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Table of Contents
Overview
The Trenz Electronic TE0835 is an extended-grade module based on Xilinx UltraScale+ RFSoC.
Refer to http://trenz.org/te0835-info for the current online version of this manual and other available documentation.
Key Features
- SoC/FPGA
- Xilinx UltraScale+ RFSoC (XCZU25DR-1FFVE1156E)
- Package: E1156
- Speed: -1 (slowest)
- Temperature: Extended (0 to +100 °C)
- Xilinx UltraScale+ RFSoC (XCZU25DR-1FFVE1156E)
- RAM/Storage
- 4x 8Gb DDR4
- 2x 512Mb SPI Flash
- 2k I2C EEPROM
- On Board
- Lattice MachXO2 CPLD
- Programmable Clock Generator
- 3x Oscillators
- Interface
- 2x Samtec ST5 (2x80 pol) Board to Board Connectors
- Power
- 5V Input Supply Voltage
- Dimension
- 90 x 65 mm
Block Diagram
Main Components
- Xilinx UltraScale+ RFSoC XCZU25DR, U1
- 8Gb DDR4 SDRAM, U2,U3,U5,U9
- Voltage Regulators, U4,U6,U7
- Programmable Glock Generator, U15
- Lattice MachXO2 CPLD, U31
- Dual SPI Flash, U24-U25
- USB2.0 Transceiver, U11
- Pin Header 3x1, J3 (not Soldered)
- Gigabit Ethernet Transceiver, U20
- EEPROM, U23
- B2B Connector, J2
- B2B Connector, J1
Initial Delivery State
Storage device name | Content | Notes |
---|---|---|
2x SPI Flash | Not Programmed | |
System Controller CPLD | Programmed | |
EEPROM | ? | |
2x DDR4 | Not Programmed | |
Programmable Clock Generator | Programmed |
Configuration Signals
Configuration must be set through CPLD,U31 by setting MODE0...3 signals.
MODE[0:3] | Boot Mode | Pin Location | Note |
---|---|---|---|
0000 | PS_JTAG | JTAG | PSJTAG Interface |
0001 | Quad SPI (24b) | MIO0...12 | QSPI 24bit addressing |
0010 | Quad SPI (32b) | MIO0...12 | QSPI 32bit addressing |
0011 | SD0 2.0 | MIO13...25 | SD 2.0 |
0100 | NAND | MIO9...25 | Requires 8 bit data bus width |
0101 | SD1 2.0 | MIO31...51 | SD 2.0 |
0110 | eMMC | MIO13...22 | eMMC version 4.5 at 1.8 V |
0111 | USB2.0 | MIO52...63 | Only USB2.0 |
1000 | PJTAG | MIO26...29 | PJTAG Connection 0 0ption |
1001 | PJTAG | MIO12...15 | PJTAG Connection 1 0ption |
1110 | SD1 LS 3.0 | MIO39...51 | SD 3.0 with complaint voltage level shifter |
Signal | B2B | I/O | Note |
---|---|---|---|
RESETN | J1-36 | Input | Pulled up to 3.3V_CPLD |
Signals, Interfaces and Pins
Board to Board (B2B) I/Os
FPGA bank number and number of I/O signals connected to the B2B connector:
FPGA Bank | B2B Connector | Number of I/Os | Voltage Level | Notes |
---|---|---|---|---|
500 | J1 | 12x Single Ended | 1.8V | MIO14...25 |
501 | J1 | 20x Single Ended | 1.8V | MIO26...51 |
505 | J1 | 18x Single Ended, 9x Differential pairs | 0.85V | EXT_CLKIN_PSMGT, RX/TX0...3 |
128 | J1 | 18x Single Ended, 9x Differential pairs | 0.9V | B128_CLK, RX/TX0...3 |
129 | J1 | 18x Single Ended, 9x Differential pairs | 0.9V | B129_CLK, RX/TX0...3 |
65 | J2 | 24x Single Ended, 12x Differential pairs | 1.8V | |
88 | J2 | 16x Single Ended, 8x Differential pairs | 3.3V | HD_B88 |
JTAG Interface
JTAG access to the TE0835 is through B2B connector JM1.
JTAG Signal | B2B Connector |
---|---|
JTAG_TMS | J1-24 |
JTAG_TDI | J1-20 |
JTAG_TDO | J1-18 |
JTAG_TCK | J1-22 |
MIO Pins
MIO Pin | Connected to | B2B | Notes |
---|---|---|---|
MIO0...12 | SPI FLash, U24-U25 | - | Dual SPI FLash |
MIO13 | LED Green, D1 | - | 3.3V_CPLD |
MIO14...25 | FPGA Bank 500,U1 | J1 | PSMIO |
MIO26...27 | FPGA Bank 501,U1 | J1 | PSMIO |
MIO28...29 | CPLD, U31 | - | UART_TX, UART_RX |
MIO30...31 | FPGA Bank 501, U1 | J1 | PSMIO |
MIO32...33 | EEPROM,U23 | - | I2C_SCL, I2C_SDA |
MIO34...35 | FPGA Bank 501,U1 | J1 | PSMIO |
MIO36 | Gigabit ETH, U20 | - | ETH_RST |
MIO37 | USB2.0, U11 | - | USB_RST |
MIO38...51 | FPGA Bank 501, U1 | J1 | PSMIO |
MIO52...62 | USB2.0, U11 | - | USB |
MIO63...77 | Gigabit ETH, U20 | - | ETH |
Test Points
Test Point | Signal | Connected to | Notes |
---|---|---|---|
TP1 | CLKOUT | Voltage Regulator, U7 | |
TP2 | PLL_RSTN | Programmable Clock Generator, U15 | |
TP3 | 3.3V_CPLD | B2B, J1 | |
TP4 | CPLD_JTAGEN | B2B, J1 CPLD, U31 | |
TP5 | JTAG_TDO | B2B, J1 CPLD, U31 | |
TP6 | JTAG_TDI | B2B, J1 CPLD, U31 | |
TP7 | JTAG_TCK | B2B, J1 CPLD, U31 | |
TP8 | JTAG_TMS | B2B, J1 CPLD, U31 | |
TP9 | GND | GND | |
TP10...11 | IO_L1P_AD15P_88, O_L4N_AD12N_88 | FPGA Bank 88, U1 | |
TP12 | VIN | B2B, J1 | |
TP13...14 | GND | GND | |
TP15...16 | MIO32-MIO33 | EEPROM,U23 FPGA Bank 501, U1 | |
TP17 | GND | GND | |
TP18 | ADC_AVCC | LDO Voltage Regulator, U8 | |
TP19 | ADC_AVCCAUX | LDO Voltage Regulator, U10 |
On-board Peripherals
Chip/Interface | Designator | Notes |
---|---|---|
SPI Flash | U24, U25 | |
DDR4 SDRAM | U2, U3, U5, U9 | |
CPLD | U31 | |
USB2.0 | U11 | |
Gigabit Ethernet | U20 | |
Programmable Clock Generator | U15 | |
EEPROM | U22 | |
Oscillators | U14, U21, U12 | |
LEDs | D0...7 |
Quad SPI Flash Memory
The TE0835 is a Dual SPI Flash module equipped with two SPI Flash U24, U25 connecfted to PSMIO FPGA bank 500.
MIO Pin | Schematic | U24 Pin | U25 Pin | Notes |
---|---|---|---|---|
MIO0 | MIO0_QSPI | CLK | - | |
MIO1 | MIO1_QSPI | DO | - | |
MIO2 | MIO2_QSPI | nWP | - | |
MIO3 | MIO3_QSPI | nHOLD | - | |
MIO4 | MIO4_QSPI | DI | - | |
MIO5 | MIO5_QSPI | nCS | - | |
MIO7 | MIO5_QSPI | - | nCS | |
MIO8 | MIO5_QSPI | - | DI | |
MIO9 | MIO5_QSPI | - | DO | |
MIO10 | MIO5_QSPI | - | nWP | |
MIO11 | MIO5_QSPI | - | nHOLD | |
MIO12 | MIO5_QSPI | - | CLK |
USB2.0
The TE0835 is equipped with a USB2.0, U11.
U11 Pin | Schematic | Connected to | Notes |
---|---|---|---|
RESETB | USB0_RST | FPGA Bank 501, U1 | |
VDDIO | 1.8V | 1.8V | |
CPEN | USB0_CPE | B2B, J1 | |
VBUS | USB0_VBUS | B2B, J1 | |
ID | USB0_ID | B2B, J1 | |
DP | USB0_D_P | B2B, J1 | |
DM | USB0_D_N | B2B, J1 | |
REFCLK | USB_CLK | Oschillator, U12 | |
STP | USB0_STP | FPGA Bank 502, U1 | |
NXT | USB0_NXT | FPGA Bank 502, U1 | |
DIR | USB0_DIR | FPGA Bank 502, U1 | |
CLKOUT | USB_CLK | Oschillator, U12 | |
DATA0...7 | USB0_DATA0...8 | FPGA Bank 502, U1 |
Ethernet
The module TE0835 is equipped with a Gigabit Ethernet Transceiver, U20.
U20 Pin | Signal Name | Connected to | Signal Description | Note |
---|---|---|---|---|
MDIO | ETH_MDIO | FPGA Bank 502, U1 | Data Management | |
MDC | ETH_MDC | FPGA Bank 502, U1 | Data Management clock reference for the serial interface | |
TX_CLK | ETH_TXCK | FPGA Bank 502, U1 | Transmit Clock | |
TX_CTRL | ETH_TXCTL | FPGA Bank 502, U1 | Transmit Control | |
TXD0...3 | ETH_TXD0...3 | FPGA Bank 502, U1 | Transmit Data | |
RX_CLK | ETH_RXCK | FPGA Bank 502, U1 | Receive Clock | |
RX_CTRL | ETH_RXCTL | FPGA Bank 502, U1 | Receive Control | |
RXD0...3 | ETH_RXD0...3 | FPGA Bank 502, U1 | Receive Data | |
RESETn | ETH_RST | FPGA Bank 501, U1 | Ethernet reset, Active low. | |
XTAL_IN | ETH_XTAL_IN | Oscillator, U21 | Reference Clock | |
MDI0...3 | PHY_MDI0...3 | B2B, J1 | Media Dependent Interface 0...3 | |
LED0...1 | PHY_LED0...1 | B2B, J1 | LED output | |
LED/INT | PHY_LED2 | B2B, J1 | LED interrupt |
EEPROM
The module TE0835 has an EEPROM (U23) connected to PSMIO FPGA Bank 501.
MIO Pin | Schematic | U23 Pin | Notes |
---|---|---|---|
MIO32 | MIO32_I2C1_SCL | SCL | |
MIO33 | MIO33_I2C1_SDA | SDA |
MIO Pin | I2C Address | Designator | Notes |
---|---|---|---|
MIO32...33 | 0xA1 | U23 |
LEDs
Designator | Color | Connected to | Active Level | Note |
---|---|---|---|---|
D1 | Green | MIO13 | Active High | |
D2...5 | Red | DBG_LED0...3 | Active Low | |
D6 | Red | ERR_OUT | Active High | |
D7 | Red | ERR_STATUS | Active High |
DDR4 SDRAM
The TE0835 SoM has 4x 1 Gigabyte volatile DDR4 SDRAM IC for storing user application code and data.
- Part number: K4A8G165WB
- Supply voltage: 1.2 V
Speed: 2400 Mbps
Temperature: -40 ~ 95 °C
Clock Sources
Designator | Description | Frequency | Note |
---|---|---|---|
U14, U21 | MEMS Oscillator | 25MHz | |
U12 | MEMS Oscillator | 52MHz | |
U15 | Programmable Clock Generator | Variable |
Power and Power-On Sequence
Power Supply
Power supply with minimum current capability of xx A for system startup is recommended.
Power Consumption
Power Input Pin | Typical Current |
---|---|
VIN | TBD* |
* TBD - To Be Determined
Power Distribution Dependencies
Power-On Sequence
Voltage Monitor Circuit
Create DrawIO object here: Attention if you copy from other page, objects are only linked.
Power Rails
Power Rail Name | B2B Connector JM1 Pin | B2B Connector JM2 Pin | B2B Connector JM3 Pin | Direction | Notes |
---|---|---|---|---|---|
Bank Voltages
Bank | Schematic Name | Voltage | Notes |
---|---|---|---|
Board to Board Connectors
The TE0835 has two Samtec Razor Beam on the bottom side.
Order | REF Number | Samtec Number | Type | Mated Height | Data sheet | Comment |
---|---|---|---|---|---|---|
27220 | REF-192552-02 | ST5-80-1.50-L-D-P-TR | Module connector | 5 mm | http://suddendocs.samtec.com/catalog_english/st5.pdf | Standard connector used on module |
27219 | REF-192552-01 | SS5-80-3.50-L-D-K-TR | Baseboard connector | 5 mm | http://suddendocs.samtec.com/catalog_english/ss5.pdf | Standard connector used on board |
With different connectors from the used series other mating heights are possible (according to the Datasheet). The module and base board can be manufactured using other connectors upon request.
Connector Specifications | Value |
---|---|
Insulator material | Liquid crystal polymer |
Stacking height | 5 mm |
Contact material | Phosphor-bronze |
Plating | Au or Sn over 50 μ" (1.27 μm) Ni |
Current rating | 1.6 A per pin (2 pins powered) |
Operating temperature range | -55 °C to +125 °C |
RoHS compliant | Yes |
Connector Speed Ratings
The LSHM connector speed rating depends on the stacking height; please see the following table:
Stacking height | Speed rating |
---|---|
5 mm, Single-Ended | 13.5GHz / 27Gbps |
5 mm, Differential | 20GHz / 40Gbps |
4 mm, Single-Ended | 13GHz / 26Gbps |
4 mm, Differential | 13.5GHz / 27Gbps |
Current Rating
Current rating of Samtec Razor Beam™ SS5/ST5 B2B connectors is 1.6A per pin (2 pins powered).
Connector Mechanical Ratings
- Shock: 100G, 6 ms sawtooth wave
- Vibration: 7.56G 'RMS', 2 hours per axis, 3 axes total
Manufacturer Documentation
Technical Specifications
Absolute Maximum Ratings
Symbols | Description | Min | Max | Unit |
---|---|---|---|---|
V | ||||
V | ||||
V | ||||
V | ||||
V | ||||
V | ||||
V | ||||
V | ||||
Recommended Operating Conditions
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
Parameter | Min | Max | Units | Reference Document |
---|---|---|---|---|
V | See ???? datasheets. | |||
V | See Xilinx ???? datasheet. | |||
V | See Xilinx ???? datasheet. | |||
V | See Xilinx ???? datasheet. | |||
V | See Xilinx ???? datasheet. | |||
V | See Xilinx ???? datasheet. | |||
V | See Xilinx ???? datasheet. | |||
°C | See Xilinx ???? datasheet. | |||
°C | See Xilinx ???? datasheet. |
Physical Dimensions
Module size: 90 mm × 65 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 7 mm.
PCB thickness: 1.65 mm.
Currently Offered Variants
Trenz shop TE0835 overview page | |
---|---|
English page | German page |
Revision History
Hardware Revision History
Date | Revision | Changes | Documentation Link |
---|---|---|---|
2019-11-05 | 01 | Initial Release | REV01 |
Hardware revision number can be found on the PCB board together with the module model number separated by the dash.
Document Change History
Date | Revision | Contributor | Description |
---|---|---|---|
| |||
-- | all |
|
Disclaimer
Data Privacy
Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy
Document Warranty
The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.
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Technology Licenses
The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.
Environmental Protection
To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.
REACH, RoHS and WEEE
REACH
Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).
RoHS
Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.
WEEE
Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).
Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.
Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.