Design Example with minimum PS Setup (DDR, QSPI, UART0) only for custom boards or easier debug via Vitis.

Refer to http://trenz.org/te0808-info for the current online version of this manual and other available documentation.

Key Features

  • Vitis/Vivado 2022.2
  • QSPI
  • Custom Carrier (minimum PS Design with available module components only)
  • Modified FSBL (some additional outputs only)

Revision History

DateVivadoProject BuiltAuthorsDescription
Manuela Strücker
  • 2022.2 release
  • new assembly variants
Manuela Strücker
  • new assembly variants
Manuela Strücker
  • script update
  • new assembly variants
Manuela Strücker
  • update board part files compatible to Vivado 2021.2.1
John Hartfiel
  • replace Starterkit FSBL with default one
Manuela Strücker
  • 2021.2 release
  • update board files
John Hartfiel
  • update board files
John Hartfiel
  • 2020.2 update
John Hartfiel
  • bugfix 8GB board parts
John Hartfiel
  • new assembly variants
John Hartfiel
  • script update
John Hartfiel
  • 2019.2 update
  • Vitis support
John Hartfiel
  • new assembly variants
John Hartfiel
  • custom FSBL
John Hartfiel
  • additional notes for FSBL generated with Win SDK
  • changed *.bif
John Hartfiel
  • new assembly variant
John Hartfiel
  • Update Board Part for TEBF0808
    • no changes for test board design and minimal board parts
John Hartfiel
  • rework Board Part Files


John Hartfiel
  • Update Board Part Files
John Hartfiel
  • Update Board Part CSV File
  • Regenerate design


John Hartfiel
  • Update Board Part CSV File with new Flash assembly variants
John Hartfiel
  • initial release
Design Revision History

Release Notes and Know Issues

IssuesDescriptionWorkaroundTo be fixed version
Xilinx SoftwareIncompatibility of board files for ZynqMP with eMMC activated between 2021.2 and 2021.2.1 patch, see Xilinx Forum Requestuse corresponding board files for the Vivado versions--
QSPI FlashFlash programming is not supported with boot mode QSPI or SD.
If flash programming fails, configure device for JTAG boot mode and try again or use older Vivado Versions for programming. (Vivado 2020.2 or 2019.2)
Known Issues



Vitis2022.2needed, Vivado is included into Vitis installation


Basic description of TE Board Part Files is available on TE Board Part Files.

Complete List is available on "<project folder>\board_files\*_board_files.csv"

Design supports following modules:

Module ModelBoard Part Short NamePCB Revision SupportDDRQSPI FlashEMMCOthersNotes
TE0808-ES1          es1_2gb      REV03|REV02 2GB      64MB       NA         NA               Not longer supported by vivado       
TE0808-ES2          es2_2gb      REV04|REV03 2GB      64MB       NA         NA               Not longer supported by vivado                    
TE0808-2ES2         2es2_2gb     REV04|REV03 2GB      64MB       NA         NA               Not longer supported by vivado             
TE0808-04-09EG-1EA  9eg_1e_2gb   REV04       2GB      64MB       NA         NA               NA                                     
TE0808-04-09EG-1EB  9eg_1e_4gb   REV04       4GB      64MB       NA         NA               NA                                     
TE0808-04-09EG-1ED  9eg_1e_4gb   REV04       4GB      64MB       NA         1 mm connectorsNA                                     
TE0808-04-09EG-2IB  9eg_2i_4gb   REV04       4GB      64MB       NA         NA               NA                                     
TE0808-04-15EG-1EB  15eg_1e_4gb  REV04       4GB      64MB       NA         NA               NA                                     
TE0808-04-09EG-1EE  9eg_1e_4gb   REV04       4GB      128MB      NA         NA               NA                                     
TE0808-04-09EG-1EL  9eg_1e_4gb   REV04       4GB      128MB      NA         1 mm connectorsNA                                     
TE0808-04-09EG-2IE* 9eg_2i_4gb   REV04       4GB      128MB      NA         NA               NA                                     
TE0808-04-15EG-1EE  15eg_1e_4gb  REV04       4GB      128MB      NA         NA               NA                                     
TE0808-04-06EG-1EE  6eg_1e_4gb   REV04       4GB      128MB      NA         NA               NA                                     
TE0808-04-06EG-1E3  6eg_1e_4gb   REV04       4GB      128MB      NA         1 mm connectorsNA                                     
TE0808-04-6GI21-L   6eg_2i_4gb   REV04       4GB      128MB      NA         1 mm connectorsNA                                     
TE0808-04-6BI21-A   6eg_1i_4gb   REV04       4GB      128MB      NA         NA               NA                                     
TE0808-04-9GI21-A   9eg_2i_4gb   REV04       4GB      128MB      NA         NA               NA                                     
TE0808-04-9BE21-A   9eg_1e_4gb   REV04       4GB      128MB      NA         NA               NA                                     
TE0808-04-6BE21-L   6eg_1e_4gb   REV04       4GB      128MB      NA         1 mm connectorsNA                                     
TE0808-04-6BE21-A   6eg_1e_4gb   REV04       4GB      128MB      NA         NA               NA                                     
TE0808-04-9BE21-L   9eg_1e_4gb   REV04       4GB      128MB      NA         1 mm connectorsNA                                     
TE0808-04-BBE21-A   15eg_1e_4gb  REV04       4GB      128MB      NA         NA               NA                                     
TE0808-04-6BI21-X   6eg_1i_4gb   REV04       4GB      128MB      NA         NA               U41 replaced with schottky diodes    
TE0808-05-6BE21-L   6eg_1e_4gb   REV05       4GB      128MB      NA         1 mm connectorsNA                                     
TE0808-05-6BE21-A   6eg_1e_4gb   REV05       4GB      128MB      NA         NA               NA                                     
TE0808-05-6BI21-D   6eg_1i_4gb   REV05       4GB      128MB      NA         1 mm connectorsSoC without encryption               
TE0808-05-6BI21-X   6eg_1i_4gb   REV05       4GB      128MB      NA         NA               U41 replaced with schottky diodes    
TE0808-05-6BI41-X   6eg_1i_8gb   REV05       8GB      128MB      NA         NA               U41 replaced with schottky diodes    
TE0808-05-9BE21-A   9eg_1e_4gb   REV05       4GB      128MB      NA         NA               NA                                     
TE0808-05-9BE21-L   9eg_1e_4gb   REV05       4GB      128MB      NA         1 mm connectorsNA                                     
TE0808-05-9BI41-X   9eg_1i_8gb   REV05       8GB      128MB      NA         NA               U41 replaced with schottky diodes    
TE0808-05-9GI21-A   9eg_2i_4gb   REV05       4GB      128MB      NA         NA               NA                                     
TE0808-05-9GI21-C   9eg_2i_4gb   REV05       4GB      128MB      NA         NA               SoC without encryption               
TE0808-05-BBE21-A   15eg_1e_4gb  REV05       4GB      128MB      NA         NA               NA                                     
TE0808-05-BBE21-L   15eg_1e_4gb  REV05       4GB      128MB      NA         1 mm connectorsNA                                     



TE0808-05-S003 15eg_1e_4gbREV054GB128MBNANACAO
TE0808-05-S005 9eg_2i_4gb REV054GB128MBNANACAO
TE0808-05-S004 9eg_2i_4gb REV054GB128MBNANACAO
TE0808-05-6BE21-AK6eg_1e_4gb REV054GB128MBNANANA
TE0808-05-9BE21-LK9eg_1e_4gb REV054GB128MBNA1 mm connectorsNA
TE0808-05-9GI21-AK9eg_2i_4gb REV054GB128MBNANANA
TE0808-05-S0069eg_2i_4gb REV054GB128MBNANACAO
TE0808-05-S0269eg_2i_4gbREV054GB128MBNACAOCAO: without PLL
TE0808-05-9BE21-KZ9eg_1e_4gbREV054GB128MBNA1 mm connectorsNA
TE0808-05-9BE21-LZ9eg_1e_4gbREV054GB128MBNA1 mm connectorsNA
TE0808-05-9BE21-AK9eg_1e_4gbREV054GB128MBNA1 mm connectorsNA
TE0808-05-9BE21-AZ9eg_1e_4gbREV054GB128MBNA1 mm connectorsNA
TE0808-05-S0019eg_1e_8gb_DREV058GB128MBNACAOCAO; Single Die DDR
TE0808-05-S0396eg_1e_4gbREV054GB128MBNACAOCAO: without PLL

*used as reference

Hardware Modules

Note: Design contains also Board Part Files for TE0808+TEBF0808 configuration, this board part files are not used for this reference design.

Design supports following carriers:

Carrier ModelNotes
Custom PCBuse simple Board Part files, if MIO connected is different to TEBF0808
TEBF0808*Used as reference carrier.
TEBT0808-01Change UART0 to UART1 (MIO68...69) and regenerate design

*used as reference

Hardware Carrier

Additional HW Requirements:

Additional HardwareNotes

*used as reference

Additional Hardware


For general structure and usage of the reference design, see Project Delivery - AMD devices

Design Sources

Vivado<project folder>\block_design
<project folder>\constraints
<project folder>\ip_lib
<project folder>\board_files
Vivado Project will be generated by TE Scripts
Vitis<project folder>\sw_libAdditional Software Template for Vitis and apps_list.csv with settings automatically for Vitis app generation
Design sources

Additional Sources

Additional design sources





BIF-File*.bifFile with description to generate Bin-File
BIN-File*.binFlash Configuration File with Boot-Image (Zynq-FPGAs)
BIT-File*.bitFPGA (PL Part) Configuration File
Diverse Reports---Report files in different formats
Hardware-Platform-Description-File*.xsaExported Vivado hardware description file for Vitis and PetaLinux
LabTools Project-File*.lprVivado Labtools Project File
Software-Application-File*.elfSoftware Application for Zynq or MicroBlaze Processor Systems
Prebuilt files (only on ZIP with prebult content)


Reference Design is only usable with the specified Vivado/Vitis/PetaLinux version. Do never use different Versions of Xilinx Software for the same Project.

Reference Design is available on:

Design Flow

Reference Design is available with and without prebuilt files. It's recommended to use TE prebuilt files for first launch.

Trenz Electronic provides a tcl based built environment based on Xilinx Design Flow.

See also:

The Trenz Electronic FPGA Reference Designs are TCL-script based project. Command files for execution will be generated with "_create_win_setup.cmd" on Windows OS and "_create_linux_setup.sh" on Linux OS.

TE Scripts are only needed to generate the vivado project, all other additional steps are optional and can also executed by Xilinx Vivado/Vitis GUI. For currently Scripts limitations on Win and Linux OS see: Project Delivery Currently limitations of functionality

Caution! Win OS has a 260 character limit for path lengths which can affect the Vivado tools. To avoid this issue, use Virtual Drive or the shortest possible names and directory locations for the reference design (for example "x:\<project folder>")

  1. Run _create_win_setup.cmd/_create_linux_setup.sh and follow instructions on shell:

    ------------------------Set design paths----------------------------
    -- Run Design with: _create_win_setup
    -- Use Design Path: <absolute project path>
    -------------------------TE Reference Design---------------------------
    -- (0)  Module selection guide, project creation...prebuilt export...
    -- (1)  Create minimum setup of CMD-Files and exit Batch
    -- (2)  Create maximum setup of CMD-Files and exit Batch
    -- (3)  (internal only) Dev
    -- (4)  (internal only) Prod
    -- (c)  Go to CMD-File Generation (Manual setup)
    -- (d)  Go to Documentation (Web Documentation)
    -- (g)  Install Board Files from Xilinx Board Store (beta)
    -- (a)  Start design with unsupported Vivado Version (beta)
    -- (x)  Exit Batch (nothing is done!)
    Select (ex.:'0' for module selection guide):
  2. Press 0 and enter to start "Module Selection Guide"
  3. Create project and follow instructions of the product selection guide, settings file will be configured automatically during this process.
    • optional for manual changes: Select correct device and Xilinx install path on "design_basic_settings.cmd" and create Vivado project with "vivado_create_project_guimode.cmd"

      Note: Select correct one, see also Vivado Board Part Flow

      Important: Use Board Part Files, which did not end with *_tebf0808

  4. Create hardware description file (.xsa file) and export to prebuilt folder

    run on Vivado TCL (Script generates design and export files into "<project folder>\prebuilt\hardware\<short name>")
    TE::hw_build_design -export_prebuilt

    Using Vivado GUI is the same, except file export to prebuilt folder.

  5. Generate Programming Files with Vitis

    run on Vivado TCL (Script generates applications and bootable files, which are defined in "test_board\sw_lib\apps_list.csv")
    TE::sw_run_vitis -all
    TE::sw_run_vitis (optional; Start Vitis from Vivado GUI or start with TE Scripts on Vivado TCL)

    TCL scripts generate also platform project, this must be done manually in case GUI is used. See Vitis



Check Module and Carrier TRMs for proper HW configuration before you try any design.

Reference Design is also available with prebuilt files. It's recommended to use TE prebuilt files for first launch.

Xilinx documentation for programming and debugging: Vivado/Vitis/SDSoC-Xilinx Software Programming and Debugging

Get prebuilt boot binaries

  1. Run _create_win_setup.cmd/_create_linux_setup.sh and follow instructions on shell
  2. Press 0 and enter to start "Module Selection Guide"
    1. Select assembly version
    2. Validate selection
    3. Select create and open delivery binary folder

      Note: Folder "<project folder>\_binaries_<Article Name>" with subfolder "boot_<app name>" for different applications will be generated

QSPI-Boot mode

  1. Connect JTAG and power on carrier with module
  2. Open Vivado Project with "vivado_open_existing_project_guimode.cmd" or if not created, create with "vivado_create_project_guimode.cmd"

    run on Vivado TCL (Script programs BOOT.bin on QSPI flash)
    TE::pr_program_flash -swapp hello_te0808

SD-Boot mode

This does not work, because SD controller is not selected on PS.


Load configuration and Application with Vitis Debugger into device


QSPI Boot:

  1. Prepare HW like described on section Programming
  2. Connect UART USB (most cases same as JTAG)
  3. Select QSPI as Boot Mode

    Note: See TRM of the Carrier, which is used.

  4. Power On PCB

    1. ZynqMP Boot ROM FSBL from QSPI into OCM,

    2. FSBL init the PS, programs the PL using the bitstream and loads PMU, ATF and U-boot from QSPI into DDR

System Design - Vivado

Block Design

Block Design

PS Interfaces

Activated interfaces:

UART0MIO, please select other one, if you have connected UART to second controller or other MIO
PS Interfaces


Basic module constrains

set_property BITSTREAM.GENERAL.COMPRESS TRUE [current_design]
set_property BITSTREAM.CONFIG.UNUSEDPIN PULLNONE [current_design]

Design specific constrain

Not needed.

Software Design - Vitis

For Vitis project creation, follow instructions from:



Template location: "<project folder>\sw_lib\sw_apps\"


TE modified 2022.2 FSBL


  • Modified Files: xfsbl_main.c, xfsbl_hooks.h/.c, xfsbl_board.h/.c (search for 'TE Mod' on source code)
  • Add Files: te_xfsbl_hooks.h/.c (for hooks and board)
  • General Changes: 
    • Display FSBL Banner and Device Name


Hello TE0808 is a Xilinx Hello World example as endless loop instead of one console output.

Additional Software

No additional software is needed.

Appx. A: Change History and Legal Notices

Document Change History

To get content of older revision go to "Change History" of this page and select older document revision number.

DateDocument Revision



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  • 2022.2 release
  • new assembly variants
2023-04-13v.43Manuela Strücker
  • new assembly variants
2022-09-29v.41Manuela Strücker
  • script update
  • new assembly variants
2022-09-12v.40Manuela Strücker
  • update board part files compatible to Vivado 2021.2.1
2022-09-06v.38Manuela Strücker
  • Design Bugfix
2022-03-16v.36Manuela Strücker
  • Release 2021.2
2021-05-25v.35Manuela Strücker
  • Document Style update



John Hartfiel

  • update board files
2021-02-05v.33John Hartfiel
  • Release 2020.2
  • Document Style update
2021-02-05v.31John Hartfiel
  • new assembly variants
2020-03-25v.28John Hartfiel
  • script update
2020-01-27v.27John Hartfiel
  • documentation update
2020-01-22v.26John Hartfiel
  • new assembly variants
  • Release 2019.2
2019-08-09v.24John Hartfiel
  • new assembly variants
  • small document style update
2019-05-07v.22John Hartfiel
  • Release 2018.3
2018-07-11v.21John Hartfiel
  • Release 2018.2


v.20John Hartfiel
  • new assembly variant
2018-02-08v.19John Hartfiel
  • Release 2017.4
2017-12-20v.14John Hartfiel
  • Design Update
  • typo correction on documentation
2017-11-22v.10John Hartfiel
  • Update assembly versions with new Flash size
  • Update HW Table Name
  • Update Design
2017-11-14v.6John Hartfiel
  • Release 2017.2

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Document change history.

Legal Notices

Data Privacy

Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy

Document Warranty

The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.

Limitation of Liability

In no event will Trenz Electronic, its suppliers, or other third parties mentioned in this document be liable for any damages whatsoever (including, without limitation, those resulting from lost profits, lost data or business interruption) arising out of the use, inability to use, or the results of use of this document, any documents linked to this document, or the materials or information contained at any or all such documents. If your use of the materials or information from this document results in the need for servicing, repair or correction of equipment or data, you assume all costs thereof.

Copyright Notice

No part of this manual may be reproduced in any form or by any means (including electronic storage and retrieval or translation into a foreign language) without prior agreement and written consent from Trenz Electronic.

Technology Licenses

The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.

Environmental Protection

To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.



Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).


Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.


Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.

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