4 x 5.64 ADM6/ADF6 B2B Connectors

The 4 x 5.64 modules use Samtec AcceleRate HD High-Density on bottom side.

• ADM6-60-01.5-L-4-2 (legacy) or ADM6-60-01.5-L-4-0 (240 pins, 60 per row)
  
  •  Mates with ADF6-60-03.5-L-4-2 (legacy) or ADF6-60-03.5-L-4-0

The carriers use Samtec AcceleRate HD High-Density on top side.

• ADF6-60-03.5-L-4-2 (legacy) or ADF6-60-03.5-L-4-0 (240 pins, 60 per row)
  • Mates with ADM6-60-01.5-L-4-0 (legacy) or ADM6-60-01.5-L-4-2

Features

• Board-to-Board connector 240-pins / 60 contacts per row
• Pitch:           0.025" (0.635 mm)
• Data Rate:
  • ADM6-XX-XX.X-X-X-2: 56 Gbps
  • ADM6-XX-XX.X-X-X-0: 64 Gbps
• Mates with: ADM6/APF6
• Insulator Material: Black LCP
• Contact Material:  Copper Alloy
• Plating:                 Au or Sn over 50 µ" (1.27 µm) N
• Operating Temperature Range: -55 ºC to +125 ºC
• Lead-Free solderable: Yes
• RoHS Compliant:        Yes

Connector Mating height

When using the same type on baseboard, the mating height is 5 mm. Other mating heights are possible by using connectors with a different height:

The module can be manufactured using other connectors upon request.

Connector Speed Ratings

The AcceleRate HD High-Density connector speed rating depends on the stacking height; please see the following table:

Current Rating

Current rating of Samtec AcceleRate HD High-Density B2B connectors is 1.34 A per pin (4 pins powered).

Connector Mechanical Ratings

• Shock:      100G, 6 ms Sine
• Vibration:  7.5G random, 2 hours per axis, 3 axes total