Page History

<!--
Template Revision 1.4 beta
(HTML comment will not display, it's not needed to remove them. For Template/Skeleton changes, increase Template Revision number. So we can check faster, if the TRM style is up to date)
 -->

Overview

Refer to https://shop.trenz-electronic.de/en/Download/?path=Trenz_Electronic/carrier_boards/TEBF0808/REV04 for downloadable version of this manual and additional technical documentation of the product.
 

The Trenz Electronic TEBF0808 carrier board is a baseboard for the Xilinx Zynq Ultrascale+ MPSoC modules TE0808 and TE0803, which exposes the module's B2B connector pins to accessible connectors and provides a whole range of on-board components to test and evaluate the Zynq Ultrascale+ SoMs and for developing purposes. The carrier board has a Mini-ITX form factor making it capable to be fitted into a PC enclosure. On the PC enclosure's rear and front panel, essential data interfaces, sockets and connectors are accessible. 

Key Features

• Mini-ITX form factor, PC enclosure compatible
• ATX-24 power supply connector
• Optional 12V standard power plug
• Headers
  • Intel 10-pin HDA Audio
  • Intel 9-pin Power-/Reset-Button, Power-/HD-LED
  • PC-BEEPER
• On-board Power- / Reset-Switches
• 2x Configuration 4-bit DIP-switches
• 2x Optional 4-wire PWM fan connectors
• PCIe Slot - one PCIe lane (16 lane connector)
• CAN FD Transceiver (10 Pin IDC connector and 6-pin header)
• 4x On-board configuration EEPROMs (1x Microchip 24LC128-I/ST, 3x  Microchip 24AA025E48T-I/OT)
• Dual SFP+ Connector (2x1 Cage)
• One Display-Port (single lane)
• One SATA Connector
• 2x USB3.0 A Connector (Superspeed Host Port (Highspeed at USB2.0))
• 1x USB3.0 on-board header with two ports
• FMC HPC Slot (FMC_VADJ max. VCCIO)
• FMC Fan
• Gigabit Ethernet RGMII PHY with RJ45 MegJack
• All Carrier Board peripherals' I²C-interfaces muxed to MPSoC's I²C-interface on PS bank 503
• Quad programmable PLL clock generator SI5338A
• 2x SMA coaxial connectors for clock signals
• MicroSD- / MMC-Card Socket (bootable)
• 32 Gbit on-board eMMC memory (8 banks a 4 Gbit)
• Two System Controller CPLDs Lattice MachXO2 1200 HC
• One Samtec FireFly (4 GT lanes bidirectional)
• One Samtec FireFly connector for reverse loopback
• 2x JTAG/UART header ('XMOD FTDI JTAG Adapter'-compatible) for programming MPSoC and SC CPLDs
• 20 Pin ARM JTAG Connector (PS JTAG0)
• 3x PMOD connector (GPIO's and I²C interface to SC CPLDs / MPSoC module
• Carrier SC CPLD managing power-up sequence of MPSoC module
• On-board DC-DC PowerSoCs

Additional assembly options are available for cost or performance optimization upon request.

Block Diagram

Figure 1: TEBF0808-04 Block Diagram

Main Components

Figure 2: TEBF0808-04 Carrier Board

1. PMOD connector, P2
2. MicroSD Card socket (on bottom side), J16
3. Display Port socket, J13
4. USB3.0 A 2x , RJ45 1x (stacked), J7
5. SFP+ 2x1 cage, J14
6. PCIe x16 connector (one PCIe lane connected), J11
7. FMC HPC, J5
8. FMC-Fan connector 5V, J19
9. USB3.0 connector, J8
10. PC-BEEPER 4-pin header, J23
11. SMA coaxial connector (SI5338A clock output), J32
12. SMA coaxial connector (clock input to MPSoC module), J33
13. eMMC Card socket, J27
14. Ultra fine 0.50 mm pitch, Razor Beam™ LP Slim Terminal Strip with 160 contacts, J4
15. Ultra fine 0.50 mm pitch, Razor Beam™ LP Slim Terminal Strip with 160 contacts, J1
16. Ultra fine 0.50 mm pitch, Razor Beam™ LP Slim Terminal Strip with 160 contacts, J3
17. Ultra fine 0.50 mm pitch, Razor Beam™ LP Slim Terminal Strip with 160 contacts, J2
18. CAN bus 6-pin header, J29
19. CAN bus 10-pin connector, J24
20. ARM-JTAG  20-pin connector, J30
21. ATX power supply connector, J20
22. 4-Wire PWM fan connector, J35
23. JTAG/UART header ('XMOD FTDI JTAG Adapter'-compatible) for access to MPSoC module, J12
24. JTAG/UART header ('XMOD FTDI JTAG Adapter'-compatible) for access to System Controller CPLDs, J28
25. Power Jack 2.1mm 12V, J25
26. 4-bit DIP-switch, S5
27. Power Button, S1
28. Samtec FireFly Connector  for reverse loopback, J21/J22
29. Samtec FireFly Connector (4 GT lanes bidirectional), J6/J15
30. SATA Header, J31
31. 4-Wire PWM fan connector, J26
32. Programmable on-module PLL I²C interface 10-pin header, J17
33. Reset Button, S2
34. INTEL HDA 9-pin header, J9
35. Intel front panel (PWR-/RST-Button, HD-/PWR-LED) 9-pin header, J10
36. Samtec FireFly Connector J6/J15 I²C interface 3-pin header, J34
37. 4-bit DIP-switch, S4
38. PMOD connector, P3
39. PMOD connector, P1
40. Battery Holder CR1220, B1

Initial Delivery State

Table 1: Initial Delivery State of the flash memories

Signals, Interfaces and Pins

FMC HPC Connector

The FMC (FPGA Mezzanine Card) connector J5 with high pin count (HPC) provides as an ANSI/VITA 57.1 standard a modular interface to the MPSoCs FPGA and exposes numerous of its I/O pins for use by other mezzanine modules and expansion cards.

The connector supports single ended (VCCIO: FMC_VADJ) and differential signaling as the I/O's are usable as LVDS-pairs.

The I/O signals are routed from the FPGA banks as LVDS-pairs to the connector.

Figure 2: FMC HPC Connector

Table 2: FMC connector pin-outs of available logic banks of the MPSoC

The MGT-banks have also clock input-pins which are exposed to the FMC connector. Following MGT-lanes are available on the FMC connectors J5:

Table 2: FMC connector pin-outs of available MGT-lanes of the MPSoC

The FMC connector provides pins for reference clock output to the Mezzanine module and clock input to PL banks of the MPSoC:

Table 3: FMC connector pin-outs for reference clock output

The FMC connector provides further interfaces like 'JTAG' and 'I²C' to the System Controller CPLD:

Table 4: FMC connector pin-outs of available interfaces to the System Controller CPLD

Several VCCIO voltages are available on the FMC connector to operate the I/O's in order of the intended purpose:

Table 5:  Available VCCIO voltages on FMC connector

MIO Bank Interfaces

The TEBF0808 carrier board provides several interfaces, which are configured on the MIO banks 500 .. 503 of the Zynq Ultrascale+ MPSoC.

Following table contains the assignment of the MIO pins to the configured interfaces:

Table 5:  MIO Assignment

On the carrier board there are up to 4 USB3.0 Super Speed ports available, which are also downward compatible to USB2.0 High Speed ports. The USB3.0 ports are provided by the IC U4, Cypress Semiconductor CYUSB3324 4-port USB3.0 Hub. The pin-strap configuration option of the USB3.0 Hub U4 is disabled, so the Hub will only be configurable over the configuration EEPROM U5. The I²C interface of the EEPROM is also accessible by the MPSoC through I²C switch U16.

On the Upstream-side, this chip is connected to the MGT1 lane of MPSoC's PG GT bank 505 to establish the USB3.0 data lane. For the USB2.0 interface, the USB3.0 HUB U4 is connected to the on-board USB2.0 PHY U9. The USB2.0 PHY U9 is connected per ULPI interface (MIO pins 52..63) to MPSoC's MIO bank 501.

Further interfaces of the MIO bank:

• SDIO port with muxed MikroSD and MMC Socket
• Gigabit Ethernet connected per RGMII
• eMMC Memory
• 4 x user configuration EEPROMs with I²C interface

Following block-diagram visualizes the interfaces of the MIO bank at the Zynq Ultrascale+ MPSoC and their associated on-board peripherals.

Figure 3: TEBF0808 MIO Interfaces

MPSoC's PS GT Bank 505 Interfaces

On the PS GT Bank 505 provides beside the USB3.0 Lane also following interfaces:

• SATA (PS GT bank 505, MGT2 Lane)
• Display-Port (PS GT bank 505, MGT3 Lane, only TX-pair routed)
• PCI Express (PS GT bank 505, MGT0 Lane)
  
  

Table 6:  PS GT Lane Assignment

Following block diagram shows the wiring of the MGT Lanes of the PS GT bank 505 to the particular high speed data interfaces:

Figure 4: TEBF0808 PS GT Bank 505 Interface

MGT Interfaces SFP+ and FireFly

The TEBF0808 carrier board provides the high speed MGT interface connectors "SFP+" (Enhanced small form-factor pluggable) and Samtec "FireFly". Each of this connectors are capable of data transmission rates up  to 10 Gbit/s.

Table 6:  MGT Lane Assignment

Following block diagram show the wiring of the MGT lanes to the particular interface connectors:

Figure 5: TEBF0808 MGT Interfaces

As shown on the block diagram, the FireFly connector pair J21, J22 provides four reversed looped back MGT lanes. To test any of the on-board MGT lanes or of an extern device, 4 RX/TX differential pairs are bridged on the connector, hence the transmitted data on these MGT lanes flows back to their sources in a loop-back circuit without intentional processing or modification.

CAN FD Interface and PMOD Connectors

On the carrier board there is a CAN FD (CAN with Flexible Data-Rate) interface available which is accessible on the CAN headers J24 (10-pin IDC connector) or J29 (6-pin header), which are connected to the CAN FD transceiver U30.

Additionally the carrier board provides PMOD connectors with GPIO and I²C interface. Following table

Table 7:  PMOD Pin Assignment

Figure 6: TEBF0808 CAN Interfaces, PMOD

Intel PC Compatible Headers and FAN Connectors

The TEBF0808 carrier board provides with its Mini-ITX form factor the possibility to encase the board in a PC Enclosure. For this purpose, the board is equipped with several Intel PC compatible headers to connect them to the PC Enclosure.

Pins are available for following PC front panel elements

• Reset Button
• Power Button
• Power LED
• Hard Disc (HD) LED
• Intel High Definition Audio (HDA) Jacks

Following table gives an overview about the particular pins of the headers and a description about their functionalities:

Table 8: PC compatible Headers

Figure 7: TEBF0808 PC Compatible Headers

JTAG Interface

The TEBF0808 carrier board provides several JTAG interfaces to program both the System Controller CPLDs and the Zynq Ultrascale+ MPSoC.

Therefore, the board is equipped with two JTAG/UART headers, which have 'XMOD FTDI JTAG Adapter'-compatible pin-assignment. So in use with the XMOD-FT2232H adapter-board TE0790 the mounted SoM and the System Controller CPLDs can be programmed via USB interface.

The System Controller CPLDs will be programmed by the XMOD-Header J28 with cascaded JTAG chain as visualized in Figure 8. To program the System Controller CPLDs, the JTAG interface of these devices have to be activated by DIP-switch S4-3.
The 4 GPIO/UART pins (XMOD1_A/B/E/G) of the XMOD-Header J28 are routed to the System Controller CPLD U17.

XMOD-Header J12 is designated to program the Zynq Ultrascale+ MPSoC via USB interface, the 4 GPIO/UART pins (XMOD2_A/B/E/G) of this header are routed to the System Controller CPLD U39.

Figure 8: TEBF0808 JTAG interfaces

Further JTAG interfaces of the TEBF0808 carrier board are the ARM JTAG 20-pin IDC connector J30 and on the FMC Connector J5. This JTAG interfaces are connected to the System Controller CPLD U17, hence the logical processing and forwarding of the JTAG signals depend on the SC CPLD firmware. The documentation of the firmware of the SC CPLD U17 contains detailed information on this matter.

Boot Process

TE0745 module supports different boot modes which are configurable by the control line 'BOOTMODE' and 'BOOTMODE_1'. The line 'BOOTMODE' is available on B2B connector pin J2-133, the line 'BOOTMODE_1' is connected to the System Controller CPLD on bank 1, pin 21.

The current boot mode will be set by the MIO pins MIO3...MIO5. The control line 'BOOTMODE' is connected to the 'MIO4' pin, 'BOOTMODE_1' to 'MIO5'.

Following table describes how to set the control lines to configure the desired boot mode:

Table 11: Selectable boot modes

In delivery state of the SoM the boot mode depends on the configured SC-CPLD firmware. The current mode is set to boot from the QSPI Flash Memory.

On-board Peripherals

System Controller CPDLs

The TEBF0808 is equipped with two System Controller CPLDs - Lattice Semiconductor LCMXO2-1200HC (MachXO2 Product Family) - with the schematic designators U17 and U39.

The  SC-CPLD is the central system management unit where essential control signals are logically linked by the implemented logic in CPLD firmware, which generates output signals to control the system, the on-board peripherals and the interfaces. Interfaces like JTAG and I²C between the on-board peripherals and to the FPGA-module are by-passed, forwarded and controlled by the System Controller CPLD.

Other tasks of the System Controller CPLD are the monitoring of the power-on sequence and to display the programming state of the FPGA module.

Both Sytem Controller CPLDs are connected to the Zynq Ultrascale+ MPSoC through MIO and also Programmable Logic pins.

The functionalities and configuration of the pins depend on the CPLDs' firmware. The documentations of the firmware of SC CPLD U17 and SC CPLD U39 contains detailed information on this matter.

Following block diagram visualizes the connection of the SC CPLDs with the Zynq Ultrascale+ MPSoC via PS (MIO) and PL bank pins.

Figure 8: TEBF0808 System Controller CPLDs

Programmable PLL Clock Generator and Reference Clock Oscillators

The TEBF0808 Carrier Board is equipped with a Silicon Labs I²C programmable quad PLL clock generator Si5338A (U35). It's output frequencies can be programmed by using the I²C bus with address 0x70.

A 25 MHz (U7) oscillator is connected to pin 3 (IN3) and is used to generate the output clocks.

Once running, the frequency and other parameters can be changed by programming the device using the I²C-bus connected through I²C switch U16 between the Zynq module (master) and reference clock signal generator (slave).

Table 9: Pin description of PLL clock generator Si5338A

Figure 9: Clocking Configuration of TE0808 SoM on TEBF0808 Carrier Board

To configure the programmable PLL clock generator on the mounted TE0808 SoM, refer to the TRM of this SoM.

Si5338 OTP can only be programmed two times, as different user configurations may required different setup, TEBF0808 is normally shipped with blank OTP.
For more information Si5338 at SiLabs.

Oscillators

The TEBF0808 carrier board is equipped several on-board oscillators to provide the Zynq Ultrascale+ MPSoC's PS and PL banks and the on-board peripherals with reference clock-signals:

Table 10: Reference clock signal oscillators

High-speed USB ULPI PHY

USB PHY (U32) is provided by USB3320 from Microchip. The ULPI interface is connected to the Zynq PS USB0. I/O voltage is fixed at 1.8V and PHY reference clock input is supplied from the on-board 52.000000 MHz oscillator (U33).

Table 8: USB PHY interface connections

The schematics for the USB connector and required components is different depending on the USB usage. USB standard A or B connectors can be used for Host or Device modes. A Mini USB connector can be used for USB Device mode. A USB Micro connector can be used for Device mode, OTG Mode or Host Mode.

Gigabit Ethernet PHY

On-board Gigabit Ethernet PHY (U7) is provided with Marvell Alaska 88E1512 IC. The Ethernet PHY RGMII interface is connected to the Zynq Ethernet0 PS GEM0. I/O voltage is fixed at 1.8V for HSTL signaling. The reference clock input of the PHY is supplied from the on-board 25.000000 MHz oscillator (U9). The 125MHz PHY output clock (PHY_CLK125M) is routed to the B2B connector J2 pin 150.

Table 7: Ethernet PHY interface connections

8-Channel I²C Switches

The I²C interface on B2B connector J2 pins 119 (I2C_33_SCL) and 121 (I2C_33_SDA) have PS_3.3V as reference voltage.

The I²C bus works internally on module with reference voltage 1.8V, on the Zynq chip it is connected to the PS I²C interface via PS MIO bank 500, pins MIO10 and MIO11.

Table 9: MIO-pin assignment of the module's I²C interface

Except the RTC (U24), all I²C slave devices are operating with the reference voltage PS_1.8V via voltage level translating (3.3V ↔ 1.8V) I²C bus repeater (U17).

I²C addresses for on-board devices are listed in the table below:

Table 10:  Module's I²C-interfaces overview

System Controller CPLD

The System Controller CPLD (U2) is provided by Lattice Semiconductor LCMXO2-256HC (MachXO2 Product Family). The  SC-CPLD is the central system management unit where essential control signals are logically linked by the implemented logic in CPLD firmware, which generates output signals to control the system, the on-board peripherals and the interfaces. Interfaces like JTAG and I²C between the on-board peripherals and to the FPGA-module are by-passed, forwarded and controlled by the System Controller CPLD.

Other tasks of the System Controller CPLD are the monitoring of the power-on sequence and to display the programming state of the FPGA module.

Quad SPI Flash Memory

On-board QSPI flash memory (U14) on the TE0745-02 is provided by Micron Serial NOR Flash Memory N25Q256A with 256 Mbit (32 MByte) storage capacity. This non volatile memory is used to store initial FPGA configuration. Besides FPGA configuration, remaining free flash memory can be used for user application and data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths. Maximum data rate depends on the selected bus width and clock frequency used.

Gigabit Ethernet PHY

On-board Gigabit Ethernet PHY (U7) is provided with Marvell Alaska 88E1512 IC (U8). The Ethernet PHY RGMII interface is connected to the Zynq Ethernet0 PS GEM0. I/O voltage is fixed at 1.8V for HSTL signaling. The reference clock input of the PHY is supplied from an on-board 25.000000 MHz oscillator (U9), the 125MHz output clock signal CLK_125MHZ is connected to the pin J2-150 of B2B connector J2.

High-speed USB ULPI PHY

Hi-speed USB ULPI PHY (U32) is provided with USB3320 from Microchip. The ULPI interface is connected to the Zynq PS USB0 via MIO28..39, bank 501 (see also section). The I/O voltage is fixed at 1.8V and PHY reference clock input is supplied from the on-board 52.000000 MHz oscillator (U33).

MAC Address EEPROM

A Microchip 24AA025E48 serial EEPROM (U23) contains a globally unique 48-bit node address, which is compatible with EUI-48(TM) specification. The device is organized as two blocks of 128 x 8-bit memory. One of the blocks stores the 48-bit node address and is write protected, the other block is available for application use. It is accessible over I²C bus with slave device address 0x53.

RTC - Real Time Clock

An temperature compensated Intersil ISL12020M is used as Real Time Clock (U24). Battery voltage must be supplied to the clock from the base board via pin 'VBAT_IN' (J1-146). Battery backed registers can be accessed over I²C bus at slave address 0x6F. General purpose RAM of the RTC can be accessed at I²C slave address 0x57. RTC IC is supported by Linux so it can be used as hwclock device. The interrupt line 'RTC_INT' of the RTC is connected to System Controller CPLD bank 3 pin 4.

On-board LEDs

Table 14: LED's description

Power and Power-On Sequence

Power Consumption

The maximum power consumption of a module mainly depends on the design which is running on the FPGA.

Xilinx provide a power estimator excel sheets to calculate power consumption. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.

Power Management

The TEBF0808 carrier board manages both the power-on sequence of the mounted TE0808 SoM and the on-board DC-DC converters via System Controller CPLD U39.

The power-on sequence of the TE0808 SoM is managed by utilizing the SoM's DC-DC converter control signals ('Enable', 'Power-Good'), so the DC-DC converters of the SoM dedicated to the particular Power Domains of the Zynq Ultrascale+ MPSoC will be powerer-up in a specific sequence to meet the recommended criteria to power up the Xilinx Zynq Ultrascale+ MPSoC properly.

Figure 10: TEBF0808 Power-Management

Adjustable PL Bank VCCO Voltage FMC_VADJ

Power Distribution Dependencies

The power rails 'DCDCIN', 'LP_DCDC', 'PL_DCIN', 'PS_BATT' have to be powered up on the assigned pins of the B2B connectors as listed on the section "Power Rails". Except 'PS_BATT' (see section "Recommended Operation Conditions"), all power-rails can be powered up, with 3.3V power sources, also shared, if Power Domain control is not required.

There are following dependencies how the initial voltages of the power rails on the B2B connectors are distributed to the on-board DCDC converters, which power up further DCDC converters and the particular on-board voltages:

Figure 11: Power Distribution Diagram

Power-On Sequence Diagram

The TE0808 SoM meets the recommended criteria to power up the Xilinx Zynq Ultrascale+ MPSoC properly by keeping a specific sequence of enabling the on-board DCDC converters dedicated to the particular Power Domains and powering up the on-board voltages.

The on-board voltages of the TE0808 SoM will be powered-up in order of a determined sequence by activating the above-mentioned power rails and the Enable-Signals of the DCDC converters. The on-board voltages will be powered up at three steps.

1. Low-Power Domain (LPD) and on-board Si5345A programmable clock generator supply voltage
2. Programmable Logic (PL) and Full-Power Domain (FPD)
3. GTH, PS GTR transceiver and DDR memory

Hence, those three power instances will be powered up consecutively and the Power-Good-Signals of the previous instance has to be asserted.

Following diagram clarifies the sequence of enabling the three power instances utilizing the DCDC converter control signals ('Enable', 'Power-Good'), which will power-up in descending order as listed in the blocks of the diagram.

Figure 12: Power-On Sequence Utilizing DCDC Converter Control Signals

Core voltages and main supply voltages have to reach stable state and their "Power Good"-signals have to be asserted before other voltages like bank's I/O voltages (VCCOx) can be powered up.

It is important that all PS and PL I/Os are tri-stated at power-on until the "Power Good"-signals are high, meaning that all on-module voltages have become stable and module is properly powered up.

See Xilinx datasheet DS925 for additional information. User should also check related base board documentation when intending base board design for TE0808 SoM.

Power Rails

Table 17: Power rails of the MPSoC module on accessible connectors

B2B connectors

Technical Specifications

Absolute Maximum Ratings

Recommended Operating Conditions

Operating Temperature Ranges

Commercial grade: 0°C to +70°C.

Industrial grade: -40°C to +85°C.

Extended grade: 0°C to +85°C.

The module operating temperature range depends also on customer design and cooling solution. Please contact us for options.

Physical Dimensions

• Module size: 52 mm × 76 mm.  Please download the assembly diagram for exact numbers

• Mating height with standard connectors: 4mm

• PCB thickness: 1.6mm

• Highest part on PCB: approx. 3mm. Please download the step model for exact numbers

All dimensions are given in millimeters.

Revision History

Hardware Revision History

Hardware revision number is written on the PCB board together with the module model number separated by the dash.

Document Change History

Disclaimer