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Overview

Trenz Electronic GigaBee also known as TE0600 series are industrial-grade FPGA micromodules integrating an AMD Spartan-6 LX FPGA, Gigabit Ethernet transceiver, two independent banks of 16-bit-wide DDR3 SDRAM, QSPI Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/Os is provided via robust board-to-board (B2B) connectors.

Refer to http://trenz.org/te0600-info for current online available documentation.

Key Features

  • SoC/FPGA/Module

    • AMD FPGA:                XC6SLX25 / XC6SLX45 / XC6SLX75 / XC6SLX100 / XC6SLX150 1)
    • Speedgrade:              -1L / -2 / -3 / -N3 1)
    • Temperature Range:  Commercial / Industrial 1)
    • Package:                    FGG484
  • RAM/Storage

    • 512 MByte DDR3 SDRAM 1)

    • 16 Mbyte QSPI Flash 1)
    • EEPROM with unique MAC/EUI-48 Ethernet address and 768 bit usable storage.
    • Optional EEPROM (DS2432P+) with unique MAC/EUI-48 Ethernet address and 1024 bit usable storage, 104 bit special storage and SHA-1 Engine.
  • On Board

    • 10/100/1000 Mbit Ethernet PHY
    • 100 MHz oscillator
    • 1x LED for FPGA configuration status
    • 1x LED user configurable
  • Interface

    • 3 x B2B Connector (LSHM) for Trenz 4 x 5 SoM socket

      • 104x SE / 52x DIFF
      • 5x SE
  • Power

    • DCDC converters for all on-board voltage rails
  • Dimension

    • 50 mm x 40 mm

  • Notes
    1) Assembly variant dependent.


Block Diagram


TE0600 block diagram

Main Components


TE0600 main components
  1. Spartan 6 FPGA, U5

  2. DDR3 SDRAM, U6, U7

  3. QSPI Flash, U11

  4. EEPROM, U10, U13

  5. Watchdog, U1

  6. Ethernet PHY, U8

  7. Oscillators, U9, U12

  8. Green LEDs, D1, D5
  9. DCDCs, U2, U3, U4, U14
  10. B2B connectors, J1, J2

Initial Delivery State

Storage device name

Content

Notes

QSPI Flash U11

Not programmed


EEPROM, U10

Not programmed

Contains write protected Unique Node ID / MAC .

Optional EEPROM, U13Not programmed

Contains write protected Unique Node ID / MAC  and SHA-1 engine.

DDR3 SDRAM, U6, U7

Not programmed
Initial delivery state of programmable devices on the module

Signals, Interfaces and Pins

Connectors

Connector Type

Designator

Interface

IO CNT

Notes

B2BJ1QSPI6Connects to FPGA U5 and QSPI flash U11.
B2BJ1IO3 SEFPGA IO BANK 2.
B2BJ1IO42 SE / 21 DIFFFPGA IO BANK 2.
B2BJ1Ethernet MDI94x DIFF data.
B2BJ2IO1 SEFPGA IO BANK 0.
B2BJ2IO44 SE / 22 DIFFFPGA IO BANK 0.
B2BJ2IO1 SEFPGA IO BANK 1.
B2BJ2IO12 SE / 6 DIFFFPGA IO BANK 1.
B2BJ2IO6 SEFPGA IO BANK 3.
B2BJ2JTAG4
Board Connectors


Test Points

Test Point

Signal

Notes

TP1

1.5V

TP2

3.3V

TP3

2.5V

TP4

VCCAUX

TP5

1.2V

TP6

GND

TP7

VCCIO0

TP8

VREF1

TP9

VREF2

TP10

MAC_DATA

TP11

1.5V

TP12

3.3V

TP13

2.5V

TP14

VCCAUX

TP16

CLK_P

TP17

PHY_CLK

TP18

GND

TP19

GND

TP20

GND

TP21

GND

TP22

PROG_B

TP23

GND

TP24

VCCIO0

TP25

VREF1

TP26

VREF2
TP27MAC_DATA
TP28CLK_P


Test Points Information

On-board Peripherals

Chip/Interface

Designator

Connected To

Notes

Spartan 6 FPGA

U5

  • DDR3 RAM
  • OSPI Flash
  • EEPROM U10
  • EEPROM U13
  • Watch dog U1
  • Ethernet PHY U8


DDR3 SDRAM

U6 / U7

  • FPGA U5


QSPI Flash

U11

  • FPGA U5
  • B2B connector J1

Accessible via FPGA and B2B.

EEPROM

U10

  • FPGA U5


EEPROM

U13

  • FPGA U5


Watchdog

U1

  • FPGA U5
  • B2B connector J1
  • B2B connector J2


Ethernet PHY

U8

  • B2B connector J1

  • SoC MIO

Gigabit ETH PHY

Oscillator

U12

  • FPGA U5

100 MHz

Oscillator

U9

  • Ethernet PHY U8

25 MHz

On board peripherals

Configuration and System Control Signals

Signal Name

Connector.Pin

Direction1)

Description

ENJ1.28INEnables all voltage converters.
INITJ1.30INOUT

Bidirectional pin for configuration. 2)

SUSPENDJ1.77IN

Dedicated Active-High control pin for power saving. 2)

VFSJ1.81IN

Power supply pin for eFUSE / decryptor key programming. 2)

RFUSEJ1.83IN

Auxilary pin for eFUSE programming. 2)

AWAKEJ1.85INOUT

Status output pin for the power-saving Suspend mode or IO pin. 2)

B2B_PROGBJ2.11IN

Reset signal. Signal to manipulate the PROGRAM_B_2 signal/pin. Active-Low asynchronous reset to configuration logic. 2)

HSWAPPENJ2.13IN

IO Pullup state before and during configuration. 2)

CSO_B / CCLK / MISO / MOSI / MISO3 / MISO2J1.17 / J1.19 / J1.21 / J1.23 / J1.25 / J1.27Signal dependent

QSPI interface. 2)

Refer to Winbond W25Q128JV.

JTAGJ2.93 / J2.95 / J2.97 / J2.99Signal dependent

JTAG interface. 2)

PHY_L10 / PHY_L100 / PHY_L1000 / PHY_DUPLEX / PHY_LED_TX / PHY_LED_RX

J1.17 / J1.19 / J1.21 / J1.23 / J1.25 / J1.27Signal dependent

Ethernet PHY configuration pins for Link Speed, Duplex Mode, MDI crossover and other features.

See Marvell Alaska 88E1111 Datasheet.

PFIJ2.16IN

Power-fail comparator input.

Refer to watchdog datasheet TPS3705-33DGN.

/MRJ2.18IN

Manual reset input.

Refer to watchdog datasheet TPS3705-33DGN.

1) Direction:

    • IN: Input from the point of view of this board.

    • OUT: Output from the point of view of this board.

2) See AMD UG380 / UG385.

Controller signal.

Power and Power-On Sequence

Power Rails

Power Rail Name/ Schematic Name

Connector.Pin

Direction1)

Notes

3.3V

J1.1 / J1.3 / J1.5 / J1.7 / J1.9 / J1.11 / J1.13 / J1.15

J2.2 / J2.4 / J2.6 / J2.8 / J2.10 /J2.12

INSoM supply.
VCCIO0J2.1 / J2.3 / J2.5 / J2.7 / J2.9INFPGA IO Bank 0 supply.
VBATTJ1.79INDecryptor key RAM memory backup supply.

1.2V

J1.41 / J1.43OUTFPGA and Eternet PHY supply.
1.5VJ2.19OUTFPGA DDR Bank 1/3 and DDR RAM supply.
2.5VJ1.39OUTEternet PHY supply.
VCCAUXJ2.91OUTJTAG reference voltage.

1) Direction:

    • IN: Input from the point of view of this board.

    • OUT: Output from the point of view of this board.

Module power rails.

Recommended Power up Sequencing


Sequence

Net name

Recommended Voltage Range

Pull-up/down

Description

Notes

1---Configuration signal setup.See Configuration and System Control Signals.
3.3V- 1)-

Main Power supply.


2VCCIO0- 1)-Bank IO Power supply.
3EN3.3 V (± 5 %)-Enable SoM.

1) Refer to Recommended Operating Conditions.

For more information refer to DS162.

Baseboard Design Hints

Board to Board Connectors

These connectors are hermaphroditic. Odd pin numbers on the module are connected to even pin numbers on the baseboard and vice versa.

4 x 5 modules use two or three Samtec Razor Beam LSHM connectors on the bottom side.

  • 2 x REF-189016-02 (compatible to LSHM-150-04.0-L-DV-A-S-K-TR), (100 pins, "50" per row)
  • 1 x REF-189017-02 (compatible to LSHM-130-04.0-L-DV-A-S-K-TR), (60 pins, "30" per row) (depending on module)
Connector Mating height

When using the same type on baseboard, the mating height is 8mm. Other mating heights are possible by using connectors with a different height

Order numberConnector on baseboardcompatible toMating height
23836REF-189016-01LSHM-150-02.5-L-DV-A-S-K-TR6.5 mm

LSHM-150-03.0-L-DV-A-S-K-TRLSHM-150-03.0-L-DV-A-S-K-TR7.0 mm
23838REF-189016-02LSHM-150-04.0-L-DV-A-S-K-TR8.0 mm

LSHM-150-06.0-L-DV-A-S-K-TRLSHM-150-06.0-L-DV-A-S-K-TR10.0mm
26125REF-189017-01LSHM-130-02.5-L-DV-A-S-K-TR6.5 mm

LSHM-130-03.0-L-DV-A-S-K-TRLSHM-130-03.0-L-DV-A-S-K-TR7.0 mm
24903 REF-189017-02LSHM-130-04.0-L-DV-A-S-K-TR8.0 mm

LSHM-130-06.0-L-DV-A-S-K-TRLSHM-130-06.0-L-DV-A-S-K-TR10.0mm
Connectors.

The module can be manufactured using other connectors upon request.

Connector Speed Ratings

The LSHM connector speed rating depends on the stacking height; please see the following table:

Stacking heightSpeed rating
12 mm, Single-Ended7.5 GHz / 15 Gbps
12 mm, Differential

6.5 GHz / 13 Gbps

5 mm, Single-Ended11.5 GHz / 23 Gbps
5 mm, Differential7.0 GHz / 14 Gbps
Speed rating.
Current Rating

Current rating of  Samtec Razor Beam™ LSHM B2B connectors is 2.0A per pin (2 adjacent pins powered).

Connector Mechanical Ratings
  • Shock: 100G, 6 ms Sine
  • Vibration: 7.5G random, 2 hours per axis, 3 axes total


Manufacturer Documentation

  File Modified
PDF File hsc-report_lshm-lshm-05mm_web.pdf High speed test report Apr 07, 2016 by Thorsten Trenz
PDF File lshm_dv.pdf LSHM catalog page Apr 07, 2016 by Thorsten Trenz
PDF File LSHM-1XX-XX.X-X-DV-A-X-X-TR-FOOTPRINT(1).pdf Recommended layout and stencil drawing Apr 07, 2016 by Thorsten Trenz
PDF File LSHM-1XX-XX.X-XX-DV-A-X-X-TR-MKT.pdf Technical drawing Apr 07, 2016 by Thorsten Trenz
PDF File REF-189016-01.pdf Technical Drawing Apr 07, 2016 by Thorsten Trenz
PDF File REF-189016-02.pdf Technical Drawing Apr 07, 2016 by Thorsten Trenz
PDF File REF-189017-01.pdf Technical Drawing Apr 07, 2016 by Thorsten Trenz
PDF File REF-189017-02.pdf Technical Drawing Apr 07, 2016 by Thorsten Trenz
PDF File TC0923--2523_report_Rev_2_qua.pdf Design qualification test report Apr 07, 2016 by Thorsten Trenz
PDF File tc0929--2611_qua(1).pdf Shock and vibration report Apr 07, 2016 by Thorsten Trenz



Technical Specifications

This TRM is generic for all variants.

  • The voltage ranges are generally the same across variants (exceptions are possible, depending on custom requests).
  • The temperature range can differ depending on the assembly version.
  • The combination of a carrier and a SoM might have different requirements.

Variants of modules are described here: Article Number Information. Please contact us for options.

Absolute Maximum Ratings *)

Power Rail Name/ Schematic Name

Description

Min

Max

Unit

3.3V

Supply power from carrier.

-0.53.75

V

VCCIO0

IO Bank 0 supply power from carrier.

-0.53.75

V

VBATTDecryptor key RAM memory backup supply.-0.54.05

V

VFSeFUSE Programming voltage supply.-0.53.75

V

Absolute maximum ratings

*) Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under "Recommended Operating Condition". Exposure to absolute-maximum rated conditions for extended periods may affect device reliability.

Recommended Operating Conditions

Trenz Electronic classifies modules into temperature range categories by subsumption of its component data (PCB, ICs, connectors, passive components). The temperature ranges are values for ambient air temperature and do not reflect the junction temperature of individual components.

The categories are:

  • Modules with commercial temperature grade are equipped with components that cover at least the ambient temperature range of 0°C to 75°C.
  • Modules with extended temperature grade are equipped with components that cover at least the ambient temperature range of 0°C to 85°C.
  • Modules with industrial temperature grade are equipped with components that cover at least the ambient temperature range of -40°C to 85°C.

These categories do not take into account the entire custom system consisting of:

  • Customer SoC/FPGA design.
  • Cooling solution, active and or passive cooling.
  • Climate or enviromental conditions besides ambient temperature range.
  • Module orientation, neighboring assemblies, neither other heat sources nor the SoC/FPGA as heat source to other components.

Temperature range

The SoM components are capable of being operated at industrial-grade temperatures, which cover at least the range of -40 °C to +85 °C.

The actual operating temperature range will depend on the customer design, usage and cooling solution. Consult Cooling Solutions for more information.

Voltage rails

Parameter

Min

Max

Units

Reference Document

3.3V

3.135

3.465

V


VCCIO01.13.45

V


VBATT1.03.6

V


VFS3.23.4

V


Recommended operating conditions.

Physical Dimensions

  • Module size: 50 mm × 40 mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: 8 mm.

  • PCB thickness: 1.724 ±10 % mm.

All dimensions are shown in millimeters.

Physical Dimension

Currently Offered Variants 

Trenz shop TE0600 overview page*

English page

German page

*)  Module article name encoding table: 6 Series Spartan 6 modules

Trenz Electronic Shop Overview

Revision History

Hardware Revision History

The hardware revision number is located on the PCB next to the module identifier, separated by a dash.


Board hardware revision number.


Date

Revision

Changes

Documentation Link

2024-0104

1. Leds D1, D5 were changed from 19-213/G6C-BM1N2/DT to SML-P11MTT86.
2. R83 was added. Inserted internal pull-up IO resistor option for FPGA via external resistor (R83).
3. D3 was changed from single BAT54VV,115 to pair BAT54A,215.
4. U2 was changed from EN6347QI to MPM3860GQW-Z and adapted power circuit.
5. U3 was changed from EP53F8QI to MPM3834CGPA and adapted power circuit.
6. Testpoints TP11 - TP15 , TP23 - TP28 were added.
7. Changed LDO LP3878SD-ADJ (U4, U14) to TPS74601PBDRVT and adapted power circuit.
8. Assembled clock SiT8008BI-73-XXS-100.000000E (U12).
9. Improved led (D1) driving circuit via adding MOSFET (T1) and resistor (R84) and changed 120 Ohm resistor (R36) to 240 Ohm.
10. Changed 2.2 kOhm resistor (R29) to 100 Ohm.
11. Changed 2.2 kOhm resistor (R56, R57, R58) to 2.4 kOhm.
12. Pulled-down board revision signal "BR0" (FPGA U5, pin P17) and updated board revision documentation.
13. Changed fiducials to standard fiducial type.
14. Changed stacked vias to staggered vias.
15. Signal trace lengths changed.
16. Updated B2B documentation.
17. Renamed document sheets.
18. Updated legal notices, revision history, block and power diagram. Updated page count and order.

REV04

PCN

2016-0803

1. Added NetTie (board revision 03).
2. Optimized placement and routing for DCDC converters.
3. Added tespoints.
4. Changed U9 from SIT1602AI-83-33E-25.0000 to SiT8008AI-73-XXS-25.000000E.
5. Update Razorbeam Connectors, full update lib.
6. Added serial number (Track-it™ Traceability Pad).
7. Added thermal vias to mounting holes.
8. DDR3 changed from IM4G16D3EABG-125I to IM4G16D3FABG-125I for the 4 GBit variants.
9. Change SPI Flash from W25Q128BVEIG to W25Q128FVEIG (W25Q128FVEIG 3V 128MBit Serial Flash) .
10. U13 (DS2432P+) is no longer populated by default.
11. Changed Board revision identification to REV03.

12. Changee SPI Flash from W25Q128FVEIG to W25Q128JVEIQ.

13. Changed DDR3 RAM from IM4G16D3FABG-125I to IS43TR16256BL-125KBLI
14. Clock Revision Change from SiT8008AI-73-XXS-25.000000E to SiT8008BI-73-XXS-25.000000E.
15. LEDs D1 and D5 changed to 19-213/G6C-BM1N2/DT.

REV03

PCN

PCN

PCN

2013-0802

1. More powerful regulators for 1.2V and 1.5V rails.
2. VCCAUX separated from 2.5V power rail.
3. 128 Mbit SPI Flash.
4. Additional secure 1 Kbit EEPROM.
5. Optional B2B connection to bank 2 differential clock input.
6. New memory options.

REV02

PCN

-01Initial release

REV01

Hardware Revision History

Document Change History

Date

Revision

Contributor

Description




v.39



Kilian Jahn


  • Updated to TRM version 4.3
  • Updated TRM to hardware revision 04
  • Minor error corrections
  • Fixed Inter Page Links

  • Updated PDF & PDF-Web Link

2024-03-21
v.28
VY
  • Updated SoM statuses in Assembly variants pin coding Table 
2024-03-11
v.27
MT
  • Added REV04 to assembly variant coding table
  • Added REV04 to revision coding table
  • Added main differences between 03 and 04 revisions
  • Updated nets lengths table
  • Added info about additional 3.3V single-ended oscillator (U12)
  • Updated supply diagram
  • Updated block diagram
2017-04-03

v.26

TT
  • Added REV03 to assembly Variant Table
2016-11-05
v.25
FDR
  • Document ported to wiki and adapted to web presentation.
2016-01-29

v.24

AIK

  • Pause advertise correction
2013-03-13v.23AIK
  • Changed Bank 1 power supply description and VCCIO0 sources description
2013-03-13v.22AIK
  • Connectors current chapter moved to separate document
2013-01-21v.21AIK
  • Added PHY reset note
2012-12-19v.20AIK
  • Fixed SPI Flash size on block diagram
2012-11-30v.19AIK
  • Added Ethernet disable note
2012-11-21v.18AIK
  • Updated module diagram
2012-11-06v.17AIK
  • Fixed bank 1 power options
2012-10-30v.16AIK
  • Fork to 01 and 02 board revisions
2012-07-18v.15AIK
  • Added table with B2B signals summary per FPGA bank
2012-06-18v.14FDR
  • Removed junction temperature limits under connector current ratings.
2012-05-18v.13AIK
  • Corrected cross-reference in section 3.2. Corrected LED description.
2012-04-17v.12FDR
  • Updated documentation link.
  • Replaced obsolete ElDesI and RedMine links with current GitHub links.
  • Updated dating convention.
2012-04-12v.11AIK
  • Added FPGA banks VCCIO voltages table.
2012-01-20v.10AIK
  • Added pin compatibility note and manual reference.
2011-11-11v.9AIK
  • Added pin numbering description for B2B connectors
2011-10-12v.8AIK
  • Fix in eFUSE section.
2011-10-08v.7AIK
  • Little fixes after FDR audit.
2011-10-06v.6AIK
  • Added power consumption section.
2011-10-06v.5AIK
  • Removed net length information for nets which can't be measured right.
2011-10-06v.4AIK
  • Added board photos. Additions to eFUSE section.
2011-10-06v.3AIK
  • Reformatted pin-out tables. Added eFUSE programming section.
2011-10-05v.2AIK
  • Added B2B pin-out section.
2011-10-01v.1AIK
  • Release.

--

all

  • --

Document change history.

Disclaimer

Data Privacy

Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy

Document Warranty

The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.

Limitation of Liability

In no event will Trenz Electronic, its suppliers, or other third parties mentioned in this document be liable for any damages whatsoever (including, without limitation, those resulting from lost profits, lost data or business interruption) arising out of the use, inability to use, or the results of use of this document, any documents linked to this document, or the materials or information contained at any or all such documents. If your use of the materials or information from this document results in the need for servicing, repair or correction of equipment or data, you assume all costs thereof.

Product Disclaimer

Products (incl. Software and Firmware) are exclusively designed, manufactured, and distributed for industrial applications. They are not intended, authorized, or certified for use in critical safety applications, medical devices, aerospace, nuclear, life-support, traffic-control, military, or other environments where malfunction or failure could result in personal injury, death, or significant property or environmental damage.

Trenz Electronic GmbH (“Manufacturer”) excludes any liability for inappropriate use in such contexts. The Customer bears all responsibility for verifying suitability and compliance with applicable regulations when deploying in any critical-use scenario. The Customer also agrees to indemnify and hold harmless the Manufacturer from any third-party claims or liabilities arising from such use.

Copyright Notice

No part of this manual may be reproduced in any form or by any means (including electronic storage and retrieval or translation into a foreign language) without prior agreement and written consent from Trenz Electronic.

Technology Licenses

The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.

Environmental Protection

To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.

REACH, RoHS and WEEE

REACH

Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).

RoHS

Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.



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