5.2 x 7.6 UltraSoM+ ADF6 and ADM6 B2B Connectors

5.2 x 7.6 cm UltraSoM+ modules use four Samtec AcceleRate HD High-Density Slim Body Arrays on bottom side.

• 4x ADM6-60-01.5-L-4-2 (240 pins, 60 per row)
  
  •  Mates with ADF6-60-03.5-L-4-2

5.2 x 7.6 cm UltraSoM+ carrier use four Samtec AcceleRate HD High-Density Slim Body Arrays on top side.

• 4x ADF6-60-03.5-L-4-2 (160-pins)
  
  • Mates with ADM6-60-01.5-L-4-2

Features

• Board-to-Board Connector 240-pins, 60 contacts per row
• 0.025" (0.635 mm) pitch
• Data Rate: max 56 Gbps 
• Mates with: ADM6/APF6
• Insulator Material: LCP, Black
• Contact Material:  Copper Alloy
• Plating: Au or Sn over 50 µ" (1.27 µm) N
• Operating Temperature Range: -55 ºC to +125 ºC
• PCIe 5.0 capable: Yes
• Lead-Free Solderable: Yes
• RoHS Compliant: Yes

Connector Stacking height

When using the standard type on baseboard and module, the mating height is 5 mm.

Other mating heights are possible by using connectors with a different height:

Connector Speed Ratings

The  AcceleRate HD High-Density  connector speed rating depends on the stacking height; please see the following table:

Current Rating

Current rating of  Samtec AcceleRate HD High-Density B2B connectors is 1.34 A per pin (4 pins powered)

Connector Mechanical Ratings

• Shock: 100G, 6 ms Sine
• Vibration: 7.5G random, 2 hours per axis, 3 axes total