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Table of Contents

Overview

The Trenz Electronic TEI0006 is an Industrial grade module based on Intel® Cyclone 10 GX. Intel Cyclone 10 GX device family delivers higher core, transceiver, and I/O performance than the previous generation of low cost FPGAs.

Refer to http://trenz.org/tei0006-info for the current online version of this manual and other available documentation.

Key Features

  • Intel® Cyclone 10 GX Industrial [10CX220YF780I5G]
    • Package: 780-FBGA
    • Speed Grade: 5 (Fastest)
    • Temperature: -40°C ~ 100°C
    • Package compatible device 10CX150 and 10CX105 as assembly variant on request possible
  • 2x SDRAM DDR3L Memory IC 8Gb, 800MHz 
  • 2x SPI Flash, 1 Gb
  • 2x Transceiver Full Ethernet 64-QFN 
  • Programmable Oscillator
  • 2Kb EEPROM Memory
  • 4x User LED 

  • I/O interfaces:
    • 284 GPIO
    • 118 LVDS
    • 12 XCVR
  • Board to Board (B2B):

    • Plug-on module with 3 x 160-pin Samtec Razor Beam (ST5) connectors
  • Power Supply:

    • 5V

  • Others:

    • Dimension: 80m x 60m

Block Diagram


TEI0006 block diagram

Main Components

TEI0006 main components
  1. Intel® MAX 10, U18
  2. DC/DC convertor, U4...11
  3. SDRAM DDR3 Memory, U12...13
  4. User LEDs, D1...4
  5. Ethernet Tranciever, U2- U14
  6. SPI Flash Memory, U1- U3
  7. Intel® Cyclone 10 GX, U23
  8. EEPROM, U64
  9. Buffer, U16

Initial Delivery State

Storage device name

Content

Notes

Quad SPI Flash

Not Programmed


EEPROMProgrammed

Programmable Oscillator configuration

DDR3 SDRAMNot Programmed


Initial delivery state of programmable devices on the module

Configuration Signals

The TEI0006 module can be configured using different modes. Mode selection can be done using MSEL[2:0]. MSEL2 is potentially connected to GND so mode selection can be done using MSEL[1:0] which are connected to Bank 3 of Intel Max 10.

MODE Signal State

MSEL2MSEL1MSEL0Boot Mode

MSEL[2:0]

010

AS x4 / Fast

011

AS x1 / Standard

000PS and FPP/ Fast
001PS and FPP/ Standard
Boot process.

By tying the CONF_DONE, nSTATUS, and nCONFIG pins together, the devices initialize and enter user mode at the same time. If any device in the chain detects an error, configuration stops for the entire chain and you must reconfigure all the devices. For example, if the first device in the chain flags an error on the nSTATUS pin, it resets the chain by pulling its nSTATUS pin low.

SignalsConnected toDescriptionNote
nCONFIG1.8VConfiguration triggerFrom U18( Intel MAX 10) - Bank 3
CONF_DONE1.8VConfiguration done To U18( Intel MAX 10) - Bank 3
nSTATUS1.8VConfiguration status To U18( Intel MAX 10) - Bank 3
DCLKU1,U3Configuration clock 

To U1(Flash Memory)

From U18( Intel MAX 10) - Bank 3

AS_DATA0...3U1Configuration dataTo U1(Flash Memory)
Configuration signals.

Signal

B2BConnected toNote

PERST

J2-99Bank A2
Reset process.

Signals, Interfaces and Pins

Board to Board (B2B) I/Os

FPGA bank number and number of I/O signals connected to the B2B connector:

FPGAFPGA BankB2B ConnectorI/O Signal CountVoltage LevelNotes
Intel Cyclone 10 GXBank 1CJ324 Single ended (12 Diff pair)0.95V

GXBL1C_RX0...5 N/P, GXBL1C_TX0...5 N/P

Bank 1D

J324 Single ended (12 Diff pair)0.95VGXBL1D_RX0...5 N/P, GXBL1D_TX0...5 N/P
Bank 2AJ22 Single ended1.8VPERST, CLKUSR
Bank 2JJ246 Single ended (23 Diff pair)1.8V
Bank 2KJ146 Single ended (23 Diff pair)VCCIO2K
Bank 2LJ146 Single ended (23 Diff pair)3.0V
Bank 3A--1.35VVDD_DDR
Bank 3B--1.35VVDD_DDR
Intel Max 10Bank 1AJ28 Single ended3.3V
Bank 1BJ25 Single ended3.3V
Bank 2J32 Single ended1.8VIO
Bank 3--1.8VIO
Bank 5J24 Single ended3.3V
Bank 6J22 Single ended3.3V
Bank 8J225 Single ended3.3V
General PL I/O to B2B connectors information


JTAG Interface

JTAG access to the TEI0006 SoM through B2B connector JM2.

JTAG Signal

B2B Connector

Note
TMSJ2-160
TDIJ2-159
TDOJ2-158
TCK

J2-157


JTAGENJ2-105Connected to 3.3V
JTAG pins connection

MIO Pins


MIO PinConnected toB2BNotes
MAX_IO1...22U18( Intel MAX 10) - Bank 8J2
MAX_IO23...26U18( Intel MAX 10) - Bank 8J2
MIOs pins


On-board Peripherals

Chip/InterfaceDesignatorNotes

SPI Flash Memory

U1- U3
EEPROMU64
SDRAM DDR3 MemoryU12...13
Ethernet TrancieverU2- U14
Intel Max 10U18

User LEDs

D1...4D1 (Red), D2...4 (Green)
OscillatorsU14, U15, U17, U21
On board peripherals

SPI Flash Memory

The TEI0006 is equipped with two Micron SPI flash memory. On-board SPI flash memory is used to store initial FPGA configuration. Besides FPGA configuration, remaining free flash memory can be used for user application and data storage. All four SPI data lines are connected to the FPGA allowing x1 or x4 data bus widths. Maximum data rate depends on the selected bus width and clock frequency.

DesignatorSchematicConnected toNotes
U1



NCSOCSS Bank (Configuration Bank)Used when you are not configuring using AS
DCKDCLKAS Configuration Clock
AS_DATA0CSS Bank (Configuration Bank)AS Configuration Pin
AS_DATA1CSS Bank (Configuration Bank)AS Configuration Data
AS_DATA2CSS Bank (Configuration Bank)AS Configuration Data
AS_DATA3CSS Bank (Configuration Bank)AS Configuration Data
U3QSPI_CSBank 2A
QSPI_CKBank 2A
QSPI_DATA0Bank 2A
QSPI_DATA1Bank 2A
QSPI_DATA2Bank 2A
QSPI_DATA3Bank 2A
Quad SPI interface MIOs and pins

EEPROM

SchematicU64 PinB2BNotes
I2C_SCLSCLJ3-135Connected to U18(Intel Max 10)- Bank 2
I2C_SDASDAJ3-137Connected to U18(Intel Max 10)- Bank 2
I2C EEPROM interface MIOs and pins

PinsI2C AddressDesignatorNotes
I2C_SCL, I2C_SDA0x53U64
I2C address for EEPROM

DDR3 SDRAM

The TEI0006 SoM has two 1 Gb volatile DDR3 SDRAM IC for storing user application code and data.

  • Part number: IS43TR16512BL
  • Supply voltage: 1.35V
  • Speed: 800MHz
  • Temperature: 0 ° C to 95 ° C

Ethernet

Signal NameConnected toB2BSignal Description

PHY1_MDI0_P

PHY1_MDI0_N

-

-

J2-93

J2-91


PHY1_MDI1_P

PHY1_MDI1_N

-

-

J2-87

J2-85


PHY1_MDI2_P

PHY1_MDI2_N

-

-

J2-81

J2-79


PHY1_MDI3_P

PHY1_MDI3_N

-

-

J2-75

J2-73


ETH1_RSTBank 2A-Connected to DVDDH Voltage
ETH1_MDCBank 2A-Connected to DVDDH Voltage
ETH1_MDIOBank 2A-Connected to DVDDH Voltage
ETH1_TXD0...7Bank 2A-8bit Transfer
ETH1_RXD0...7Bank 2A-8bit Recieve
ETH1_GTXCKBank 2A-
ETH1_TXCLKBank 2A-
ETH1_TXENBank 2A-
ETH1_TXERBank 2A-
ETH1_RXCKBank 2A-Connected to GNG
ETH1_RXDVBank 2A-Connected to GNG
PHY1_INT--Connected to DVDDH Voltage
PHY1_LED1-

J2-69

Connected to DVDDH Voltage
PHY1_LED2-J2-67Connected to GNG
ETH1_CRSBank 2A-
ETH1_XTAL_INETH_CLKIN-From U21 (25MHz MEMS Oschillator)
Ethernet PHY to Intel Cyclone 10 GX SoC connections

Intel MAX 10

The TEI0006 is equipped with an Intel MAX 10 device which is a single-chip, non-volatile low-cost programmable logic device (PLD) to integrate the optimal set of system components. Intel MAX 10 (U18) is power and configuration controller on TEI0006 SoM. 

Intel Max 10 BankSignalsConnected to DescriptionNotes
Bank 1AAIN0...7B2B- J2

Bank 1BTCK, TDO, TMS, TDI, JTAGENB2B- J2

Bank 2

PHY1_LED1

PHY1_LED2

U23(Ethernet)

U23(Ethernet)

Ethernet LED

Ethernet LED

Tight to GND

Tight to DVDDH

F_TCK, F_TDO, F_TDI, F_TMSU23(Intel Cyclone 10 GX) - Bank CSSIntel Cyclone 10 JTAG signals
I2C_SDA, I2C_SCL

U64(EEPROM)

J3 (B2B)

U14 (Programmable Oscillator)

I2C EEPROM signals
PLL_RST

U14 (Programmable Oscillator)

Oscillator reset signal
Bank 3nSTATUS, nCONFIG, CONF_DONEU23(Intel Cyclone 10 GX) - Bank CSSIntel Cyclone 10 Configuration signals
DCLK

U23(Intel Cyclone 10 GX) - Bank CSS

U1(SPI Flash)

Intel Cyclone 10

Configuration clock from Flash memory


MSEL0...1U23(Intel Cyclone 10 GX) - Bank CSS

Intel Cyclone 10

Configuration mode signals


DEV_CLRN, INIT_DONEU23(Intel Cyclone 10 GX) - Bank 2A

M10_IO0...4U23(Intel Cyclone 10 GX) - Bank 2A

Bank 5

DIS_GROUP1...4T1...4 (N- Channel MOSFET)Fast Discharching
MAX_IO23...26J2 (B2B)Intel MAX 10 GPIO

PG_0.95V, EN_0.95V

PG_1.8VIO, EN_1.8VIO

U7(Voltage Regulator)

U7(Voltage Regulator)

Power control signals
Bank 6




M10_CLKU21(25MHz Oscillator)Intel MAX 10 Clock

VADJ_VS0...2, VADJ_EN

PG_1.35V, EN_1.35V

PG_1.8V, EN_1.8V

PG_VTT, EN_VTT

PG_0V9, EN_0V9

U11(Voltage Regulator)

U8(Voltage Regulator)

U5(Voltage Regulator)

U9(Voltage Regulator)

U4(Voltage Regulator)

Power control signals
PHY1_33LED1...2

J2 (B2B)

Ethernet LED

LED_FP_1

LED_FP_2...4

D1

D2...4

User LEDs

Red LED

Green LED

Bank 8

M10_nSTATUS, M10_nCONFIG, M10_CONF_DONE

J2(B2B)Intel MAX 10 configuration signals
MAX_IO1...22J2(B2B)Intel MAX 10 GPIO
General PL I/O to B2B connectors information


LEDs

DesignatorColorConnected toActive LevelNote
D1RedLED_FP_1Active high
D2GreenLED_FP_2Active high
D3GreenLED_FP_3Active high
D4GreenLED_FP_4Active high
On-board LEDs

Clock Sources

The TEI0006 has three MEMS oscillator and a programmable clock generator. 

DesignatorDescriptionFrequencyNote
U21MEMS Oscillator25MHz
U15MEMS Oscillator25MHz
U17MEMS Oscillator48MHz
U14Programmable OscillatorVariable
Osillators


SignalsClock TypeIn/ OutConnected toFrequencyNote

IN1_P

IN1_N

Differential

In

In

U15 (Oscillator)

GND

25 MHz
IN1..3 DifferentialInJ3(B2B)Variable

XA

XB

Differential

U17 (Oscillator)

GND

48 MHz

CLK0...4

DifferentialOutJ3(B2B)25MHz
REFCLK_EMIFPDifferentialOut-Variable
CLK6...7DifferentialOutU23 (Intel Cyclon 10 GX)- Bank 1DVariable
CLK8...9DifferentialOutU23 (Intel Cyclon 10 GX)- Bank 1CVariable
Programmable Oscillator connections

Power and Power-On Sequence

Power Supply

Power supply with minimum current capability of 2.5 A for system startup is recommended.

Power Consumption

Power Input PinTypical Current
VINTBD*
Power Consumption

* TBD - To Be Determined

Power Distribution Dependencies

Power Distribution

Power-On Sequence

Voltage regulators can be enabled through U18(Intel MAX 10)- Bank 6.

Power Sequence

Power Rails

Power Rail Name

B2B Connector

JM1 Pin

B2B Connector

JM2 Pin

B2B Connector

JM3 Pin

Voltage LevelDirectionNotes
VCCIO2K53, 54--1.8 VInput
VADJ140,142--3.0 VOutput
VCCIO2J-29,30
1.8 VInput

3.3V

-149,150-3.3 VOutput
1.8_VIO--1391.8 VOutput
Module power rails.

Bank Voltages

FPGAFPGA BankVoltage LevelNotes
Intel Cyclone 10 GXBank 1C0.95 V

Bank 1D

0.95 V
Bank 2A1.8 V
Bank 2J1.8 VVCCIO2J
Bank 2K1.8 VVCCIO2K
Bank 2L3.0 V
Bank 3A1.35 VVDD_DDR
Bank 3B1.35 VVDD_DDR
Intel Max 10Bank 1A3.3 V
Bank 1B3.3 V
Bank 21.8 V1.8VIO
Bank 31.8 V1.8VIO
Bank 53.3V
Bank 63.3V
Bank 83.3V
SoC bank voltages.


Board to Board Connectors


TEI0006 module has three Samtec Razor Beam LP Terminal Strip (ST5) on the bottom side.

  • 3x REF-192552-02 (160-pins, 80 pins per row) 
  • ST5 Mates with SS5

Operating Temperature: -55°C ~ 125°C
Current Rating: 1.6 A per ContactNumber of Positions: ??

The module has a 160-pin double-row REF-192552-02 connector on the bottom side. The counterpart REF-192552-01 is placed on the base board.

Order
number

REF NumberSamtec NumberTypeMated HeightData sheetComment
27220REF-192552-02ST5-80-1.50-L-D-P-TRModule connector5 mmhttp://suddendocs.samtec.com/catalog_english/st5.pdfStandard connector
used on module
27219REF-192552-01SS5-80-3.50-L-D-K-TRBaseboard connector5 mmhttp://suddendocs.samtec.com/catalog_english/ss5.pdfStandard connector
used on board
Connectors.

 With different connectors from the used series other mating heights are possible (according to the Datasheet). The module and base board can be manufactured using other connectors upon request.

Connector SpecificationsValue
Insulator materialLiquid crystal polymer
Stacking height5 mm
Contact materialPhosphor-bronze
PlatingAu or Sn over 50 μ" (1.27 μm) Ni
Current rating1.6 A per pin (2 pins powered)
Operating temperature range-55 °C to +125 °C
RoHS compliantYes
Connector specifications.
Connector Speed Ratings

The LSHM connector speed rating depends on the stacking height; please see the following table:

Stacking heightSpeed rating
5 mm, Single-Ended 13.5GHz /  27Gbps
5 mm, Differential 20GHz / 40Gbps
4 mm, Single-Ended 13GHz /  26Gbps
4 mm, Differential 13.5GHz / 27Gbps
Speed rating.
Current Rating

Current rating of  Samtec Razor Beam™ SS5/ST5 B2B connectors is 1.6A per pin (2 pins powered).

Connector Mechanical Ratings
  • Shock: 100G, 6 ms sawtooth wave
  • Vibration: 7.56G 'RMS', 2 hours per axis, 3 axes total
Manufacturer Documentation

  File Modified
PDF File hsc-report-sma_st5-ss5-04mm_web.pdf 21 09, 2018 by Martin Rohrmüller
PDF File hsc-report-sma_st5-ss5-05mm_web.pdf 21 09, 2018 by Martin Rohrmüller
PDF File ss5_catalog.pdf 21 09, 2018 by Martin Rohrmüller
PDF File ss5-st5_specs.pdf 21 09, 2018 by Martin Rohrmüller



Technical Specifications

Absolute Maximum Ratings

SymbolsDescriptionMinMaxUnitNote
VCCCore voltage power supply-0.51.21V
VCCPPeriphery circuitry and transceiver fabric interface power supply-0.51.21V
VCCERAMEmbedded memory power supply-0.51.36V
VCCPTPower supply for programmable power technology and I/O pre-driver-0.52.46V
VCCIOI/O buffers power supply-0.54.10V3 V I/O
VCCA_PLLPhase-locked loop (PLL) analog power supply-0.52.46V
VCCT_GXBTransmitter power supply-0.51.34V
VCCR_GXBReceiver power supply-0.51.34V
VCCH_GXBTransceiver output buffer power supply-0.52.46V
T_STGStorage temperature-55125°C
Absolute maximum ratings

Recommended Operating Conditions

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

ParameterMinMaxUnitsReference Document
VCC0.870.93VSee Intel Cyclone 10 GX datasheet.
VCCP0.870.93VSee Intel Cyclone 10 GX datasheet.
VCCERAM0.870.93VSee Intel Cyclone 10 GX datasheet.
VCCPT1.711.89VSee Intel Cyclone 10 GX datasheet.
VCCPGM1.711.89VSee Intel Cyclone 10 GX datasheet.
VCCIO2.853.15VSee Intel Cyclone 10 GX datasheet.
VCCA_PLL1.711.89VSee Intel Cyclone 10 GX datasheet.
T_J085°CSee Intel Cyclone 10 GX datasheet.
Recommended operating conditions.

Physical Dimensions

  • Module size: 60 mm × 80 mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: 5 mm.

  • PCB thickness: 1.65 mm

Physical Dimension

Currently Offered Variants 

Trenz shop TEI0006 overview page
English pageGerman page
Trenz Electronic Shop Overview

Revision History

Hardware Revision History

DateRevisionChangesDocumentation Link
2018-07-2701-REV01
Hardware Revision History

Document Change History

DateRevisionContributorDescription

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Document change history.

Disclaimer

Data Privacy

Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy

Document Warranty

The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.

Limitation of Liability

In no event will Trenz Electronic, its suppliers, or other third parties mentioned in this document be liable for any damages whatsoever (including, without limitation, those resulting from lost profits, lost data or business interruption) arising out of the use, inability to use, or the results of use of this document, any documents linked to this document, or the materials or information contained at any or all such documents. If your use of the materials or information from this document results in the need for servicing, repair or correction of equipment or data, you assume all costs thereof.

Copyright Notice

No part of this manual may be reproduced in any form or by any means (including electronic storage and retrieval or translation into a foreign language) without prior agreement and written consent from Trenz Electronic.

Technology Licenses

The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.

Environmental Protection

To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.

REACH, RoHS and WEEE

REACH

Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).

RoHS

Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.


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