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5.2 x 7.6 cm UltraSoM+ modules use four Samtec AcceleRate HD High-Density Slim Body Arrays on bottom side.

  • 4x ADM6-60-01.5-L-4-2 (240 pins, 60 per row)
    •  Mates with ADF6-60-01.5-L-4-2

5.2 x 7.6 cm UltraSoM+ carrier use four Samtec AcceleRate HD High-Density Slim Body Arrays on top side.

  • 4x ADF6-60-03.5-L-4-2 (160-pins)
    • Mates with ADM6-60-01.5-L-4-2
Features
  • Board-to-Board Connector 240-pins, 60 contacts per row
  • 0.025" (0.635 mm) pitch
  • Data Rate: max 56 Gbps 
  • Mates with: ADM6/APF6
  • Insulator Material: LCP, Black
  • Contact Material:  Copper Alloy
  • Plating: Au or Sn over 50 µ" (1.27 µm) N
  • Operating Temperature Range: -55 ºC to +125 ºC
  • PCIe 5.0 capable: Yes
  • Lead-Free Solderable: Yes
  • RoHS Compliant: Yes
Connector Stacking height

When using the standard type on baseboard and module, the mating height is 5 mm.

Other mating heights are possible by using connectors with a different height:

Order numberREF numberSamtec NumberTypeContribution to stacking heightComment
30095REF-30095ADM6-60-01.5-L-4-2Module connector1.5 mmStandard connector used on modules
31137REF-31137ADF6-60-03.5-L-4-2Baseboard connector3.5 mmStandard connector used on carrier
Connectors.
Connector Speed Ratings

The  AcceleRate HD High-Density  connector speed rating depends on the stacking height; please see the following table:

Stacking heightSpeed rating
5 mm56 Gbps
Speed rating.
Current Rating

Current rating of  Samtec AcceleRate HD High-Density B2B connectors is 1.34 A per pin (4 pins powered)

Connector Mechanical Ratings
  • Shock: 100G, 6 ms Sine
  • Vibration: 7.5G random, 2 hours per axis, 3 axes total


Manufacturer Documentation


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