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Trenz Electronic TEM0007 module is an industrial-grade FPGA micromodule integrating a Microsemi Polarfire SoC FPGA, Gigabit Ethernet PHY, USB 2.0 PHY, LPDDR4 SDRAM, SPI Flash memory for configuration and operation, and power supply. A large number of configurable I/Os is provided via robust board-to-board (B2B) connectors.
Refer to http://trenz.org/tem0007-info for the current online version of this manual and other available documentation.
up to 118 FPGA IOs
up to 14 MSSIO
Storage device name | Content | Notes |
|---|---|---|
LPDDR4 SDRAM | not programmed | |
SPI NOR Flash | not programmed | |
| EEPROM | not programmed besides factory programmed MAC address | |
| System Controller CPLD, U1 | Standard firmware | See TEM0007 CPLD. |
| Connector Type | Designator | Interface | IO CNT | Notes |
|---|---|---|---|---|
| B2B | JM1 | GPIO | up to 48 SE / 24 DIFF | only 40 SE / 20 DIFF for MPFS025 variants |
| B2B | JM1 | MSSIO | 2 x MSSIO | |
| B2B | JM1 | I2C or MSSIO | I2C or 2 x MSSIO | |
| B2B | JM1 | SDIO or MSSIO | SDIO or 6 x MSSIO | |
| B2B | JM1 | UART or MSSIO | 2 x UART or 4 x MSSIO | |
| B2B | JM1 | ETH - MDI | ETH | |
| B2B | JM2 | HSIO | 18 SE / 9 DIFF | |
| B2B | JM2 | GPIO | up to 36 SE / 18 DIFF | only 8 SE / 4 DIFF for MPFS025 variants |
| B2B | JM2 | CFG | JTAG | |
| B2B | JM3 | HSIO | 16 SE / 8 DIFF | |
| B2B | JM3 | SGMII | 1 x SGMII (RX/TX) | |
| B2B | JM3 | MGT FPGA | 4 x MGT (RX/TX) | |
| B2B | JM3 | MGT CLK | 2 x MGT CLK | |
| B2B | JM3 | USB | USB |
| Test Point | Signal | Notes |
|---|---|---|
| TP1 | +3.3V | |
| TP2 | +2.5V | |
| TP3 | +2.5V_XCVR | |
| TP4 | +1.8V | |
| TP5 | - | Signal at U17 pin 3. See schematics. |
| TP6 | +1.1V_LPDDR4 | |
| TP7 | +1.0V | |
| TP8 | VDDAUX1 | |
| TP9 | AVDD18 | |
| TP10 | AVDD33 | |
| TP11 | DVDD1V0 | |
| TP12 | VCCIOB_SW | |
| TP13 | +2.5V_VDDA | |
| TP14 | +1.0V_VDDA | |
| TP15 | +2.5V_VDD |
| Chip/Interface | Designator | Connected To | Notes |
|---|---|---|---|
System Controller CPLD | U1 | B2B | |
Gigabit Ethernet | U7 | SoC - MSS | |
USB PHY | U11 | SoC - MSS | |
LPDDR4 SDRAM | U6 | SoC - MSS | |
EEPROM | U10 | SoC - MSS | |
SPI Flash Memory | U3 | SoC - MSS | |
Oscillator | U4 | SoC - MSS | |
| Oscillator | U5 | Soc - FPGA | |
| Oscillator | U8 | ETH PHY | |
| Oscillator | U12 | USB PHY |
| Connector+Pin | Signal Name | Direction1) | Description |
|---|---|---|---|
| JM1-7 | NOSEQ | IN/OUT | See 4 x 5 SoM Integration Guide and TEM0007 CPLD. |
| JM1-28 | SC_EN1 | IN | See 4 x 5 SoM Integration Guide and TEM0007 CPLD. |
| JM1-30 | SC_PGOOD | IN/OUT | See 4 x 5 SoM Integration Guide and TEM0007 CPLD. |
| JM1-32 | SC_BOOTMODE | IN | See 4 x 5 SoM Integration Guide and TEM0007 CPLD. |
| JM1-89 | JTAGSEL | IN | See 4 x 5 SoM Integration Guide and TEM0007 CPLD. |
| JM2-18 | SC_nRST | IN | See 4 x 5 SoM Integration Guide and TEM0007 CPLD. |
| JM2-93 / JM2-95 / JM2-97 / JM2-99 | TMS / TDI / TDO / TCK | Signal-dependent | JTAG configuration and debugging interface. JTAG reference voltage: 3.3VIN |
1) Direction:
| Power Rail Name/ Schematic Name | Connector + Pin | Direction1) | Notes |
|---|---|---|---|
| VIN | JM1.1 / JM1.3 / JM1.5 / JM2.2 / JM2.4 / JM2.6 / JM2.8 | IN | Supply voltage from the carrier board |
| 3.3VIN | JM1.13 / JM1.15 | IN | Supply voltage from the carrier board |
| 3.3VIN | JM2.91 | OUT | JTAG reference voltage |
+1.8V | JM1.39 | OUT | Internal +1.8V voltage level |
VCCIOB | JM2.1 / JM2.3 | IN | General purpose I/O bank voltage |
VCCIOD | JM2.7 / JM2.9 | IN | High speed I/O bank voltage (max. +1.8 V) |
+3.3V | JM2.10 / JM2.12 | OUT | Internal +3.3 V voltage level |
1) Direction:
| Sequence | Net name | Recommended Voltage Range | Pull-up/down | Description | Notes |
|---|---|---|---|---|---|
| 0 | - | - | - | Configuration signal setup. | See Configuration and System Control Signals. |
| 1 | 3.3VIN | 3.3 V (± 5 %) | - | Management and SoC power supply. | Main module power supply for management and SoC. 3 A recommended. Power consumption depends mainly on design and cooling solution. |
| 2 | VIN | 3.3 V (± 5 %) 1) | - | Main module power supply. | Main module power supply for management and SoC. 5.5 A recommended. Power consumption depends mainly on design and cooling solution. |
| 3 | +1.8V | - | - | 1.8 V on-module power supply. | |
| 4 | VCCIOB / VCCIOD | 2) | - | Module bank voltages. | Enable bank voltages after 1.8 V are available on carrier. |
1) A higher or lower input voltage may be possible.
2) See DS0147 for additional information.
These connectors are hermaphroditic. Odd pin numbers on the module are connected to even pin numbers on the baseboard and vice versa.
4 x 5 modules use two or three Samtec Razor Beam LSHM connectors on the bottom side.
When using the same type on baseboard, the mating height is 8mm. Other mating heights are possible by using connectors with a different height
| Order number | Connector on baseboard | compatible to | Mating height |
|---|---|---|---|
| 23836 | REF-189016-01 | LSHM-150-02.5-L-DV-A-S-K-TR | 6.5 mm |
| LSHM-150-03.0-L-DV-A-S-K-TR | LSHM-150-03.0-L-DV-A-S-K-TR | 7.0 mm | |
| 23838 | REF-189016-02 | LSHM-150-04.0-L-DV-A-S-K-TR | 8.0 mm |
| LSHM-150-06.0-L-DV-A-S-K-TR | LSHM-150-06.0-L-DV-A-S-K-TR | 10.0mm | |
| 26125 | REF-189017-01 | LSHM-130-02.5-L-DV-A-S-K-TR | 6.5 mm |
| LSHM-130-03.0-L-DV-A-S-K-TR | LSHM-130-03.0-L-DV-A-S-K-TR | 7.0 mm | |
| 24903 | REF-189017-02 | LSHM-130-04.0-L-DV-A-S-K-TR | 8.0 mm |
| LSHM-130-06.0-L-DV-A-S-K-TR | LSHM-130-06.0-L-DV-A-S-K-TR | 10.0mm |
The module can be manufactured using other connectors upon request.
The LSHM connector speed rating depends on the stacking height; please see the following table:
| Stacking height | Speed rating |
|---|---|
| 12 mm, Single-Ended | 7.5 GHz / 15 Gbps |
| 12 mm, Differential | 6.5 GHz / 13 Gbps |
| 5 mm, Single-Ended | 11.5 GHz / 23 Gbps |
| 5 mm, Differential | 7.0 GHz / 14 Gbps |
Current rating of Samtec Razor Beam™ LSHM B2B connectors is 2.0A per pin (2 adjacent pins powered).
| File | Modified | |
|---|---|---|
| PDF File hsc-report_lshm-lshm-05mm_web.pdf High speed test report | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File lshm_dv.pdf LSHM catalog page | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File LSHM-1XX-XX.X-X-DV-A-X-X-TR-FOOTPRINT(1).pdf Recommended layout and stencil drawing | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File LSHM-1XX-XX.X-XX-DV-A-X-X-TR-MKT.pdf Technical drawing | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File REF-189016-01.pdf Technical Drawing | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File REF-189016-02.pdf Technical Drawing | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File REF-189017-01.pdf Technical Drawing | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File REF-189017-02.pdf Technical Drawing | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File TC0923--2523_report_Rev_2_qua.pdf Design qualification test report | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File tc0929--2611_qua(1).pdf Shock and vibration report | Apr 07, 2016 by Thorsten Trenz | |
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| Power Rail Name/ Schematic Name | Description | Min | Max | Unit |
|---|---|---|---|---|
| VIN | Supply voltage | -0.3 | 6.0 | V |
| 3.3VIN | Supply voltage | -0.3 | 3.75 | V |
VCCIOB | I/O bank voltage | -0.5 | 3.6 | V |
| VCCIOD | I/O bank voltage | -0.5 | 2.0 | V |
*) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these
or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum rated conditions for extended periods may affect device reliability.
This TRM is generic for all variants. Temperature range can be differ depending on the assembly version. Voltage range is mostly the same during variants (exceptions are possible, depending on custom request)
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
| Parameter | Min | Max | Units | Reference Document |
|---|---|---|---|---|
| VIN | 3.135 | 3.465 | V | |
| 3.3VIN | 3.135 | 3.465 | V | |
VCCIOB | 1.14 | 3.465 | V | See FPGA datasheet. |
| VCCIOD | 1.14 | 1.89 | V | See FPGA datasheet. |
1) Higher and lower values may be possible. For more information consult schematic and according datasheets.
Module size: 40 mm × 50 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 8 mm.
PCB thickness: 1.74 mm.
| Trenz shop TEM0007 overview page | |
|---|---|
| English page | German page |
| Date | Revision | Changes | Documentation Link |
|---|---|---|---|
| 2020-05-26 | 01 | Inital Release | TEM0007-01 |
Hardware revision number can be found on the PCB board together with the module model number separated by the dash.
| Date | Revision | Contributor | Description |
|---|---|---|---|
Link fixed | |||
| 2023-11-07 | v.45 | ED | Initial Release |
-- | all |
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