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Table of contents

Overview

Design Example with minimum PS Setup (DDR, QSPI, UART0) only for custom boards or easier debug via SDK.

Refer to http://trenz.org/te0803-info for the current online version of this manual and other available documentation.

Key Features

  • Vitis/Vivado 2019.2
  • QSPI
  • SDK
  • Custom Carrier (minimum PS Design with available module components only)
  • Modified FSBL (some additional outputs only)
  • Special FSBL for QSPI Programming

Revision History

DateVivadoProject BuiltAuthorsDescription
2020-03-252019.2TE0803-test_board-vivado_2019.2-build_8_20200325082253.zip
TE0803-test_board_noprebuilt-vivado_2019.2-build_8_20200325082311.zip
John Hartfiel
  • script update
2020-01-232019-2TE0803-test_board-vivado_2019.2-build_3_20200123070036.zip
TE0803-test_board_noprebuilt-vivado_2019.2-build_3_20200123070049.zip
John Hartfiel
  • 2019.2 update
  • Vitis support
  • FSBL SI programming procedure update 
2019-5-062018.3TE0803-test_board_noprebuilt-vivado_2018.3-build_05_20190506161948.zip
TE0803-test_board-vivado_2018.3-build_05_20190506161936.zip
John Hartfiel
  • custom FSBL
  • new assembly variants
2018-10-262018.2TE0803-test_board_noprebuilt-vivado_2018.2-build_03_20181026141705.zip
TE0803-test_board-vivado_2018.2-build_03_20181026141651.zip
John Hartfiel
  • new assembly variant
2018-08-142018.2TE0803-test_board_noprebuilt-vivado_2018.2-build_02_20180814103119.zip
TE0803-test_board-vivado_2018.2-build_02_20180814103105.zip
John Hartfiel
  • new assembly variant
2018-07-132018.2TE0803-test_board_noprebuilt-vivado_2018.2-build_02_20180713085721.zip
TE0803-test_board-vivado_2018.2-build_02_20180713085704.zip
John Hartfiel
  • additional notes for FSBL generated with Win SDK
  • changed *.bif
2018-05-172017.4TE0803-test_board_noprebuilt-vivado_2017.4-build_09_20180517152118.zip
TE0803-test_board-vivado_2017.4-build_09_20180517152103.zip
John Hartfiel
  • new assembly variant
2018-04-112017.4TE0803-test_board_noprebuilt-vivado_2017.4-build_07_20180411081821.zip
TE0803-test_board-vivado_2017.4-build_07_20180411081757.zip
John Hartfiel
  • bugfix TE0803-01-04EG boart part file
2018-02-132017.4TE0803-test_board_noprebuilt-vivado_2017.4-build_06_20180213120257.zip
TE0803-test_board-vivado_2017.4-build_06_20180213120229.zip
John Hartfiel
  • new assembly variant
2018-02-052017.4TE0803-test_board-vivado_2017.4-build_05_20180205101915.zip
TE0803-test_board_noprebuilt-vivado_2017.4-build_05_20180205101943.zip
John Hartfiel
  • new assembly variant
2018-01-312017.4TE0803-test_board-vivado_2017.4-build_05_20180131124202.zip
TE0803-test_board_noprebuilt-vivado_2017.4-build_05_20180131124215.zip
John Hartfiel
  • new assembly variant
2018-01-182017.4TE0803-test_board-vivado_2017.4-build_05_20180118160549.zip
TE0803-test_board_noprebuilt-vivado_2017.4-build_05_20180118160604.zip
John Hartfiel
  • rework Board Part Files
2017-11-162017.2TE0803-test_board-vivado_2017.2-build_05_20171116152716.zip
TE0803-test_board_noprebuilt-vivado_2017.2-build_05_20171116154619.zip
John Hartfiel
  • Update Board Part CSV File with new Flash assembly variants

2017-11-14

2017.2TE0803-test_board-vivado_2017.2-build_05_20171114090712.zip
TE0803-test_board_noprebuilt-vivado_2017.2-build_05_20171114090725.zip
John Hartfiel
  • Initial release
Design Revision History

Release Notes and Know Issues

IssuesDescriptionWorkaroundTo be fixed version
No known issues---------

Requirements

Software

SoftwareVersionNote
Vitis2019.2needed, Vivado is included into Vitis installation

Hardware

Basic description of TE Board Part Files is available on TE Board Part Files.

Complete List is available on <design name>/board_files/*_board_files.csv

Design supports following modules:

Module ModelBoard Part Short NamePCB Revision SupportDDRQSPI FlashEMMCOthersNotes
TE0803-ES1         es1_2gb    REV01      2GB      64MB       NA         NA               Not longer supported by vivado   
TE0803-01-02EG-1E  2eg_2gb    REV01      2GB      64MB       NA         NA               NA                                 
TE0803-01-02CG-1E  2cg_2gb    REV01      2GB      64MB       NA         NA               NA                                 
TE0803-01-03EG-1E  3eg_2gb    REV01      2GB      64MB       NA         NA               NA                                 
TE0803-01-03CG-1E  3cg_2gb    REV01      2GB      64MB       NA         NA               NA                                 
TE0803-01-02EG-1EA 2eg_2gb    REV01      2GB      128MB      NA         NA               NA                                 
TE0803-01-02CG-1EA 2cg_2gb    REV01      2GB      128MB      NA         NA               NA                                 
TE0803-01-03EG-1EA 3eg_2gb    REV01      2GB      128MB      NA         NA               NA                                 
TE0803-01-03CG-1EA 3cg_2gb    REV01      2GB      128MB      NA         NA               NA                                 
TE0803-02-03EG-1EB 3eg_4gb    REV02|REV014GB      128MB      NA         NA               NA                                 
TE0803-01-04CG-1EA 4cg_2gb    REV01      2GB      128MB      NA         NA               NA                                 
TE0803-01-04EV-1EA 4ev_2gb    REV01      2GB      128MB      NA         NA               NA                                 
TE0803-01-04EV-1E3 4ev_2gb    REV01      2GB      128MB      NA         1 mm connectorsNA                                 
TE0803-01-04EG-1EA 4eg_2gb    REV01      2GB      128MB      NA         NA               NA                                 
TE0803-01-04CG-1EB 4cg_2gb    REV01      2GB      256MB      NA         NA               NA                                 
TE0803-01-05EV-1EA 5ev_2gb    REV01      2GB      128MB      NA         NA               NA                                 
TE0803-01-05EV-1IA 5ev_i_2gb  REV01      2GB      128MB      NA         NA               NA                                 
TE0803-02-04EV-1EB 4ev_4gb    REV02      4GB      128MB      NA         NA               NA                                 
TE0803-02-04EV-1E3 4ev_4gb    REV02      4GB      128MB      NA         1 mm connectorsNA                                 
TE0803-02-04EG-1E3 4eg_4gb    REV02      4GB      128MB      NA         1 mm connectorsNA                                 
TE0803-03-2AE11-A  2cg_2gb    REV03      2GB      128MB      NA         NA               NA                                 
TE0803-03-2BE11-A  2eg_2gb    REV03      2GB      128MB      NA         NA               NA                                 
TE0803-03-3AE11-A  3cg_2gb    REV03      2GB      128MB      NA         NA               NA                                 
TE0803-03-3BE11-A  3eg_2gb    REV03      2GB      128MB      NA         NA               NA                                 
TE0803-03-4AE11-A  4cg_2gb    REV03      2GB      128MB      NA         NA               NA                                 
TE0803-03-4BE11-A  4eg_2gb    REV03      2GB      128MB      NA         NA               NA                                 
TE0803-03-4BE21-L  4eg_4gb    REV03      4GB      128MB      NA         1 mm connectorsNA                                 
TE0803-03-4BI21-A  4eg_i_4gb  REV03      4GB      128MB      NA         NA               NA                                 
TE0803-03-4DE11-A  4ev_2gb    REV03      2GB      128MB      NA         NA               NA                                 
TE0803-03-4DE21-L  4ev_4gb    REV03      4GB      128MB      NA         1 mm connectorsNA                                 
TE0803-03-4GE21-L  4eg_2_4gb  REV03      4GB      128MB      NA         1 mm connectorsNA                                 
TE0803-03-5DE11-A  5ev_2gb    REV03      2GB      128MB      NA         NA               NA                                 
TE0803-03-5DI21-A  5ev_i_4gb  REV03      4GB      128MB      NA         NA               NA                                 
Hardware Modules

Note: Design contains also Board Part Files for TE0803+TEBF0808 configuration, this boart part files are not used for this reference design.

Design supports following carriers:

Carrier ModelNotes
Custom PCB use simple Board Part files, if MIO connected is different to TEBF0808
TEBF0808Used as reference carrier.
TEBT0808-01Change UART0 to UART1 (MIO68...69) and regenerate design
Hardware Carrier

Additional HW Requirements:

Additional HardwareNotes
------
Additional Hardware

Content

For general structure and of the reference design, see Project Delivery - Xilinx devices

Design Sources

TypeLocationNotes
Vivado<design name>/block_design
<design name>/constraints
<design name>/ip_lib
Vivado Project will be generated by TE Scripts
Vitis<design name>/sw_libAdditional Software Template for Vitis and apps_list.csv with settings automatically for Vitis app generation
Design sources

Additional Sources

TypeLocationNotes
---------
Additional design sources

Prebuilt

File

File-Extension

Description

BIF-File*.bifFile with description to generate Bin-File
BIN-File*.binFlash Configuration File with Boot-Image (Zynq-FPGAs)
BIT-File*.bitFPGA (PL Part) Configuration File
Diverse Reports---Report files in different formats
Hardware-Platform-Specification-Files*.xsaExported Vivado Hardware Specification for Vitis and PetaLinux
LabTools Project-File*.lprVivado Labtools Project File
Software-Application-File*.elfSoftware Application for Zynq or MicroBlaze Processor Systems
Prebuilt files (only on ZIP with prebult content)

Download

Reference Design is only usable with the specified Vivado/SDK/PetaLinux/SDx version. Do never use different Versions of Xilinx Software for the same Project.

Reference Design is available on:

Design Flow

Reference Design is available with and without prebuilt files. It's recommended to use TE prebuilt files for first lunch.

Trenz Electronic provides a tcl based built environment based on Xilinx Design Flow.

See also:

The Trenz Electronic FPGA Reference Designs are TCL-script based project. Command files for execution will be generated with "_create_win_setup.cmd" on Windows OS and "_create_linux_setup.sh" on Linux OS.

TE Scripts are only needed to generate the vivado project, all other additional steps are optional and can also executed by Xilinx Vivado/SDK GUI.  For currently Scripts limitations on Win and Linux OS see: Project Delivery Currently limitations of functionality


  1. _create_win_setup.cmd/_create_linux_setup.sh and follow instructions on shell:
  2. Press 0 and enter to start "Module Selection Guide"
  3. (optional Win OS) Generate Virtual Drive or use short directory  for the reference design (for example x:\<design name>)
  4. Create Project (follow instruction of the product selection guide), settings file will be configured automatically during this process
    1. (optional for manual changes) Select correct device and Xilinx install path on "design_basic_settings.cmd" and create Vivado project with "vivado_create_project_guimode.cmd"
      Note: Select correct one, see TE Board Part Files
      Important: Use Board Part Files, which did not ends with *_tebf0808
  5. Create XSA and export to prebuilt folder
    1. Run on Vivado TCL: TE::hw_build_design -export_prebuilt
      Note: Script generate design and export files into \prebuilt\hardware\<short dir>. Use GUI is the same, except file export to prebuilt folder
  6. Generate Programming Files with Vitis
    1. Run on Vivado TCL: TE::sw_run_vitis -all
      Note: Scripts generate applications and bootable files, which are defined in "sw_lib\apps_list.csv"
    2. (alternative) Start SDK with Vivado GUI or start with TE Scripts on Vivado TCL: TE::sw_run_vitis
      Note:  TCL scripts generate also platform project, this must be done manuelly in case GUI is used. See Vitis

Launch

Programming

Check Module and Carrier TRMs for proper HW configuration before you try any design.

Xilinx documentation for programming and debugging: Vivado/SDK/SDSoC-Xilinx Software Programming and Debugging

Get prebuilt boot binaries

  1. _create_win_setup.cmd/_create_linux_setup.sh and follow instructions on shell
  2. Press 0 and enter to start "Module Selection Guide"
    1. Select assembly version
    2. Validate selection
    3. Select Create and open delivery binary folder
      Note: Folder (<project foler>/_binaries_<Artikel Name>) with subfolder (boot_<app name>) for different applications will be generated

QSPI

  1. Connect JTAG and power on carrier with module
  2. Open Vivado Project with "vivado_open_existing_project_guimode.cmd" or if not created, create with "vivado_create_project_guimode.cmd"
  3. Type on Vivado TCL Console: TE::pr_program_flash_binfile -swapp hello_te0803
    Note: To program with SDK/Vivado GUI, use special FSBL (zynqmp_fsbl_flash) on setup

SD

This does not work, because SD controller is not selected on PS.

JTAG

Load configuration and Application with SDK Debugger into device, see:

Usage

QSPI Boot:

  1. Prepare HW like described on section Programming
  2. Connect UART USB (most cases same as JTAG)
  3. Select QSPI Card as Boot Mode
    Note: See TRM of the Carrier, which is used.
  4. Power On PCB
    Note: 1. ZynqMP Boot ROM loads PMU Firmware and  FSBL from QSPI into OCM, 2. FSBL loads Application into DDR

System Design - Vivado

Block Design

Block Design


PS Interfaces

Activated interfaces:

TypeNote
DDR
QSPIMIO
UART0MIO, please select other one, if you have connected uart to second controller or other MIO
SWDT0..1
TTC0..3
PS Interfaces

Constrains

Basic module constrains

_i_bitgen.xdc
set_property BITSTREAM.GENERAL.COMPRESS TRUE [current_design]
set_property BITSTREAM.CONFIG.UNUSEDPIN PULLNONE [current_design]

Design specific constrain

Not needed.

Software Design - SDK/HSI

For SDK project creation, follow instructions from:

Vitis

Application

Template location: ./sw_lib/sw_apps/

zynqmp_fsbl

TE modified 2019.2 FSBL

General:

  • Modified Files: xfsbl_main.c, xfsbl_hooks.h/.c, xfsbl_board.h/.c(search for 'TE Mod' on source code)
  • Add Files:  te_xfsbl_hooks.h/.c (for hooks and board)\n\
  • General Changes: 
    • Display FSBL Banner and Device Name

zynqmp_fsbl_flash

TE modified 2019.2 FSBL

General:

  • Modified Files: xfsbl_initialisation.c, xfsbl_hw.h, xfsbl_handoff.c, xfsbl_main.c
  • General Changes:
    •  Display FSBL Banner
    • Set FSBL Boot Mode to JTAG
    • Disable Memory initialisation

hello_te0803

Hello TE0803 is a Xilinx Hello World example as endless loop instead of one console output.

Additional Software

No additional software is needed.

Appx. A: Change History and Legal Notices

Document Change History

To get content of older revision  got to "Change History"  of this page and select older document revision number.

DateDocument Revision

Authors

Description

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  • Script update
2020-01-23v.22John Hartfiel
  • Release 2019.2
2019-05-07v.21John Hartfiel
  • Release 2018.3
2018-10-26v.18John Hartfiel
  • new assembly variant

2018-08-14

v.16John Hartfiel
  • new assembly variant

2018-07-13

v.15John Hartfiel
  • Release 2018.2

2018-05-18

v.14John Hartfiel
  • new assembly variant

2018-04-11

v.13John Hartfiel
  • bugfix boart part file

2018-04-03

v.11John Hartfiel
  • new assembly variant
2018-01-18v.6John Hartfiel
  • Release 2017.4
2017-11-16v.4John Hartfiel
  • Update assembly versions with new Flash size
2017-11-14v.3John Hartfiel
  • Release 2017.2

All

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Document change history.

Legal Notices

Data Privacy

Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy

Document Warranty

The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.

Limitation of Liability

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Copyright Notice

No part of this manual may be reproduced in any form or by any means (including electronic storage and retrieval or translation into a foreign language) without prior agreement and written consent from Trenz Electronic.

Technology Licenses

The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.

Environmental Protection

To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.

REACH, RoHS and WEEE

REACH

Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).

RoHS

Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.


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