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Table of Contents

Table of Contents

Overview

The Trenz Electronic

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TE0823-01-3PIU1FL is an industrial-grade MPSoC module integrating a low power Xilinx Zynq UltraScale+ ZU3CG, 1 GByte LPDDR4 SDRAM, 128 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

All this on a tiny footprint, smaller than a credit card, at the most competitive price. Modules in 4 x 5 cm form factor are fully mechanically and largely electrically compatible among each other.

All parts are at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Refer ... module ... based on Xilinx ...Refer to http://trenz.org/tec0850te0823-info for the current online version of this manual and other available documentation.

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 'description: Important components and connector or other Features of the module
→ please sort and indicate assembly options

Key Features'  must be split into 6 main groups for modules and mainboards:

  • SoC/FPGA
    • Package: SFVC784
    • Device: ZU2...ZU5*
    • Engine: CG, EG, EV*
    • Speed: -1LI, -2LE,*, **
    • Temperature: I, E,*, **
  • RAM/Storage
    • Low Power DDR4 on PS
      • Data width: 32bit
      • Size: def. 2GB*
      • Speed:***
    • eMMC
      • Data width: 8Bit
      • size: def. 8GB *
    • QSPI boot Flash in dual parallel mode (size depends on assembly version)
      • Data width: 8bit
      • size: def. 128MB *
    • HyperRAM/Flash (optional, default not assembled)
      • size:*
    • MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48)
  • On Board
    • Lattice LCMXO2
    • PLL SI5338
    • Gigabit Ethernet transceiver PHY (Marvell Alaska 88E1512)
    • Hi-speed USB2 ULPI transceiver with full OTG support (Microchip USB3320C)
  • Interface
    • 132 x HP PL I/Os (3 banks)
    • ETH
    • USB
    • 4 GTR (for USB3, Sata, PCIe, DP)
    • MIO for UART
    • MIO for SD
    • MIO for PJTAG
    • JTAG
    • Ctrl
  • Power
    • 3.3V-5V Main Input
    • 3.3V Controller Input
    • Variable Bank IO Power Input
  • Dimension
    • 4 cm x 5 cm
  • Notes
    • * depends on assembly version
    • ** also non low power assembly options possible
    • *** depends on used U+ Zynq and DDR4 combination


Key Features'  must be split into 6 main groups for carrier:

  • Modules
    • TE0808, TE807, TE0803,...
  • RAM/Storage
    • E.g. SDRAM, SPI
  • On Board
    • E.g. CPLD, PLL
  • Interface
    • E.g. ETH, USB, B2B, Display port
  • Power
    • E.g. Input supply voltage
  • Dimension


  • <Replace for module use "SoC/FPGA" for Carrier "Modules">
    • ...
  • RAM/Storage
    • ...
  • On Board
    • ...
  • Interface
    • ...
  • Power
    • ...
  • Dimension
    • ...
  • Notes
    • ...

Block Diagram

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Note

For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .

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titleTE0823 block diagram

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Main Components

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Notes :

  • Picture of the PCB (top and bottom side) with labels of important components
  • Add List below
Note

For more information regarding how to add board photoes, Please refer to "Diagram Drawing Guidline" .

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titleTE0823 main components
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    • Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
      • Application Processor: Dual-core ARM Cortex-A53 MPCore
      • Real-Time Processor: Dual-core ARM Cortex-R5 MPCore
    • Package: SFVC784
    • Device: ZU3
    • Engine: CG
    • Speed: -1LI (also non-low power assembly options possible)
    • Temperature range: industrial
  • RAM/Storage
    • Low power DDR4 on PS with 32 bit data width
    • 128 MByte QSPI boot Flash in dual parallel mode
    • 8 GByte e.MMC memory with 8 bit data width
    • MAC address serial EEPROM with EUI-48 node identity
  • On Board
    • Lattice LCMXO2
    • PLL SI5338
    • Gigabit Ethernet transceiver PHY
    • Hi-speed USB2 ULPI transceiver with full OTG support
  • Interface
    • 132 x HP PL I/Os (3 banks)
    • ETH
    • USB
    • 4 GTR (for USB3, SATA, PCIe, DP)
      Four high-speed serial I/O (HSSIO) interfaces supporting following protocols:
      • PCI Express interface version 2.1 compliant
      • SATA 3.1 specification compliant interface
      • DisplayPort source-only interface with video resolution up to 4k x 2k

      • USB 3.0 specification compliant interface implementing a 5 Gbit/s line rate
      • 1 GB/s serial GMII interface
    • 14 x PS MIOs
      • MIO for UART
      • thereof 6 MIO for SD card interface (default configuration)
      • MIO for PJTAG
    • JTAG
    • Ctrl
  • Power
    • 132 x HP PL I/Os (3 banks)
    • ETH
    • USB
    • 4 GTR (for USB3, SATA, PCIe, DP)
      Four high-speed serial I/O (HSSIO) interfaces supporting following protocols:
      • PCI Express interface version 2.1 compliant
      • SATA 3.1 specification compliant interface
      • DisplayPort source-only interface with video resolution up to 4k x 2k

      • USB 3.0 specification compliant interface implementing a 5 Gbit/s line rate
      • 1 GB/s serial GMII interface
    • 14 x PS MIOs
      • MIO for UART
      • thereof 6 MIO for SD card interface (default configuration)
      • MIO for PJTAG
    • JTAG
    • Ctrl
  • Dimension
    • 4 x 5 cm
  • Notes
    • Rugged for shock and high vibration
    • Evenly spread supply pins for good signal integrity
    • Plug-on module with 2 x 100 pin and 1 x 60 pin Razor Beam High-Speed hermaphroditic Terminal/Socket Strips (low profile, 2,5 mm)

Block Diagram

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For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .



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Main Components

  1. ...
  2. ...
  3. ...

Initial Delivery State

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Notes :

Only components like EEPROM, QSPI flash can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty

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titleInitial delivery state of programmable devices on the module

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Storage device name

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Content

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Notes

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Quad SPI Flash

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  • Overview of Boot Mode, Reset, Enables.
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titleBoot process.
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MODE Signal State

Boot Mode
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titleReset process.
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Signal

B2BI/ONote

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Notes :

  • Picture of the PCB (top and bottom side) with labels of important components
  • Add List below


Note

For more information regarding how to add board photoes, Please refer to "Diagram Drawing Guidline" .



Scroll Title
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titleTE0823 main components


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  1. Xilinx Zynq UltraScale+ XCZU3EG, U1
  2. Red LED (ERR_OUT), D3
  3. Green User LED, D2
  4. Green LED (ERR_STATUS), D4
  5. Red LED (DONE), D1
  6. 10/100/1000 Mbps energy efficient ethernet transceiver, U8
  7. 8Gb DDR4, U2-U3
  8. 512 Mbit QSPI flash memory, U7-U17
  9. B2B connector Samtec Razor Beam, JM1
  10. Programmable clock generator, U10
  11. USB2.0 Transceiver,  U18
  12. B2B connector Samtec Razor Beam, JM3
  13. B2B connector Samtec Razor Beam, JM2
  14. 8 GByte eMMC memory, U6
  15. Lattice Semiconductor MachXO2 System Controller CPLD, U21

Initial Delivery State

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Notes :

  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

Board to Board (B2B) I/Os

FPGA bank number and number of I/O signals connected to the B2B connector:

Only components like EEPROM, QSPI flash can be initialized by default at manufacture.

If there is no components which might have initial data ( possible on carrier) you must keep the table empty


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titleInitial delivery state of programmable devices on the module

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FPGA BankB2B ConnectorI/O Signal CountVoltage LevelNotes

...

Storage device name

Content

Notes

Quad SPI Flash



EEPROM


System Controller CPLD











Configuration Signals

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  • Overview of Boot Mode, Reset, Enables.


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JTAG

MODE Signal State

B2B Connector

TMSTDITDOTCKJTAG_EN

...

Boot Mode








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titleReset process.

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Signal

B2BI/ONote










Signals, Interfaces and Pins

you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

Example:

QSPI
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MIO PinConnected toB2BNotes
MIO12...14

SPI_CS , SPI_DQ0... SPI_DQ3

SPI_SCK

J2

Notes :

  • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
    • SD
    • USB
    • ETH
    • FMC
    • ...
  • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
    • JTAG
    • UART
    • I2C
    • MGT
    • ...

Board to Board (B2B) I/Os

FPGA bank number and number of I/O signals connected to the B2B connector:

Scroll Title
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titleMIOs pinsGeneral PL I/O to B2B connectors information

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MIO PinConnected toB2BNotes

Test Points

FPGA BankB2B ConnectorI/O Signal CountVoltage LevelNotes
































JTAG Interface

JTAG access to the TExxxx SoM through B2B connector JMX.

you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

Example:

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titleJTAG pins connection

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Test PointSignalB2BNotes
10PWR_PL_OKJ2-120
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titleTest Points Information

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Test PointSignalConnected toNotes

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JTAG Signal

B2B Connector

TMS
TDI
TDO
TCK


JTAG_EN


MIO Pins

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs
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Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection

you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

Example:

MIO PinConnected toB2BNotes
MIO12...14

SPI_CS , SPI_DQ0... SPI_DQ3

SPI_SCK

J2QSPI



Designator
Scroll Title
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titleMIOs pins
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titleOn board peripherals

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sortEnabledfalse
cellHighlightingtrue

MIO PinConnected toB2B
Chip/Interface
Notes

...






































Test Points

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you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

Example:

Test PointSignalB2BNotes
10PWR_PL_OKJ2-120

Notes :

Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.



U?? Pin
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titleQuad SPI interface MIOs and pinsTest Points Information

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MIO Pin
Test Point
Schematic
SignalConnected toNotes

...






































On-board Peripherals

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Notes :

  • add subsection for every component which is important for design, for example:
    • Two 100 Mbit Ethernet Transciever PHY
    • USB PHY
    • Programmable Clock Generator
    • Oscillators
    • eMMCs
    • RTC
    • FTDI
    • ...
    • DIP-Switches
    • Buttons
    • LEDs


Notes

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Notes :

In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection

Scroll Title
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titleI2C interface MIOs and pins
Scroll Table Layout
orientationportrait
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repeatTableHeadersdefault
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cellHighlightingtrue
MIO PinSchematicU? Pin


I2C Address
Scroll Title
anchorTable_OBP_I2C_RTC
titleI2C Address for RTCOn board peripherals

Scroll Table Layout
orientationportrait
sortDirectionASC
repeatTableHeadersdefault
style
widths
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sortEnabledfalse
cellHighlightingtrue

MIO Pin
Chip/InterfaceDesignatorNotes