You are viewing an old version of this page. View the current version.

Compare with Current View Page History

« Previous Version 2 Next »

Table of Contents

Overview

 

The Trenz Electronic TEC0330 FPGA board has a PCI Express card form factor and is containing the Xilinx FPGA-module Virtex-7 XC7VX330T. This high-end FPGA-module is optimized for system performance and is used in applications with high demands on system resources.

This board is designed to fit in computing systems with PCI Express x8 slots (PCIe 2.0 or higher) and has also a SO-DIMM socket to extend the board with DDR3-RAM.

The FMC (FPGA Mezzanine Card) connector provides a high pin count (HPC) and is as an ANSI/VITA 57.1 standard a modular interface to the FPGA for mezzanine expansion cards. Further connectors provide JTAG-interfaces to the FPGA-module and to the on-board System Controller CPLD together with access to high-speed data lanes composed of differential signaling pairs.

Block Diagram


Figure 1TEC0330-03 Block Diagram

Main Components

                    

Figure 2: FPGA board TEC0330-03

 

TEC0330-03:

  1. PCIe x8 connector J1
  2. FPGA JTAG connector J9
  3. User button S2
  4. SO-DIMM socket U2
  5. Xilinx Virtex-7 XC7VX330T-2FFG1157C FPGA-module U1
  6. ANSI/VITA 57.1 compliant FMC HPC Connector J2
  7. SMA coaxial connector for external clock input J3
  8. CPLD JTAG connector J8
  9. I²C-connector for LT LTM4676 Step-down DC/DC regulator J10
  10. IDC header for access to 5 x high-speed data lanes (LVDS-pairs) J7
  11. 4-Wire PWM fan connector J4
  12. 6-pin 12V power connector J5
  13. Reference clock generator (RAKON P5146, U11) @10.0 MHz
  14. LDO DC/DC regulator (TI TPS74901RGWR, U21) @3.3V (LMK_3V3)
  15. 256 Mbit Quad SPI Flash Memory (Micron N25Q256A, U12)
  16. Cooling fan 5VDC M1 (45X5MM, 0.7W, 1.06CFM)
  17. System Controller CPLD (Lattice Semiconductor MachXO2-1200HC, U5)
  18. Ultra low jitter clock synthesizer (TI LMK04828B, U9)
  19. Step-down DC/DC regulator (LT LTM4676, U4) @1.0V
  20. Step-down DC/DC regulator (LT LTM4676, U3) @1.5V (VCC1V5), @4.0V
  21. I²C Programmable Quad Clock Generator (Silicon Labs Si5338A, U13)
  22. 4A PowerSoC DC-DC converter (Altera EN6347QI, U20) @1.8V
  23. LDO DC/DC regulator (TI TPS74401RGW, U18) @1.0V (MGTAVCC_FPGA)
  24. LDO DC/DC regulator (TI TPS74401RGW, U17) @1.2V (MGTAVTT_FPGA)
  25. 4A PowerSoC DC-DC converter (Altera EN6347QI, U15) @3.3V (3V3FMC)
  26. 4A PowerSoC DC-DC converter (Altera EN6347QI, U7) @1.8V (FMC_VADJ)

Key Features

  • Xilinx Virtex-7 FPGA module XC7VX330T-2FFG1157C (commercial temperature range)
  • FPGA board designed as PCIe card is fitting in PCI Express x8 slots (PCIe 2.0 or higher)
  • FMC High Pin Count (HPC) Connector
  • 8 MGT-lanes available on PCIe interface
  • DDR3 SO-DIMM Socket
  • 256-Mbit (32-MByte) Quad SPI Flash memory (for configuration and operation) accessible through:
    • FPGA
    • JTAG port (SPI indirect (Bus width x4))
  • External Clock Input via SMA coaxial connector
  • 28 GTH transceivers, each with up to 13.1 Gbit/s data transmission rate
  • FPGA configuration through:
    • JTAG-connector
    • SPI Flash memory
  • Programmable quad PLL clock generator
  • TI LMK04828B ultra low-noise high-performance clock synthesizer (jitter cleaner)
  • On-board high-efficiency DC-DC converters
  • Up to 202 FPGA I/O pins available on FMC connector (up to 101 LVDS-pairs possible)
  • System management and power sequencing
  • AES bit-stream encryption
  • eFUSE bit-stream encryption

Additional assembly options are available for cost or performance optimization upon request.

Initial Delivery State

Storage device name

Content

Notes

SPI Flash OTP Area

Empty, not programmed

Except serial number programmed by flash vendor.

SPI Flash Quad Enable bit

Programmed

-

SPI Flash main array

Demo design

-

eFUSE USER

Not programmed

-

eFUSE Security

Not programmed

-

Table 1: Initial delivery state

Signals, Interfaces and Pins

FMC Connector

The FMC (FPGA Mezzanine Card) connector (J2) with high pin count (HPC) provides as an ANSI/VITA 57.1 standard a modular interface to the FPGA and exposes numerous of its I/O pins for use by other mezzanine modules and expansion cards.

The connector supports single ended (with severeal VCCIO voltages available) and differential signaling as the I/O's are usable as LVDS-pairs.

The I/O signals are routed from the FPGA banks as LVDS-pairs to the connector:

BankI/O Signal countLVDS-pairs countVCCO bank VoltageNotes
Bank 1992461.8V-
Bank 394221VIO_B_FMC

bank voltage VIO_B_FMC must be supplied by FMC connector pins J2-J39, J2-K40

bank's VREF-pin (VREF_B_M2C) available on FMC connector pin J2-K1 (extern reference voltage)

Bank 3734171.8Vbank's VREF-pin (VREF_A_M2C) available on FMC connector pin J2-H1 (extern reference voltage)
Bank 3834171.8Vbank's VREF-pin (VREF_A_M2C) available on FMC connector pin J2-H1 (extern reference voltage)

Table 2:  FMC connector pin-outs of available logic banks of the FPGA.

The FMC connector provides also access to the MGT-banks of the FPGA. There are 10 high-speed data links (Xilinx GTH transceiver) available composed as differential signaling pairs for both directions (RX/TX), means from card to (mezzanine) module and vice versa.

The MGT-banks have also clock input-pins which are exposed to the FMC connector. Following MGT-lanes are available on the FMC connector:

BankI/O signal countLVDS-pairs countMGT-lanes count (RX/TX LVDS-pairs)bank's reference clock (LVDS-pair)Notes
Bank 11610521 clock-signal from clock synthesizer U9 to bank's pins T6/T5-
Bank 117201042 clock-signals from clock FMC connector 'GBTCLK0_M2C' and 'GBTCLK1_M2C' (pins J2-D4/J2-D5 and J2-B20/J2-B21) to bank's pins M6/M5 and P6/P5-
Bank 11820104

1 reference clock from clock synthesizer U9 to bank's pins F6/F5

1 reference clock from  programmable quad PLL clock generator U13 to bank's pins H6/H5

-

Table 3:  FMC connector pin-outs of available MGT-lanes of the FPGA

The FMC connector provides further interfaces like 'JTAG' and 'I²C' to the System Controller CPLD:

Interfaces I/O signal countpin schematic names / FMC pinsconnected withNotes
JTAG5

FMC_TRST, pin D34

FMC_TCK, pin D29

FMC_TMS, pin D33

FMC_TDI, pin D30

FMC_TDO, pin D31

SC CPLD, bank 2VCCIO: 3V3PCI
I²C2

FMC_SCL, pin C30

FMC_SDA, pin C31

SC CPLD, bank 2

VCCIO: 3V3PCI

I²C-lines 3V3PCI pulled-up

control lines3

FMC_PRSNT_M2C_L, pin H2

FMC_PG_C2M, pin D1 (3V3FMC pull-up)

FMC_PG_M2C, pin F1 (3V3FMC pull-up)

SC CPLD, bank 1

'PG' = 'Power Good'-signal

'C2M' = carrier to (mezzanine) module

'M2C' = (mezzanine) module to carrier

internal System Controller CPLD signal assignment:

'FEX_0_N' <= 'FMC_PG_M2C'

'FMC_PG_C2M' <= 'FMC_PRSNT_M2C_L'

Table 4:  FMC connector pin-outs of available interfaces to the System Controller CPLD

The FMC connector provides pins for reference clock input to the FPGA banks:

clock schematic name
I/O signal countLVDS-pairs countFMC connector pinsconnected withNotes
CLK021H4/H5bank 17, pins R28/R29-
CLK121G3/G2bank 17, pins P29/P30-
CLK221K4/K5bank 18, pins G31/G31-
CLK321J2/J3bank 18, pins H29/H30-

Table 5:  FMC connector pin-outs for reference clock input

Several VCCIO voltages are available on the FMC connector to operate the I/O's in order of the intended purpose:

VCCIO schematic namemax currentFMC connector pinsNotes
12V1AC35/C37extern supplied 12V
3V3PCI20mAD32supplied by PCIe interface
3V3FMC3AD36/D38/D40/C39supplied by DC/DC converter U15
VIO_B_FMCextern supplyJ39/K40extern supplied VCCO to HB FPGA Bank 39
FMC_VADJ4AH40/G39/F40/E39fixed to 1.8V, supplied by DC/DC converter U7

Table 6:  Available VCCIO voltages on FMC connector

PCI Express Interface

The TEC0330 FPGA board is also a PCI Express card designed to fit in computing systems with PCI Express x8 slots (PCIe 2.0 or higher) and is PCIe Gen. 2 capable.

8 MGT-lanes are routed to the PCIe interface composed of RX/TX LVDS-pairs for each lane:

 BankI/O signal countLVDS-pairs count

MGT-lanes count
(RX/TX LVDS-pairs)

bank's reference clock (LVDS-pair)Notes
FPGA bank 1141684--
FPGA bank 1151894

1 reference clock from  programmable quad PLL clock generator
U13 to bank's pins AB6/AB5

1 reference clock from PCIe interface J1 to bank's pins AD6/AD5

-

Table 7: MGT-lanes available on PCIe interface

JTAG Interfaces

JTAG interfaces are accessible on the TEC0330 board  to program the FPGA-module or the System Controller CPLD:

JTAG interfaceJTAG signals schematic nameJTAG connector pinsconnected with

CPLD JTAG

VCCIO: 3V3PCI

Connector: J8

CPLD_JTAG_TMSJ8-1SC CPLD, bank 0, pin 90
CPLD_JTAG_TDIJ8-2SC CPLD, bank 0, pin 94
CPLD_JTAG_TDOJ8-3SC CPLD, bank 0, pin 95
CPLD_JTAG_TCK

J8-4

SC CPLD, bank 0, pin 91
    

FPGA JTAG

VCCIO: 1V8

Connector: J9

FPTA_JTAG_TMSJ9-4FPGA, bank 0, pin N9
FPTA_JTAG_TCKJ9-6FPGA, bank 0, pin M8
FPTA_JTAG_TDOJ9-8FPGA, bank 0, pin N8
FPTA_JTAG_TDIJ9-10FPGA, bank 0, pin L8
    

FMC JTAG

VCCIO: 3.3VPCI

Connector: J2

FMC_TRSTJ2-D34SC CPLD, bank 2, pin 36
FMC_TCKJ2-D29SC CPLD, bank 2, pin 27
FMC_TMSJ2-D33SC CPLD, bank 2, pin 28
FMC_TDIJ2-D30SC CPLD, bank 2, pin 31
FMC_TDOJ2-D31SC CPLD, bank 2, pin 32

Table 8: JTAG Interface on TEC0330 board

SO-DIMM Socket for DDR3-RAM

The TEC0330 board can be upgraded with a DDR3 SO-DIMM (204-pin). For this purpose the board is equipped with a 204-pin SO-DIMM socket U2. The DDR3 memory interface is routed to the FPGA banks 34, 35 and 36.

The reference clock signal for the DDR3 interface is generated by the quad programmable reference clock U13 and is applied to bank 35.

There is also a I²C-interface between the System Controller CPLD and the DDR3 memory interface:

Interface signals schematic namedesignated CPLD pinsDDR3 memory interface pins
DDR3_SDAbank 2, pin 48pin 200 (3V3PCI pull-up)
DDR3_SCLbank 2, pin 49pin 202 (3V3PCI pull-up)

Table 9: I²C-interface between SC CPLD and DDR3 memory

System Controller CPLD

The System Controller CPLD is the central system management unit that provides numerous interfaces between the on-board peripherals and to the FPGA-module. The signals routed to the CPLD will be linked by the logic implemented in the CPLD firmware, which generates output signals to control the system, the on-board peripherals and the interfaces. So some interfaces between the on-board peripherals and to the FPGA-module are by-passed, forwarded and controlled by the System Controller CPLD.

Other tasks of the System Controller CPLD are the monitoring of the power-on sequence, the proper programing of the FPGA-module and to display its programming state.

CPLD bankCPLD bank's VCCIO
03V3PCI
13V3PCI
23V3PCI
31V8

Table 10: VCCIO voltages of CPLD banks

Following table describes the interfaces and functionalities established by the CPLD, which weren't discussed elsewhere in this TRM:

CPLD functionalityinterfacedesignated CPLD pinspins connected withNote
FPGA I²C connection between on-board peripherals and FPGA-moduleI²C

FPGA_IIC_SDA, pin 24

FPGA_IIC_SCL, pin 25

FPGA_IIC_OE, pin 19

FPGA bank 16, pin V29

FPGA bank 16, pin W29

FPGA bank 16, pin W26

VCCIO: 1V8

all lines 1V8 pulled-up

Following I²C-interfaces of are linked to the I²C-lines of 'FPGA_IIC' for data-transmission between the FPGA-module and on-board peripherals:

  • FMC connector J2
  • PCIe connector J1
  • DC/DC converter U3 and U4 (LT LTM4676)
  • Quad programmable PLL clock generator U13

Note: 'FPGA_IIC_OE' must kept high for I²C-operation.

For I²C-addresses refer to the data sheets of the components.

user I/O's

external LVDS-pairs

10 I/O's

5 x differential signaling pairs

EX0_P ... EX4_P

EX0_N ... EX4_N

IDC header J7

pins can also be used for single-ended signaling

user I/O's

internal LVDS-pairs

13 I/O's

6 x differential signaling pairs

FEX0_P ... FEX5_P

FEX0_N ... FEX5_N

FEX_DIR (single-ended I/O)

FPGA bank 18

VCCIO: 1V8

pins can also be used for single-ended signaling

FPGA bank 18 has also reference clock input from FMC connector (CLK2, CLK3) and from clock synthesizer U9 (FCLK)

internal signal assignment:

'FEX_DIR' <= 'FMC_PRSNT_M2C_L'

FPGA programing control and state2 I/O's

DONE, pin 7

PROGRAM_B, pin 8

FPGA bank 0, pin V8

FPGA bank 0, pin U8

VCCIO: 1V8
I²C-interface to quad programmable PLL clock generatorI²C

PLL_SCL, pin 14

PLL_SDA, pin 15

U13, pin 12

U13, pin 19

VCCIO: 1V8

only 'PLL_SDA' 1V8 pulled-up

Fan PWM control J42 I/O's

F1SENSE, pin 99

F1PWM, pin 98

J4-3 (low-active signal)

J4-4

internal signal assignment:

'FEX_5_P' <= 'F1SENSE'

'FEX_5_N' => 'F1PWM'

Button S21 I/OBUTTON, pin 77switch S2functionality depends on CPLD-firmware, activating pin 'PROGRAM_B' (low-active) and 'LED1' at standard configuration
LED11 I/OLED1, pin 76LED D1 (green)

fast blinking, if FPGA not programmed

internal signal assignment:

'LED1' <= 'Button S2' or 'FEX0_P'

PCIe control line RESET_B

1 I/O'PCIE_RSTB', pin 37PCIe connector J1-A11 (33R serial resistor)

internal signal assignment:

'FEX_4_N' <= 'PCIE_RSTB'

Control Interface to clock synthesizer U9 (TI LMK04828B)

SPI (3 I/O's),

4 I/O's

CLK_SYNTH_SDIO, pin 75

CLK_SYNTH_SCK, pin 74

CLK_SYNTH_RESET, pin 54

CLK_SYNTH_CS, pin 53

CLK_SYNTH_SYNC, pin 52

LMK_STAT0, pin 62

LMK_STAT1, pin 63

U9, pin 20

U9, pin 19

U9, pin 5

U9, pin 18

U9, pin 6

U9, pin 31

U9, pin 48

'CLK_SYNTH_SDIO' 3V3PCI pulled-up

internal signal assignment:

'LMK_SCK' <= 'FEX_1_P'

'LMK_SDIO' <= 'FEX_1_N'

'LMK_CS' <= 'FEX_3_P'

'LMK_SYNC' <= 'FEX_3_N'

LMK_RESET <= 'FEX_4_P'

'FEX_2_P' => 'LMK_SDIO' (FEX_2_N must be 0)

'LMK_STAT0' and 'LMK_STAT1' signals will not be evaluated.

Control Interface to DC/DC converters U3 and U4 (both LT LTM4676)

I²C (2 I/O's),

2 I/O's

LTM_SCL, pin 67

LTM_SDA, pin 66

LTM1_ALERT, pin 65

LTM2_ALERT, pin 64

U4, pin E6 and U3, pin E6

U4, pin D6 and U3, pin D6

U4, pin E5

U3, pin E5

all lines 3V3 pulled-up

LTM I²C-interface also accessible trough header J10

LTM1- and LTM2-Alert signals will not be evaluated.

power-on sequence and monitoring6 I/O's

EN_1V8, pin 58

PG_1V8, pin 59

EN_FMC_VADJ, pin 60

PG_FMC_VADJ, pin 61

EN_3V3, pin 51

PG_3V3, pin 57

U20, pin 27

U20, pin 28

U7, pin 27

U7, pin 28

U15, pin 27

U15, pin 28

The effective sequencing of the supply voltages depends on the currently programmed CPLD firmware.

EN_1V8, EN_3V3 and EN_FMC_VADJ will be set simultaneously at start-up.

PG-signals will not be evaluated.

Table 11: System Controller CPLD functionalities

Clocking

The TEC0330 FPGA board has a sophisticated clock generation and conditioning system to meet the requirements of the Xilinx Virtex-7 GTH units with data transmission rates up to 13.1 Gb/s.

Clock sources

The board has the following sources to be provided with extern reference clock signals and on-board clock oscillators:

clock generator sourcesSchematic NameFrequencyclock input destinationNotes
SMA coaxial connector, J3

CLK_SYNTH_CLKIN0_P,

CLK_SYNTH_CLKIN0_N (GND)

userclock synthesizer U9, pins 37/38-
RAKON P5146LF oscillator, U11-10.0 MHzclock synthesizer U9, pins 43/44-
SiTime SiT8208 oscillator, U14CLK_25MHz25.0 MHzquad PLL clock Generator U13, pin 3-
FMC connector J2, pins H4/H5

CLK0_P, CLK0_N

userFPGA bank 17, pins R28/R29-
FMC connector J2, pins G2/G3CLK1_P, CLK1_NuserFPGA bank 17, pins P29/P30-
FMC connector J2, pins K4/K5CLK2_P, CLK2_NuserFPGA bank 18, pins G30/G31-
FMC connector J2, pins J2/J3CLK3_P, CLK3_NuserFPGA bank 18, pins H29/H30-
FMC connector J2, pins D4/D5

GBTCLK0_M2C_P,

GBTCLK0_M2C_N

userFPGA bank 117, pins M6/M5-
FMC connector J2, pins B20/B21

GBTCLK1_M2C_P,

GBTCLK1_M2C_N

userFPGA bank 117, pins P6/P5-
PCIe interface J1, pins A13/A14

PCIE_CLK_P,

PCIE_CLK_N

100 MHz

(PCIe spec.)

FPGA bank 115, pins AD6/AD5-

Table 12: Clock generator sources overview

Programmable PLL Clock (Phase-Locked Loop)

There is a Silicon Labs I²C programmable quad PLL clock generator Si5338A (U13) on-board. It's output frequencies can be programmed by using the I²C-bus with address 0x70.

A 25 MHz (U14) oscillator is connected to pin 3 (IN3) and is used to generate the output clocks.

Once running, the frequency and other parameters can be changed by programming the device using the I²C-bus connected between the FPGA (master) and clock generator (slave). Logic needs to be generated inside the FPGA-module to utilize I²C-bus correctly.

Si5338A (U13) inputsignal schematic nameNote

IN1/IN2

CLKIN_5338_C_P, CLKIN_5338_C_N

reference clock signal from clock synthesizer U9

(100 nF decoupling capacitors and 100Ω termination resistor)

IN3

clock signal from reference clock oscillator SiTime  SiT8208AI (U14).

25.0 MHz fixed frequency

IN4/IN6

pins put to GNDLSB (pin 'IN4') of the default I²C-adress 0x70 is zero

IN5

not connected

-
Si5338A (U13) output
signal schematic nameNote

CLK0 A/B

DDR3_CLK_P, DDR3_CLK_N

DDR3-RAM reference clock signal to FPGA bank 35

CLK1 A/B

MGTCLK_5338_C_P,

MGTCLK_5338_C_N

reference clock signal to FPGA bank 115 MGT

(100 nF decoupling capacitors and 100Ω termination resistor)

CLK2 A/B

LMK_CLK_P, LMK_CLK_N

input clock signal to clock synthesizer U9

(100 nF decoupling capacitors)

CLK3 A/B

MGTCLK2_5338_C_P,

MGTCLK2_5338_C_N

reference clock signal to FPGA bank 118 MGT

(100 nF decoupling capacitors and 100Ω termination resistor)

Table 13: Pin description of PLL clock generator Si5338A

Ultra low-noise high-performance clock synthesizer

The TEC0330 board utilizes an ultra low jitter clock synthesizer TI LMK04828B (U9) for conditioning and generating clean clock signals which are necessary for the GTH units of the Xilinx Virtex-7 FPGA-module.

The clock synthesizer can be controlled and programmed by its SPI-interface (SPI-slave) and other control lines, which are routed to the FPGA-module (SPI-master) and by-passed trough the System Controller CPLD. See section 'System Controller CPLD' for more detailed information.

Logic needs to be generated inside the FPGA-module to utilize SPI-bus correctly.

LMK04828B (U9) inputsignal schematic nameNote
Status_LD1, Status_LD2LMK_STAT0, LMK_STAT1connected to System Controller CPLD, not evaluated in current CPLD-firmware

SPI-interface and control lines

see section 'System controller CPLD'the clock synthesizer can be controlled and programmed by the FPGA-module via the SPI-interface and control lines, which are by-passed through the System Controller CPLD
CLKin0, CLKin0*

CLK_SYNTH_CLKIN0_P,

CLK_SYNTH_CLKIN0_N

input reference clock signal via SMA coaxial connector J3, connected to CLKin0* via serial decoupling capacitator 100nF.

CLKin0 to connected to GND via serial decoupling capacitator 100nF. 

CLKin1, CLKin1*

CLK_SYNTH_CLKIN1_P,

CLK_SYNTH_CLKIN1_N

input reference clock signal from quad PLL clock generator Si5338A (U13) via serial decoupling capacitator 100nF
OSCin, OSCin*-signal from reference clock oscillator RAKON P51446LF, fixed to 10.0 MHz
LMK04828B (U9) outputsignal schematic nameNote
DCLKout0, DCLKout0*

CLK_SYNTH_DCLKOUT0_P,

CLK_SYNTH_DCLKOUT0_N

reference clock signal to FPGA bank 15 pins AD29/AE29
SDCLKout1, SDCLKout1*

CLK_SYNTH_SDCLKOUT1_P,

CLK_SYNTH_SDCLKOUT1_N

reference clock signal to FPGA bank 15 pins AE31/AF31
DCLKout2, DCLKout2*

CLKIN_5338_P,

CLKIN_5338_N

reference clock signal to quad PLL clock generator Si5338A (U13)

(100 nF decoupling capacitors and 100Ω termination resistor)

DCLKout4, DCLKout4*

CLK_SYNTH_DCLKOUT4_P,

CLK_SYNTH_DCLKOUT4_N

reference clock signal to FPGA bank 115 MGT, pins T6/T5
SDCLKout7, SDCLKout7*

CLK_SYNTH_SDCLKOUT7_P,

CLK_SYNTH_SDCLKOUT7_N

reference clock signal to FPGA bank 118 MGT, pins F6/F5
OSCout0, OSCout0*

CLK_SYNTH_CLKIN2_P,

CLK_SYNTH_CLKIN2_N

reference clock signal to FPGA bank 18, pins J30/J31

(100 nF decoupling capacitors)

Table 14: Pin description of clock synthesizer TI LMK04828B

32 MByte Quad SPI Flash Memory

An 256 Mbit (32 MByte) Quad SPI Flash Memory (Micron N25Q256A, U12) is provided for FPGA configuration file storage. After configuration process completes the remaining free memory can be used for application data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths to be used. The maximum data transfer rate depends on the bus width and clock frequency. The memory can be accessed indirectly by the FPGA JTAG-port (J9) by implementing the functional logic for this purpose inside the FPGA.

Power and Power-On Sequence

Power Supply

The TEC0330 FPGA board is mainly suppled by the 6-pin 12V power connector J5, a minimum current capability of 3A for system startup is recommended. The FPGA board can't be used as a stand-alone board, it works only in use of a plugged PCI Express card (2.0 or higher).

Power Consumption

 Power Input
Max Current
12V (J5)*t.b.d.
3V3PCI (J1)*t.b.d.

Table 15: Maximum current of power supplies. *to be determined

Power-On Sequence

The on-board voltages of the TEC0330 FPGA board will be powered-up in order of a determined sequence after the external voltages '12V' on connector J5 and '3V3PCI' on connector J1 are available.

Core voltages and main supply voltages have to reach stable state and their "Power Good"-signals have to be asserted before other voltages like PL bank's I/O voltages can be powered up.

Following diagram clarifies the sequence of enabling the particular on-board voltages:

Figure 3: FPGA board TEC0330-03 Power-On sequence diagram

Bank Voltages

BankSchematic NameVoltageRangeNote
01V81.8VHP: 1.2V to 1.8Vconfig bank (fixed to 1.8V) / JTAG interface
141V81.8VHP: 1.2V to 1.8VQSPI flash memory interface
151V81.8VHP: 1.2V to 1.8Vreference clock input
161V81.8VHP: 1.2V to 1.8VI²C interface of FPGA
171V81.8VHP: 1.2V to 1.8Vreference clock input
181V81.8VHP: 1.2V to 1.8Vreference clock input / I/O's to CPLD
34VCC1V51.5VHP: 1.2V to 1.8VDDR3 memory interface
35VCC1V51.5VHP: 1.2V to 1.8VDDR3 memory interface
36VCC1V51.5VHP: 1.2V to 1.8VDDR3 memory interface

114

115

116

117

118

MGTAVCC_FPGA

MGTVCCAUX_FPGA

MGTAVTT_FPGA

1.0V

1.8V

1.2V

MGT bank supply voltage

MGT bank auxiallary supply voltage

MGT bank termination circuits voltage

MGT banks with Xilinx GTH transceiver units
191V81.8VHP: 1.2V to 1.8Vbank's I/O's exposed to FMC, usable as LVDS-pairs
 371V81.8VHP: 1.2V to 1.8Vbank's I/O's exposed to FMC, usable as LVDS-pairs
 381V81.8VHP: 1.2V to 1.8Vbank's I/O's exposed to FMC, usable as LVDS-pairs
 39VIO_B_FMCuserHP: 1.2V to 1.8Vbank's I/O's exposed to FMC, usable as LVDS-pairs

Table 16: Range of FPGAs bank voltages

See Xilinx Virtex-7 datasheet (DS183) for the voltage ranges allowed.

Power Rails

Connector / -pinVoltageDirectionNote
J4, pin 212V (filtered)out4-wire PWM fan connector suppy voltage
J6, pin 25V (filtered)outCooling fan M1 supply voltage
J8, pin 63V3PCIoutVCCIO CPLD-JTAG
J9, pin 21V8outVCCIO FPGA-JTAG
J2, pin C35 / C3712VoutVCCIO FMC
J2, pin D323V3PCIoutVCCIO FMC
J2, pin D36 / D38 / D39 / D403V3FMCoutVCCIO FMC
J2, pin H1VREF_A_M2CinVREF voltage for bank 37 / 38
J2, pin K1VREF_B_M2CinVREF voltage for bank 39
J2, pin J39 / J40VIO_B_FMCinPL I/O voltage bank 39 (VCCO)
J2, pin H40 / G39 / F40 / E39FMC_VADJoutVCCIO FMC (fixed to 1.8V)
J1, pin A10 / A11 / B83V3PCIinPCIe interface supply voltage
J5, pin 1 / 2 / 312Vinmain power supply interface

Table 17: Power rails of FPGA board on accessible connectors

Technical Specifications

Absolute Maximum Ratings

ParameterMinMaxUnitsNotesNotes

12V power supply voltage

11.412.6V12V ± 5 %ANSI/VITA 57.1 FPGA Mezzazine Card (FMC) Standard
PL I/O voltage for HP banks-0.55 VCCO_X + 0.55V-Xilinx datasheet DS183
GTH receiver (RXP/RXN) and transmitter (TXP/TXN)-0.51.26V-Xilinx datasheet DS183
Voltage on System Controller CPLD pins

-0.3

3.6V-

MachX02 Family Data Sheet

Storage temperature

-55

+125

°C-MachX02 Family Data Sheet

Table 18: Absolute maximum ratings

Recommended Operating Conditions

ParameterMinMaxUnitsNotesReference Document
12V power supply voltage11.412.6V12V ± 5 %ANSI/VITA 57.1 FPGA Mezzazine Card (FMC) Standard
PL I/O voltage for HP banks-0.2VCCO_X + 0.2V-Xilinx datasheet DS183
GTH receiver (RXP/RXN) and transmitter (TXP/TXN)(*)(*)--* See data sheet DS183
Voltage on System Controller CPLD pins3.1353.6V-MachX02 Family Data Sheet

Table 19: Recommended operation conditions

Check Xilinx datasheet (DS183) for complete list of absolute maximum and recommended operating ratings.

Operating Temperature Ranges

Commercial grade: 0°C to +70°C.

Industrial grade: -40°C to +85°C.

The FPGA board's operating temperature range depends also on customer design and cooling solution. Please contact us for options.

Physical Dimensions

  • board size: 106,65mm × 167,65mm
  • Mating height with standard FMC connectors: 10 mm
  • PCB thickness: 1.65 mm

Figure 4: Physical dimensions of the TEC0330-03 board. All dimensions are shown in millimeters.

Weight

156 g - Plain board.

Revision History

Hardware Revision History

DateRevisionNotesPCNDocumentation
-03first production release--
-02Prototype--
-01Prototype--

Hardware revision number is written on the PCB board together with the model number separated by the dash.


Document Change History

DateRevisionContributorsDescription
2017-03-15
 Ali Naseri
Initial TRM release

Disclaimer

Data Privacy

Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy

Document Warranty

The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.

Limitation of Liability

In no event will Trenz Electronic, its suppliers, or other third parties mentioned in this document be liable for any damages whatsoever (including, without limitation, those resulting from lost profits, lost data or business interruption) arising out of the use, inability to use, or the results of use of this document, any documents linked to this document, or the materials or information contained at any or all such documents. If your use of the materials or information from this document results in the need for servicing, repair or correction of equipment or data, you assume all costs thereof.

Copyright Notice

No part of this manual may be reproduced in any form or by any means (including electronic storage and retrieval or translation into a foreign language) without prior agreement and written consent from Trenz Electronic.

Technology Licenses

The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.

Environmental Protection

To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.

REACH, RoHS and WEEE

REACH

Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).

RoHS

Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.


Error rendering macro 'page-info'

Ambiguous method overloading for method jdk.proxy244.$Proxy3589#hasContentLevelPermission. Cannot resolve which method to invoke for [null, class java.lang.String, class com.atlassian.confluence.pages.Page] due to overlapping prototypes between: [interface com.atlassian.confluence.user.ConfluenceUser, class java.lang.String, class com.atlassian.confluence.core.ContentEntityObject] [interface com.atlassian.user.User, class java.lang.String, class com.atlassian.confluence.core.ContentEntityObject]

  • No labels