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Overview

The Trenz Electronic TEBA0841 is a low cost carrier board for testing, evaluation and development purposes of the TE0841 and TE0741 modules. Although this base-board is dedicated to the modules TE0841 and TE0741, it is also compatible with other Trenz Electronic 4 x 5 cm SoMs. The carrier board offers one SFP connector, one Micro USB2 B connector, two 2x25-pin headers and one XMOD header to get access to the I/O's and interfaces of FPGA modules. To test and evaluate the Multi-gigabit transceiver units of the FPGA module, 6 MGT lanes on the carrier board are routed in a loop-back circuit on the B2B connectors.

See page "4 x 5 cm carriers" to get information about the SoMs supported by the TEBA0841 carrier board.

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Refer to http://trenz.org/teba0841-info for the current online version of this manual and other available documentation.

Key Features

• SFP+ connector (Enhanced small form-factor pluggable), supports data transmission rates up to 10 Gbit/s
• Micro USB2 Type B Connector
• Trenz Electronic 4x5 module B2B connectors (3 x Samtec LSHM series connectors)
• 4 x 5 SoM programmable by XMOD header
  
• Soldering-pads for pin headers for access to SoM's I/O-bank pins, usable as LVDS-pairs
• Soldering-pads for pin headers for access to further interfaces and I/O's of the SoM
• 2 x user LEDs routed to I/O-pins of the SoM
• 4-bit DIP switch for setting module parameters
• 4x VCCIO selection jumper to set module's bank voltages
  
  

Additional assembly options are available for cost or performance optimization upon request.

Block Diagram

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Main Component

1. Samtec Razor Beam™ LSHM-150 B2B connector, JB1
2. Samtec Razor Beam™ LSHM-150 B2B connector, JB3
3. Samtec Razor Beam™ LSHM-130 B2B connector, JB2
4. 6-pin header J26, for selecting PL I/O-bank voltage
5. 6-pin header J5, for selecting PL I/O-bank voltage
6. 6-pin header J6, for selecting PL I/O-bank voltage
7. 6-pin header J27, for selecting PL I/O-bank voltage
8. Micro USB2 Type B connector J10 (Device or OTG mode)
9. 2-pin VBAT header J7
10. XMOD FTDI JTAG/UART header, JX1
11. 4-bit DIP-switch S1
12. User LED D1 (green)
13. User LED D2 (red)
14. 10-pin header soldering-pads J4, 6 I/O's available
15. 16-pin header soldering-pads J3, JTAG/UART header ('XMOD FTDI JTAG Adapter'-compatible pin-assignment)
16. 50-pin header soldering-pads J17, for access to PL I/O-bank pins (42 I/O'S, 21 LVDS pairs)
17. 50-pin header soldering-pads J20, for access to PL I/O-bank pins (42 I/O'S, 21 LVDS pairs)
18. SFP+ Connector, J1

Initial Delivery State

Board is shipped in following configuration:

• VCCIO selection jumpers are all set to 1.8 V
• Pin headers (not soldered to the board, but included in the package as separate component)

Different delivery configurations are available upon request.

Signals, Interfaces and Pins

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Connections and Interfaces or B2B Pin's which are accessible by User
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B2B Connectors

Following table gives a summary of the available I/O's, interfaces and differential pairs of the mounted SoM on the B2B connectors JB1, JB2 and JB3 of the carrier board:

Table 1: General overview of PL I/O signals and SoM's interfaces connected to the B2B connectors

On-board Pin Header

The TEBA0841 carrier board has footprints as soldering pads to mount 2.54mm grid size pin headers to get access the PL I/O-bank's pins and further interfaces of the mounted SoM. With these pin headers, SoM's PL-I/O's are available to the user, a large quantity of these I/O's are also usable as  differential pairs.

Following table gives a summary of the pin-assignment, available interfaces and functional I/O's of the pin headers:

Table 2: General overview of PL I/O signals, SoM's interfaces and control signals connected to the on-board connectors

SFP+ Connector

The TEBA0841 carrier board is equipped with one SFP+ connector J1 (board-rev. 01: Molex 74441-0001). The connector is fitted into a SFP cage J2 (board-rev. 01: Molex 74737-0009).

The differential RX/TX data lanes are connected to B2B connector JB2, the control-lines are connected to B2B connector JB1.

Following table describes the pin-assignment of the SFP+ connector:

Table 3: SFP+ connector pin-assignment

Loop Back Circuits on B2B Connector JB1 and JB2

The TEBA0841 carrier board is mainly designed for the 4 x 5 SoMs TE0841 and TE0741. This SoMs have GTX-Transceiver units on the FPGA devices with up to 8 available MGT lanes. To test this MGT lanes, 6 RX/TX differential pairs are routed in loop back circuit on-board, hence the transmitted data on those MGT lanes flows back to its source in a loop back circuit without processing or modification.

The MGT lane pins are routed on-board as follows, if 4 x 5 SoM TE0841 is mounted on carrier board:

Table 4: Looped-backed MGT-lanes for mounted 4 x 5 SoM TE0841

JTAG Interface

JTAG access to the mounted SoM is provided through B2B connector JB3 and is routed to the XMOD header JX1 and also to pin header J3. With the TE0790 XMOD USB2 to JTAG adapter, the FPGA device of the mounted SoM can be programed via USB2 interface.

Table 5: JTAG interface signals

XMOD FTDI JTAG-Adapter Header JX1

The JTAG interface of the mounted SoM can be accessed via XMOD header JX1, so in use with the XMOD-FT2232H adapter-board TE0790 the mounted SoM can be programmed via USB2 interface. The TE0790 board provides also an UART interface to the SoM's FPGA device which can be accessed by the USB2 interface of the adapter-board while the signals between these serial interfaces will be converted.

Following table describes the signals and interfaces of the XMOD header JX1:

Table 6: XMOD header JX1 signals and connections

When using XMOD FTDI JTAG Adapter TE0790, the adapter-board's VCC and VCCIO will be sourced by the on-boards 3.3V supply voltage. Set the XMOD DIP-switch with the setting:

Table 7: XMOD adapter board DIP-switch positions for voltage configuration

JTAG/UART Header J3

As alternative to the XMOD header JX1, on the carrier board pin header J3 is present, which has a XMOD header-compatible pin-assignment, but also two additional pins (15,16) as differential pair to supply the mounted SoM with an external MGT reference clock signal:

Table 8: JTAG/UART header J3 signals and connections

UART Interface

UART interface is available on B2B connector JB1 established by the mounted SoM's FPGA device. With the TE0790 XMOD USB2 adapter, the UART signals can be converted to USB2 interface signals:

Table 9: UART interface signals

USB2 Interface

TEBA0841 board has one physical Micro USB2 Type B socket J10, the differential data signals of the USB2 socket are routed to the B2B connector JB2, where they can be accessed by the corresponding USB2 PHY transceiver of the mounted SoM, if available.

With Micro USB2 Type B connector, the USB2 interface is usable in Device or OTG mode.

Following table gives an overview of the USB2 interface signals:

Table 10: USB2 interface signals and connections

On-board Peripherals

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On-board LEDs

The on-board LEDs are available to the user and can be used to indicate system status and activities:

Table 11: On-board LEDs

DIP-Switch

There are one 4-bit DIP-witches S1 present on the TEBA0841 board to configure options and set parameters. The following table describes the of the particular switches:

Table 12: DIP-switch S1, see also 4x5 Module Controller IOs

VCCIO Selection Jumper

On the TEBA0841 carrier board different VCCIO configurations can be selected by the jumper header J26, J27, J5 and J6.

TE 4 x 5 Modules have a standard assignment of PL-bank I/O voltages on the B2B connectors, which will be fed with I/O voltage from base-board.

Table 13: Base-board PL-bank I/O voltages VCCIOA ... VCCIOD

Following table describes how to configure the base-board supply-voltages by jumpers:

Table 14: Configuration of base-board supply-voltages via jumpers. Jumper-Notification: 'Jx: 1-2' means pins 1 and 2 are connected, 'Jx: 3-4' means pins 3 and 4 are connected, and so on

Power and Power-On Sequence

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Power Consumption

The maximum power consumption of the carrier board depends mainly on the mounted SoM's FPGA design running on the Zynq device.

Xilinx provide a power estimator excel sheets to calculate power consumption. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.

Table 15: Typical power consumption

 * TBD - To Be Determined soon with reference design setup.

Power supply with minimum current capability of 3A for system startup is recommended.

Power Supply

Power supply with minimum current capability of 3A at 3.3V for system startup is recommended.

The on-board voltages of the carrier board will be powered up with an external power-supply with nominal voltage of 3.3V.

The external power-supply can be connected to the board by the following pins:

Table 16: Connector pins capable for external 3.3V power supply

Power Distribution Dependencies

The PL-bank I/O voltages 1.8V, 2.5V and 3.3V will be available after the mounted SoM's 3.3V voltage level has reached stable state on B2B-connector pins JM2-10 and JM2-12 (JB2-9, JB2-11), meaning that all on-module voltages have become stable and module is properly powered up.

Following diagram shows the distribution of the external input voltage of nominal 3.3V to the components:

Power Rails

The voltage direction of the power rails is from board and on-board connectors' view:

Table 17: Power pin description of B2B module connector

Table 18: Power Pin description of on-board connector

Table 19: Power Pin description of VCCIO selection jumper pin header

Table 20: Power pin description of peripheral connector

Table 21: Power pin description of XMOD/JTAG connector

Board to Board Connectors

Technical Specifications

Absolute Maximum Ratings

Table 22: Board absolute maximum ratings

Recommended Operating Conditions

Table 23: Module recommended operating conditions

Operating Temperature Ranges

TEBA0841 carrier board operating temperature range is industrial grade: -40°C to +85°C.

Please check the operating temperature range of the mounted SoM, which determine the relevant operating temperature range of the overall system.

Physical Dimensions

Please note that two different units are used on the figures below, SI system millimeters (mm) and imperial system thousandths of an inch(mil). This is because of the 100mil pin headers used, see also explanation below. To convert mils to millimeters and vice versa use formula 100mil's = 2,54mm.

• Module size: 56mm × 75mm.  Please download the assembly diagram for exact numbers.

• Mating height with standard connectors: 8mm.

• PCB thickness: 1.65mm.

• Highest part on the PCB is the SFP+ connector, which has an approximately 11.3mm overall hight. Please download the step model for exact numbers.

Revision History

Hardware Revision History

Table 24: Module hardware revision history

Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

Document Change History

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Table 24: Document change history.

Disclaimer

02 Sept 2017