You are viewing an old version of this page. View the current version.

Compare with Current View Page History

Version 1 Next »

Table of Contents

Overview

The Trenz Electronic TE0714 is an industrial-grade SoM (System om Module) based on Xilinx Artix-7, 16 megabyte Flash memory and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/Os is provided via rugged high-speed stacking strips. All modules in 4 x 5 cm form factor are mechanically compatible.

Block diagram

Board Components

Top view

Bottom view

Main Components:

  1. Artix-7

  2. B2B-Connector

    1. JM1

    2. JM2

Key Features

  • Xilinx Artix-7 (A15T, A35T, A50T)

  • Rugged for shock and high vibration
  • 16 MByte QSPI Flash memory
  • Plug-on module with 2 × 100-pin high-speed hermaphroditic strips
  • 144 FPGA I/Os (68 LVDS pairs possible, Analog 1 x ADC) available on board-to-board connectors
  • 4 GTP (high-performance transceiver) lanes
    • GTP (high-performance transceiver) clock input
  • On-board high-efficiency DC-DC converters
    • 3 A x 1.35 V power rail
    • 3 A x 1 V power rail
    • 1.5 A x 1 V power rail
    • 1.5 A x 1.2 V power rail
    • 600 mA x 1.8 V power rail
  • System management
  • eFUSE bit-stream encryption
  • AES bit-stream encryption
  • LED
  • Evenly-spread supply pins for good signal integrity

Assembly options for cost or performance optimization available upon request. Possible options:

  • FPGA Type (A15T, A35T, A50T), temperature grade
  • GT Clock Frequency (or none if not assembled)
  • PL Clock Frequency and precision or none if not assembled)
  • Config and B14 Bank Voltage: 1.8V or 3.3V
  • SPI Flash type (or none if not assembled)
  • LED Color (or none if not assembled)
  • PUDC Pin strapping (pull high or pull down)
  • GT Power Enable pin strapping (default power enabled or disabled)

Current Assembly Variants

VariantFPGAGT ClockPL ClockPUDCGT PWR EnableB14/Config VoltageSPI FlashLED
StandardA35T-2I125MHz25MhzHIGHEnabled3.3VS25FL127SRed
35-2IC6A35T-2I125MHz25MHzHIGHEnabled1.8VN25Q128Red

Signals, Interfaces and Pins

Boot Modes

Two boot modes are controlled by the MODE signal on the board to board (B2B) connector:

MODE signal

Boot Mode

high or open

Master SPI

low or ground

Slave SelectMAP

JTAG

JTAG access to the Xilinx Artix-7 device is provided through connector JM1. 

Signal
B2B Pin
TCKJM1: 89
TDIJM1: 85
TDOJM1: 87
TMSJM1: 91

 Clocking

Clock

Frequency

IC

FPGA

Notes

CLK

25 MHz

U8, SiT8008

 

 
MGT_CLK

 

 

 

 

Peripherals

LED's

There is 1 LED on TE0714:

LED

Color

Connected to

Notes

D4

green

pin K18

 

Power

For startup, a power supply with minimum current capability of 1A is recommended.

Power Supplies

Vin

3.3 V

Typical 200 mA, depending on customer design and connections

Bank Voltages

Bank

Voltage

Notes

0 Config and B14

1.8V or 3.3V

Depends on assembly option

15

User

Has to be supplied from base, max 3.3V

34

User

Has to be supplied from base, max 3.3V

Initial Delivery state

Storage device name

Content

Notes

SPI Flash OTP Area

Empty, not programmed

Except serial number programmed by flash vendor

SPI Flash Quad Enable bit

Programmed

 

SPI Flash main array

demo design

 

EFUSE USER

Not programmed

 

EFUSE Security

Not programmed

 

Hardware Revision History

 Revision

Changes                                   

01

Current Hardware Revision, no changes

Technical Specification

Absolute Maximum Ratings

Parameter

MinMax

Units

Notes

Reference document

Vin supply voltage

-0.1

6.3

V

  
PL IO Bank supply voltage for HR I/O banks (VCCO)-0.53.6V Xilinx document DS181
I/O input voltage for HR I/O banks-0.4VCCO_X+0.55V Xilinx document DS181
GT Receiver (RXP/RXN) and Transmitter (TXP/TXN)-0.51.26V Xilinx document DS181

Voltage on Module JTAG pins

-0.4

VCCO_0+0.55

V

VCCO_0 is 3.3V nominalXilinx document DS181

Storage Temperature

-40

+85

C

  

Storage Temperature without the LXDC2HL18A-052

-40

+125

C

  

Recommended Operating Conditions

ParameterMinMaxUnitsNotesReference document
Vin supply voltage3.1355.5V  
IO Bank supply voltage for I/O banks1.143.465V Xilinx document DS181
I/O input voltage for HR I/O banks-0.20Vcco + 0.20V Xilinx document DS181
Voltage on Module JTAG pins3.1353.465VFor assembly variant with
3.3V on config banks
Xilinx document DS181
Please check Xilinx Datasheet for complete list of Absolute maximum and recommended operating ratings for the Artix-7 device (DS181).

 

Physical Dimensions

  • Module size: 40 mm × 30 mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: 8 mm

  • PCB thickness: 1.6 mm

  • Highest part on PCB: approx. 2.5 mm. Please download the step model for exact numbers.

All dimensions are shown in mm and can be found here.

Temperature Ranges

Commercial grade modules

All parts are at least commercial temperature range of 0°C to +70°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Industrial grade modules

All parts are at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Weight

VariantWeight gNote
2IC68.3Plain Module

Document Change History

Date

Revision

Authors

Description

2016-06-01

initial version

Disclaimer

 

Unable to render {include} The included page could not be found.

 

 

  • No labels