The Trenz Electronic TE0818 is an industrial grade MPSoC SOM integrating a Xilinx Zynq UltraScale+ MPSoC, DDR4 SDRAM with 64-Bit width data bus connection, SPI Boot Flash memory for configuration and operation, transceivers and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/Os is provided via rugged high-speed stacking connections in a compact 5.2 cm x 7.6 cm form factor.
Refer to http://trenz.org/te0818-info for the current online version of this manual and other available documentation.
Key Features
SoC
Device: ZU6 / ZU9 / ZU15 1)
Engine: CG / EG 1)
Speedgrade: -1 / -2 1)
Temperature Range: Extended / Industrial 1)
Package: FFVC900
RAM/Storage
4 GByte DDR4 SDRAM 2)
2 x 64 MByte Serial Flash 3)
EEPROM with MAC address
On Board
Oscillator
Interface
4 x B2B Connector (ADM6)
up to 204 PL IO
HP: 156
HD: 48
up to 65 PS MIO
4 GTR
16 GTH
I2C, JTAG, CONFIG
Power
3.3 V power supply via B2B Connector needed 4).
Dimension
76 mm x 52 mm
Notes 1)Please, take care of the possible assembly options. Furthermore, check whether the power supply is powerful enough for your FPGA design. 2) Up to 32 GByte are possible with a maximum bandwidth of 2400 MBit/s. 3) Please, take care of the possible assembly options. 4) Dependant on the assembly option a higher input voltage may be possible
Recommended Power up Sequencing (ED: Needs to be checked in detail!!! It is only copied from TE0817 TRM.)
The power up sequencing highly depends on the use case. In general, it should be possible to enable/disable the processing system (PS) / programmable logic (PL) independently. Furthermore, within the processing logic it should be possible to enable/disable only low-power domain and/or low-power and full-power domain. Additionally, usage of GTR for PS side and GTH for PL side should be possible. Because of this flexibility the needed parts of the following table needs to be selected individually. For detailed information take a look into schematics.
Full-power domainand GTR transceiver power supply.
Main module power supply for full-power domain. 7 A recommended. Power consumption depends mainly on design and cooling solution.
2.2.2
EN_FPD
3.3 V
-
Full-power domain power enable.
2.2.3
PG_FPD
-
PU 3), 3.3 V
Full-power domain power good status.
Module power-on sequencing for full-power domain finished.
2.2.4
EN_DDR
3.3 V
-
DDR memory power enable.
2.2.5
PG_DDR
PU 3), 3.3 V
DDR memory power good status.
Module power-on sequencing for DDR memory finished.
2.3
GTR Transceiver
Procedure for GTR transceiver starting.
PS transceiver usage needs powered PS (low- and full-power domain).
2.3.1
EN_PSGT
3.3 V
-
GTR transceiver power enable.
2.3.2
PG_PSGT
-
PU 3), 3.3 V
GTR transceiver power good status.
Module power-on sequencing for GTR transceiver finished.
2
Programmable Logic (PL)
Procedure for PL starting.
PS and PL can be started independently.
2.1
PL_DCIN
3.3 V (± 5 %) 2)4)
-
Programmable logic power supply.
Main module power supply for programmable logic. 12 A recommended. Power consumption depends mainly on design and cooling solution.
2.2
EN_PL
-
PU 3), 3.3 V
Programmable logic power enable.
2.3
PG_PL
-
PU 3), 3.3 V
Programmable logic power good status.
Module power-on sequencing for programmable logic finished. Periphery and variable bank voltages can be enabled on carrier.
2.4
VCCO_47 / VCCO_48 / VCCO_64 / VCCO_65 / VCCO_66
5)
-
Module bank voltages.
Enable bank voltages after PG_PL deassertion.
2.5
PG_VCU
-
PU 3), 3.3 V
VCU power good status.
3
GTH / GTY Transceiver
Procedure for GTH / GTY transceiver starting.
PL transceiver usage needs powered PL and low-power PS domain.
3.1
GT_DCDC
3.3 V (± 5 %) 2)
-
GTH transceiver power supply.
Main module power supply for GTH transceiver. 5 A recommended. Power consumption depends mainly on design and cooling solution.
3.2
EN_GT_R
3.3 V
-
GTH / GTY transceiver power enable.
3.3
PG_GT_R
-
PU 3), 3.3 V
GTH / GTY transceiver power good status.
1) (optional)
2) Dependent on the assembly option a higher input voltage may be possible.
3) (on module)
4) This value depends highly on DCDC U4. Higher values may be possible with different DCDCs. For more information consult schematic and according datasheets.
5) See DS925 for additional information.
Baseboard Design Hints
Board to Board Connectors
5.2 x 7.6 cm UltraSoM+ modules use four Samtec AcceleRate HD High-Density Slim Body Arrays on bottom side.
4x ADM6-60-01.5-L-4-2 (240 pins, 60 per row)
Mates with ADF6-60-03.5-L-4-2
5.2 x 7.6 cm UltraSoM+ carrier use four Samtec AcceleRate HD High-Density Slim Body Arrays on top side.
4x ADF6-60-03.5-L-4-2 (160-pins)
Mates with ADM6-60-01.5-L-4-2
Features
Board-to-Board Connector 240-pins, 60 contacts per row
0.025" (0.635 mm) pitch
Data Rate: max 56 Gbps
Mates with: ADM6/APF6
Insulator Material: LCP, Black
Contact Material: Copper Alloy
Plating: Au or Sn over 50 µ" (1.27 µm) N
Operating Temperature Range: -55 ºC to +125 ºC
PCIe 5.0 capable: Yes
Lead-Free Solderable: Yes
RoHS Compliant: Yes
Connector Stacking height
When using the standard type on baseboard and module, the mating height is 5 mm.
Other mating heights are possible by using connectors with a different height:
Order number
REF number
Samtec Number
Type
Contribution to stacking height
Comment
30095
REF-30095
ADM6-60-01.5-L-4-2
Module connector
1.5 mm
Standard connector used on modules
31137
REF-31137
ADF6-60-03.5-L-4-2
Baseboard connector
3.5 mm
Standard connector used on carrier
Connectors.
Connector Speed Ratings
The AcceleRate HD High-Density connector speed rating depends on the stacking height; please see the following table:
Stacking height
Speed rating
5 mm
56 Gbps
Speed rating.
Current Rating
Current rating of Samtec AcceleRate HD High-Density B2B connectors is 1.34 A per pin (4 pins powered)
Connector Mechanical Ratings
Shock: 100G, 6 ms Sine
Vibration: 7.5G random, 2 hours per axis, 3 axes total
This TRM is generic for all variants. Temperature range can be differ depending on the assembly version. Voltage range is mostly the same during variants (exceptions are possible, depending on custom request)
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
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Board hardware revision number.
Date
Revision
Changes
Documentation Link
Hardware Revision History
Hardware revision number can be found on the PCB board together with the module model number separated by the dash.
Document Change History
Date
Revision
Contributor
Description
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Technology Licenses
The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.
Environmental Protection
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REACH, RoHS and WEEE
REACH
Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).
RoHS
Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.
WEEE
Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).
Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.
Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.
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