Table of Contents
Overview
The Trenz Electronic TE0820 are 4 x 5 standard footprint MPSoC modules integrating a Xilinx Zynq UltraScale+ with up to 4 GByte 32-Bit DDR4 SDRAM, and max. 512 MByte SPI Boot Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking strips.
All this on a tiny footprint, smaller than a credit card, at the most competitive price.
All Trenz Electronic SoMs in 4 x 5 cm form factor are mechanically compatible.
Block Diagram
Main Components
- Xilinx Zynq UltraScale+ ZU3EG MPSoC, U1
- 4A power system on a chip (PowerSoC) DC-DC converter, U5
- 3A High efficiency step-down converter MicroSiP™ with integrated inductor (0.9V), U9
- 3A High efficiency step-down converter MicroSiP™ with integrated inductor (1.8V), U13
3A PFET load switch with configurable slew rate, fast transient isolation and hysteresis control, Q1
- Ultralow supply-current voltage monitor with optional watchdog, U19
- Marvell Alaska 88E1512 integrated 10/100/1000 Mbps energy efficient ethernet transceiver, U8
- Low power programmable oscillator @ 12.000000 MHz, U11
- Miniature traceability S/N pad for low-cost, unique product identification
- 3A High efficiency step-down converter MicroSiP™ with integrated inductor (2.5V), U4
- 4 Gbit (256 x 16) DDR4 SDRAM, U3
- 4 Gbit (256 x 16) DDR4 SDRAM, U2
- 3A High efficiency step-down converter MicroSiP™ with integrated inductor (1.2V), U15
- 1.8V, 256 Mbit multiple I/O serial flash memory, U17
- 1.8V, 256 Mbit multiple I/O serial flash memory, U7
- Low power programmable oscillator @ 33.333333 MHz, U32
- 3A High efficiency step-down converter MicroSiP™ with integrated inductor (0.85V), U12
- 350 mA, ultra-low VIN, RF low-dropout linear regulator with bias pin, U23
- 3A High efficiency step-down converter MicroSiP™ with integrated inductor (1.8V), U20
- B2B connector Samtec Razor Beam™ LSHM-150, JM2
- 2A peak sink / source DDR termination regulator with VTTREF buffered reference for DDR2, DDR3, DDR3L, and DDR4, U16
- Low power programmable oscillator @ 52.000000 MHz, U14
- Highly integrated full featured hi-speed USB 2.0 ULPI transceiver, U18
- B2B connector Samtec Razor Beam™ LSHM-130, JM3
- I2C programmable, any frequency , any output quad clock generator, U10
- B2B connector Samtec Razor Beam™ LSHM-150, JM1
- Lattice Semiconductor MachXO2 System Controller CPLD, U21
- 4 GByte eMMC memory, U6
Key features
- Xilinx Zynq UltraScale+ MPSoC 784 pin package (ZU3EG, option ZU5EV)
- Memory:
- 32-Bit DDR4 - 4 GByte max
- SPI Boot Flash dual parallel - 512 MByte max
- 4 GByte eMMC (up to 64 GByte)
- B2B connectors:
Plug-on module with 2 x 100-pin and 1 x 60-pin high-speed hermaphroditic strips- 14 x MIO, 132 I/O's x HP (3 banks)
- 4 x serial PS GTR transceivers
- GT Reference clock input
- PLL for GT clocks (optional external reference)
- 1 Gbit Ethernet PHY
- USB 2.0 OTG PHY
- Real Time Clock
- Size: 40 x 50 mm
- All power supplies on board.
Initial delivery state
Signals Interfaces and Pins
Board to Board (B2B) I/Os
I/O signals connected to the MPSoC's I/O bank and B2B connector:
| Bank | Type | B2B Connector | I/O Signal Count | Voltage | Notes |
|---|---|---|---|---|---|
64 | HP | JM2 | 48 | User | Max voltage 1.8V. |
64 | HP | JM2 | 2 | User | Max voltage 1.8V. |
| 65 | HP | JM2 | 18 | User | Max voltage 1.8V. |
65 | HP | JM3 | 12 | User | Max voltage 1.8V. |
66 | HP | JM1 | 48 | User | Max voltage 1.8V. |
501 | MIO | JM1 | 6 | 1.8V | - |
505 | GTR | JM3 | 4 lanes | N/A | - |
505 | GTR CLK | JM3 | 1 differential input | N/A | - |
For detailed information about the pin out, please refer to the Pin-out Table.
JTAG Interface
System Controller I/O Pins
On-board LEDs
Default MIO Mapping
Gigabit Ethernet
USB Interface
I2C Interface
Boot Modes
On-board Peripherals
Processing System (PS) Peripherals
Clocking
Power and Power-on sequence
Power Supply
Power-on sequence
Power Rails
Bank Voltages
Board to Board Connectors
Technical Specifications
Absolute Maximum Ratings
Parameter | Min | Max | Units | Notes | Reference document |
|---|---|---|---|---|---|
VIN supply voltage | -0.1 | 3.6 | V | ||
| I/O Bank supply voltage | -0.5 | 3.6 | V | Xilinx document DS181 | |
| I/O input voltage for FPGA I/O banks | -0.4 | VCCO_X+0.55 | V | Xilinx document DS181 | |
| GT Transceiver | -0.5 | 1.26 | V | Xilinx document DS181 | |
Voltage on module JTAG pins | -0.4 | VCCO_0+0.55 | V | VCCO_0 is 1.8V or 3.3V nominal | Xilinx document DS181 |
Storage temperature | -40 | +85 | °C |
Recommended Operating Conditions
| Parameter | Min | Max | Units | Notes | Reference document |
|---|---|---|---|---|---|
| VIN supply voltage | 3.135 | 3.45 | V | ||
| IO Bank supply voltage for I/O banks | 1.14 | 3.465 | V | Xilinx document DS181 | |
| I/O input voltage for I/O banks | -0.20 | VCCO + 0.20 | V | Xilinx document DS181 | |
| Voltage on module JTAG pins | 3.135 | 3.465 | V | For a module variant with 3.3V CONFIG Bank option | Xilinx document DS181 |
Please check Xilinx datasheet DS181 for complete list of absolute maximum and recommended operating ratings for the Artix-7.
Physical Dimensions
Module size: 50 mm × 40 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 8 mm
PCB thickness: 1.6 mm
Highest part on PCB: approximately 5 mm. Please download the step model for exact numbers.
All dimensions are shown in mm. Additional sketches, drawings and schematics can be found here.
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| Top View, Mounting Holes | Bottom View, Samtec Connectors |
Operating Temperature Ranges
Commercial grade modules
All parts are at least commercial temperature range of 0 °C to +70 °C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.
Industrial grade modules
All parts are at least industrial temperature range of -40 °C to +85 °C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.
Weight
| Variant | Weight in g | Note |
|---|---|---|
| 2IC6 | 8.3 | Plain Module |
Revision History
Hardware Revision History
| Date | Revision | Notes | PCN Link | Documentation Link |
|---|---|---|---|---|
| 2016-12-23 | 01 | - | TE0820-01 |
Hardware revision number is printed on the PCB board next to the module model number separated by the dash.
Document Change History
Date | Revision | Authors | Description |
|---|---|---|---|
| 2017-05-10 | Jan Kumann | Initial version. |
Disclaimer
Data Privacy
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Document Warranty
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Technology Licenses
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REACH, RoHS and WEEE
REACH
Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).
RoHS
Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.
WEEE
Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).
Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.
Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.
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