Table of Contents
Overview
The Trenz Electronic TEB0911 UltraRack+ board is an industrial-grade motherboard integrating a Xilinx Zynq Ultrascale+ MPSoC with 4 GByte Flash memory for configuration and operation, DDR4-SDRAM SODIMM socket with 64-bit wide data bus, 20 Gigabit transceivers and powerful switch-mode power supplies for all on-board voltages.. The motherboard exposes the Zynq MPSoC's pins to accessible connectors and provides a whole range of on-board components to test and evaluate the Zynq Ultrascale+ MPSoC and for developing purposes. The motherboard is capable to be fitted to a dedicated enclosure. On the enclosure's rear and front panel, I/O's and MGT interfaces are accessible through 6 on-board FMC connectors and other standard high-speed interfaces for USB3.0, SFP+, SSD, GbE, etc.
Key Features
- Single 24V main power supply
- Motherboard fitted to dedicated enclosure from Trenz ??
- 2x USB3.0 A Connector (Superspeed Host Port (Highspeed at USB2.0))
- Gigabit Ethernet RGMII PHY with RJ45 MegJack
- Dual SFP+ Connector (2x1 Cage)
- DDR4-SDRAM SODIMM socket (64bit bus width)
- SSD (Solid State Disk) Connector
- CAN FD Transceiver (10 Pin IDC connector and 6-pin header)
- 1x DisplayPort
- 4x On-board configuration EEPROMs (1x Microchip 24LC128-I/ST, 3x Microchip 24AA025E48T-I/OT)
- All carrier board peripherals' I²C interfaces muxed to MPSoC's I²C interface
- 6x FMC HPC Connectors
- 6x FMC Fans
- 3x Optional 4-wire PWM fan connectors
- 10 output programmable PLL clock generator Si5345A
- Quad programmable PLL clock generator SI5338A
- 1x SMA coaxial connectors for reference clock signal input
- MicroSD-Socket (bootable)
- 32 Gbit (4 GByte) on-board eMMC flash (8 banks a 4 Gbit)
- System Controller CPLD Lattice MachXO2 7000 HC
- 2x JTAG/UART header ('XMOD FTDI JTAG Adapter'-compatible) for programming MPSoC and SC CPLD
- On-board DC-DC PowerSoCs and LDOs
Additional assembly options are available for cost or performance optimization upon request.
Block Diagram
Put your block diagram here...
Figure 1: TE0xxx-xx block diagram.
Main Components
Put top and bottom pics with labels of the real PCB here...
Table 1: TE0xxx-xx main components.
Add description list of PCB labels here...
Initial Delivery State
Storage device name | Content | Notes |
---|---|---|
User configuration EEPROMs (1x Microchip 24LC128-I/ST, 3x Microchip 24AA025E48T-I/OT) | ||
USB3.0 HUB Configuration EEPROM (Microchip 24LC128-I/ST) | Empty | Not programmed |
Si5338A programmable PLL NVM OTP | ||
Si5345A programmable PLL NVM OTP |
Table 1: Initial delivery state of programmable devices on the module.
Boot Process
For the boot process prior to powering up the board settings must be done via DIP-Switch S3-3 and S3-4. Four boot modes can be selected:
S3-3 (SC_SW1) | S3-4 (SC_SW2) | MIO Location | Description | Notes |
---|---|---|---|---|
OFF | OFF | MIO[43:38] | SD1 Boot Mode (SD-Card on J11) | Supports SD 2.0. |
OFF | ON | MIO[29:26] | PJTAG0 | PS JTAG connection 0 option. |
ON | OFF | MIO[12:0] | QSPI32 | 32-bit addressing, configured with dual on-board QSPI Flash Memory. |
ON | ON | - | JTAG | Dedicated PS interface. |
Table 2: Available boot modes of the on-board Zynq MPSoC
Refer also to the documentation of the SC CPLD firmware of the TEB0911 motherboard.
Signals, Interfaces and Pins
FMC Connectors
The TEB0911 Ultrarack+ offers 6FMC (FPGA Mezzanine Card) connectors which provides as an ANSI/VITA 57.1 standard a modular interface to the MPSoCs FPGA and exposes numerous of its I/O pins for use by other mezzanine modules and expansion cards.
The connector supports single ended and differential signaling as the I/O's are routed from the FPGA banks as LVDS-pairs to the FMC connector.
Following diagram gives an overview of the FMC connectors and their connections to the Zynq Ultrascale+ MPSoC and the System Controller CPLD U27:
Figure x: General overview of the FMC HPC connectors
MGT Lanes
MGT (Multi Gigabit Transceiver) lane consists of one transmit and one receive (TX/RX) differential pairs, two signals each or four signals total per one MGT lane. Following table lists lane number, MGT bank number, transceiver type, signal schematic name, board-to-board pin connection and FPGA pins connection:
Lane | Bank | Type | Signal Name | B2B Pin | FPGA Pin |
---|---|---|---|---|---|
0 | 225 | GTH |
|
|
|
1 | 225 | GTH |
|
|
|
.. | .. | .. | .. | .. | .. |
4 | 224 | GTH |
|
|
|
5 | 224 | GTH |
|
|
|
.. | .. | .. | .. | .. | .. |
Table x: MGT lanes.
Below are listed MGT banks reference clock sources.
Clock signal | Bank | Source | FPGA Pin | Notes |
---|---|---|---|---|
MGT_CLK0_P | 225 | B2B, JM3-33 | MGTREFCLK0P_225, Y6 | Supplied by the carrier board. |
MGT_CLK0_N | 225 | B2B, JM3-31 | MGTREFCLK0N_225, Y5 | Supplied by the carrier board. |
MGT_CLK1_P | 225 | U2, CLK1B | MGTREFCLK1P_225, V6 | On-board Si5338A. |
MGT_CLK1_N | 225 | U2, CLK1A | MGTREFCLK1N_225, V5 | On-board Si5338A. |
MGT_CLK2_P | 224 | B2B, JM3-34 | MGTREFCLK2P_224, AD6 | Supplied by the carrier board. |
MGT_CLK2_N | 224 | B2B, JM3-32 | MGTREFCLK2N_224, AD5 | Supplied by the carrier board. |
MGT_CLK3_P | 224 | U2, CLK2B | MGTREFCLK3P_224, AB6 | On-board Si5338A. |
MGT_CLK3_N | 224 | U2, CLK2B | MGTREFCLK3N_224, AB5 | On-board Si5338A. |
Table x: MGT reference clock sources.
XMOD Interface
JTAG access to the ... is provided through B2B connector ....
JTAG Signal | B2B Connector Pin |
---|---|
TCK | JMx-xx |
TDI | JMx-xx |
TDO | JMx-xx |
TMS | JMx-xx |
Table 5: JTAG interface signals.
Gigabit Ethernet Interface
USB3.0 Interface
SFP+ Interface
SSD Interface
DisplayPort Interface
DDR4 Memory Socket
CAN Interface
SD Card Interface
Describe SD Card interface shortly here if the module has one...
FPGA / SoC Pin | Connected To | Signal Name | Notes |
---|---|---|---|
MIO0 | J10-9 | Card detect switch | |
MIO10 | J10-7 | DAT0 | |
MIO11 | J10-3 | CMD | |
MIO12 | J10-5 | CLK | |
MIO13 | J10-8 | DAT1 | |
MIO14 | J10-1 | DAT3 | |
MIO15 | J10-2 | CD/DAT3 |
Table x: SD Card interface signals and connections.
PLL Clock Programing Interface
4-Wire PWM FAN Connectors
SMA Coax Clock Input
On-board Peripherals
System Controller CPLD
The System Controller CPLD (U2) is provided by Lattice Semiconductor LCMXO2-256HC (MachXO2 Product Family). The SC-CPLD is the central system management unit where essential control signals are logically linked by the implemented logic in CPLD firmware, which generates output signals to control the system, the on-board peripherals and the interfaces. Interfaces like JTAG and I2C between the on-board peripherals and to the FPGA module are by-passed, forwarded and controlled by the System Controller CPLD.
Other tasks of the System Controller CPLD are the monitoring of the power-on sequence and to display the programming state of the FPGA module.
For detailed information, refer to the reference page of the SC CPLD firmware of this module.
The TEB0911 UltraRack is equipped with one System Controller CPLDs - Lattice Semiconductor LCMXO2-7000HC (MachXO2 Product Family) with the schematic designators U27.
The SC-CPLD is the central system management unit where essential control signals are logically linked by the implemented logic of the CPLD firmware, which generates output signals to control the system, the on-board peripherals and the interfaces. Interfaces like JTAG and I2C between the on-board peripherals and to the FPGA-module are by-passed, forwarded and controlled by the System Controller CPLD.
Other tasks of the System Controller CPLD are the monitoring of the power-on sequence and to display the programming state of the FPGA module.
The Sytem Controller CPLDs are connected to the Zynq Ultrascale+ MPSoC through MIO, PL IO-bank differential lanes and I²C interface.
The functionalities and configuration of the pins depend on the CPLDs' firmware. The documentations of the firmware of SC CPLD U27 contains detailed information on this matter.
Following block diagram visualizes the connection of the SC CPLDs with the Zynq Ultrascale+ MPSoC via PS (MIO), PL bank pins and I²C interface.
Special purpose pins are connected to smaller System Controller CPLD and have following default configuration:
Pin Name | Mode | Function | B2B Connector Pin | Default Configuration |
---|---|---|---|---|
PGOOD | Output | Power Good | J1-148 | Active high when all on-module power supplies are working properly. |
JTAGEN | Input | JTAG Select | J2-131 | Low for normal operation. |
.. | .. | .. | .. | .. |
Table x: System Controller CPLD I/O pins.
High-speed USB ULPI PHY
USB PHY (U9) is provided by USB3320 from Microchip. The ULPI interface is connected to the Zynq Ultrascale+ PS USB0. I/O voltage is fixed at 1.8V and PHY reference clock input is supplied from the on-board 52.000000 MHz oscillator (U10).
PHY Pin | Connected to | Notes |
---|---|---|
ULPI | PS bank MIO52 ... MIO63 | Zynq Ultrascale+ USB0 MIO pins are connected to the PHY |
REFCLK | - | 52MHz from on board oscillator (U9) |
REFSEL[0..2] | - | All pins set to GND selects the external reference clock frequency (52.000000 MHz) |
RESETB | SC CPLD U17 | Low active USB PHY Reset (pulled-up to PS_1.8V). |
DP, DM | 4-port USB3.0 Hub U4 | USB2.0 data lane |
CPEN | - | External USB power switch active-high enable signal |
VBUS | 5V | Connected to USB VBUS via a series of resistors, see schematic |
ID | - | For an A-device connect to the ground. For a B-device, leave floating |
Table 17: USB PHY interface connections
Hi-speed USB ULPI PHY (U32) is provided with USB3320 from Microchip. The ULPI interface is connected to the Zynq PS USB0 via MIO28..39, bank 501 (see also section). The I/O voltage is fixed at 1.8V and PHY reference clock input is supplied from the on-board 52.000000 MHz oscillator (U33).
4-port USB3.0 Hub
On the carrier board there are up to 4 USB3.0 Super Speed ports available, which are also downward compatible to USB2.0 High Speed ports. The USB3.0 ports are provided by Cypress Semiconductor CYUSB3324 4-port USB3.0 Hub controller U4. The pin-strap configuration option of the USB3.0 Hub is disabled, so this controller gets the configuration data and parameter from the configuration EEPROM U5. The I²C interface of the EEPROM and the controller is also accessible by the Zynq Ultrascale+ MPSoC through I²C switch U16.
On the Upstream-side, this controller is connected to the MGT1 lane of MPSoC's PS GT bank to establish the USB3.0 data lane. For the USB2.0 interface, the controller is connected to the on-board USB2.0 PHY U9. The USB2.0 PHY is connected per ULPI interface (MIO pins 52..63) to MPSoC's MIO bank.
The USB3.0 Hub controller has also an ARM Cortex-M0 controller integrated, refer to the data sheet for further features and programmable options.
Gigabit Ethernet PHY
On-board Gigabit Ethernet PHY (U12) is provided with Marvell Alaska 88E1512 IC. The Ethernet PHY RGMII interface is connected to the Zynq Ultrascale+ Ethernet0 PS GEM3. I/O voltage is fixed at 1.8V for HSTL signaling. The reference clock input of the PHY is supplied from the on-board 25.000000 MHz oscillator (U13). The 125MHz PHY output clock (PHY_CLK125M) is routed to System Controller CPLD U17, pin 70.
PHY Pin | Connected to | Notes |
---|---|---|
MDC/MDIO | PS bank MIO76, MIO77 | - |
PHY LED0..1 | SC CPLD U17, pin 67,86 | see schematic for details, forwarded to RJ45 GbE MagJack J7 |
PHY_LED2 / INTn: | SC CPLD U17, pin 85 | Active low interrupt line |
PHY_CLK125M | SC CPLD U17, pin 70 | 125 MHz Ethernet PHY clock out |
CONFIG | SC CPLD U17, pin 65 | Configuration of PHY address LSB and VDDO level |
RESETn | SC CPLD U17, pin 62 | Active low reset line |
RGMII | PS bank MIO64 ... MIO75 | Reduced Gigabit Media Independent Interface |
SGMII | - | Serial Gigabit Media Independent Interface |
MDI | RJ45 GbE MagJack J7 | Media Dependent Interface |
Table 18: Ethernet PHY interface connections
On-board Gigabit Ethernet PHY (U7) is provided with Marvell Alaska 88E1512 IC (U8). The Ethernet PHY RGMII interface is connected to the Zynq Ethernet0 PS GEM0. I/O voltage is fixed at 1.8V for HSTL signaling. The reference clock input of the PHY is supplied from an on-board 25.000000 MHz oscillator (U9), the 125MHz output clock signal CLK_125MHZ is connected to the pin J2-150 of B2B connector J2.
8-Channel I²C Switches
All on-board and on-module peripherals with accessible I²C interface are muxed to the I²C interface of the Zynq Ultrascale+ MPSoC as master.
For this purpose, the TEB0911 carrier board is equipped with two 8-channel I²C switches provided by TCA9548A from Texas Instruments, together creating up to 16 switched I²C channels.
Refer to the data sheet of the TCA9548A chip how to address and and transmit data to the I²C slave devices through this switches.
The I2C bus works internally on-module with reference voltage 1.8V, it is connected to the MPSoC I2C interface via PS MIO bank (pins MIO38, MIO39) configured as master.
MIO | Signal Schematic Name | Notes |
---|---|---|
38 | I2C_SCL | 1.8V reference voltage |
39 | I2C_SDA | 1.8V reference voltage |
Table 19: MIO-pin assignment of the module's I2C interface
I2C addresses for on-board slave devices are listed in the table below:
I²C Slave Devices connected to MPSoC I²C Interface | I²C Switch Position | I²C Slave Address | Schematic Names of I²C Bus Lines |
---|---|---|---|
8-channel I²C switch U16 | - | 0x73 | I2C_SDA / I2C_SCL |
8-channel I²C switch U27 | - | 0x77 | I2C_SDA / I2C_SCL |
SC CPLD U39, bank 2, pins 52 (SDA), 50 (SCL) | - | User programmable | I2C_SDA / I2C_SCL |
I²C Slave Devices connected to 8-channel I²C Switch U16 | I²C Switch Position | I²C Slave Address | Schematic Names of I²C Bus Lines |
On-board Quad programmable PLL clock generator U35 Si5338 | 0 | 0x70 | MCLK_SDA / MCLK_SCL |
8-bit I²C IO Expander U44 | 1 | 0x26 | SFP_SDA / SFP_SCL |
PCIe Connector J1 | 2 | module dependent | PCIE_SDA / PCIE_SCL |
SFP+ Connector J14A | 3 | module dependent | SFP1_SDA / SFP1_SCL |
SFP+ Connector J14B | 4 | module dependent | SFP2_SDA / SFP2_SCL |
Configuration EEPROM U24 | 5 | 0x54 | MEM_SDA / MEM_SCL |
Configuration EEPROM U36 | 5 | 0x52 | MEM_SDA / MEM_SCL |
Configuration EEPROM U41 | 5 | 0x51 | MEM_SDA / MEM_SCL |
Configuration EEPROM U22 | 5 | 0x50 | MEM_SDA / MEM_SCL |
8-bit I²C IO Expander U38 | 5 | 0x27 | MEM_SDA / MEM_SCL |
FMC Connector J5 | 6 | module dependent | FMC_SDA / FMC_SCL |
USB3.0 Hub configuration EEPROM U5 | 7 | 0x51 | USBH_SDA / USBH_SCL |
USB3.0 Hub | 7 | 0x60 | USBH_SDA / USBH_SCL |
I²C Slave Devices connected to 8-channel I²C Switch U27 | I²C Switch Position | I²C Slave Address | Schematic Names of I²C Bus Lines |
PMOD Connector P1 | 0 | module dependent | PMOD_SDA / PMOD_SCL |
24-bit Audio Codec U3 | 1 | 0x38 | A_I2C_SDA / A_I2C_SCL |
FireFly Connector J15 | 2 | module dependent | FFA_SDA / FFA_SCL |
FireFly Connector J22 | 3 | module dependent | FFB_SDA / FFB_SCL |
On-module Quad programmable PLL clock generator Si5345 (TE0808) | 4 | 0x69 | PLL_SDA / PLL_SCL |
SC CPLD U17, bank 3, pins 13 (SDA), 14 (SCL) | 5 | User programmable | SC_SDA / SC_SCL |
8-bit I²C IO Expander U34 | 6 | 0x24 | FF_E_SDA / FF_E_SCL |
PMOD Connector P3 | 7 | module dependent | EXT_SDA / EXT_SCL |
Table 20: On-board peripherals' I2C-interfaces device slave addresses
Configuration EEPROMs
The TEB0911 carrier board contains several EEPROMs for configuration and general user purposes. The EEPROMs are provided by Microchip and all have I²C interfaces:
EEPROM Modell | Schematic Designator | Memory Density | Purpose |
---|---|---|---|
24LC128-I/ST | U24 | 128 Kbit | user |
24AA025E48T-I/OT | U36 | 2 Kbit | user |
24AA025E48T-I/OT | U41 | 2 Kbit | user |
24AA025E48T-I/OT | U42 | 2 Kbit | user |
24LC128-I/ST | U5 | 128 Kbit | USB3.0 Hub U4 configuration memory |
Table 21: On-board configuration EEPROMs overview
CAN FD Transceiver
On-board CAN FD (Flexible Data Rate) transceiver is provided by Texas Instruments TCAN337. This controller is the physical layer of the CAN interface and is specified for data rates up to 1 Mbps. The controller has many protection features included to ensure CAN network robustness and to eliminate the need for additional protection circuits. Refer to the data sheet of this transceiver for more details and specifications.
The transceiver is connected to System Controller CPLD U17, means it works on this interface with 3.3V VCCIO. The logical signal processing of the CAN interface depends on the current firmware ot the SC CPLD U17.
eMMC Memory
The TEB0911 UltraRack board is equipped with embedded MMC memory connected to the PS MIO bank (MIO13 ... MIO23) of the Zynq Ultrascale+ MPSoC. The memory is provided by MTFC4GACAJCN-4M from Micron Technology. It has a memory density of 32 Gbit (4 GByte) and is sectored into 8 banks a 4 Gbit.
Quad SPI Flash Memory
On-board QSPI flash memory (U14) on the TE0745-02 is provided by Micron Serial NOR Flash Memory N25Q256A with 256 Mbit (32 MByte) storage capacity. This non volatile memory is used to store initial FPGA configuration. Besides FPGA configuration, remaining free flash memory can be used for user application and data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths. Maximum data rate depends on the selected bus width and clock frequency used.
SPI Flash QE (Quad Enable) bit must be set to high or FPGA is unable to load its configuration from flash during power-on. By default this bit is set to high at the manufacturing plant.
MAC Address EEPROM
A Microchip 24AA025E48 serial EEPROM (U23) contains a globally unique 48-bit node address, which is compatible with EUI-48(TM) specification. The device is organized as two blocks of 128 x 8-bit memory. One of the blocks stores the 48-bit node address and is write protected, the other block is available for application use. It is accessible over I2C bus with slave device address 0x53.
Oscillators
The TEB0911 carrier board is equipped several on-board oscillators to provide the Zynq Ultrascale+ MPSoC's PS and PL banks and the on-board peripherals with reference clock-signals:
Clock Source | Schematic Name | Frequency | Clock Input Destination |
---|---|---|---|
SiTime SiT8008BI oscillator, U10 | USB0_RCLK | 52.000000 MHz | USB 2.0 transceiver PHY U9, pin 26 |
SiTime SiT8008BI oscillator, U13 | ETH_CLK | 25.000000 MHz | Gigabit Ethernet PHY U12, pin 34 |
SiTime SiT8008BI oscillator, U7 | - | 25.000000 MHz | Quad PLL clock generator U35, pin 3 |
DSC1123 oscillator, U23 | B505_CLK1 | 150.0000 MHz | PS GT Bank, dedicated for SATA interface |
DSC1123 oscillator, U6 optional, not equipped | B505_CLK0 | 100.0000 MHz | PS GT Bank, dedicated for USB interface |
Silicon Labs 570FBB000290DG, U45 optional, not equipped | B47_L5 (LVDS) | 250.MHz | PL Bank clock capable input pins |
SiTime SiT8008BI oscillator, U25 | CLK_CPLD | 25.576000 MHz | System Controller CPLD U35, pin 128 |
Table 16: Reference clock signal oscillators
Programmable Clock Generator Si5338A
There is a Silicon Labs I2C programmable quad PLL clock generator on-board (Si5338A, U2) to generate various reference clocks for the module.
Si5338A Pin | Signal Name / Description | Connected To | Direction | Note |
---|---|---|---|---|
IN1 | - | Not connected. | Input | Not used. |
IN2 | - | GND | Input | Not used. |
IN3 | Reference input clock. | U3, pin 3 | Input | 25.000000 MHz oscillator, Si8208AI. |
IN4 | - | GND | Input | I2C slave device address LSB. |
IN5 | - | Not connected. | Input | Not used. |
IN6 | - | GND | Input | Not used. |
CLK0A | CLK1_P | U1, R23 | Output | FPGA bank 45. |
CLK0B | CLK1_N | U1, P23 | Output | FPGA bank 45. |
CLK1A | MGT_CLK1_N | U1, V5 | Output | FPGA MGT bank 225 reference clock. |
CLK1B | MGT_CLK1_P | U1, V6 | Output | FPGA MGT bank 225 reference clock. |
CLK2A | MGT_CLK3_N | U1, AB5 | Output | FPGA MGT bank 224 reference clock. |
CLK2B | MGT_CLK3_P | U1, AB6 | Output | FPGA MGT bank 224 reference clock. |
CLK3A | CLK0_P | U1, pin T24 | Output | FPGA bank 45. |
CLK3B | CLK0_N | U1, pin T25 | Output | FPGA bank 45. |
Table : Programmable quad PLL clock generator inputs and outputs.
Programmable Clock Generator Si5345A
Oscillators
The module has following reference clock signals provided by on-board oscillators and external source from carrier board:
Clock Source | Schematic Name | Frequency | Clock Destination |
---|---|---|---|
.. | .. | .. | .. |
SiTime SiT8008BI oscillator, U21 | - | 25.000000 MHz | Quad PLL clock generator U16, pin 3. |
Table : Reference clock signals.
On-board LEDs
LED | Color | Connected to | Description and Notes |
---|---|---|---|
D1 | Green | ||
.. | .. | .. | .. |
Table : On-board LEDs.
User Buttons
Configuration DIP-switches
Backup Battery Holder
Power and Power-On Sequence
Power Consumption
The maximum power consumption of the board mainly depends on the design running on the FPGA.
Xilinx provide a power estimator excel sheets to calculate power consumption. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.
Power Input | Typical Current |
---|---|
24V VIN | TBD* |
Table : Typical power consumption, *to Be Determined soon with reference design setup.
Power supply with minimum current capability of ?? A for system startup is recommended.
The TEB0911 UltraRack board is equipped with the Xilinx Zynq UltraScale+ MPSoC delivers a heterogeneous multi-processing system with integrated programmable logic and independently operable elements and is designed to meet embedded system power management requirement by advanced power management features. This features allow to offset the power and heat constraints against overall performance and operational efficiency.
This features allowing highly flexible power management are achieved by establishing Power Domains for power isolation. The Zynq UltraScale+ MPSoC has multiple power domains, whereby each power domain requires its own particular on-board DC-DC converters.
The Processing System contains three Power Domains:
- Battery Power Domain (BBRAM and RTC)
- Full-Power Domain (Application Processing Unit, DDR Controller, Graphics Processing Unit and High-Speed Connectivity)
- Low-Power Domain (Real-Time Processing Unit, Security and Configuration Unit, Platform Management Unit, System Monitor and General Connectivity)
- Programmable Logic (PL)
Power Distribution Dependencies
There are following dependencies how the initial 24V voltage from the main power jack J34 is distributed to the on-board DC-DC converters, which power up further DC-DC converters and the particular on-board voltages:
Power-On Sequence
The TEB0911 UltraRack board meets the recommended criteria to power up the Xilinx Zynq UltraScale+ MPSoC properly by keeping a specific sequence of enabling the on-board DC-DC converters dedicated to the particular Power Domains and powering up the on-board voltages.
On the TEB0911 UltraRack board following Power Domains will be powered up in a certain sequence with by enable and power-good signals of the DC-DC converters, which are controlled by the System Controller CPLD U27:
- Low-Power Domain (LPD)
- Programmable Logic (PL) and Full-Power Domain (FPD)
- GTH, PS GTR transceiver and DDR memory
Hence, those three power instances will be powered up consecutively and the Power-Good-Signals of the previous instance is asserted.
Following diagram describes the sequence of enabling the three power instances utilizing the DC-DC converter control signals (Enable, Power-Good), which will power-up in descending order as listed in the blocks of the diagram.
Figure : Module power-on diagram.
Voltage Monitor Circuit
If the module has one, describe it here...
Power Rails
NB! Following table with examples is valid for most of the 4 x 5 cm modules but depending on the module model and specific design, number and names of power rails connected to the B2B connectors may vary.
Power Rail Name | B2B JM1 Pins | B2B JM2 Pins | Direction | Notes |
---|---|---|---|---|
VIN | 1, 3, 5 | 2, 4, 6, 8 | Input | Main supply voltage from the carrier board. |
3.3V | - | 10, 12, 91 | Output | Module on-board 3.3V voltage supply. (would be good to add max. current allowed here if possible) |
B64_VCO | 9, 11 | - | Input | HR (High Range) bank voltage supply from the carrier board. |
VBAT_IN | 79 | - | Input | RTC battery supply voltage from the carrier board. |
... | ... | ... | ... | ... |
Table : Module power rails.
Different modules (not just 4 x 5 cm ones) have different type of connectors with different specifications. Following note is for Samtec Razor Beam™ LSHM connectors only, but we should consider adding such note into included file in Board to Board Connectors section instead of here.
Current rating of Samtec Razor Beam™ LSHM B2B connectors is 2.0A per pin (2 adjacent pins powered).
Bank Voltages
Bank | Schematic Name | Voltage | Voltage Range |
---|---|---|---|
500 (MIO0) | PS_1.8V | 1.8V | - |
501 (MIO1) | PS_1.8V | 1.8V | - |
502 (DDR3) | 1.35V | 1.35V | - |
12 HR | VCCIO_12 | User | HR: 1.2V to 3.3V |
13 HR | VCCIO_13 | User | HR: 1.2V to 3.3V |
33 HP | VCCIO_33 | User | HP: 1.2V to 1.8V |
34 HP | VCCIO_34 | User | HP: 1.2V to 1.8V |
35 HP | VCCIO_35 | User | HP: 1.2V to 1.8V |
Table : Module PL I/O bank voltages.
Board to Board Connectors
Variants Currently In Production
NB! Note that here we look at the module as a whole, so you just can't rely only on junction temperature or max voltage of particular SoC or FPGA chip on the module. See examples in the table below.
Module Variant | FPGA / SoC | Operating Temperature | Temperature Range |
---|---|---|---|
TE0710-02-35-2CF | XC7A35T-2CSG324C | 0°C to +70°C | Commercial |
TE0715-04-30-3E | XC7Z030-3SBG485E | 0°C to +85°C | Extended |
TE0841-01-035-1I | XCKU035-1SFVA784I | –40°C to +85°C | Industrial |
.. | .. | .. | .. |
Table : Module variants.
Technical Specifications
Absolute Maximum Ratings
Parameter | Min | Max | Units | Reference Document |
---|---|---|---|---|
VIN supply voltage | V | - | ||
Storage temperature | °C | - |
Table : Module absolute maximum ratings.
Recommended Operating Conditions
Parameter | Min | Max | Units | Reference Document |
---|---|---|---|---|
VIN supply voltage | ||||
Operating temperature |
Table : Module recommended operating conditions.
Operating Temperature Ranges
Commercial grade: 0°C to +70°C.
Extended grade: 0°C to +85°C.
Industrial grade: -40°C to +85°C.
Module operating temperature range depends also on customer design and cooling solution. Please contact us for options.
Physical Dimensions
Module size: ... mm × ... mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: ... mm.
PCB thickness: ... mm.
Highest part on PCB: approx. ... mm. Please download the step model for exact numbers.
All dimensions are given in millimeters.
Put mechanical drawings here...
Figure : Module physical dimensions drawing.
Revision History
Hardware Revision History
Date | Revision | Notes | PCN | Documentation Link |
---|---|---|---|---|
- | 01 | Prototypes |
Table : Module hardware revision history.
Hardware revision number can be found on the PCB board together with the module model number separated by the dash.
Put picture of actual PCB showing model and hardware revision number here...
Figure : Module hardware revision number.
Document Change History
Date | Revision | Contributors | Description |
---|---|---|---|
John Hartfiel | Remove Link to Download | ||
2017-11-10 | v.58 | Ali Naseri |
|
2017-09-06 | v.56 | Jan Kumann |
|
2017-09-02 | v.54 | Jan Kumann | DDR Memory section added. |
2017-08-27 | v.43 | John Hartfiel |
|
2017-08-16 | v.42 | Jan Kumann |
|
2017-08-07 | v.32 | Jan Kumann | Few corrections and cosmetic changes. |
2017-07-14 | v.25 | John Hartfiel | Removed weight section update template version |
2017-06-08 | v.20 | John Hartfiel | Add revision number and update document change history |
2017-05-30 | v.1 | Jan Kumann | Initial document. |
all | Jan Kumann, John Hartfiel |
Table : Document change history.
Disclaimer
Data Privacy
Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy
Document Warranty
The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.
Limitation of Liability
In no event will Trenz Electronic, its suppliers, or other third parties mentioned in this document be liable for any damages whatsoever (including, without limitation, those resulting from lost profits, lost data or business interruption) arising out of the use, inability to use, or the results of use of this document, any documents linked to this document, or the materials or information contained at any or all such documents. If your use of the materials or information from this document results in the need for servicing, repair or correction of equipment or data, you assume all costs thereof.
Copyright Notice
No part of this manual may be reproduced in any form or by any means (including electronic storage and retrieval or translation into a foreign language) without prior agreement and written consent from Trenz Electronic.
Technology Licenses
The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.
Environmental Protection
To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.
REACH, RoHS and WEEE
REACH
Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).
RoHS
Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.
WEEE
Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).
Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.
Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.