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Overview

The TE0320 is an industrial-grade FPGA micromodule integrating a leading-edge Xilinx Spartan-3A DSP FPGA, a USB 2.0 microcontroller, 32-bit wide 128 MByte DDR RAM, 4 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/Os is provided via robust board-to-board (B2B) connectors.
All this on a tiny footprint, smaller than a credit card, at the most competitive price. Hardware and software development environment as well as reference designs are available at: www.trenz-electronic.de.

   Sample Applications

  • Cryptographic hardware module
  • Digital signal processing
  • Embedded educational platform
  • Embedded industrial OEM platform
  • Embedded system design
  • Emulation platforms
  • FPGA graphics
  • Image processing
  • IP (intellectual property) cores
  • Low-power design
  • Parallel processing
  • Rapid prototyping
  • Reconfigurable computing
  • System-on-Chip (SoC) development

 

 

TE0320, top view
TE0320, bottom view.

 
 

Key Features

  • Industrial-grade Xilinx Spartan-3A DSP FPGA module (1800 k gates or 3400 k gates)
  • USB 2.0 (Hi-Speed USB) interface with a signalling bit rate of up to 480 Mbit/s
  • 32-bit wide 1 Gbit DDR SDRAM
  • FPGA configuration through:
  • JTAG (B2B connector, pin header)
  • SPI Flash memory
  • Large SPI Flash memory (for configuration and operation) accessible through:
  • B2B connector (SPI direct)
  • FPGA JTAG port (SPI indirect)
  • USB bus (Firmware Upgrade Tool)
  • On-board 100 MHz oscillator for high performance
  • On-board 24 MHz oscillator available to user
  • 3 on-board high-power, high-efficiency, switch-mode DC-DC converters capable of 3 A each
  • Power supply range: 4.0 - 7.0 V
  • Power supply via USB or B2B (carrier board)
  • 4 LEDs, 2 push buttons, 8 DIP switches.
  • Plug-on module with 2 female 1.27 mm pitch header connectors
  • 109 FPGA I/O pins (+ 10 dual-purpose pins) available on B2B connectors
  • Evenly spread supply pins for good signal integrity
  • Assembly options for cost or performance optimization available on request

Module Options

  • FPGA options
    Module can be ordered with Spartan-3A DSP XC3SD1800A or XC3SD3400A chip.
  • Flash options
    Module can be ordered with 32, 64 or 128 Mbit SPI Flash chip.
  • Temperature grade options
    Module can be ordered in commercial or in extended (from -25 C° to +85 C°) temperature grade.

Block Diagram

TE0320 block diagram


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