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The Trenz Electronic TE0714 is an industrial-grade SoM (System on Module) based on Xilinx Artix-7, 16 MByte Flash memory and powerful switching mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking strips. TE0714 is the smallest module with transceiver (3 x 4 cm).

Refer to for the current online version of this manual and other available documentation.

Key Features

  • Xilinx Artix-7 FPGA (A15T, A35T, A50T)

  • Rugged for shock and high vibration
  • 16 MByte QSPI Flash memory
  • Differential MEMS oscillator for MGT clocking
  • MEMS oscillator for PL clocks (Optional)
  • Plug-on module with 2 × 100-pin high-speed hermaphroditic strips
    • 138 FPGA I/O's (Max 68 differential)
    • 5 IO's (QSPI or user I/O's)

    • XADC analog input
    • 4 GTP (high-performance transceiver) lanes
    • GT reference clock inputs
    • Optimized I/O and power pins for good signal integrity
  • On-board high-efficiency DC-DC converters
  • Power supply for all on-board components
  • eFUSE bit-stream encryption (AES)
  • One user configurable LED

Different configurations for cost and performance optimization available upon request. Available options are:

  • FPGA Type (A15T, A35T, A50T), temperature grade
  • GT clock frequency (or none if not implemented)
  • PL clock frequency and precision (or none if not implemented)
  • Config and B14 bank Voltage: 1.8V or 3.3V
  • SPI Flash type (or none if not implemented)
  • LED Color (or none if not implemented)
  • PUDC Pin strapping (pull high or pull down)
  • GT power enable pin strapping (default power enabled or disabled)

Block Diagram

TE0714 block diagram

Main Components

TE0714 main components
  1. Xilinx Artix-7 FPGA (XC7A series), U4
  2. 16 MByte SPI Flash, U7
  3. B2B connector Samtec Razor Beam™ LSHM-150, JM2
  4. B2B connector Samtec Razor Beam™ LSHM-150, JM1
  5. 25 MHz oscillator, U8
  6. Single output low-dropout linear regulator (1.2V_MGT), U6
  7. Single output low-dropout linear regulator (1.0V_MGT), U5
  8. Low-jitter precision LVDS 125 MHz oscillator (GT Clock), U2
  9. Red indication LED, D4
  10. Step-down DC-DC converter (1.0V), U1
  11. PFET load switch with configurable slew rate (3.3V), Q1
  12. Low-power step-down DC-DC converter (1.8V), U3
  13. Voltage detector for circuit initialization and timing supervision, U23 

Initial Delivery State

Storage device name



SPI Flash OTP Area

Empty, not programmed

Except serial number programmed by flash vendor

SPI Flash Quad Enable bit


SPI Flash main array

demo design


Not programmed

eFUSE Security

Not programmed

Initial delivery state of programmable devices on the module.

Control Signals

Boot process is controlled by signals on the board to board (B2B) connector.


Signal State




high or open

Master SPI, x4 Mode

low or ground

Slave SelectMAP

PROG_Binputpulsed lowClear FPGA configuration (falling edge) and initiate a new configuration sequenz (next rising edge).
DONEoutputhighCompletion of configuration sequence.
Boot signals.

SPI FPGA pins D02 and D03 have no pull-ups on the module, so with PUDC=High option, those pins are floating if there are no pull-ups on baseboard. As those pins have SPI RESET function when Quad mode is not enabled, it is mandatory to either add pull-ups on user baseboard or program the Quad Enable bit in Flash nonvolatile status register.

Signals, Interfaces and Pins

JTAG Interface

JTAG access to the Xilinx Artix-7 FPGA device is provided through connector JM1. 

Signal Name

B2B Pin



JTAG signals.

Board to Board (B2B) I/Os

FPGA bank number and number of I/O signals connected to the B2B connector:

FPGA BankB2B ConnectorI/O Signal CountVoltage LevelNotes
14JM236VCCIO_0NB! 17 LVDS pairs possible.
15JM248VCCIO15Supplied by the baseboard.
34JM148VCCIO34Supplied by the baseboard.



4 x GTP lanes.
B2B I/Os

Please refer to the Pin-out  tables page for additional information. 

On-board Peripherals

Quad SPI Flash

On-board SPI flash memory S25FL127S (U7) is used to store initial FPGA configuration. Besides FPGA configuration, remaining free flash memory can be used for user application storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths. Maximum data rate depends on the bus width and clock frequency used.

SPI Flash QE (Quad Enable) bit must be set to high or FPGA is unable to load its configuration from flash. By default this bit is set to high at the manufacturing plant.

On-board LED

There is one LED on TE0714 module.








User programmable

LED connection.



Default Frequency





25 MHz



Frequency depends on the module variant. Output is compatible to 3.3V and 1.8V I/O standard of the FPGA bank.




Frequency depends on the module variant

Clock signals.

Power and Power-On Sequence

To power-up a module, power supply with minimum current capability of 1A is recommended.

TE0714 needs one single power supply with nominal of 3.3V.

Power Consumption

Test Condition (25 °C ambient)VIN Current mANotes
TE0714-35, TEBT0714, empty design, GT not enabled110mA
Power Consumption

Actual power consumption depends on the FPGA design and ambient temperature.

Power Distribution Dependencies

Power Distribution

Power-On Sequence

There is no specific or special power-on sequence, single power source is needed as VIN, rest of the sequence is automatic.

Power-On Sequency

Power Rails

Voltages on B2B-


B2B JM1-Pin

B2B JM2-Pin

VIN98, 100-inputsupply voltage
VCCIO_0-54inputhigh range bank voltage
VCCIO_15-53inputhigh range bank voltage
VCCIO_3462-inputhigh range bank voltage
3.3V84-outputinternal 3.3V voltage level
1.8V-17outputinternal 1.8V voltage level
Power Rails

Bank Voltages




0 Config and B14

1.8V or 3.3V

Depends on module assembly variant. See R21, R22 and R27 assembly option*



Supplied from baseboard via B2B connector, max 3.3V



Supplied from baseboard via B2B connector, max 3.3V
  • *R21 assembled: 3.3V and B2B is output if R27 is assembled
  • *R22 assembled 1.8V and B2B is output if R27 is assembled
  • *R21 and R22 not assembled , B2B is input and carrier defines voltage → pay attention on assembled flash!
Bank Voltages

Board to Board Connectors

These connectors are hermaphroditic. Odd pin numbers on the module are connected to even pin numbers on the baseboard and vice versa.

3 x 4 modules use two  Samtec Razor Beam LSHM connectors on the bottom side.

  • 2 x REF-189016-02 (compatible to LSHM-150-04.0-L-DV-A-S-K-TR), (100 pins, "50" per row).

When using the same type on baseboard, the mating height is 8mm. Other mating heights are possible by using connectors with a different height.

Order numberConnector on baseboardcompatible toMating height
23836REF-189016-01LSHM-150-02.5-L-DV-A-S-K-TR6.5 mm

LSHM-150-03.0-L-DV-A-S-K-TRLSHM-150-03.0-L-DV-A-S-K-TR7.0 mm
23838REF-189016-02LSHM-150-04.0-L-DV-A-S-K-TR8.0 mm


The module can be manufactured using other connectors upon request.

Connector Speed Ratings

The LSHM connector speed rating depends on the stacking height; please see the following table:

Stacking heightSpeed rating
12 mm, Single-Ended7.5 GHz / 15 Gbps
12 mm, Differential

6.5 GHz / 13 Gbps

5 mm, Single-Ended11.5 GHz / 23 Gbps
5 mm, Differential7.0 GHz / 14 Gbps
Speed rating.
Current Rating

Current rating of  Samtec Razor Beam™ LSHM B2B connectors is 2.0A per pin (2 adjacent pins powered).

Connector Mechanical Ratings
  • Shock: 100G, 6 ms Sine
  • Vibration: 7.5G random, 2 hours per axis, 3 axes total

Manufacturer Documentation

  File Modified
PDF File hsc-report_lshm-lshm-05mm_web.pdf 18 09, 2018 by Martin Rohrmüller
PDF File lshm_dv.pdf 18 09, 2018 by Martin Rohrmüller
PDF File LSHM-1XX-XX.X-X-DV-A-X-X-TR-FOOTPRINT(1).pdf 18 09, 2018 by Martin Rohrmüller
PDF File LSHM-1XX-XX.X-XX-DV-A-X-X-TR-MKT.pdf 18 09, 2018 by Martin Rohrmüller
PDF File REF-189016-01.pdf 18 09, 2018 by Martin Rohrmüller
PDF File REF-189016-02.pdf 18 09, 2018 by Martin Rohrmüller
PDF File TC0923--2523_report_Rev_2_qua.pdf 18 09, 2018 by Martin Rohrmüller
PDF File tc0929--2611_qua(1).pdf 18 09, 2018 by Martin Rohrmüller

Technical Specifications

Absolute Maximum Ratings

ParameterMinMaxUnitsReference Document

VIN supply voltage




HR I/O banks supply voltage (VCCO)-0.53.6VXilinx datasheet DS181
HR I/O banks input voltage-0.4VCCO + 0.55VXilinx datasheet DS181
GTP transceivers Tx/Rx input voltage-0.51.26VXilinx datasheet DS181

Voltage on module JTAG pins


VCCO_0 + 0.55


Xilinx datasheet DS181

Storage temperature




Module absolute maximum ratings.

Recommended Operating Conditions

This TRM is generic for all variants.

Variants of modules are described here: Article Number Information

Modules with commercial temperature grade are equipped with components that cover at least the range of 0°C to 75°C

Modules with extended temperature grade are equipped with components that cover at least the range of 0°C to 85°C

Modules with industrial temperature grade are equipped with components that cover at least the range of -40°C to 85°C

The actual operating temperature range will depend on the FPGA / SoC design / usage and cooling and other variables.

ParameterMinMaxUnitsReference Document
VIN supply voltage3.1353.45V-
HR I/O banks supply voltage (VCCO)1.143.465VXilinx datasheet DS181
HR I/O banks input voltage-0.20VCCO + 0.20VVXilinx datasheet DS181
Voltage on module JTAG pins0VCCO_0 + 5%VXilinx datasheet DS181
Recommended Operating Conditions

Physical Dimensions

  • Module size: 40 mm × 30 mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: 8 mm

  • PCB thickness: 1.6 mm

  • Highest part on PCB: approximately 2.5 mm. Please download the step model for exact numbers.

All dimensions are shown in mm. Additional sketches, drawings and schematics can be found here.

Physical dimensions drawing

Variants Currently In Production

Trenz shop TE0714 overview page
English pageGerman page
Trenz Electronic Shop Overview

On REV 01 JM2 Pin 54 was connected to GND. When R27 is not populated, REV 02 is backwards compatible to REV 01. When R27 is set, check your baseboard to not connect this pin to GND. For all new baseboards JM2.54 should be used as VCCIO output (it will then be 1.8V or 3.3V depending the voltage settings on the module.

Revision History

Hardware Revision History

DateRevisionPCNDocumentation LinkNote
2016-08-0402PCN-20160815TE0714-02VCCIO0 added to B2B




Hardware Revision History

Hardware revision number is printed on the PCB board next to the module model number separated by the dash.


Document Change History





  • changed operating conditions

2019-03-04v55John Hartfiel
  • Restore and modify v.50
  • Correction max IO count on key features
  • Change history table
  • typo correction
2019-01-07v.50John Hartfiel
  • Updated to TRM version 2.2
  • Style modifications


v.48Martin Rohrmüller
  • Updated to TRM version 2.1
  • Updated B2B Connectors
  • Style modifications


Martin Rohrmüller
  • Added power rail section
  • Added Rev 02 Flash PCN
  • Corrected table headings
2018-09-17v.36Martin Rohrmüller
  • Update to TRM version 2.0 with DrawIO Figures

  • Added Figure Power Distribution


Martin RohrmüllerCorrected clock net designator in table.


Jan Kumann
  • Board-to-Board I/O section added.
  • New physical dimensions images.
  • Documents sections rearranged.


John Hartfiel
  • Notes on Clocking section.
2017-01-27v.25Jan Kumann
  • New block diagram.


Jan Kumann
  • Changes in the document structure, few corrections.

Thorsten Trenz, Emmanuel Vassilakis

  • Hardware revision 02 specific changes.



Antti Lukats

  • Initial version.
Document change history


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Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).


Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.


Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

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