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Trenz Electronic GigaBee also known as TE0600 series are industrial-grade FPGA micromodules integrating an AMD Spartan-6 LX FPGA, Gigabit Ethernet transceiver, two independent banks of 16-bit-wide DDR3 SDRAM, QSPI Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/Os is provided via robust board-to-board (B2B) connectors.
Refer to http://trenz.org/te0600-info for current online available documentation.
SoC/FPGA/Module
RAM/Storage
512 MByte DDR3 SDRAM 1)
On Board
Interface
3 x B2B Connector (LSHM) for Trenz 4 x 5 SoM socket
Power
Dimension
50 mm x 40 mm
Notes
1) Assembly variant dependent.
Spartan 6 FPGA, U5
DDR3 SDRAM, U6, U7
QSPI Flash, U11
EEPROM, U10, U13
Watchdog, U1
Ethernet PHY, U8
Oscillators, U9, U12
Storage device name | Content | Notes |
|---|---|---|
QSPI Flash U11 | Not programmed | |
EEPROM, U10 | Not programmed | Contains write protected Unique Node ID / MAC . |
| Optional EEPROM, U13 | Not programmed | Contains write protected Unique Node ID / MAC and SHA-1 engine. |
DDR3 SDRAM, U6, U7 | Not programmed |
Connector Type | Designator | Interface | IO CNT | Notes |
|---|---|---|---|---|
| B2B | J1 | QSPI | 6 | Connects to FPGA U5 and QSPI flash U11. |
| B2B | J1 | IO | 3 SE | FPGA IO BANK 2. |
| B2B | J1 | IO | 42 SE / 21 DIFF | FPGA IO BANK 2. |
| B2B | J1 | Ethernet MDI | 9 | 4x DIFF data. |
| B2B | J2 | IO | 1 SE | FPGA IO BANK 0. |
| B2B | J2 | IO | 44 SE / 22 DIFF | FPGA IO BANK 0. |
| B2B | J2 | IO | 1 SE | FPGA IO BANK 1. |
| B2B | J2 | IO | 12 SE / 6 DIFF | FPGA IO BANK 1. |
| B2B | J2 | IO | 6 SE | FPGA IO BANK 3. |
| B2B | J2 | JTAG | 4 |
Test Point | Signal | Notes |
|---|---|---|
TP1 | 1.5V | |
TP2 | 3.3V | |
TP3 | 2.5V | |
TP4 | VCCAUX | |
TP5 | 1.2V | |
TP6 | GND | |
TP7 | VCCIO0 | |
TP8 | VREF1 | |
TP9 | VREF2 | |
TP10 | MAC_DATA | |
TP11 | 1.5V | |
TP12 | 3.3V | |
TP13 | 2.5V | |
TP14 | VCCAUX | |
TP16 | CLK_P | |
TP17 | PHY_CLK | |
TP18 | GND | |
TP19 | GND | |
TP20 | GND | |
TP21 | GND | |
TP22 | PROG_B | |
TP23 | GND | |
TP24 | VCCIO0 | |
TP25 | VREF1 | |
TP26 | VREF2 | |
| TP27 | MAC_DATA | |
| TP28 | CLK_P |
Chip/Interface | Designator | Connected To | Notes |
|---|---|---|---|
Spartan 6 FPGA | U5 |
| |
DDR3 SDRAM | U6 / U7 |
| |
QSPI Flash | U11 |
| Accessible via FPGA and B2B. |
EEPROM | U10 |
| |
EEPROM | U13 |
| |
Watchdog | U1 |
| |
Ethernet PHY | U8 |
| Gigabit ETH PHY |
Oscillator | U12 |
| 100 MHz |
Oscillator | U9 |
| 25 MHz |
Signal Name | Connector.Pin | Direction1) | Description |
|---|---|---|---|
| EN | J1.28 | IN | Enables all voltage converters. |
| INIT | J1.30 | INOUT | Bidirectional pin for configuration. 2) |
| SUSPEND | J1.77 | IN | Dedicated Active-High control pin for power saving. 2) |
| VFS | J1.81 | IN | Power supply pin for eFUSE / decryptor key programming. 2) |
| RFUSE | J1.83 | IN | Auxilary pin for eFUSE programming. 2) |
| AWAKE | J1.85 | INOUT | Status output pin for the power-saving Suspend mode or IO pin. 2) |
| B2B_PROGB | J2.11 | IN | Reset signal. Signal to manipulate the PROGRAM_B_2 signal/pin. Active-Low asynchronous reset to configuration logic. 2) |
| HSWAPPEN | J2.13 | IN | IO Pullup state before and during configuration. 2) |
| CSO_B / CCLK / MISO / MOSI / MISO3 / MISO2 | J1.17 / J1.19 / J1.21 / J1.23 / J1.25 / J1.27 | Signal dependent | QSPI interface. 2) Refer to Winbond W25Q128JV. |
| JTAG | J2.93 / J2.95 / J2.97 / J2.99 | Signal dependent | JTAG interface. 2) |
PHY_L10 / PHY_L100 / PHY_L1000 / PHY_DUPLEX / PHY_LED_TX / PHY_LED_RX | J1.17 / J1.19 / J1.21 / J1.23 / J1.25 / J1.27 | Signal dependent | Ethernet PHY configuration pins for Link Speed, Duplex Mode, MDI crossover and other features. |
| PFI | J2.16 | IN | Power-fail comparator input. Refer to watchdog datasheet TPS3705-33DGN. |
| /MR | J2.18 | IN | Manual reset input. Refer to watchdog datasheet TPS3705-33DGN. |
1) Direction:
IN: Input from the point of view of this board.
OUT: Output from the point of view of this board.
Power Rail Name/ Schematic Name | Connector.Pin | Direction1) | Notes |
|---|---|---|---|
| 3.3V | J1.1 / J1.3 / J1.5 / J1.7 / J1.9 / J1.11 / J1.13 / J1.15 J2.2 / J2.4 / J2.6 / J2.8 / J2.10 /J2.12 | IN | SoM supply. |
| VCCIO0 | J2.1 / J2.3 / J2.5 / J2.7 / J2.9 | IN | FPGA IO Bank 0 supply. |
| VBATT | J1.79 | IN | Decryptor key RAM memory backup supply. |
1.2V | J1.41 / J1.43 | OUT | FPGA and Eternet PHY supply. |
| 1.5V | J2.19 | OUT | FPGA DDR Bank 1/3 and DDR RAM supply. |
| 2.5V | J1.39 | OUT | Eternet PHY supply. |
| VCCAUX | J2.91 | OUT | JTAG reference voltage. |
1) Direction:
IN: Input from the point of view of this board.
OUT: Output from the point of view of this board.
| Sequence | Net name | Recommended Voltage Range | Pull-up/down | Description | Notes |
|---|---|---|---|---|---|
| 1 | - | - | - | Configuration signal setup. | See Configuration and System Control Signals. |
| 3.3V | - 1) | - | Main Power supply. | ||
| 2 | VCCIO0 | - 1) | - | Bank IO Power supply. | |
| 3 | EN | 3.3 V (± 5 %) | - | Enable SoM. |
1) Refer to Recommended Operating Conditions.
For more information refer to DS162.
These connectors are hermaphroditic. Odd pin numbers on the module are connected to even pin numbers on the baseboard and vice versa.
4 x 5 modules use two or three Samtec Razor Beam LSHM connectors on the bottom side.
When using the same type on baseboard, the mating height is 8mm. Other mating heights are possible by using connectors with a different height
| Order number | Connector on baseboard | compatible to | Mating height |
|---|---|---|---|
| 23836 | REF-189016-01 | LSHM-150-02.5-L-DV-A-S-K-TR | 6.5 mm |
| LSHM-150-03.0-L-DV-A-S-K-TR | LSHM-150-03.0-L-DV-A-S-K-TR | 7.0 mm | |
| 23838 | REF-189016-02 | LSHM-150-04.0-L-DV-A-S-K-TR | 8.0 mm |
| LSHM-150-06.0-L-DV-A-S-K-TR | LSHM-150-06.0-L-DV-A-S-K-TR | 10.0mm | |
| 26125 | REF-189017-01 | LSHM-130-02.5-L-DV-A-S-K-TR | 6.5 mm |
| LSHM-130-03.0-L-DV-A-S-K-TR | LSHM-130-03.0-L-DV-A-S-K-TR | 7.0 mm | |
| 24903 | REF-189017-02 | LSHM-130-04.0-L-DV-A-S-K-TR | 8.0 mm |
| LSHM-130-06.0-L-DV-A-S-K-TR | LSHM-130-06.0-L-DV-A-S-K-TR | 10.0mm |
The module can be manufactured using other connectors upon request.
The LSHM connector speed rating depends on the stacking height; please see the following table:
| Stacking height | Speed rating |
|---|---|
| 12 mm, Single-Ended | 7.5 GHz / 15 Gbps |
| 12 mm, Differential | 6.5 GHz / 13 Gbps |
| 5 mm, Single-Ended | 11.5 GHz / 23 Gbps |
| 5 mm, Differential | 7.0 GHz / 14 Gbps |
Current rating of Samtec Razor Beam™ LSHM B2B connectors is 2.0A per pin (2 adjacent pins powered).
| File | Modified | |
|---|---|---|
| PDF File hsc-report_lshm-lshm-05mm_web.pdf High speed test report | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File lshm_dv.pdf LSHM catalog page | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File LSHM-1XX-XX.X-X-DV-A-X-X-TR-FOOTPRINT(1).pdf Recommended layout and stencil drawing | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File LSHM-1XX-XX.X-XX-DV-A-X-X-TR-MKT.pdf Technical drawing | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File REF-189016-01.pdf Technical Drawing | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File REF-189016-02.pdf Technical Drawing | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File REF-189017-01.pdf Technical Drawing | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File REF-189017-02.pdf Technical Drawing | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File TC0923--2523_report_Rev_2_qua.pdf Design qualification test report | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File tc0929--2611_qua(1).pdf Shock and vibration report | Apr 07, 2016 by Thorsten Trenz | |
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This TRM is generic for all variants.
Variants of modules are described here: Article Number Information. Please contact us for options.
Power Rail Name/ Schematic Name | Description | Min | Max | Unit |
|---|---|---|---|---|
| 3.3V | Supply power from carrier. | -0.5 | 3.75 | V |
| VCCIO0 | IO Bank 0 supply power from carrier. | -0.5 | 3.75 | V |
| VBATT | Decryptor key RAM memory backup supply. | -0.5 | 4.05 | V |
| VFS | eFUSE Programming voltage supply. | -0.5 | 3.75 | V |
*) Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under "Recommended Operating Condition". Exposure to absolute-maximum rated conditions for extended periods may affect device reliability.
Trenz Electronic classifies modules into temperature range categories by subsumption of its component data (PCB, ICs, connectors, passive components). The temperature ranges are values for ambient air temperature and do not reflect the junction temperature of individual components.
The categories are:
These categories do not take into account the entire custom system consisting of:
The SoM components are capable of being operated at industrial-grade temperatures, which cover at least the range of -40 °C to +85 °C.
The actual operating temperature range will depend on the customer design, usage and cooling solution. Consult Cooling Solutions for more information.
Parameter | Min | Max | Units | Reference Document |
|---|---|---|---|---|
| 3.3V | 3.135 | 3.465 | V | |
| VCCIO0 | 1.1 | 3.45 | V | |
| VBATT | 1.0 | 3.6 | V | |
| VFS | 3.2 | 3.4 | V |
Module size: 50 mm × 40 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 8 mm.
PCB thickness: 1.724 ±10 % mm.
All dimensions are shown in millimeters.
Trenz shop TE0600 overview page* | |
|---|---|
*) Module article name encoding table: 6 Series Spartan 6 modules
The hardware revision number is located on the PCB next to the module identifier, separated by a dash.
Date | Revision | Changes | Documentation Link |
|---|---|---|---|
| 2024-01 | 04 | 1. Leds D1, D5 were changed from 19-213/G6C-BM1N2/DT to SML-P11MTT86. | |
| 2016-08 | 03 | 1. Added NetTie (board revision 03). 12. Changee SPI Flash from W25Q128FVEIG to W25Q128JVEIQ. 13. Changed DDR3 RAM from IM4G16D3FABG-125I to IS43TR16256BL-125KBLI | |
| 2013-08 | 02 | 1. More powerful regulators for 1.2V and 1.5V rails. | |
| - | 01 | Initial release |
Date | Revision | Contributor | Description |
|---|---|---|---|
| |||
| 2024-03-21 | v.28 | VY |
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| 2024-03-11 | v.27 | MT |
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| 2017-04-03 | v.26 | TT |
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| 2016-11-05 | v.25 | FDR |
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| 2016-01-29 | v.24 | AIK |
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| 2013-03-13 | v.23 | AIK |
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| 2013-03-13 | v.22 | AIK |
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| 2013-01-21 | v.21 | AIK |
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| 2012-12-19 | v.20 | AIK |
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| 2012-11-30 | v.19 | AIK |
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| 2012-11-21 | v.18 | AIK |
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| 2012-11-06 | v.17 | AIK |
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| 2012-10-30 | v.16 | AIK |
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| 2012-07-18 | v.15 | AIK |
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| 2012-06-18 | v.14 | FDR |
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| 2012-05-18 | v.13 | AIK |
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| 2012-04-17 | v.12 | FDR |
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| 2012-04-12 | v.11 | AIK |
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| 2012-01-20 | v.10 | AIK |
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| 2011-11-11 | v.9 | AIK |
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| 2011-10-12 | v.8 | AIK |
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| 2011-10-08 | v.7 | AIK |
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| 2011-10-06 | v.6 | AIK |
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| 2011-10-06 | v.5 | AIK |
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| 2011-10-06 | v.4 | AIK |
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| 2011-10-06 | v.3 | AIK |
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| 2011-10-05 | v.2 | AIK |
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| 2011-10-01 | v.1 | AIK |
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Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy
The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.
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Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.
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