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Table of Contents
Overview
The Trenz Electronic TEM0005-02 is a low-cost module with Microsemi SmartFusion2 SoC and 32 MByte flash memory for configuration and operation. SmartFusion2 combines a 166 MHz Cortex-M3 MCU with 256 KByte Flash and 80 KByte SRAM as well as 12 kLUT FPGA Core Logic.
Refer to http://trenz.org/tem0005-info for the current online version of this manual and other available documentation.
Key Features
- SoC/FPGA
- Package: VFG400
- Device: M2S010, M2S050 *
- Engine: 166Mhz 32Bit ARM Cortex-M3
- Speed: Standard
- Temperature: C, I*
- RAM/Storage
- Low Power DDR3
- Data width: 16bit
- Size: def. 2Gb
- SPI Flash
- size: 256 M bit
- 2Kb EEPROM
- Low Power DDR3
- On Board
- Crypto Authentication IC
- Voltage monitor IC
- 10/100 Mbps PHY Ethernet
- Interface
- Samtec ST5 B2B Connector
- Power
- 3.3V supplied from carrier
- Dimension
- 56 x 31 mm
- Notes
- * depends on assembly version
Block Diagram
Main Components
- Microsemi SmartFusion2 SoC, U2
- Dual DCDC Regulator, U7
- EEPROM, U4
- 10/100 Mb Ethernet, U1
- QSPI Flash, U3
- Authentication IC, U6
- DDR3 Memory, U5
- B2B Connector, J1
Initial Delivery State
Storage device name | Content | Notes |
---|---|---|
Quad SPI Flash | Not Programmed | |
EEPROM | Not Programmed | |
CryptoAuthentication | Not Programmed |
Configuration Signals
Signal | B2B | I/O | Note |
---|---|---|---|
RESET | J1-11 | Active low reset |
Signals, Interfaces and Pins
Board to Board (B2B) I/Os
FPGA bank number and number of I/O signals connected to the B2B connector, J1.
FPGA Bank | Interface | I/O Signal Count | Voltage Level | Notes |
---|---|---|---|---|
Bank 1 | GPIO | 8x Single Ended | 3.3V | |
UART | 4x Single Ended | 3.3V | ||
I2C | 2x Single Ended | 3.3V | ||
GOLDEN | 1x Single Ended | 3.3V | ||
Bank 2 | ULPI/I/O | 12x Single Ended | 3.3V | |
I2C | 2x Single Ended | 3.3V | ||
GPIO | 10x Single Ended | 3.3V | ||
SC SPI | 4x Single Ended | 3.3V | ||
SPI1 | 7x Single Ended | 3.3V | ||
Bank 3 | JTAG | 5x Single Ended | 3.3V | |
Reset | 1x Single Ended | 3.3V | ||
Bank 4 | I/O | 24x Single Ended/12 LVDS pairs | 3.3V | |
Bank 6 | I/O | 28x Single Ended/14 LVDS pairs | VDDI6 | max 2.5V |
Bank 7 | I/O | 4x Single Ended | 3.3V |
JTAG Interface
JTAG access to the TEM0005 SoM through B2B connector J1.
JTAG Signal | B2B Connector |
---|---|
TMS | J1-14 |
TDI | J1-8 |
TDO | J1-10 |
TCK | J1-12 |
TRST | J1-7 |
Test Points
Test Point | Signal | Connected to | Notes |
---|---|---|---|
TP1 | CLKOUT | Regulator, U7 |
On-board Peripherals
Chip/Interface | Designator | Notes |
---|---|---|
QSPI | U3 | |
DDR3L SDRAM | U5 | |
TEM0005 TRM#EEPROM | U4 | |
Authentication IC | U6 | |
Ethernet PHY | U1 | |
Oscillators | Y3 |
(Quad) SPI Flash Memory
The TEM0005 is equipped with a (Q)SPI flash memory, U3 provided in order to store data and configuration.
Schematic | U3 Pin | Connected to | Notes |
---|---|---|---|
SPI0_SS0 | nCE | FPGA Bank 2 | |
SPI0_CLK | SCK | FPGA Bank 2 | |
SPI0_SDO | SI/IO0 | FPGA Bank 2 | |
SPI0_SDI | SO/IO0 | FPGA Bank 2 |
EEPROM
The TEM0005 is equipped with an EEPROM IC, U4. The I2C signals are connected to authentication IC as well.
Schematic | U4 Pin | Notes |
---|---|---|
I2C0_SCL | SCL | |
I2C0_SDA | SDA |
Pin | I2C Address | Designator | Notes |
---|---|---|---|
SCL/SDA | 0x70 | U4 |
Authentication IC
There is an Authentication IC ATECC608A provided on TEM0005, The IC is connected to I2C0 bus.
Pin | Schematic | Notes |
---|---|---|
SCL | I2C0_SCL | Serial Clock |
SDA | I2C1_SCL | Serial Data |
Pin | I2C Address | Designator | Notes |
---|---|---|---|
SCL/SDA | 0xC0 | U6 | This is the default value, which can be changed, see device datasheet. |
DDR3L SDRAM
The TEM0005 SoM has 2 Gb volatile DDR3L SDRAM IC for storing user application code and data.
- Part number: IS43TR16128CL-125KBLI
- Supply voltage: 1.5 V
- Temperature: -40 to 95 °C
Ethernet Transceiver
On board 10/100 Mbps Ethernet Transceiver U1 is provided on the module TEM0005.
U1 Pin | Signal Name | Connected to | Note |
---|---|---|---|
RXM/RXP | ETH1_RX | B2B, J1 | |
TXM/TXP | ETH1_TX | B2B, J1 | |
LED0/NWAYEN | ETH1_LED0 | B2B, J1 | |
LED1/SPEED | ETH1_LED1 | B2B, J1 | |
MDIO | ETH1_MDIO | FPGA Bank 7, U2 | |
MDC | ETH1_MDC | FPGA Bank 7, U2 | |
REXT | - | GND | |
INTRP | ETH1_INTRP | FPGA Bank 7, U2 | |
XO/XI | - | Crystal Oscillator, Y3 | |
nRST | ETH1_RST | FPGA Bank 7, U2 | |
CONFIG0...2 | ETH1_COL/CRC/RXDV | FPGA Bank 7, U2 | |
TXC | ETH1_TXC | FPGA Bank 7, U2 | |
TXEN | ETH1_TXEN | FPGA Bank 7, U2 | |
TXD0...3 | ETH1_TXD0...3 | FPGA Bank 7, U2 | |
RXD0...3 | ETH1_RXD0...3 | FPGA Bank 7, U2 | |
RXC | ETH1_RXC | FPGA Bank 7, U2 | |
RXCER | ETH1_RXCER | FPGA Bank 7, U2 |
Clock Sources
Designator | Description | Frequency | Note |
---|---|---|---|
Y3 | Crystal Oscillator | 25 MHz | Connected to ETH PHY |
Power and Power-On Sequence
Power Supply
Power supply with minimum current capability of 1.5 A for system startup is recommended.
Power Consumption
Power Input Pin | Typical Current |
---|---|
VIN | TBD* |
* TBD - To Be Determined
Power Distribution Dependencies
Power-On Sequence
Voltage Monitor Circuit
The TEM0005 is equipped with a voltage monitoring IC, U8. Reset Logic Output (nRST) asserts low when any of the V1, V2, or ADJ inputs are below their reset thresholds.
Power Rails
Power Rail Name | B2B Connector J1 Pin | Direction | Notes |
---|---|---|---|
3.3V | 1, 2, 3, 4 | Input | |
VDDI6 | 22 | Input |
Bank Voltages
Bank | Schematic Name | Voltage | Notes |
---|---|---|---|
Bank0 | 1.5V | 1.5V | |
Bank1 | 3.3V | 3.3V | |
Bank2 | 3.3V | 3.3V | |
Bank3 | 3.3V | 3.3V | |
Bank4 | 3.3V | 3.3V | |
Bank5 | 3.3V | 3.3V | |
Bank6 | VDDI6 | max. 2.5V | supplied by carrier |
Bank7 | 3.3V | 3.3V |
Board to Board Connectors
Technical Specifications
Absolute Maximum Ratings
Symbols | Description | Min | Max | Unit |
---|---|---|---|---|
VIN | Input Supply Voltage | -0.3 | 3.63 | V |
STG_T | Storage Temperature | -45 | 125 | °C |
Recommended Operating Conditions
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
Parameter | Min | Max | Units | Reference Document |
---|---|---|---|---|
VIN | 3.15 | 3.45 | V | See the carrier datasheets. |
OPT_T | 0 /-40 | 85 / 100 | °C | See Microsemi Smartfusion2 datasheet. Depends on assembly version. |
Physical Dimensions
Module size: 56 mm × 31 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 4 mm.
PCB thickness: 1.6 mm.
Currently Offered Variants
Trenz shop TEM0005 overview page | |
---|---|
English page | German page |
Revision History
Hardware Revision History
Hardware revision number can be found on the PCB board together with the module model number separated by the dash.
Document Change History
Date | Revision | Contributor | Description |
---|---|---|---|
| |||
-- | all |
|
Disclaimer
Data Privacy
Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy
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The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.
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WEEE
Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).
Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.
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