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Trenz Electronic TE0728 is an automotive-grade FPGA module integrating a Xilinx Automotive Zynq-7020 FPGA, two 100 Mbit Ethernet transceivers (PHY) , 512 MByte DDR3L SDRAM, 16 MByte Flash memory for configuration and operation, and powerful switching-mode power supplies for all on-board voltages. Numerous configurable I/Os are provided via rugged high-speed strips.
Within the complete module only Automotive components are installed.
All this in a compact 6 x 6 cm form factor, at the most competitive price.
Refer to http://trenz.org/te0728-info for the current online version of this manual and other available documentation.
Other assembly options for cost or performance optimization plus high volume prices available on request.
Depending on the customer design, additional cooling might be required.
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Storage device name | Symbol | Content |
---|---|---|
Quad SPI Flash | U13 | Empty |
24xx64 | U11 | Not Programmed |
MIO pin | Signal State | Boot Mode |
---|---|---|
MIO4 | Low | QSPI |
MIO4 | High | SD Card |
Zynq-7020SoC includes a reset that is driven by the reset system. Hardware resets are driven by the power-on reset signal (PS_POR_B) and the system reset signal (PS_SRST_B).
Signal | FPGA Bank | Pin | B2B |
---|---|---|---|
PS_POR_B | 500 | B5 | JM2-9 |
PS_SRST_B | 501 | C9 | JM2-2 |
FPGA bank number and number of I/O signals connected to the B2B connector:
FPGA Bank | B2B Connector | I/O Signal Count | Voltage Level | Notes |
---|---|---|---|---|
13 | JM1 | 48 | VCCO_13 | |
500 | JM1 | 4 | 3.3V | |
33 | JM3 | 34 | 3.3V | |
35 | JM3 | 20 | 3.3V | |
35 | JM2 | 22 | 3.3V | |
501 | JM2 | 38 | VMIO1 | MIO1 VREF is connected to resistor divider to support HSTL18 |
JTAG access to the Xilinx XA7Z020 FPGA through B2B connector JM2.
JTAG Signal | B2B Pin |
---|---|
TMS | JM2-12 |
TDI | JM2-10 |
TDO | JM2-8 |
TCK | JM2-6 |
MIO Pin | Schematic | Notes |
---|---|---|
MIO0 | MIO0 | RTC interrupt |
MIO1 | SPI_CS | SPI Flash |
MIO2 | SPI_DQ0/M0 | SPI Flash |
MIO3 | SPI_DQ1/M1 | SPI Flash |
MIO4 | SPI_DQ2/M2 | SPI Flash |
MIO5 | SPI_DQ3/M3 | SPI Flash |
MIO6 | SPI_SCK/M4 | SPI Flash clock |
MIO7 | LED RED | LED |
MIO8 | D | CAN Transceiver |
MIO9 | R | CAN Transceiver |
MIO10 | IO_0 | JM1-7 |
MIO11 | IO_1 | JM1-9 |
MIO12 | IO_2 | JM1-11 |
MIO13 | IO_3 | JM1-13 |
MIO14 | SCL | EEPROM |
MIO15 | SDA | EEPROM |
MIO16-MIO53 | PS_MIOxx | Bank 501 |
There is no fixed mapping for PS7 UART, if needed it can be mapped to free pins from MIO1 Bank or via EMIO to PL pins.
Recommended mapping for primary (console, debug) UART are MIO52, MIO53.
Chip/Interface | Product | Notes |
---|---|---|
SPI Flash | U13 | 16 MByte Flash |
EEPROM | U11 | 64 Kbit EEPROM |
RTC | U7 | Real Time Clock |
DDR3 SDRAM | U1 | Volatile Memory |
Ethernet | U3, U10 | |
CAN Transceiver | U16 | |
User LED | D4 | Green LED |
On-board QSPI flash memory is used to store initial FPGA configuration. Datasheet is provided in Texas Instruments. Besides FPGA configuration, remaining free flash memory can be used for user application and data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths. Maximum data rate depends on the selected bus width and clock frequency used.
Quad SPI Flash (U7) is connected to the Zynq PS QSPI0 interface via PS MIO bank 500.
MIO Pin | Schematic | Pin | Notes |
---|---|---|---|
MIO1 | SPI_CS | U13-A1 | |
MIO2 | SPI_DQ0/M0 | U13-A2 | |
MIO3 | SPI_DQ1/M1 | U13-F6 | |
MIO4 | SPI_DQ2/M2 | U13-E4 | |
MIO5 | SPI_DQ3/M3 | U13-A3 | |
MIO6 | SPI_SCK/M4 | U13-A4 |
The RTC has an I2C Bus (2-wire SerialInterface) and offers temperature compensated time. The STC-Smart Temperature Compensation is calibrated in the factory and leads to a very high time-accuracy.
RTC intruppt is connected to MIO0 connected to Bank 500, pin G6.
MIO Pin | Schematic | Pin | Notes |
---|---|---|---|
MIO15 | SDA | U7-5 | On-board RTC, and EEPROM |
MIO14 | SCL | U7-4 | On-board RTC, and EEPROM |
The Microchip Technology Inc. 24xx64 is a 64 Kbit Electrically Erasable PROM. The device is organized as a single block of 8K x 8-bit memory with a 2-wire serial interface. Lowvoltage design permits operation down to 1.7V, with standby and active currents of only 1 μA and 3 mA, respectively. It has been developed for advanced, lowpower applications such as personal communications or data acquisition. The 24xx64 also has a page write capability for up to 32 bytes of data. Functional address lines allow up to eight devices on the same bus, for up to 512 Kbits address space.
MIO Pin | Schematic | Pin | Notes |
---|---|---|---|
MIO15 | SDA | U11-3 | On-board RTC, and EEPROM |
MIO14 | SCL | U11-1 | On-board RTC, and EEPROM |
Schematic | Color | Connected to | Active Level | IO Standard |
---|---|---|---|---|
D9 | Green | DONE | Low | not applicable |
D8 | RED | MIO7 | High | not applicable |
D4 | Green | Bank 33 - V18 | High | LVCMOS33 |
The TE0728 SoM has two 512 MByte volatile DDR3 SDRAM IC for storing user application code and data.
Configuration of the DDR3 memory controller in the FPGA should be done using the MIG tool in the Xilinx Vivado Design Suite IP catalog.
There are two 100 MBit Extreme Temperature Ethernet provided by Texas Instrument on the board. Datasheet is provided TI website. Both PHY's are connected with all I/O Pins to FPGA Bank 34 (VCCIO = 3.3V). PHY Clock 25 MHz source is provided from MEMS Oscillator. There is no sharing of signals for the two PHY's.
PUDC pin is connected with pull-up to 3.3V those pre-configuration pull-ups are disabled by default. Strapping resistor exist to change the PUDC mode.
Schematic | ETH1 | ETH2 | Pullup | Notes |
---|---|---|---|---|
CTREF | J3-57 | J3-25 | Magnetics center tap voltage | |
TD+ | J3-58 | J3-28 | on-board | |
TD- | J3-56 | J3-26 | on-board | |
RD+ | J3-52 | J3-22 | on-board | |
RD- | J3-50 | J3-20 | on-board | |
LED1 | J3-55 | J3-23 | on-board | |
LED2 | J3-53 | J3-21 | on-board | |
LED3 | J3-51 | J3-19 | on-board | |
POWERDOWN/INT | L21 | R20 | on-chip | It is recommended to configure FPGA I/O as input with Pullup or as output driving 1 if Interrupt not used. |
RESET_N | M15 | R16 | on-chip | It is recommended to configure FPGA I/O as input with Pullup or as output (active low PHY Reset). |
Controller Area Network (CAN) transceivers are designed for use with the Texas Instruments TMS320Lx240x 3.3-V DSPs with CAN controllers. The datasheet is available in TI website. Each CAN transceiver is designed to provide differential transmit capability to the bus and differential receive capability to a CAN controller at speeds up to 1 Mbps.
MIO Pin | Schematic | Pin | Notes |
---|---|---|---|
MIO8 | D | U16-1 | Driver Input |
MIO9 | R | U16-4 | Reciever Output |
The low-dropout (LDO) provides an easy-to-use robust power management solution for a wide variety of applications. User programmable soft-start minimizes stress on the input power source by reducing capacitive inrush current on start-up. The soft-start is monotonic and well- suited for powering many different types of Monitoring or Provides a Sequencing Signal processors and ASICs. The enable input and power for Other Supplies good output allow easy sequencing with external regulators. This complete flexibility permits the user to configure a solution that meets the sequencing Voltage Startup requirements of FPGAs, DSPs, and other applications with special start-up requirements.
IC | Description | Frequency | Used as |
---|---|---|---|
U14 | MEMS Oscillator | 50 MHz | PS PLL clock |
U5 | MEMS Oscillator | 25 MHz | Ethernet PHY Clock |
U7 | RTC (internal oscillator) | 32.768 KHz | Used by RTC, CLKOUT of RTC not connected |
Power supply with minimum current capability of 3.5 A for system startup is recommended.
Power Input Pin | Typical Current |
---|---|
VIN | TBD* |
* TBD - To Be Determined
The PS and PL power supplies are fully independent. PS power supplies (VCCPINT, VCCPAUX, VCCPLL, VCCO_DDR, VCCO_MIO0, and VCCO_MIO1) can be powered before or after any PL power supplies. The PS and PL power regions are isolated to prevent damage. The recommended power-on sequence is VCCPINT, then VCCPAUX and VCCPLL together, then the PS VCCO supplies (VCCO_MIO0, VCCO_MIO1, and VCCO_DDR) to achieve minimum current draw and ensure that the I/Os are 3-stated at power-on. The PS_POR_B input is required to be asserted to GND during the power-on sequence until VCCPINT, VCCPAUX and VCCO_MIO0 have reached minimum operating levels to ensure PS eFUSE integrity.
The PS and PL power supplies are fully independent. PS power supplies (VCCPINT, VCCPAUX, VCCPLL, VCCO_DDR, VCCO_MIO0, and VCCO_MIO1) can be powered before or after any PL power supplies. The PS and PL power regions are isolated to prevent damage. The recommended power-on sequence is VCCPINT, then VCCPAUX and VCCPLL together, then the PS VCCO supplies (VCCO_MIO0, VCCO_MIO1, and VCCO_DDR) to achieve minimum current draw and ensure that the I/Os are 3-stated at power-on. The PS_POR_B input is required to be asserted to GND during the power-on sequence until VCCPINT, VCCPAUX and VCCO_MIO0 have reached minimum operating levels to ensure PS eFUSE integrity.
The microprocessor supervisory circuits monitor system voltages from 0.4 V to 5 V, asserting an open-drain RESET signal when the SENSE voltage drops below a preset threshold or when the manual reset (MR) pin drops to a logic low. The RESET output remains low for the user adjustable delay time after the SENSE voltage and MR return above their thresholds. Datasheet is available in Texas Instruments website.
When the U8 and U9 generates PWRGD signal, it turns on the U4 which generates PWRGD_3.3V, it turns on the U6 and it generates PWROK signal which is connected to MR. Whenever the supply voltage for U12 drops down below the threshold it resets the system. Actually it resets the system when all regulators are working.
B2B Name | B2B JM1 Pin | B2B JM2 Pin | B2B JM3 Pin | Direction | Notes |
---|---|---|---|---|---|
VIN | 1,3 | - | - | Input | Supply voltage from carrier board. |
VCCO_13 | 39 | - | - | I/O | |
VBATT | - | 1 | - | Output | RTC Supply voltage |
3.3V | 19 | 2, 4 | 25,57 | Output | Internal 3.3V voltage level. |
1.8V | - | 5 | - | Output | Internal 1.8V voltage level. |
Bank | Schematic Name | Voltage | Notes |
---|---|---|---|
500 | VCCO_MIO0_500 | 3.3V | |
501 | VCCO_MIO1_500 | 3.3V | |
502 | VCCO_DDR_502 | 1.5V | |
13 HR | VCCO_13 | 3.3V | Supplied by the carrier board. JM1 |
33 HR | VCCO_33 | 3.3V | Supplied by carrier board. JM3 |
34 HR | VCCO_34 | 3.3V | |
35 HR | VCCO_35 | 3.3V | Supplied by the carrier board. JM2,JM3 |
6 x 6 modules use two or three Samtec Micro Tiger Eye Connector on the bottom side.
3 x REF-189018-01 (compatible to SEM-140-02-03.0-H-D-A), (80 pins, "40" per row)
Operating Temperature:-55°C ~ 125°C
Current Rating: 2.6A per ContactNumber of Positions: 80
Number of Rows: 2
Symbols | Description | Min | Max | Unit |
---|---|---|---|---|
VCCPINT | PS internal logic supply voltage | -0.5 | 1.1 | V |
VCCPAUX | PS auxiliary supply voltage | -0.5 | 2.0 | V |
VCCPLL | PS PLL supply | -0.5 | 2.0 | V |
VCCO_DDR | PS DDR I/O supply voltage | -0.5 | 2.0 | V |
VPREF | PS input reference voltage | -0.5 | 2.0 | V |
VCCO_MIO0 | PS MIO I/O supply voltage for HR I/O banks | -0.5 | 3.6 | V |
VCCO_MIO1 | PS MIO I/O supply voltage for HR I/O banks | 1.71 | 3.45 | V |
Symbols | Description | Min | Max | Unit |
---|---|---|---|---|
VCCINT | PL internal logic supply voltage | -0.5 | 1.1 | V |
VCCPAUX | PL auxiliary supply voltage | -0.5 | 2.0 | V |
VCCPLL | PL PLL supply | -0.5 | 1.1 | V |
VPREF | PL input reference voltage | -0.5 | 2.0 | V |
VCCO | PL supply voltage for HR I/O banks | -0.5 | 3.6 | V |
VIN | I/O input voltage for HR I/O banks | 1.71 | 3.45 | V |
Parameter | Min | Max | Units | Reference Document |
---|---|---|---|---|
VIN supply voltage | 3.5 | 60 | V | TPS54260-Q1 datasheets. |
Supply voltage for PS MIO banks | 1.71 | 3.465 | V | See Xilinx DS187 datasheet. |
I/O input voltage for PS MIO banks | -0.2 | VCCO_MIO + 0.20 | V | See Xilinx DS187 datasheet. |
Supply voltage for PS DDR | 1.14 | 1.89 | V | See Xilinx DS187 datasheet. |
I/O input voltage for PS DDR | -0.20 | VCCO_DDR + 0.20 | V | See Xilinx DS187 datasheet. |
Supply voltage for HR I/Os banks | 1.14 | 3.465 | V | See Xilinx DS187 datasheet. |
I/O input voltage for HR I/O banks | -0.20 | VCCIO + 0.20 | V | See Xilinx DS187 datasheet. |
Storage Temperature | -65 | 150 | °C | See Xilinx DS187 datasheet. |
CAN Transceiver Temperature | -40 | 125 | °C | See Texas Instrument sn65hvd230q-q1 datasheet. |
SPI Flash Memory | -40 | 85 | °C | See Cypress S25FL127S datasheet. |
DDR3 SDRAM Temperature | -40 | 95 | °C | See Nanya NT5CC256M16CP-DIA datasheet. |
Temprature range: -40°C to +85°C.
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
Module size: 60 mm × 60 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 7 mm.
PCB thickness: 1.6 mm.
Trenz shop TE0728 overview page | |
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English page | German page |
Date | Revision | Note | PCN | Documentation Link |
---|---|---|---|---|
- | 01 | Prototypes | - | - |
Hardware revision number is printed on the PCB board next to the module model number separated by the dash.
Date | Revision | Contributor | Description |
---|---|---|---|
| |||
-- | all |
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