USB0 via MIO52..63, bank 502. The I/O voltage is fixed at 1.8V and PHY reference clock input is supplied from the on-board 52.00 MHz oscillator (U14).

eMMC Flash Memory

eMMC Flash memory device(U6) is connected to the ZynqMP PS MIO bank 500 pins MIO13..MIO23. eMMC chips IS21ES08G-JCLI (FLASH - NAND Speicher-IC (64 Gb x 1) MMC ) is used.

Programmable Clock Generator

There is a Silicon Labs I2C programmable clock generator Si5338A (U10) chip on the module. It's output frequencies can be programmed using the I2C bus address 0x70 or 0x71. Default address is 0x70, IN4/I2C_LSB pin must be set to high for address 0x71.

A 25.00 MHz oscillator is connected to the pin IN3 and is used to generate the output clocks. The oscillator has its output enable pin permanently connected to 1.8V power rail, thus making output frequency available as soon as 1.8V is present. Three of the Si5338 clock outputs are connected to the FPGA. One is connected to a logic bank and the other two are connected to the GTR banks.

Once running, the frequency and other parameters can be changed by programming the device using the I2C bus connected between the FPGA (master) and clock generator (slave). For this, proper I2C bus logic has to be implemented in FPGA.

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titleQuad SPI interface MIOs and pinsProgrammable Clock Generator Inputs and Outputs

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MIO
U25 Pin
SchematicU?? PinNotes

EEPROM

...

anchorTable_OBP_EEP
titleI2C EEPROM interface MIOs and pins
SignalConnected toDirectionNote

IN0..1

CLK_INJM3IN
IN2CLK_25MOscillator, U11IN
SCLI2C_SCLEEPROM,U25INOUT
SDAI2C_SDAEEPROM,U25INOUT
CLK0CLK0JM3OUT
CLK1B505_CLK3FPGA Bank 505IN
CLK2B505_CLK1FPGA Bank 505IN
CLK3CLK3_N
IN


Power and Power-On Sequence

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In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:

  • Power on-sequence
  • Power distribution
  • Voltage monitoring circuit


Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .


Power Supply

Power supply with minimum current capability of 2.5 A for system startup is recommended.

Power Consumption

...

anchorTable_OBP_I2C_EEPROM
titleI2C address for EEPROM

...

LEDs

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titleOn-board LEDsPower Consumption

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DesignatorColorConnected toActive LevelNote

DDR3 SDRAM

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Notes :

Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3)

The TE???? SoM has ??? GByte volatile DDR3 SDRAM IC for storing user application code and data.

  • Part number: 
  • Supply voltage:
  • Speed: 
  • NOR Flash
  • Temperature: 

...

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Power Input PinTypical Current
VINTBD*


* TBD - To Be Determined

Power Distribution Dependencies

Scroll Title
anchorTableFigure_OBPPWR_ETHPD
titleEthernet PHY to Zynq SoC connectionsPower Distribution


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U?? Pin Signal NameConnected toSignal DescriptionNote

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Power-On Sequence

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titleOsillators
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DesignatorDescriptionFrequencyNote
MHzMHzKHz

Programmable Clock Generator

...

PWR_PS
titlePower Sequency


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Power Rails

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titleProgrammable Clock Generator Inputs and OutputsModule power rails.

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U?? Pin
SignalConnected toDirectionNote

IN0

IN1IN2IN3

XAXB

SCLKSDAOUT0OUT1OUT2OUT3OUT4OUT5OUT6OUT7OUT8/OUT9

Power and Power-On Sequence

...

hiddentrue
idComments

In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:

  • Power on-sequence
  • Power distribution
  • Voltage monitoring circuit
Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .

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Power Rail Name

B2B Connector

JM1 Pin

B2B Connector

JM2 Pin

B2B Connector

JM3 Pin

DirectionNotes
VIN

1, 3, 5

2, 4, 6, 8InputSupply voltage from the carrier board
3.3V-10, 12OutputInternal 3.3V voltage level
3.3VIN13, 15-InputSupply voltage from the carrier board
1.8V39-OutputInternal 1.8V voltage level
JTAG VREF-91OutputJTAG reference voltage.
Attention: Net name on schematic is "3.3VIN"

VCCO_64-7, 9InputHigh performance I/O bank voltage
VCCO_65-5InputHigh performance I/O bank voltage
VCCO_669, 11-InputHigh performance I/O bank voltage


Bank Voltages

Power Supply

Power supply with minimum current capability of xx A for system startup is recommended.

...

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titlePower ConsumptionZynq SoC bank voltages.

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Power Input PinTypical Current
VINTBD*

* TBD - To Be Determined

Power Distribution Dependencies

...

anchorFigure_PWR_PD
titlePower Distribution

Bank          

Schematic Name

Voltage

Notes
24 HDVCCO_HD24_24Variable Max voltage 3.3V
25 HD
Variable Max voltage 3.3V
26 HDVCCO_HD25_26Variable Max voltage 3.3V
44 HDVCCO_HD24_44VariableMax voltage 3.3V
65 HP

VCCO_65

VariableMax voltage 1.8V
66 HPVCCO_661.8V
500 PSMIOVCCO_PSIO0_5001.8V

501 PSMIO

VCCO_PSIO1_501

3.3V


502 PSMIOVCCO_PSIO2_5021.8V
503 PSCONFIGVCCO_PSIO3_5031.8V
504 PSDDRDDR_1V21.2V



Board to Board Connectors

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  • This section is optional and only for modules.
  • use "include page" macro and link to the general B2B connector page of the module series,

    For example: 6 x 6 SoM LSHM B2B Connectors

    Include Page
    6 x 6 SoM LSHM B2B Connectors
    6 x 6 SoM LSHM B2B Connectors

Include Page
4 x 5 SoM LSHM B2B Connectors
4 x 5 SoM LSHM B2B Connectors

Technical Specifications

Absolute Maximum Ratings

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Power-On Sequence

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titlePower Sequency

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Power Rails

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titleModule power rails.PS absolute maximum ratings

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Power Rail Name

B2B Connector

JM1 Pin

B2B Connector

JM2 Pin

B2B Connector

JM3 Pin

DirectionNotes

Bank Voltages

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anchorTable_PWR_BV
titleZynq SoC bank voltages.

...

Bank          

...

Voltage

...

hiddentrue
idComments

...

SymbolsDescriptionMinMaxUnit

VIN supply voltage

-0.3

7

V

See EN6347QI and TPS82085SIL datasheets
3.3VIN supply voltage-0.13.630VXilinx DS925 and TPS27082L datasheet
PS I/O supply voltage, VCCO_PSIO-0.53.630VXilinx document DS925
PS I/O input voltage-0.5VCCO_PSIO + 0.55VXilinx document DS925
HP I/O bank supply voltage, VCCO-0.52.0VXilinx document DS925
HP I/O bank input voltage-0.55VCCO + 0.55VXilinx document DS925
PS GTR reference clocks absolute input voltage-0.51.1VXilinx document DS925
PS GTR absolute input voltage-0.51.1VXilinx document DS925

Voltage on SC CPLD pins

-0.5

3.75

V

Lattice Semiconductor MachXO2 datasheet

Storage temperature

-40

+85

°C

See eMMC datasheet


Recommended Operating Conditions

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

use "include page" macro and link to the general B2B connector page of the module series,

...

Technical Specifications

...

Scroll Title
anchorTable_TS_AMRROC
titlePS absolute maximum ratingsRecommended operating conditions.

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Symbols
Parameter
Description
MinMax
Unit
UnitsReference Document
VIN supply voltage3.36
VVV
V
V

Recommended Operating Conditions

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

See TPS82085S datasheet
3.3VIN supply voltage3.33.465VSee LCMXO2-256HC, Xilinx DS925 datasheet
PS I/O supply voltage, VCCO_PSIO1.7103.465VXilinx document DS925
PS I/O input voltage–0.20VCCO_PSIO + 0.20VXilinx document DS925
HP I/O banks supply voltage, VCCO0.9501.9VXilinx document DS925
HP I/O banks input voltage-0.20VCCO + 0.20VXilinx document DS925
Voltage on SC CPLD pins-0.33.6VLattice Semiconductor MachXO2 datasheet
Operating Temperature Range085°CXilinx document DS925, extended grade Zynq temperarure range
Scroll Title
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titleRecommended operating conditions.
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ParameterMinMaxUnitsReference Document
VSee ???? datasheets.VSee Xilinx ???? datasheet.VSee Xilinx ???? datasheet.°CSee Xilinx ???? datasheet.°CSee Xilinx ???? datasheet.