3456 Module type Revision 1 (initial) Speed grade 8Gbit - K4A8G165WB-BIRC (NRND) #28375 8Gbit - K4A8G165WC-BITDTCV #30211 Variation Other assembly variations (position 17) LTE 0841 - 02 - x x x x x x x x 1 2 7 8 9 10 11 12 13 14 15 16 17 18 TE BB Mezzanine Module Module name 0841 Module Revision 01 Device name 1 2 3 4 5 6 7 8 9 US 115 25 35 40 - 60 - 85 95 A B D F G H K L M N P R S T U V US+ 3P 5P 7P 9P 10P 11P 13P 15P 20P 25P 27P 29P 31P 33P 35P 37P 1 2 3 4 5 5 1 2 3 1L 2L 2L Temp range C E I Q Commercial Extended Industrial Automotive DDR memory - Not present at all - - - 0 Not populated - - - 1 2 TE0841: 2 GByte Industrial 3 TE0841: 2 GByte Industrial X DDR SODIMM Socket Flash memory 0 Not populated - - - 1 TE0841: 64MByte Industrial 512Mbit - MT25QU512ABB8E12-0SIT #29292 eMMC - TE0841: Not present - - - 0 Not populated - - F Other options (Connectors, custom options) Module Description All A Standard height L Low profile ... Custom assembly variant, look additional table below Additional options Blank no extra options S Starter Kit K With Heat spreader Module Variation Description TE0841 A Standard profile B2B connectors LSHM-150-04.0-L-DV-A-S-K-TR #23838/LSHM-130-04.0-L-DV-A-S-K-TR #24903 Low profile B2B connectors LSHM-150-02.5-L-DV-A-S-K-TR #23836/LSHM-130-02.5-L-DV-A-S-K-TR #26125 C B2B connectors: standard profile , FPGA: without encryption module D B2B connectors: low profile, FPGA: without encryption module T Standard profile B2B connectors LSHM-150-04.0-H-DV-A-S-K-TR #30488/LSHM-130-04.0-H-DV-A-S-K-TR #30489 (30µ Gold on contact)