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TE0841-02-xxxxxx-x
1 2

3456

78 9101112131415





16



1718

Module type

Additional options
TEBB Mezzanine Module
no extra options
Module nameSStarter Kit

0841









KWith Heat spreader
Module RevisionOther options (Connectors, custom options)
01

Revision 1 (initial)

AStandard height
Device nameLLow profile
123456789US...Custom assembly variant, look additional table below
115253540-60-8595
ABDFGHKLMNPRSUS+eMMC 
3P5P7P9P11P13P15P27P29P31P33P35P37P-Not present at all (TE0841)

Speed grade

0Not populated
12345









F


1231L2L









G


Temp rangeH


CEIQ



K


CommercialExtendedIndustrialAutomotive



Flash memory (TE0841: 1x)
DDR memory (TE0841: 2x)0Not populated
-Not present at all
1512MbitMT25QU512ABB8E12-0SIT#29292
0Not populated--
2


14GbitLeft for future use

3


28GBitK4A8G165WB-BIRC#28375
4


XSODIMMSocket

5



Other assembly variations (position 17)

ModuleVariationDescription
TE0841AStandard profile B2B connectors LSHM-150-04.0-L-DV-A-S-K-TR #23838/LSHM-130-04.0-L-DV-A-S-K-TR #24903

L

Low profile B2B connectors LSHM-150-02.5-L-DV-A-S-K-TR #23836/LSHM-130-02.5-L-DV-A-S-K-TR #26125
CB2B connectors: standard profile , FPGA: without encryption module
DB2B connectors: low profile, FPGA: without encryption module
TStandard profile B2B connectors LSHM-150-04.0-H-DV-A-S-K-TR #30488/LSHM-130-04.0-H-DV-A-S-K-TR #30489 (30µ Gold on contact)

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