Table of Contents
Overview
The Trenz Electronic TEB0911 UltraRack+ board is an industrial-grade motherboard integrating a Xilinx Zynq Ultrascale+ MPSoC with 4 GByte Flash memory for configuration and operation, DDR4-SDRAM SODIMM socket with 64-bit wide data bus, 20 Gigabit transceivers and powerful switch-mode power supplies for all on-board voltages.. The motherboard exposes the Zynq MPSoC's pins to accessible connectors and provides a whole range of on-board components to test and evaluate the Zynq Ultrascale+ MPSoC and for developing purposes. The motherboard is capable to be fitted to a dedicated enclosure. On the enclosure's rear and front panel, I/O's and MGT interfaces are accessible through 6 on-board FMC connectors and other standard high-speed interfaces for USB3.0, SFP+, SSD, GbE, etc.
Key Features
- Single 24V main power supply
- Motherboard fitted to dedicated enclosure from Trenz ??
- 2x USB3.0 A Connector (Superspeed Host Port (Highspeed at USB2.0))
- Gigabit Ethernet RGMII PHY with RJ45 MegJack
- Dual SFP+ Connector (2x1 Cage)
- DDR4-SDRAM SODIMM socket (64bit bus width)
- SSD (Solid State Disk) Connector
- CAN FD Transceiver (10 Pin IDC connector and 6-pin header)
- 1x DisplayPort
- 4x On-board configuration EEPROMs (1x Microchip 24LC128-I/ST, 3x Microchip 24AA025E48T-I/OT)
- All carrier board peripherals' I²C interfaces muxed to MPSoC's I²C interface
- 6x FMC HPC Connectors
- 6x FMC Fans
- 3x Optional 4-wire PWM fan connectors
- 10 output programmable PLL clock generator Si5345A
- Quad programmable PLL clock generator SI5338A
- 1x SMA coaxial connectors for reference clock signal input
- MicroSD-Socket (bootable)
- 32 Gbit (4 GByte) on-board eMMC flash (8 banks a 4 Gbit)
- System Controller CPLD Lattice MachXO2 7000 HC
- 2x JTAG/UART header ('XMOD FTDI JTAG Adapter'-compatible) for programming MPSoC and SC CPLD
- On-board DC-DC PowerSoCs and LDOs
Additional assembly options are available for cost or performance optimization upon request.
Block Diagram
Put your block diagram here...
Figure 1: TE0xxx-xx block diagram.
Main Components
Put top and bottom pics with labels of the real PCB here...
Table 1: TE0xxx-xx main components.
Add description list of PCB labels here...
Initial Delivery State
Storage device name | Content | Notes |
---|---|---|
User configuration EEPROMs (1x Microchip 24LC128-I/ST, 3x Microchip 24AA025E48T-I/OT) | ||
USB3.0 HUB Configuration EEPROM (Microchip 24LC128-I/ST) | Empty | Not programmed |
Si5338A programmable PLL NVM OTP | ||
Si5345A programmable PLL NVM OTP |
Table 1: Initial delivery state of programmable devices on the module.
Boot Process
For the boot process prior to powering up the board settings must be done via DIP-Switch S3-3 and S3-4. Four boot modes can be selected:
S3-3 (SC_SW1) | S3-4 (SC_SW2) | MIO Location | Description | Notes |
---|---|---|---|---|
OFF | OFF | MIO[43:38] | SD1 Boot Mode (SD-Card on J11) | Supports SD 2.0. |
OFF | ON | MIO[29:26] | PJTAG0 | PS JTAG connection 0 option. |
ON | OFF | MIO[12:0] | QSPI32 | 32-bit addressing, configured with dual on-board QSPI Flash Memory. |
ON | ON | - | JTAG | Dedicated PS interface. |
Table 2: Available boot modes of the on-board Zynq MPSoC
Refer also to the documentation of the SC CPLD firmware of the TEB0911 motherboard.
Signals, Interfaces and Pins
FMC HPC Connectors
The TEB0911 Ultrarack+ offers 6FMC (FPGA Mezzanine Card) connectors with high pin count (HPC) which provides as an ANSI/VITA 57.1 standard a modular interface to the MPSoCs FPGA and exposes numerous of its I/O pins for use by other mezzanine modules and expansion cards.
The connector supports single ended and differential signaling as the I/O's are routed from the FPGA banks as LVDS-pairs to the FMC connector.
Following diagram gives an overview of the FMC connectors and their connections to the Zynq Ultrascale+ MPSoC and the System Controller CPLD U27:
Figure x: General overview of the FMC HPC connectors
All PS MIO banks are powered by on-module DC-DC power rail. All PL I/O banks have separate VCCO input pins in the B2B connectors, valid VCCO should be supplied from the carrier board.
For detailed information about the pin out, please refer to the Pin-out Tables.
The configuration of the PS I/Os MIOx, MIOx ... MIOx, ... depend on the carrier board peripherals connected to these pins.
MGT Lanes
MGT (Multi Gigabit Transceiver) lane consists of one transmit and one receive (TX/RX) differential pairs, two signals each or four signals total per one MGT lane. Following table lists lane number, MGT bank number, transceiver type, signal schematic name, board-to-board pin connection and FPGA pins connection:
Lane | Bank | Type | Signal Name | B2B Pin | FPGA Pin |
---|---|---|---|---|---|
0 | 225 | GTH |
|
|
|
1 | 225 | GTH |
|
|
|
.. | .. | .. | .. | .. | .. |
4 | 224 | GTH |
|
|
|
5 | 224 | GTH |
|
|
|
.. | .. | .. | .. | .. | .. |
Table x: MGT lanes.
Below are listed MGT banks reference clock sources.
Clock signal | Bank | Source | FPGA Pin | Notes |
---|---|---|---|---|
MGT_CLK0_P | 225 | B2B, JM3-33 | MGTREFCLK0P_225, Y6 | Supplied by the carrier board. |
MGT_CLK0_N | 225 | B2B, JM3-31 | MGTREFCLK0N_225, Y5 | Supplied by the carrier board. |
MGT_CLK1_P | 225 | U2, CLK1B | MGTREFCLK1P_225, V6 | On-board Si5338A. |
MGT_CLK1_N | 225 | U2, CLK1A | MGTREFCLK1N_225, V5 | On-board Si5338A. |
MGT_CLK2_P | 224 | B2B, JM3-34 | MGTREFCLK2P_224, AD6 | Supplied by the carrier board. |
MGT_CLK2_N | 224 | B2B, JM3-32 | MGTREFCLK2N_224, AD5 | Supplied by the carrier board. |
MGT_CLK3_P | 224 | U2, CLK2B | MGTREFCLK3P_224, AB6 | On-board Si5338A. |
MGT_CLK3_N | 224 | U2, CLK2B | MGTREFCLK3N_224, AB5 | On-board Si5338A. |
Table x: MGT reference clock sources.
JTAG Interface
JTAG access to the ... is provided through B2B connector ....
JTAG Signal | B2B Connector Pin |
---|---|
TCK | JMx-xx |
TDI | JMx-xx |
TDO | JMx-xx |
TMS | JMx-xx |
Table 5: JTAG interface signals.
System Controller CPLD I/O Pins
Special purpose pins are connected to smaller System Controller CPLD and have following default configuration:
Pin Name | Mode | Function | B2B Connector Pin | Default Configuration |
---|---|---|---|---|
PGOOD | Output | Power Good | J1-148 | Active high when all on-module power supplies are working properly. |
JTAGEN | Input | JTAG Select | J2-131 | Low for normal operation. |
.. | .. | .. | .. | .. |
Table x: System Controller CPLD I/O pins.
Quad SPI Interface
Following line is just an example, change it to your needs.
Quad SPI Flash (U14) is connected to the Zynq PS QSPI0 interface via PS MIO bank 500, pins MIO1 ... MIO6.
Note that table column says "Signal Name", it should match the name used on the schematic.
MIO | Signal Name | U14 Pin |
---|---|---|
1 | SPI-CS | C2 |
2 | SPI-DQ0/M0 | D3 |
3 | SPI-DQ1/M1 | D2 |
4 | SPI-DQ2/M2 | C4 |
5 | SPI-DQ3/M3 | D4 |
6 | SPI-SCK/M4 | B2 |
Table x: Quad SPI interface signals and connections.
SD Card Interface
Describe SD Card interface shortly here if the module has one...
FPGA / SoC Pin | Connected To | Signal Name | Notes |
---|---|---|---|
MIO0 | J10-9 | Card detect switch | |
MIO10 | J10-7 | DAT0 | |
MIO11 | J10-3 | CMD | |
MIO12 | J10-5 | CLK | |
MIO13 | J10-8 | DAT1 | |
MIO14 | J10-1 | DAT3 | |
MIO15 | J10-2 | CD/DAT3 |
Table x: SD Card interface signals and connections.
Ethernet Interface
On board Gigabit Ethernet PHY is provided with ...
Ethernet PHY connection
PHY Pin | PS | PL | B2B | Notes |
---|---|---|---|---|
Table x: ...
USB Interface
USB PHY is provided with ...
PHY Pin | Pin | B2B Name | Notes |
---|---|---|---|
Table x: ...
The schematic for the USB connector and required components is different depending on the USB usage. USB standard A or B connectors can be used for Host or Device modes. A Mini USB connector can be used for USB Device mode. A USB Micro connector can be used for Device mode, OTG Mode or Host Mode.
I2C Interface
On-board I2C devices are connected to MIO.. and MIO.. which are configured as I2C... by default. I2C addresses for on-board devices are listed in the table below:
I2C Device | I2C Address | Notes |
---|---|---|
Table x: I2C slave device addresses.
On-board Peripherals
System Controller CPLD
The System Controller CPLD (U2) is provided by Lattice Semiconductor LCMXO2-256HC (MachXO2 Product Family). The SC-CPLD is the central system management unit where essential control signals are logically linked by the implemented logic in CPLD firmware, which generates output signals to control the system, the on-board peripherals and the interfaces. Interfaces like JTAG and I2C between the on-board peripherals and to the FPGA module are by-passed, forwarded and controlled by the System Controller CPLD.
Other tasks of the System Controller CPLD are the monitoring of the power-on sequence and to display the programming state of the FPGA module.
For detailed information, refer to the reference page of the SC CPLD firmware of this module.
DDR Memory
By default TE0xxx module has ... DDRx SDRAM chips arranged into 32-bit wide memory bus providing total of 1 GBytes of on-board RAM. Different memory sizes are available optionally.
Quad SPI Flash Memory
On-board QSPI flash memory (U14) on the TE0745-02 is provided by Micron Serial NOR Flash Memory N25Q256A with 256 Mbit (32 MByte) storage capacity. This non volatile memory is used to store initial FPGA configuration. Besides FPGA configuration, remaining free flash memory can be used for user application and data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths. Maximum data rate depends on the selected bus width and clock frequency used.
SPI Flash QE (Quad Enable) bit must be set to high or FPGA is unable to load its configuration from flash during power-on. By default this bit is set to high at the manufacturing plant.
Gigabit Ethernet PHY
On-board Gigabit Ethernet PHY (U7) is provided with Marvell Alaska 88E1512 IC (U8). The Ethernet PHY RGMII interface is connected to the Zynq Ethernet0 PS GEM0. I/O voltage is fixed at 1.8V for HSTL signaling. The reference clock input of the PHY is supplied from an on-board 25.000000 MHz oscillator (U9), the 125MHz output clock signal CLK_125MHZ is connected to the pin J2-150 of B2B connector J2.
High-speed USB ULPI PHY
Hi-speed USB ULPI PHY (U32) is provided with USB3320 from Microchip. The ULPI interface is connected to the Zynq PS USB0 via MIO28..39, bank 501 (see also section). The I/O voltage is fixed at 1.8V and PHY reference clock input is supplied from the on-board 52.000000 MHz oscillator (U33).
MAC Address EEPROM
A Microchip 24AA025E48 serial EEPROM (U23) contains a globally unique 48-bit node address, which is compatible with EUI-48(TM) specification. The device is organized as two blocks of 128 x 8-bit memory. One of the blocks stores the 48-bit node address and is write protected, the other block is available for application use. It is accessible over I2C bus with slave device address 0x53.
RTC - Real Time Clock
An temperature compensated Intersil ISL...
Programmable Clock Generator
There is a Silicon Labs I2C programmable quad PLL clock generator on-board (Si5338A, U2) to generate various reference clocks for the module.
Si5338A Pin | Signal Name / Description | Connected To | Direction | Note |
---|---|---|---|---|
IN1 | - | Not connected. | Input | Not used. |
IN2 | - | GND | Input | Not used. |
IN3 | Reference input clock. | U3, pin 3 | Input | 25.000000 MHz oscillator, Si8208AI. |
IN4 | - | GND | Input | I2C slave device address LSB. |
IN5 | - | Not connected. | Input | Not used. |
IN6 | - | GND | Input | Not used. |
CLK0A | CLK1_P | U1, R23 | Output | FPGA bank 45. |
CLK0B | CLK1_N | U1, P23 | Output | FPGA bank 45. |
CLK1A | MGT_CLK1_N | U1, V5 | Output | FPGA MGT bank 225 reference clock. |
CLK1B | MGT_CLK1_P | U1, V6 | Output | FPGA MGT bank 225 reference clock. |
CLK2A | MGT_CLK3_N | U1, AB5 | Output | FPGA MGT bank 224 reference clock. |
CLK2B | MGT_CLK3_P | U1, AB6 | Output | FPGA MGT bank 224 reference clock. |
CLK3A | CLK0_P | U1, pin T24 | Output | FPGA bank 45. |
CLK3B | CLK0_N | U1, pin T25 | Output | FPGA bank 45. |
Table : Programmable quad PLL clock generator inputs and outputs.
Oscillators
The module has following reference clock signals provided by on-board oscillators and external source from carrier board:
Clock Source | Schematic Name | Frequency | Clock Destination |
---|---|---|---|
.. | .. | .. | .. |
SiTime SiT8008BI oscillator, U21 | - | 25.000000 MHz | Quad PLL clock generator U16, pin 3. |
Table : Reference clock signals.
On-board LEDs
LED | Color | Connected to | Description and Notes |
---|---|---|---|
D1 | Green | ||
.. | .. | .. | .. |
Table : On-board LEDs.
Power and Power-On Sequence
Power Consumption
The maximum power consumption of a module mainly depends on the design running on the FPGA.
Xilinx provide a power estimator excel sheets to calculate power consumption. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.
Power Input | Typical Current |
---|---|
VIN | TBD* |
3.3VIN | TBD* |
Table : Typical power consumption.
* TBD - To Be Determined soon with reference design setup.
Power supply with minimum current capability of ...A for system startup is recommended.
For the lowest power consumption and highest efficiency of the on-board DC-DC regulators it is recommended to power the module from one single 3.3V supply. All input power supplies have a nominal value of 3.3V. Although the input power supplies can be powered up in any order, it is recommended to power them up simultaneously.
The on-board voltages of the TE07xx SoC module will be powered-up in order of a determined sequence after the external voltages '...', '...' and '...' are available. All those power-rails can be powered up, with 3.3V power sources, also shared. <-- What?
Power Distribution Dependencies
Regulator dependencies and max. current.
Put power distribution diagram here...
Figure : Module power distribution diagram.
See Xilinx data sheet ... for additional information. User should also check related base board documentation when intending base board design for TE07xx module.
Power-On Sequence
The TE07xx SoM meets the recommended criteria to power up the Xilinx Zynq MPSoC properly by keeping a specific sequence of enabling the on-board DC-DC converters dedicated to the particular functional units of the Zynq chip and powering up the on-board voltages.
Following diagram clarifies the sequence of enabling the particular on-board voltages, which will power-up in descending order as listed in the blocks of the diagram:
Put power-on diagram here...
Figure : Module power-on diagram.
Voltage Monitor Circuit
If the module has one, describe it here...
Power Rails
NB! Following table with examples is valid for most of the 4 x 5 cm modules but depending on the module model and specific design, number and names of power rails connected to the B2B connectors may vary.
Power Rail Name | B2B JM1 Pins | B2B JM2 Pins | Direction | Notes |
---|---|---|---|---|
VIN | 1, 3, 5 | 2, 4, 6, 8 | Input | Main supply voltage from the carrier board. |
3.3V | - | 10, 12, 91 | Output | Module on-board 3.3V voltage supply. (would be good to add max. current allowed here if possible) |
B64_VCO | 9, 11 | - | Input | HR (High Range) bank voltage supply from the carrier board. |
VBAT_IN | 79 | - | Input | RTC battery supply voltage from the carrier board. |
... | ... | ... | ... | ... |
Table : Module power rails.
Different modules (not just 4 x 5 cm ones) have different type of connectors with different specifications. Following note is for Samtec Razor Beam™ LSHM connectors only, but we should consider adding such note into included file in Board to Board Connectors section instead of here.
Current rating of Samtec Razor Beam™ LSHM B2B connectors is 2.0A per pin (2 adjacent pins powered).
Bank Voltages
Bank | Schematic Name | Voltage | Voltage Range |
---|---|---|---|
500 (MIO0) | PS_1.8V | 1.8V | - |
501 (MIO1) | PS_1.8V | 1.8V | - |
502 (DDR3) | 1.35V | 1.35V | - |
12 HR | VCCIO_12 | User | HR: 1.2V to 3.3V |
13 HR | VCCIO_13 | User | HR: 1.2V to 3.3V |
33 HP | VCCIO_33 | User | HP: 1.2V to 1.8V |
34 HP | VCCIO_34 | User | HP: 1.2V to 1.8V |
35 HP | VCCIO_35 | User | HP: 1.2V to 1.8V |
Table : Module PL I/O bank voltages.
Board to Board Connectors
Variants Currently In Production
NB! Note that here we look at the module as a whole, so you just can't rely only on junction temperature or max voltage of particular SoC or FPGA chip on the module. See examples in the table below.
Module Variant | FPGA / SoC | Operating Temperature | Temperature Range |
---|---|---|---|
TE0710-02-35-2CF | XC7A35T-2CSG324C | 0°C to +70°C | Commercial |
TE0715-04-30-3E | XC7Z030-3SBG485E | 0°C to +85°C | Extended |
TE0841-01-035-1I | XCKU035-1SFVA784I | –40°C to +85°C | Industrial |
.. | .. | .. | .. |
Table : Module variants.
Technical Specifications
Absolute Maximum Ratings
Parameter | Min | Max | Units | Reference Document |
---|---|---|---|---|
VIN supply voltage | V | - | ||
Storage temperature | °C | - |
Table : Module absolute maximum ratings.
Recommended Operating Conditions
Parameter | Min | Max | Units | Reference Document |
---|---|---|---|---|
VIN supply voltage | ||||
Operating temperature |
Table : Module recommended operating conditions.
Operating Temperature Ranges
Commercial grade: 0°C to +70°C.
Extended grade: 0°C to +85°C.
Industrial grade: -40°C to +85°C.
Module operating temperature range depends also on customer design and cooling solution. Please contact us for options.
Physical Dimensions
Module size: ... mm × ... mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: ... mm.
PCB thickness: ... mm.
Highest part on PCB: approx. ... mm. Please download the step model for exact numbers.
All dimensions are given in millimeters.
Put mechanical drawings here...
Figure : Module physical dimensions drawing.
Revision History
Hardware Revision History
Date | Revision | Notes | PCN | Documentation Link |
---|---|---|---|---|
- | 01 | Prototypes |
Table : Module hardware revision history.
Hardware revision number can be found on the PCB board together with the module model number separated by the dash.
Put picture of actual PCB showing model and hardware revision number here...
Figure : Module hardware revision number.
Document Change History
Date | Revision | Contributors | Description |
---|---|---|---|
John Hartfiel | Remove Link to Download | ||
2017-11-10 | v.58 | Ali Naseri |
|
2017-09-06 | v.56 | Jan Kumann |
|
2017-09-02 | v.54 | Jan Kumann | DDR Memory section added. |
2017-08-27 | v.43 | John Hartfiel |
|
2017-08-16 | v.42 | Jan Kumann |
|
2017-08-07 | v.32 | Jan Kumann | Few corrections and cosmetic changes. |
2017-07-14 | v.25 | John Hartfiel | Removed weight section update template version |
2017-06-08 | v.20 | John Hartfiel | Add revision number and update document change history |
2017-05-30 | v.1 | Jan Kumann | Initial document. |
all | Jan Kumann, John Hartfiel |
Table : Document change history.
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Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.
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