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The Trenz Electronic TE0823 -01-3PIU1FL is (3PIU1FA /3PIU1FL)  is an industrial-grade MPSoC module integrating a low power Xilinx Zynq UltraScale+ ZU3CGMPSoC, 1 GByte LPDDR4 SDRAM, 128 MByte 8 GB eMMC chip, 2x 64 MB Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections The module is equipped with a Lattice Mach XO2 CPLD for system controlling. 3x Robust high-speed connectors provide a large number of inputs and outputs.

The highly integrated modules are All this on a tiny footprint, smaller than a credit card , at the most competitive price. Modules in and are offered in several variants at an affordable price-performance ratio. Modules with a 4 x 5 cm form factor are fully completely mechanically and largely electrically compatible among with each other.

All parts are at least industrial temperature range of -40°C to +85°C. The module . The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Refer to http://trenz.org/te0823-info for the current online version of this manual and other available documentation.

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Note:
 'description: Important components and connector or other Features of the module
→ please sort and indicate assembly options

Key Features'  must be split into 6 main groups for modules and mainboards:

  • SoC/FPGA
    • Package: SFVC784
    • Device: ZU2...ZU5*
    • Engine: CG, EG, EV*
    • Speed: -1LI, -2LE,*, **
    • Temperature: I, E,*, **
  • RAM/Storage
    • Low Power DDR4 on PS
      • Data width: 32bit
      • Size: def. 2GB*
      • Speed:***
    • eMMC
      • Data width: 8Bit
      • size: def. 8GB *
    • QSPI boot Flash in dual parallel mode (size depends on assembly version)
      • Data width: 8bit
      • size: def. 128MB *
    • HyperRAM/Flash (optional, default not assembled)
      • size:*
    • MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48)
  • On Board
    • Lattice LCMXO2
    • PLL SI5338
    • Gigabit Ethernet transceiver PHY (Marvell Alaska 88E1512)
    • Hi-speed USB2 ULPI transceiver with full OTG support (Microchip USB3320C)
  • Interface
    • 132 x HP PL I/Os (3 banks)
    • ETH
    • USB
    • 4 GTR (for USB3, Sata, PCIe, DP)
    • MIO for UART
    • MIO for SD
    • MIO for PJTAG
    • JTAG
    • Ctrl
  • Power
    • 3.3V-5V Main Input
    • 3.3V Controller Input
    • Variable Bank IO Power Input
  • Dimension
    • 4 cm x 5 cm
  • Notes
    • * depends on assembly version
    • ** also non low power assembly options possible
    • *** depends on used U+ Zynq and DDR4 combination


Key Features'  must be split into 6 main groups for carrier:

  • Modules
    • TE0808, TE807, TE0803,...
  • RAM/Storage
    • E.g. SDRAM, SPI
  • On Board
    • E.g. CPLD, PLL
  • Interface
    • E.g. ETH, USB, B2B, Display port
  • Power
    • E.g. Input supply voltage
  • Dimension


  • SoC/FPGAXilinx Zynq UltraScale+ XCZU3CG-L1SFVC784IApplication Processor: Dual-core ARM Cortex-A53 MPCore
    • Real-Time Processor: Dual-core ARM Cortex-R5 MPCore
    • Package: SFVC784, SFRC784
    • Device: ZU3ZU2 ...ZU5, *
    • Engine:  EG, CG, EV, *
    • Speed: -1LI (also non-low power assembly options possible)
    • Temperature range: industrial
    • 1, -1L, -2, -2L, 3, *, **
    • Temperature: I, E, *, **
  • RAM/Storage
    • 2x  DDR4 SDRAM,
      • Data Width: 32 Bit
      • Size: 16 Gb, *
      • Speed: 3733 Mbps, ***
    • 2x
    RAM/Storage
    • Low power DDR4 on PS with 32 bit data width
    • 128 MByte QSPI boot Flash in dual parallel mode
      • Data Width: 8 Bit
      • Size: 512 Mb Gb, *
    • 1x 8 GByte e.MMC memory with 8 bit data widthMemory
      • Data Width: 8 Bit
      • Size: 32 Gb, *
    • MAC address serial EEPROM with EUI-48 node identity
  • On Board
    • Lattice LCMXO2
    • PLL SI5338
    • Gigabit Ethernet transceiver PHY
    • MachXO2 CPLD
    • Programmable Clock Generator
    • Hi-speed USB2 ULPI Transceiver
    • 4x LEDS
  • Interface
    • 1x GB/s serial GMII interface
    • 1x Hi-speed USB2 ULPI transceiver with full OTG support
    Interface
    • 132 x HP PL 154 x High Performance (HP) und 96 x High Density (HD) I/Os (3 banks)
    • ETH
    • USB
    • 78 x PS MIOs
    • 4 x serial PS GTR transceivers
        4 GTR (for USB3, SATA, PCIe, DP)
        Four high-speed serial I/O (HSSIO) interfaces supporting following protocols:
        • PCI Express interface version 2.1 compliant
        • SATA 3.1 specification compliant interface
        • DisplayPort source-only interface with video resolution up to 4k x 2k

        • USB 3.0 specification compliant interface implementing a 5 Gbit/s line rate
        • 1 GB/s serial GMII interface
      • 14 x PS MIOs
        • MIO for UART
        • thereof 6 MIO for SD card interface (default configuration)
        • MIO for PJTAG
      • JTAG
      • Ctrl
    • Power
      • 132 x HP PL I/Os (3 banks)
      • ETH
      • USB
      • 4 GTR (for USB3, SATA, PCIe, DP)
        Four high-speed serial I/O (HSSIO) interfaces supporting following protocols:
        • PCI Express interface version 2.1 compliant
        • SATA 3.1 specification compliant interface
        • DisplayPort source-only interface with video resolution up to 4k x 2k

        • USB 3.0 specification compliant interface implementing a 5 Gbit/s line rate
        • 1 GB/s serial GMII interface
      • 14 x PS MIOs
        • MIO for UART
        • thereof 6 MIO for SD card interface (default configuration)
        • MIO for PJTAG
      • JTAG
      • Ctrl
    • Dimension
      • 4 x 5 cm
    • Notes
      • Rugged for shock and high vibration
      • Evenly spread supply pins for good signal integrity
      • Plug-on module with 2 x 100 pin and 1 x 60 pin Razor Beam High-Speed hermaphroditic Terminal/Socket Strips (low profile, 2,5 mm)

    ...

    • Power
      • All power regulators on board
    • Dimension
      • 40 x 50 mm
    • Note
      • * depends on assembly version
      • ** also non low power assembly options possible
      • *** depends on used U+ Zynq and DDR4 combination
      • Rugged for shock and high vibration

    BlockDiagram

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    Main Components

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    • Picture of the PCB (top and bottom side) with labels of important components
    • Add List below


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    Note

    For more information regarding how to draw a diagramadd board photoes, Please refer to "Diagram Drawing Guidline" .


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    titleTE0823 block diagrammain components


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    Notes :

    • Picture of the PCB (top and bottom side) with labels of important components
    • Add List below
    Note

    For more information regarding how to add board photoes, Please refer to "Diagram Drawing Guidline" .

    image link to the generate DrawIO PNG file of this page. This is a workaround until scroll pdf export bug is fixed


    1. Xilinx Zynq UltraScale+ XCZU3EG, U1
    2. Red LED (ERR_OUT), D3
    3. Green User LED, D2
    4. Green LED (ERR_STATUS), D4
    5. Red LED (DONE), D1
    6. 10/100/1000 Mbps energy efficient ethernet transceiver, U8
    7. 8Gb DDR4, U2-U3
    8. 512 Mbit QSPI flash memory, U7-U17
    9. B2B connector Samtec Razor Beam, JM1
    10. B2B connector Samtec Razor Beam, JM3
    11. Programmable clock generator, U10
    12. USB2.0 Transceiver,  U18
    13. B2B connector Samtec Razor Beam, JM2
    14. 8 GByte eMMC memory, U6
    15. Lattice Semiconductor MachXO2 System Controller CPLD, U21

    Initial Delivery State

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    If there is no components which might have initial data ( possible on carrier) you must keep the table empty


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    titleInitial delivery state of programmable devices on the module

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    Storage device name

    Content

    Notes

    QSPI Flash Memory

    Not programmed


    eMMC Memory

    Not programmed


    Programmable Clock GeneratorNot programmed
    CPLD (LCMXO2-256HC)SC0820-02 QSPI Firmware


    Configuration Signals

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    • Overview of Boot Mode, Reset, Enables.


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    titleBoot process.

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    titleTE0823 main components

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    1. Xilinx Zynq UltraScale+ XCZU3EG, U1
    2. Red LED (ERR_OUT), D3
    3. Green User LED, D2
    4. Green LED (ERR_STATUS), D4
    5. Red LED (DONE), D1
    6. 10/100/1000 Mbps energy efficient ethernet transceiver, U8
    7. 8Gb DDR4, U2-U3
    8. 512 Mbit QSPI flash memory, U7-U17
    9. B2B connector Samtec Razor Beam, JM1
    10. Programmable clock generator, U10
    11. USB2.0 Transceiver,  U18
    12. B2B connector Samtec Razor Beam, JM3
    13. B2B connector Samtec Razor Beam, JM2
    14. 8 GByte eMMC memory, U6
    15. Lattice Semiconductor MachXO2 System Controller CPLD, U21

    Initial Delivery State

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    If there is no components which might have initial data ( possible on carrier) you must keep the table empty

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    Storage device name

    Content

    Notes

    QSPI Flash Memory

    Not programmed

    eMMC Memory

    Not programmed

    Programmable Clock GeneratorNot programmedCPLD (LCMXO2-256HC)SC0820-02 QSPI Firmware

    Configuration Signals

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    • Overview of Boot Mode, Reset, Enables.

    MODE Signal State

    Boot Mode
    High

    QSPI*

    LowSD Card*

    *changable also with other CPLD Firmware:TE0823 CPLD



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    titleReset
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    titleBoot process.

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    MODE

    Signal

    State

    Boot Mode
    Low

    QSPI

    HighSD Card
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    Signal

    B2BI/ONote

    Signals, Interfaces and Pins

    B2BI/ONote

    RESIN

    JM2-18Input


    Signals, Interfaces and Pins

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    • For
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    Notes :

    • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
      • SD
      • USB
      • ETH
      • FMC
      • ...
    • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
      • JTAG
      • UART
      • I2C
      • MGT
      • ...

    ...

    Scroll Title
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    FPGA BankB2B ConnectorI/O Signal CountVoltage LevelNotes
    24HDJM224x I/O, 12x  LVDS PairsVariable Max voltage 3.3V
    25HDJM124x I/O, 12x  LVDS PairsVariable Max voltage 3.3V
    26HDJM124x I/O, 12x  LVDS PairsVariable Max voltage 3.3V
    44HDJM224x I/O, 12x  LVDS PairsVariableMax voltage 3.3V
    65

    HP

    JM2

    18x I/O, 9x LVDS Pairs

    VariableMax voltage 1.8V

    65

    HP

    JM3

    16x I/O, 8x LVDS Pairs

    Variable

    Max voltage 1.8V
    505GTRJM316x I/O, 8x LVDS Pairs-4x lanes
    505GTR CLKJM31x Diff Clock-

    501

    MIO

    JM1

    15 I/O

    3.3V



    ...

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    title General overview of the USB PHY signals

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     PHY PinZYNQ PinB2B NameNotes
    ULPIMIO52..63-Zynq USB0 MIO pins are connected to the USB PHY.
    REFCLK--52.000000 MHz from on-board oscillator (U14).
    REFSEL[0..2]--Reference clock frequency select, all set to GND selects 52.000000 MHz.
    RESETBMIO25-Active low reset.
    CLKOUTMIO52-Connected to 1.8V, selects reference clock operation mode.
    DP, DM-OTG_D_P, OTG_D_NUSB data lines routed to B2B connector JM3 pins 47 and 49.
    CPEN-VBUS_V_ENExternal USB power switch active high enable signal, routed to JM3 pin 17.
    VBUS-USB_VBUSConnect to USB VBUS via a series of resistors, see reference schematics, routed to JM3 pin 55.
    ID-OTG_IDFor an A-device connect to ground, for a B-device left floating. routed from JM3 pin 23.

    MIO Pins


    I2C Interface

    On-board I2C devices are connected to MIO38 (SCL) and MIO39 (SDA) which are configured as I2C0 by default. Addresses for on-board I2C slave devices are listed in the table below:

    you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

    Example:

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    MIO PinConnected toB2BNotes
    MIO12...14

    SPI_CS , SPI_DQ0... SPI_DQ3

    SPI_SCK

    J2QSPI
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    MIO PinConnected toB2BNotes
    0...5QSPI Flash, U7-SPI Flash
    7...12QSPI Flash, U17-SPI Flash
    13...23eMMC, U6
    24ETH Transceiver, U8-ETH_RST
    25USB2.0 Transceiver, U18-OTG_RST
    26...33User MIOJM1
    34...37N.C-N.C
    38...39EEPROM, U25-I2C_SDA/SCL
    40...45N.CN.C46...51SD CardJM152...63USB2.0 Transceiver, U18-63...77Ethernet Transceiver, U8-

    Test Points

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    Example:

    I2C DeviceI2C AddressNotes

    Si5338A PLL

    0x70-
    EEPROM0x50-


    MIO Pins

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    Example:

    MIO PinConnected toB2BNotes
    MIO12...14

    SPI_CS , SPI_DQ0... SPI_DQ3

    SPI_SCK

    J2QSPI



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    MIO PinConnected toB2BNotes
    0...5QSPI Flash, U7-SPI Flash
    7...12QSPI Flash, U17-SPI Flash
    13...23eMMC, U6

    24ETH Transceiver, U8-ETH_RST
    25USB2.0 Transceiver, U18-OTG_RST
    26...33User MIOJM1
    34...37N.C-N.C
    38...39EEPROM, U25-I2C_SDA/SCL
    40...45N.C
    N.C
    46...51SD CardJM1
    52...63USB2.0 Transceiver, U18-
    63...77Ethernet Transceiver, U8-


    Test Points

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    Example:

    Test PointSignalB2BNotes
    10PWR_PL_OKJ2-120



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    Test PointSignalConnected toNotes
    1PS_LP0V85Regulator, U12
    2SRST_BFPGA Bank 503, U1HPSCONFIG
    3PS_AVCCRegulator, U9
    4+1.1V_LPDDR4Regulator, U15
    5PS_AVTTRegulator, U13
    6--
    7PS_FP0V85Regulator, U26
    8PS_LP0V85Voltage Regulator, U12
    9POR_BVoltage Regulator, U19
    10PS_PLLVoltage Regulator, U23
    11PL_VCCINTVoltage Regulator, U5
    12...15--
    16PL_VCUVoltage Regulator, U24


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    On-board Peripherals

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    • add subsection for every component which is important for design, for example:
      • Two 100 Mbit Ethernet Transciever PHY
      • USB PHY
      • Programmable Clock Generator
      • Oscillators
      • eMMCs
      • RTC
      • FTDI
      • ...
      • DIP-Switches
      • Buttons
      • LEDs

    ...

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    Chip/InterfaceDesignatorNotes

    Quad SPI Flash Memory

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    Quad SPI Flash Memory

    The TE0821 is equipped with dual Flash Memory, U7, U17.  Two quad SPI compatible serial bus flash memory chips are provided for FPGA configuration file and data storage. After configuration completes the remaining free memory can be used for application data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths to be used. The maximum data transfer rate depends on the bus width and clock frequency.

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    MIO
    PinSchematicU?? PinNotes

    ...

    Notes
    QSPI, U7QSPI, U17
    nCSMIO5MIO7
    CLKMIO0MIO12
    DI/IO0MIO4MIO8
    DO/IO1MIO1MIO9
    nHOLD/IO3MIO3MIO11
    WP/IO2MIO2MIO10


    EEPROM

    There is a 2Kb EEPROM provided on the module TE0821.

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    MIO PinSchematicU?? PinNotes
    MIO39I2C_SDASDA
    MIO38I2C_SCLSCL



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    MIO PinI2C AddressDesignatorNotes
    MIO38-MIO390x50U25


    LEDs

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    DesignatorColorConnected toActive LevelNote
    D1RedDONELow
    D2GreenUSR_LEDHigh
    D3RedERR_OUTHigh
    D4GreenERR_STATUSHigh


    DDR4 SDRAM

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    Notes :

    Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3)

    The TE0823 SoM has a 1 GB volatile LPDDR4 SDRAM IC for storing user application code and data.

    • Part number: IS43LQ32256A
    • Supply voltage: 1.7V ~ 1.95V
    • Speed: 3200 Mbps
    • Temperature: -40 ~ 95 °C

    Gigabyte Ethernet

    On-board Gigabit Ethernet PHY (U8) is provided with Marvell Alaska 88E1512 IC (U8). The Ethernet PHY RGMII interface is connected to the ZynqMP Ethernet3 PS GEM3. I/O voltage is fixed at 1.8V for HSTL signaling. The reference clock input of the PHY is supplied from an on-board 25.00 MHz oscillator (U11).

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    U8 Pin SchematicConnected toNote
    MDIP0...3

    PHY_MDI0...3

    B2B, JM1


    MDC

    ETH_MDC

    MIO76


    MDIOETH_MDIOMIO77
    S_INS_INB2B, JM3
    S_OUTS_OUTB2B, JM3
    TXD0..3ETH_TXD0...3MIO65...68
    TX_CTRLETH_TXCTLMIO69
    TX_CLKETH_TXCKMIO64
    RXD0...3ETH_RXD0...3MIO71...74
    RX_CTRLETH_RXCTLMIO75
    RX_CLKETH_RXCKMIO70
    LED0...2PHY_LED0...2FPGA Bank 66
    RESETnETH_RSTMIO24



    Clock Sources

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    DesignatorDescriptionFrequencyNote
    U11MEMS Oscillator25 MHz
    U14MEMS Oscillator52 MHz
    U32MEMS Oscillator80 MHz


    USB2.0 Transceiver

    Hi-speed USB ULPI PHY (U18) is provided with USB3320 from Microchip. The ULPI interface is connected to the Zynq PS USB0 via MIO52..63, bank 502. The I/O voltage is fixed at 1.8V and PHY reference clock input is supplied from the on-board 52.00 MHz oscillator (U14).

    eMMC Flash Memory

    eMMC Flash memory device(U6) is connected to the ZynqMP PS MIO bank 500 pins MIO13..MIO23. eMMC chips IS21ES08G-JCLI (FLASH - NAND Speicher-IC (64 Gb x 1) MMC ) is used.

    Programmable Clock Generator

    There is a Silicon Labs I2C programmable clock generator Si5338A (U10) chip on the module. It's output frequencies can be programmed using the I2C bus address 0x70 or 0x71. Default address is 0x70, IN4/I2C_LSB pin must be set to high for address 0x71.

    A 25.00 MHz oscillator is connected to the pin IN3 and is used to generate the output clocks. The oscillator has its output enable pin permanently connected to 1.8V power rail, thus making output frequency available as soon as 1.8V is present. Three of the Si5338 clock outputs are connected to the FPGA. One is connected to a logic bank and the other two are connected to the GTR banks.

    Once running, the frequency and other parameters can be changed by programming the device using the I2C bus connected between the FPGA (master) and clock generator (slave). For this, proper I2C bus logic has to be implemented in FPGA.

    Scroll Title
    anchorTable_OBP_EEPPCLK
    titleI2C EEPROM interface MIOs and pinsProgrammable Clock Generator Inputs and Outputs

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    MIO PinSchematicU?? PinNotes
    Scroll Title
    anchorTable_OBP_I2C_EEPROM
    titleI2C address for EEPROM
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    MIO PinI2C AddressDesignatorNotes

    ...

    U25 Pin
    SignalConnected toDirectionNote

    IN0..1

    CLK_INJM3IN
    IN2CLK_25MOscillator, U11IN
    SCLI2C_SCLEEPROM,U25INOUT
    SDAI2C_SDAEEPROM,U25INOUT
    CLK0CLK0JM3OUT
    CLK1B505_CLK3FPGA Bank 505IN
    CLK2B505_CLK1FPGA Bank 505IN
    CLK3CLK3_N
    IN


    Power and Power-On Sequence

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    idComments

    In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:

    • Power on-sequence
    • Power distribution
    • Voltage monitoring circuit


    Note

    For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .


    Power Supply

    Power supply with minimum current capability of 2.5 A for system startup is recommended.

    Power Consumption

    Scroll Title
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    titleOn-board LEDsPower Consumption

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    DesignatorColorConnected toActive LevelNote

    DDR3 SDRAM

    Page properties
    hiddentrue
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    Notes :

    Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3)

    The TE???? SoM has ??? GByte volatile DDR3 SDRAM IC for storing user application code and data.

    • Part number: 
    • Supply voltage:
    • Speed: 
    • NOR Flash
    • Temperature: 

    ...

    sortEnabledfalse
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    Power Input PinTypical Current
    VINTBD*


    * TBD - To Be Determined

    Power Distribution Dependencies

    Scroll Title
    anchorTableFigure_OBPPWR_ETHPD
    titleEthernet PHY to Zynq SoC connectionsPower Distribution


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    U?? Pin Signal NameConnected toSignal DescriptionNote

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    Power-On Sequence

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    titleOsillators
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    DesignatorDescriptionFrequencyNote
    MHzMHzKHz

    Programmable Clock Generator

    ...

    PWR_PS
    titlePower Sequency


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    Power Rails

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    titleProgrammable Clock Generator Inputs and OutputsModule power rails.

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    U?? Pin
    SignalConnected toDirectionNote

    IN0

    IN1IN2IN3

    XAXB

    SCLKSDAOUT0OUT1OUT2OUT3OUT4OUT5OUT6OUT7OUT8/OUT9

    Power and Power-On Sequence

    ...

    hiddentrue
    idComments

    In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:

    • Power on-sequence
    • Power distribution
    • Voltage monitoring circuit
    Note

    For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .

    Power Rail Name

    B2B Connector

    JM1 Pin

    B2B Connector

    JM2 Pin

    B2B Connector

    JM3 Pin

    DirectionNotes
    VIN

    1, 3, 5

    2, 4, 6, 8InputSupply voltage from the carrier board
    3.3V-10, 12OutputInternal 3.3V voltage level
    3.3VIN13, 15-InputSupply voltage from the carrier board
    1.8V39-OutputInternal 1.8V voltage level
    JTAG VREF-91OutputJTAG reference voltage.
    Attention: Net name on schematic is "3.3VIN"

    VCCO_64-7, 9InputHigh performance I/O bank voltage
    VCCO_65-5InputHigh performance I/O bank voltage
    VCCO_669, 11-InputHigh performance I/O bank voltage


    Bank Voltages

    Power Supply

    Power supply with minimum current capability of xx A for system startup is recommended.

    ...

    Scroll Title
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    titlePower ConsumptionZynq SoC bank voltages.

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    Power Input PinTypical Current
    VINTBD*

    * TBD - To Be Determined

    Power Distribution Dependencies

    ...

    anchorFigure_PWR_PD
    titlePower Distribution

    Bank          

    Schematic Name

    Voltage

    Notes
    24 HDVCCO_HD24_24Variable Max voltage 3.3V
    25 HD
    Variable Max voltage 3.3V
    26 HDVCCO_HD25_26Variable Max voltage 3.3V
    44 HDVCCO_HD24_44VariableMax voltage 3.3V
    65 HP

    VCCO_65

    VariableMax voltage 1.8V
    66 HPVCCO_661.8V
    500 PSMIOVCCO_PSIO0_5001.8V

    501 PSMIO

    VCCO_PSIO1_501

    3.3V


    502 PSMIOVCCO_PSIO2_5021.8V
    503 PSCONFIGVCCO_PSIO3_5031.8V
    504 PSDDRDDR_1V21.2V



    Board to Board Connectors

    Page properties
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    • This section is optional and only for modules.
    • use "include page" macro and link to the general B2B connector page of the module series,

      For example: 6 x 6 SoM LSHM B2B Connectors

      Include Page
      6 x 6 SoM LSHM B2B Connectors
      6 x 6 SoM LSHM B2B Connectors

    Include Page
    4 x 5 SoM LSHM B2B Connectors
    4 x 5 SoM LSHM B2B Connectors

    Technical Specifications

    Absolute Maximum Ratings

    ...

    Scroll Only

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    Power-On Sequence

    ...

    anchorFigure_PWR_PS
    titlePower Sequency

    ...

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    Scroll Title
    anchorTable_PWRTS_PRAMR
    titleModule power rails.PS absolute maximum ratings

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    Power Rail Name

    B2B Connector

    JM1 Pin

    B2B Connector

    JM2 Pin

    B2B Connector

    JM3 Pin

    DirectionNotes

    Bank Voltages

    ...

    anchorTable_PWR_BV
    titleZynq SoC bank voltages.

    ...

    Bank          

    ...

    Voltage

    ...

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    SymbolsDescriptionMinMaxUnit

    VIN supply voltage

    -0.3

    7

    V

    See EN6347QI and TPS82085SIL datasheets
    3.3VIN supply voltage-0.13.630VXilinx DS925 and TPS27082L datasheet
    PS I/O supply voltage, VCCO_PSIO-0.53.630VXilinx document DS925
    PS I/O input voltage-0.5VCCO_PSIO + 0.55VXilinx document DS925
    HP I/O bank supply voltage, VCCO-0.52.0VXilinx document DS925
    HP I/O bank input voltage-0.55VCCO + 0.55VXilinx document DS925
    PS GTR reference clocks absolute input voltage-0.51.1VXilinx document DS925
    PS GTR absolute input voltage-0.51.1VXilinx document DS925

    Voltage on SC CPLD pins

    -0.5

    3.75

    V

    Lattice Semiconductor MachXO2 datasheet

    Storage temperature

    -40

    +85

    °C

    See eMMC datasheet


    Recommended Operating Conditions

    Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

    use "include page" macro and link to the general B2B connector page of the module series,

    ...

    Technical Specifications

    Absolute Maximum Ratings

    Description
    Scroll Title
    anchorTable_TS_AMRROC
    titlePS absolute maximum ratingsRecommended operating conditions.

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    Symbols
    ParameterMinMaxUnits
    Unit
    Reference Document
    VIN supply voltage3.36
    VVV
    V
    V

Recommended Operating Conditions

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

See TPS82085S datasheet
3.3VIN supply voltage3.33.465VSee LCMXO2-256HC, Xilinx DS925 datasheet
PS I/O supply voltage, VCCO_PSIO1.7103.465VXilinx document DS925
PS I/O input voltage–0.20VCCO_PSIO + 0.20VXilinx document DS925
HP I/O banks supply voltage, VCCO0.9501.9VXilinx document DS925
HP I/O banks input voltage-0.20VCCO + 0.20VXilinx document DS925
Voltage on SC CPLD pins-0.33.6VLattice Semiconductor MachXO2 datasheet
Operating Temperature Range085°CXilinx document DS925, extended grade Zynq temperarure range
Scroll Title
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titleRecommended operating conditions.
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ParameterMinMaxUnitsReference Document
VSee ???? datasheets.VSee Xilinx ???? datasheet.VSee Xilinx ???? datasheet.°CSee Xilinx ???? datasheet.°CSee Xilinx ???? datasheet.


Physical Dimensions

  • Module size: ?? 40 mm × ?? 50 mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: ? 8 mm.

PCB thickness: ?? 1.7 mm.

Page properties
hiddentrue
idComments

In 'Physical Dimension' section, top and bottom view of module must be inserted, information regarding physical dimensions can be obtained through webpage for product in Shop.Trenz, (Download> Documents> Assembly part) for every SoM.

For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below:

https://www.trenz-electronic.de/fileadmin/docs/Trenz_Electronic/Modules_and_Module_Carriers/5.2x7.6/TE0745/REV02/Documents/AD-TE0745-02-30-1I.PDF

Note

For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .


...

Scroll Title
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titlePhysical Dimension


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titleHardware Revision History

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Documentation Link
DateRevisionChangesChangesDocumentation Link
2018-09-25REV01Initial ReleaseREV01


Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

Scroll Title
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titleBoard hardware revision number.


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Document Change History

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Scroll Title
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titleDocument change history.

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  • Bugfix document style

2021-08-23v.42Pedram Babakhani
  • Bugfix Boot mode
2020-11-02v.40Pedram Babakhani
  • Initial Release

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