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Table of Contents
Overview
The Cyclone10 LP Reference Kit is the world's first development board with a 55kLE Intel Cyclone 10 LP and a variety of interfaces for numerous applications. The board is comprehensively tested and ready for use with end products and can also be ordered in customer-specific variants according to your requirements.
Refer to http://trenz.org/tei0009-info for the current online version of this manual and other available documentation.
Key Features
- Intel Cyclone 10 LP FPGA 10CL055YU484C8G, 55 kLE in 484-pin
- 16 MBit flash memory (optional up to 32 MBit possible)
- Integrated USB Programmer 2
- Connectors
- 256 MBit (optional up to 512 MBit possible) SDRAM
- 128 MBit (optional up to 512 MBit possible) User Quad-SPI Flash memory
- 64 MBit HyperRAM (optional up to 128 MBit possible)
- 2 x MAC address EEPROM
- 2 x Fast Ethernet PHY (10/100 Mbps)
- 8-channel, 12-bit, configurable ADC / DAC with on-chip reference
- Status LEDs, Power LED
- 13 x User LEDs
- 1 x 7-segment display
- 2 x reset buttons
- 5 x user buttons
Block Diagram
TEI0009 block diagram
Main Components
TEI0009 main components
- Barrel Jack, J12
- RJ45 socket, J8...9
- VGA Socket, J11
- Push button(Reset), S7
- Grove connector, J5
- Under/Over Voltage Protector, U9
- 7-segment LED, D11
- 1x6 pin header, J4
- 1x8 pin header, J2...3
- User Red LEDs, D2...9
- User Red LEDs, D13...17
- Push buttons, S1- S3...6
- Red LED (CONF_DONE), D10
- PSDRAM memory, U3
- SDRAM memory, U10
- Voltage Regulator, U5- U7
- AD/DA Convertor, U2
- Pmod 2x6 SMD host socket, P1...6
- Intel Cyclone 10 LP, U1
- Config Device, U5
- 1x10 pin header, J1
- EEEPROM, U15- U18- U20
- FTDI FT2232H, U14
- Micro USB 2.0 receotacle 90, J10
- Push button (RST_GPIO), S2
- Oscillator, U22
- Ethernet PHY, U17- U19
- SPI Flash memory, U12
Initial Delivery State
Storage device name | Content | Notes |
|---|---|---|
SPI Flash | ||
| EEPROM | ||
| DDR3 SDRAM | ||
| FTDI System Controller CPLD | ||
| PSRAM | ||
| Config Device |
Initial delivery state of programmable devices on the module
Configuration Signals
Configuration mode has been set to AS (Active Serial) configuration.
MODE Signal State | MSEL0 | MSEL1 | MSEL2 | MSEL3 | Connected to | Boot Mode |
|---|---|---|---|---|---|---|
MSEL[0:3] | 0 | 1 | 0 | 0 | Bank 6 | AS (Active Serial) |
Boot process.
RESET pin can be set through the push button S1.
Signal | Connected to | Note |
|---|---|---|
RESET | S1 (Push button) | Connected to nCONFIG |
| EXT_RST | J3 (1x8 pin header) Bank 2 |
Reset process.
Signals, Interfaces and Pins
I/Os on Pin Headers and Connectors
FPGA bank number and number of I/O signals connected to the B2B connector:
| FPGA Bank | Connector | I/O Signal Count | Voltage Level | Notes |
|---|---|---|---|---|
| Bank 1 | J1 (Pin header) | 8 Single ended | 3.3 V | |
| J2 (Pin header) | 8 Single ended | 3.3 V | ||
| J4 (Pin header) | 6 Single ended | 3.3 V | ||
| Bank 2 | J3 (Pin header) | 1 Single ended | 3.3 V | |
| P1 (PMod SMD host socket) | 8 Single ended | 3.3 V | ||
| P2 (PMod SMD host socket) | 8 Single ended | 3.3 V | ||
| J11 (VGA host Socket) | 14 Single ended | 3.3 V | ||
| Bank 6 | J5 (Grove connector) | 2 Single ended | 3.3 V | |
| Bank 7 | P5 (PMod SMD host socket) | 8 Single ended | 3.3 V | |
| P6 (PMod SMD host socket) | 8 Single ended | 3.3 V | ||
| Bank 8 | P3 (PMod SMD host socket) | 8 Single ended | 3.3 V | |
| P4 (PMod SMD host socket) | 8 Single ended | 3.3 V |
General PL I/O to B2B connectors information
PMod SMD Host Socket
TEI0009 has 6 PMod 2x6 SMD Host Socket 90° which are connected to Cyclon 10 LP.
| Designator | Signals | Connected to | Notes |
|---|---|---|---|
| P1 | P1_IO1...8 | Bank 2 | |
| P2 | P2_IO1...8 | Bank 2 | |
| P3 | P3_IO1...8 | Bank 8 | |
| P4 | P4_IO1...8 | Bank 8 | |
| P5 | P5_IO1...8 | Bank 7 | |
| P6 | P6_IO1...8 | Bank 7 |
PMod SMD host socket information
UART Interface
UART access to TEI0009 is available on 1x8 pin header J2.
| Schematic | Pin Header | Connected to | Voltage Level | Notes |
|---|---|---|---|---|
| TXD | J2 | Bank 1 | 3.3 V | |
| RXD | J2 | Bank 1 | 3.3 V |
UART interface information
Micro USB2.0 Connector
U14(FTDI FT2232) can be accessed through Micro USB2.0 B Receptacle 90 (J10).
| Schematic | Connected to | Voltage Level | Notes |
|---|---|---|---|
| USB_VBUS | GND | ||
| D- | U14 (FTDI FT2232) | 3.3 V | |
| D+ | U14 (FTDI FT2232) | 3.3 V |
Micro USB2.0 B Receptacle 90 ° information
RJ45 Connectors
TEI0009 is equipped with two RJ45 connectors and two Ethernet PHYs. RJ45 connectors J8 and J9 are connected to Ethernet PHYs U17 and U19 respectively. .
| Pin | Schematic | ETH1 Pin | ETH2 Pin | Notes |
|---|---|---|---|---|
| TD+ | ETH_TX_P | U17- TXP | U19- TXP | |
| CT | ETH_CTREF_TCT | - | - | Connected to GND |
| TD- | ETH_TX_N | U17- TXM | U19- TXM | |
| RD+ | ETH_RX_P | U17- RXP | U19- RXP | |
| CT | ETH_CTREF_RCT | - | - | Connected to GND |
| RD- | ETH_RX_N | U17- RXM | U19- RXM | |
| LED Green | ETH_LED0 | U17- NWAYEN | U19- NWAYEN | |
| LED Yellow | ETH_LED1 | U17- SPEED | U19- SPEED |
RJ45 connectors information
VGA socket Connectors
VGA host socket is connected to Cyclone 10 LP through Bank 2.
| Schematic | Corresponding Signals | Connected to | Notes |
|---|---|---|---|
| VGA_RED | VGA_R0...3 | Bank 2 | Red channel |
| VGA_GREEN | VGA_G0...3 | Bank 2 | Green channel |
| VGA_BLUE | VGA_B0...3 | Bank 2 | Blue channel |
| VGA_RGB_HSYNC | VGA_HS | Bank 2 | Horizontal sync |
| VGA_RGB_VSYNC | VGA_VS | Bank 2 | Vertical sync |
VGA host socket information
On-board Peripherals
| Chip/Interface | Designator | Notes |
|---|---|---|
| SPI Flash memory | U12 | |
| SDRAM memory | U10 | |
| PSRAM memory | U3 | |
| 7 Segment | D11 | |
| FTDI FT2232 | U14 | |
| Ethernet PHY | U17, U19 | |
| Configuration Device | U5 | |
| AD/DA Converter | U2 | |
| EEPROM | U15, U18, U20 | |
| User LEDs | D2...D17 | |
| Oscillators | U16, U22 |
On board peripherals
SPI Flash Memory
| Pin | Schematic | Connected to | Notes |
|---|---|---|---|
| CS | F_CS | Bank 7 | |
| CLK | F_CLK | Bank 7 | |
| IO0...3 | F_IO0...3 | Bank 7 |
Quad SPI interface MIOs and pins
SDRAM Memory
The TEI0009 has 64 Mb volatile , SDRAM IC(U10) for storing user application code and data. Up to 512 MBit SDRAM is possibleon other assembly option.
Part number: W9864G6JT-6-ND
Supply voltage: 3.3 V
- Clock Frequency: 166MHz
Temperature: 0°C ~ 70°C
PSRAM Memory
The TEI0009 is integrated with 64Mbit Pseudo Static Random Access Memory (SDRAM) using a self-refresh DRAM array organized as 8M words by 8 bits. The device supports a HyperBus interface, Very Low Signal Count (Address, Command and data through 8 DQ pins), Hidden Refresh Operation, and Automotive Temperature Operation.
Part number: IS66WVH8M8BLL
Supply voltage: 3.3 V
- Clock Frequency: 100MHz
Temperature: -40°C ~ 85°C
LED 7 Segment 4 Digit
the TEI0009 has a LED 7 Segment 4 Digit which is connected to Bank 6.
| Pin | Schematic | Connected to | Notes |
|---|---|---|---|
| A/L1 | SEG_CA | Bank 6 | |
| B/L2 | SEG_CB | Bank 6 | |
| C/L3 | SEG_CC | Bank 6 | |
| D | SEG_CD | Bank 6 | |
| E | SEG_CE | Bank 6 | |
| F | SEG_CF | Bank 6 | |
| G | SEG_CG | Bank 6 | |
| DP | SEG_CDP | Bank 6 | |
| A1 | SEG_AN | Bank 6 | |
| A2 | SEG_AN4 | Bank 6 | |
| A3 | SEG_AN3 | Bank 6 | |
| A4 | SEG_AN2 | Bank 6 | |
| L1-L3 | SEG_AN1 | Bank 6 |
LED 7 Segment pins
FTDI FT2232H
The FTDI chip U14 converts signals from USB2.0 to a variety of standard serial and parallel interfaces. Refer to the FTDI data sheet to get information about the capacity of the FT2232H chip.
FTDI FT2232H chip is used in MPPSE mode for JTAG, 6 I/O's of Channel B are routed to FPGA bank 8 of the FPGA SoC and are usable for example as GPIOs, UART or other standard interfaces.
The configuration of FTDI FT2232H chip is pre-programmed on the EEPROM U15.
| FTDI Chip Pin | Signal Schematic Name | Connected to | Notes |
|---|---|---|---|
| ADBUS0 | TCK | Bank 1 | JTAG interface |
| ADBUS1 | TDI | Bank 1 | |
| ADBUS2 | TDO | Bank 1 | |
| ADBUS3 | TMS | Bank 1 | |
| BDBUS0 | BDBUS0 | Bank 6 | |
| BDBUS1 | BDBUS1 | Bank 6 | |
| BDBUS2 | BDBUS2 | Bank 6 | |
| BDBUS3 | BDBUS3 | Bank 6 | |
| BDBUS4 | BDBUS4 | Bank 6 | |
| BDBUS5 | BDBUS5 | Bank 6 | |
| EECS | EECS | U15 (EEPROM) | |
| EECLK | EECLK | U15 (EEPROM) | |
| EEDATA | EEDATA | U15 (EEPROM) | |
| OSCI | CK12M | U16 (12MHz Oscillator) | |
| DM | D_N | J10 (Micro USB2.0) | |
| DP | D_P | J10 (Micro USB2.0) |
FTDI chip interfaces and pins
Ethernet PHY
The TEI0009 is equipped with two Ethernet PHY (U19, U17) which are connected to two RJ45 connectors.
| Ethernet Pin | Signals | ETH 1 | ETH 2 | Note |
|---|---|---|---|---|
| TXD0...3 | ETH_TXD0...3 | Bank 5 | Bank 5 | |
| TXC | ETH_TXC | Bank 5 | Bank 5 | |
| TXEN | ETH_TXEN | Bank 5 | Bank 5 | |
| RXD0...3 | ETH_RXD0...3 | Bank 5 | Bank 5 | |
| RXC//B-CAST_OFF | ETH_RXC | Bank 5 | Bank 5 | |
| RXER/ISO | ETH_RXER | Bank 5 | Bank 5 | |
| INTRP//NAND_Tree | ETH_INTRP | Bank 5 | Bank 5 | |
| XI | ETH_CLKIN | U22 (Oscillator) | U22 (Oscillator) | |
| MDC | ETH_MDC | Bank 5 | Bank 5 | |
| MDIO | ETH_MDIO | Bank 5 | Bank 5 | |
| COL/CONFIG0 | ETH_COL | Bank 5 | Bank 5 | |
| CRS/CONFIG1 | ETH_CRS | Bank 5 | Bank 5 | |
| RXDV/CONFIG2 | ETH_RXDV | Bank 5 | Bank 5 | |
| LED0/NWAYEN | ETH_LED0 | Bank 5 J8B (RJ45- Green LED) | Bank 5 J9B (RJ45-Green LED) | |
| LED1/SPEED | ETH_LED1 | Bank 5 J8C (RJ45-Yellow LED) | Bank 5 J9B (RJ45-Yellow LED) | |
| nRST | ETH_RST | Bank 5 | Bank 5 | |
| RXM | ETH_RX_N | J8 (RJ45) | J9 (RJ45) | |
| RXP | ETH_RX_P | J8 (RJ45) | J9 (RJ45) | |
| TXM | ETH_TX_N | J8 (RJ45) | J9 (RJ45) | |
| TXP | ETH_TX_P | J8 (RJ45) | J9 (RJ45) |
Ethernet PHY connections and pins
RTC
| MIO Pin | Schematic | U? Pin | Notes |
|---|---|---|---|
I2C interface MIOs and pins
| MIO Pin | I2C Address | Designator | Notes |
|---|---|---|---|
I2C Address for RTC
EEPROM
| MIO Pin | Schematic | U?? Pin | Notes |
|---|---|---|---|
I2C EEPROM interface MIOs and pins
| MIO Pin | I2C Address | Designator | Notes |
|---|---|---|---|
I2C address for EEPROM
LEDs
| Schematic | Color | Connected to | Active Level | Note |
|---|---|---|---|---|
On-board LEDs
Ethernet
| Bank | Signal Name | ETH1 | ETH2 | Signal Description |
|---|---|---|---|---|
Ethernet PHY to Zynq SoC connections
CAN Transceiver
| Bank | Schematic | U?? Pin | Notes |
|---|---|---|---|
| D-Tx | Driver Input | ||
| R-Rx | Reciever Output |
CAN Tranciever interface MIOs
Clock Sources
| Designator | Description | Frequency | Note |
|---|---|---|---|
| MHz | |||
| MHz | |||
| KHz | |||
Osillators
Power and Power-On Sequence
Power Supply
Power supply with minimum current capability of xx A for system startup is recommended.
Power Consumption
| Power Input Pin | Typical Current |
|---|---|
| VIN | TBD* |
Power Consumption
* TBD - To Be Determined
Power Distribution Dependencies
Power Distribution
Power-On Sequence
Power Sequency
Voltage Monitor Circuit
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Voltage Monitor Circuit
Power Rails
| Power Rail Name | B2B Connector JM1 Pin | B2B Connector JM2 Pin | B2B Connector JM3 Pin | Direction | Notes |
|---|---|---|---|---|---|
Module power rails.
Bank Voltages
Bank | Schematic Name | Voltage | Notes |
|---|---|---|---|
Zynq SoC bank voltages.
Board to Board Connectors
? x ? modules use two or three Samtec Micro Tiger Eye Connector on the bottom side.
3 x REF-??????? (compatible to ????????), (?? pins, ?? per row)
Operating Temperature: -??°C ~ ??°C
Current Rating: ??A per ContactNumber of Positions: ??
Number of Rows: ??
Technical Specifications
Absolute Maximum Ratings
| Symbols | Description | Min | Max | Unit |
|---|---|---|---|---|
| V | ||||
| V | ||||
| V | ||||
| V | ||||
| V | ||||
| V | ||||
| V | ||||
| V | ||||
PS absolute maximum ratings
Recommended Operating Conditions
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
| Parameter | Min | Max | Units | Reference Document |
|---|---|---|---|---|
| V | See ???? datasheets. | |||
| V | See Xilinx ???? datasheet. | |||
| V | See Xilinx ???? datasheet. | |||
| V | See Xilinx ???? datasheet. | |||
| V | See Xilinx ???? datasheet. | |||
| V | See Xilinx ???? datasheet. | |||
| V | See Xilinx ???? datasheet. | |||
| °C | See Xilinx ???? datasheet. | |||
| °C | See Xilinx ???? datasheet. |
Recommended operating conditions.
Physical Dimensions
Module size: ?? mm × ?? mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: ? mm.
PCB thickness: ?? mm.
Physical Dimension
Currently Offered Variants
| Trenz shop TE0728 overview page | |
|---|---|
| English page | German page |
Trenz Electronic Shop Overview
Revision History
Hardware Revision History
| Date | Revision | Changes | Documentation Link |
|---|---|---|---|
| - | |||
Hardware Revision History
Hardware revision number can be found on the PCB board together with the module model number separated by the dash.
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Board hardware revision number.
Document Change History
| Date | Revision | Contributor | Description |
|---|---|---|---|
| |||
-- | all |
|
Document change history.
Disclaimer
Data Privacy
Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy
Document Warranty
The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.
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Technology Licenses
The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.
Environmental Protection
To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.
REACH, RoHS and WEEE
REACH
Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).
RoHS
Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.
WEEE
Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).
Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.
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