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Table of Contents |
Overview
The Trenz Electronic TE0xxx-xx ... is an industrial-grade ... module ... based on Xilinx ..TEP0003 is is a BEMF (Back Electromagnetic Field) based drive. It can be used in many low cost drives where no low speed operation is needed.
Refer to http://trenz.org/tec0850tep0003-info for the current online version of this manual and other available documentation.
Key Features
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Note: 'description: Important components and connector or other Features of the module → please sort and indicate assembly options Key Features' must be split into 6 main groups for modues: - SoC/FPGA
- Package:
- Speed:
- Temperature:
- RAM/Storage
- On Board
- Interface
- E.g. ETH, USB, B2B, Display port
- Power
- E.g. Input supply voltage
- Dimension
Key Features' must be split into 6 main groups for carrier: - Modules
- TE0808, TE807, TE0803,...
- RAM/Storage
- On Board
- Interface
- E.g. ETH, USB, B2B, Display port
- Power
- E.g. Input supply voltage
- Dimension
|
- Modules/ SoC FPGA
- RAM/Storage
- E.g. SDRAM, SPI
- On Board
- Interface
- E.g. ETH, USB, B2B, Display port
- Power
- E.g. Input supply voltage
- Dimension
- On Board
- 2x A2D Converters
- 3x Current Sensors
- 6x Power Stages
- Interface
- 2x Pmod Pin Headers (2x6 Pol)
- Power
- 3.3V supply voltage from Pmods
- Dimension
Block Diagram
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anchor | Figure_OV_BD |
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title | TExxxx TEP0003 block diagram |
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Main Components
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Main Components
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Notes : |
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Notes : - Picture of the PCB (top and bottom side) with labels of important components
- Add List below
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anchor | Figure_OV_MC |
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title | TExxxx TEP0003 main components |
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- ...
- ...
- ...
Initial Delivery State
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Notes : Only components like EEPROM, QSPI flash can be initialized by default at manufacture. If there is no components which might have initial data ( possible on carrier) you must keep the table empty |
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anchor | Table_OV_IDS |
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title | Initial delivery state of programmable devices on the module |
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- Pmod Pin Header, J1
- Pmod Pin Header, J2
- Synchronous DC/DC Converter, U7
- Power Stages, U1...U6
- Current Sensors, U18, U21, U46
- ADC, U22, U47
- Terminal Block, J3
- Terminal Block, J4
- Low-Power Push-Pull Output Comparator, U9
Initial Delivery Stat
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Notes : Only components like EEPROM, QSPI flash can be initialized by default at manufacture. If there is no components which might have initial data ( possible on carrier) you must keep the table empty |
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anchor | Table_OV_IDS |
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title | Initial delivery state of programmable devices on the module |
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Storage device name
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Content
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Notes
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Quad SPI Flash
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Configuration Signals
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- Overview of Boot Mode, Reset, Enables.
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anchor | Table_OV_BP |
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title | Boot process. |
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MODE Signal State | Boot Mode |
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Storage device name | Content | Notes |
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--
| -- | -- |
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Configuration Signals
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- Overview of Boot Mode, Reset, Enables.
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anchor | Table_OV_RST |
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title | Reset process. |
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Signal | B2B | I/O | Note
Signals, Interfaces and Pins
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Notes : - For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
- For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
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Board to Board (B2B) I/Os
Pmod Connectors
TEP0003 is equipped with two Pmod Connectors. FPGA bank number and number of I/O signals connected to the B2B connector:
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anchor | Table_SIP_B2B |
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title | General PL I/O to B2B connectors information |
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FPGA BankB2B Connector | I/O Signal Count | Voltage Level | Notes | |
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JTAG access to the TExxxx SoM through B2B connector JMX.
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anchor | Table_SIP_JTG |
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title | JTAG pins connection |
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Schematic | Notes |
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Pmod, J1 | Pmod, J2 |
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1 | PWM_CH0 | ADC_CH |
| 2 | PWM_CH1 | ADC_SCK |
| 3 | PWM_CH2 | ADC_CS |
| 4 | - | SENSOR_FAUL |
| 5 | GND | GND |
| 6 | 3.3V | 3.3V |
| 7 | COMP_CH0 | ADC0_DO |
| 8 | COMP_CH1 | ADC1_DO |
| 9 | COMP_CH2 | - |
| 10 | - | - |
| 11 | GND | GND |
| 12 | 3.3V | 3.3V |
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Terminal blocks
The TEP0002 is equipped with two Terminal Blocks J3 and J4.
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JTAG Signal
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B2B Connector
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MIO Pins
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you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.
Example:
MIO Pin | Connected to | B2B | Notes |
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MIO12...14 | SPI_CS , SPI_DQ0... SPI_DQ3 SPI_SCK | J2 | QSPI |
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anchor | Table_OBPSIP_MIOsTerBlk |
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title | MIOs pinsTerminal Blocks information |
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MIO Pin | Connected to | B2B | Pin | Schematic | Notes |
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J3 | 1 | DRV_CH2 | ARK500-3 | 2 | DRV_CH1 | ARK500-3 | 3 | DRV_CH0 | ARK500-3 | J4 | 1 | DC_IN | ARK500-2 | 2 | GND | ARK500-2 | Notes
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On-board Peripherals
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Notes : - add subsection for every component which is important for design, for example:
- Two 100 Mbit Ethernet Transciever PHY
- USB PHY
- Programmable Clock Generator
- Oscillators
- eMMCs
- RTC
- FTDI
- ...
- DIP-Switches
- Buttons
- LEDs
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anchor | Table_OBP |
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title | On board peripherals |
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Chip/Interface | Designator | Notes |
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Quad SPI Flash Memory
...
Notes :
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Analog to Digital Converters
The TEP0003 has two ADCs, U22 and U47.
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anchor | Table_OBP_SPIADC |
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title | Quad SPI interface MIOs and pinsAnalog Digital Converter |
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MIO Pin | Schematic | U?? PinConnected to |
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ADC, U22 | ADC, U47 | Notes |
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anchor | Table_OBP_RTC |
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title | I2C interface MIOs and pins |
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sortDirection | ASC |
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repeatTableHeaders | default |
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cellHighlighting | true |
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MIO Pin | Schematic | U? Pin | Notes |
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anchor | Table_OBP_I2C_RTC |
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title | I2C Address for RTC |
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orientation | portrait |
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repeatTableHeaders | default |
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MIO Pin | I2C Address | Designator | Notes |
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5V |
| REF | 5V | 5V |
| AIN0+ | U18 (VIOUT) | DC_IN |
| AIN0- | GND | GND |
| AIN1+ | U21 (VIOUT) | U46 (VIOUT) |
| AIN1- | GND | GND |
| REFGND | GND | GND |
| DVDD | 3.3V | 3.3V |
| SCLK | ADC_SCK | ADC_SCK | Access via Pmod, J2 | SDO | ADC1_DO | ADC0_DO | Access via Pmod, J2 | CS | ADC_CS | ADC_CS | Access via Pmod, J2 | CH_SEL | ADC_CH | ADC_CH | Access via Pmod, J2 | PDEN | GND | GND |
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Power and Power-On Sequence
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In 'Power and Power-on Sequence' section there are three important digrams which must be drawn: - Power on-sequence
- Power distribution
- Voltage monitoring circuit
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Power Supply
TEP0003 will be power supplied through 3.3V from Pmods, J1 and J2.
Power Consumption
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anchor | Table_OBP_EEP |
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title | I2C EEPROM interface MIOs and pins |
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orientation | portrait |
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sortDirection | ASC |
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repeatTableHeaders | default |
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style | widths | sortByColumn | 1 |
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sortEnabled | false |
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cellHighlighting | true |
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MIO Pin | Schematic | U?? Pin | Notes |
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Scroll Title |
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anchor | Table_OBPPWR_I2C_EEPROMPC |
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title | I2C address for EEPROMPower Consumption |
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orientation | portrait |
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sortDirection | ASC |
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repeatTableHeaders | default |
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style | |
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widths | |
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sortByColumn | 1 |
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sortEnabled | false |
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cellHighlighting | true |
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MIO I2C Address | Designator | Notes | |
...
* TBD - To Be Determined
Power Distribution Dependencies
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anchor | TableFigure_OBPPWR_LEDPD |
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title | On-board LEDsPower Distribution |
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tablelayoutorientationportraitsortDirectionASCrepeatTableHeadersdefaultstylewidthssortByColumn1sortEnabledfalse |
cellHighlighting | true |
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Designator | Color | Connected to | Active Level | Note |
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DDR3 SDRAM
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Notes : Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3) |
The TE???? SoM has ??? GByte volatile DDR3 SDRAM IC for storing user application code and data.
- Part number:
- Supply voltage:
- Speed:
- NOR Flash
- Temperature:
Ethernet
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anchor | Table_OBP_ETH |
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title | Ethernet PHY to Zynq SoC connections |
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CAN Transceiver
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anchor | Table_OBP_CAN |
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title | CAN Tranciever interface MIOs |
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anchor | Table_OBP_CLK |
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title | Osillators |
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Power and Power-On Sequence
...
In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:
- Power on-sequence
- Power distribution
- Voltage monitoring circuit
Note |
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For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" . |
Power Supply
Power supply with minimum current capability of xx A for system startup is recommended.
Power Consumption
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anchor | Table_PWR_PC |
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title | Power Consumption |
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...
* TBD - To Be Determined
Power Distribution Dependencies
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anchor | Figure_PWR_PD |
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title | Power Distribution |
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diagramName | TEP0003_PWR_PD |
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simpleViewer | false |
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width | |
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links | auto |
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tbstyle | hidden |
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diagramWidth | 641 |
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Power-On Sequence
There is no specific power on sequence, after power on all electrical components will be enabled.
Power Rails
Power-On Sequence
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anchor | Figure_PWR_PS |
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title | Power Sequency |
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Voltage Monitor Circuit
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anchor | Figure_PWR_VMC |
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title | Voltage Monitor Circuit |
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Power Rails
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anchor | Table_PWR_PR |
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title | Module power rails. |
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B2B Connector
JM1 Pin
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B2B Connector
JM2 Pin
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B2B Connector
JM3 Pin
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Bank Voltages
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anchor | Table_PWR_BV |
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title | Zynq SoC bank voltages. |
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| Scroll Table Layout |
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orientation | portrait |
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sortDirection | ASC |
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repeatTableHeaders | default |
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style | widths | sortByColumn | 1 |
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sortEnabled | false |
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cellHighlighting | true |
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| Schematic Name | | Notes |
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...
...
use "include page" macro and link to the general B2B connector page of the module series,
...
? x ? modules use two or three Samtec Micro Tiger Eye Connector on the bottom side.
3 x REF-??????? (compatible to ????????), (?? pins, ?? per row)
PR | title | Module power rails. |
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orientation | portrait |
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sortDirection | ASC |
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repeatTableHeaders | default |
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style | |
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widths | |
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sortByColumn | 1 |
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sortEnabled | false |
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cellHighlighting | true |
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Power Rail Name | Pmod J1 Pin | Pmod J2 Pin | Notes |
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3.3V | 6,12 | 6,12 |
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...
Technical Specifications
Absolute Maximum Ratings
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anchor | Table_TS_AMR |
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title | PS absolute maximum ratings |
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orientation | portrait |
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sortDirection | ASC |
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repeatTableHeaders | default |
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style | |
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sortByColumn | 1 |
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sortEnabled | false |
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cellHighlighting | true |
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Symbols | Description | Min | Max | Unit |
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V | 3.3V | Supply Voltage | -0.3 | 6.5 | VV | T_STG | Storage Temperature | -40 | 105 | °C |
V | V | V | V
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Recommended Operating Conditions
Operating temperature range depends also on customer design and cooling solution. Please contact us for options.
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anchor | Table_TS_ROC |
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title | Recommended operating conditions. |
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orientation | portrait |
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sortDirection | ASC |
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repeatTableHeaders | default |
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sortEnabled | false |
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cellHighlighting | true |
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Parameter | Min | Max | Units | Reference Document |
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V | See ???? datasheets. | V | See Xilinx ???? datasheet. | V | See Xilinx ???? datasheet. | V | See Xilinx ???? datasheet. | V | See Xilinx ???? datasheet. | V | See Xilinx ???? datasheet. | V | See Xilinx ???? datasheet. | °C | See Xilinx ???? datasheet. | |
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3.3V | 3.0 | 4.2 | V | Supplied from Pmod | T_OPR | -30 | +105 | °C | See ARK500-3 and ARK500-2 Datasheet |
°C | See Xilinx ???? datasheet.
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Physical Dimensions
Module size: ?? 40 mm × ?? 40 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: ? mm.
PCB thickness: ?? 1.6 mm.
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In 'Physical Dimension' section, top and bottom view of module must be inserted, information regarding physical dimensions can be obtained through webpage for product in Shop.Trenz, (Download> Documents> Assembly part) for every SoM. For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below: https://www.trenz-electronic.de/fileadmin/docs/Trenz_Electronic/Modules_and_Module_Carriers/5.2x7.6/TE0745/REV02/Documents/AD-TE0745-02-30-1I.PDF
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Scroll Title |
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anchor | Figure_TS_PD |
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title | Physical Dimension |
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_TS_PD | title | Physical Dimension |
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draw.io Diagram |
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border | false |
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fitWindow | false |
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diagramDisplayName | |
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lbox | true |
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revision | 1 |
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diagramName | TEP0006_TS_PD |
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simpleViewer | false |
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width | |
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links | auto |
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tbstyle | hidden |
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diagramWidth | 641 |
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scroll-office | true |
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scroll-chm | true |
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scroll-docbook | true |
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scroll-eclipsehelp | true |
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scroll-epub | true |
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scroll-html | true |
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| image link to the generate DrawIO PNG file of this page. This is a workaround until scroll pdf export bug is fixedImage Added |
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Currently Offered Variants
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Set correct link to the shop page overview table of the product on English and German. Example for TE0728: ENG Page: https://shop.trenz-electronic.de/en/Products/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/ DEU Page: https://shop.trenz-electronic.de/de/Produkte/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/ For Baseboards or modules, where no overview page is available (and revision number is coded in the direct link) use shop search link, e.g. TE0706: ENG Page: https://shop.trenz-electronic.de/en/search?sSearch=TE0706 DEU Page: https://shop.trenz-electronic.de/de/search?sSearch=TE0706 |
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anchor | Table_VCP_SO |
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title | Trenz Electronic Shop Overview |
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orientation | portrait |
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sortDirection | ASC |
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repeatTableHeaders | default |
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style | |
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widths | |
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sortByColumn | 1 |
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sortEnabled | false |
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cellHighlighting | true |
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Revision History
Hardware Revision History
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anchor | Table_RH_HRH |
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title | Hardware Revision History |
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orientation | portrait |
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sortDirection | ASC |
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repeatTableHeaders | default |
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sortByColumn | 1 |
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sortEnabled | false |
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cellHighlighting | true |
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Date | Revision | Changes | Documentation Link | Revision | Changes | Documentation Link |
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2018-07-18 | 01 | | REV01 | - |
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Hardware revision number can be found on the PCB board together with the module model number separated by the dash.
Scroll Title |
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anchor | Figure_RV_HRN |
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title | Board hardware revision number. |
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draw.io Diagram |
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border | false |
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viewerToolbar | true |
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fitWindow | false |
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diagramDisplayName | |
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lbox | true |
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revision | 2 |
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diagramName | TEP0006_RV_HRN |
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simpleViewer | false |
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width | |
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links | auto |
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tbstyle | hidden |
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diagramWidth | 149 |
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anchor | Figure_RV_HRN |
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title | Board hardware revision number. |
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Document Change History
Page properties |
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- Note this list must be only updated, if the document is online on public doc!
- It's semi automatically, so do following
Add new row below first Copy "Page Information Macro(date)" Macro-Preview, Metadata Version number, Author Name and description to the empty row. Important Revision number must be the same as the Wiki document revision number Update Metadata = "Page Information Macro (current-version)" Preview+1 and add Author and change description. --> this point is will be deleted on newer pdf export template - Metadata is only used of compatibility of older exports
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anchor | Table_RH_DCH |
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title | Document change history. |
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orientation | portrait |
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sortDirection | ASC |
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repeatTableHeaders | default |
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style | |
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widths | |
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sortByColumn | 1 |
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sortEnabled | false |
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cellHighlighting | true |
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Date | Revision | Contributor | Description |
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Page info |
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infoType | Modified date |
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dateFormat | yyyy-MM-dd |
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type | Flat |
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| Page info |
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infoType | Current version |
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prefix | v. |
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type | Flat |
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showVersions | false |
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| Page info |
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infoType | Modified by |
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type | Flat |
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showVersions | false |
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| | -- | all | Page info |
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infoType | Modified users |
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type | Flat |
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showVersions | false |
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| |
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Disclaimer
Include Page |
---|
| IN:Legal Notices |
---|
| IN:Legal Notices |
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|
...