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Overview

Refer to https://wiki.trenz-electronic.de/display/PD/TE0715+TRM for online version of this manual and the rest of available documentation.

The Trenz Electronic TE0715 is an industrial-grade SoM (System on Module) based on Xilinx Zynq-7000 SoC (XC7Z015 or XC7Z030) with 1GByte of DDR3 SDRAM, 32MBytes of SPI Flash memory, Gigabit Ethernet PHY transceiver, a USB PHY transceiver and powerful switching-mode power supplies for all on-board voltages. A large number of configurable I/Os is provided via rugged high-speed stacking strips.

Key Features

• Industrial-grade Xilinx Zynq-7000 SoC (XC7Z015, XC7Z030)

• Rugged for shock and high vibration
• 2 × ARM Cortex-A9
• 10/100/1000 Mbps Ethernet transceiver PHY
• MAC address EEPROM
• 32-bit wide 1GB DDR3 SDRAM
• 32 MByte quad SPI Flash memory
• Programmable clock generator
  • Transceiver clock

Overview

The Trenz Electronic TE0715 is an industrial-grade System-on-Chip (SoC) module integrating a Xilinx Zynq-7000 SoC, a gigabit Ethernet transceiver, 1 gigabyte DDR3 SDRAM, 32 megabyte Flash memory, 4 GTP/GTX transceivers, a USB ULPI transceiver and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/Os is provided via rugged high-speed stacking strips. All modules in 4 x 5 cm form factor are mechanically compatible.

All this on a tiny footprint, smaller than a credit card, at the most competitive price.

Block diagram

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Board Components

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Main Components:

1. Zynq-7000 All Programmable SoC

2. System Controller CPLD

3. Programmable clock generator

4. 10/100/1000 Mbps Ethernet PHY

5. DDR3-SDRAM

6. Hi-Speed USB 2.0 ULPI Transceiver

7. B2B-Connector

   1. JM1

   2. JM2

   3. JM3

Key Features

...

Industrial-grade Xilinx Zynq-7000 (Z-7015, Z-7030) SoM

...

• • (default 125 MHz)
• Plug-on module with 2 × 100-pin and 1 × 60-pin high-speed hermaphroditic strips
• 132 FPGA I/Os (65 LVDS pairs possible) and 14 PS MIO available on

...

• B2B connectors
• 4 GTP/GTX (high-performance transceiver) lanes
  • GTP/GTX (high-performance transceiver) clock input
• USB 2.0 high-speed ULPI transceiver
• On-board high-efficiency DC-DC converters
  • 4 A x 1.0 V power rail
  • 3 A x 1.0 V power rail
  • 3 A x 1.

...

• • 2 V power rail
  • 3 A x 1.

...

• • 35 V power rail

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• • 3 A x 1.8 V power rail
• System management
• eFUSE bit-stream encryption
• AES bit-stream encryption
• Temperature compensated RTC (real-time clock)
• User LED
• Evenly-spread supply pins for good signal integrity

...

Additional assembly options are available for cost or performance optimization

...

upon request.

Signals, Interfaces and Pins

Processing System (PS) Peripherals

Default MIO mapping:

I2C Interface

The on-board I2C components are connected to MIO48 and MIO49 and configured as I2C1 by default.

I2C addresses for on-board components:

B2B I/O

Number of I/O's connected to the SoC's I/O bank and B2B connector: 

 For detailed information about the pinout, please refer to the Master Pinout Table.

JTAG

JTAG access to the Xilinx Zynq-7000 device is provided through connector JM2. 

Peripherals

LED's

There are 3 LED's on TE0715:

Ethernet

The TE0715 is populated with a Marvell Alaska 88E1512 Gigabit Ethernet PHY. The Ethernet PHY RGMII Interface is connected to the Zynq Ethernet0 PS GEM0. The I/O Voltage is fixed at 1.8V for HSTL signaling. 

SGMII (SFP copper or fiber) can be used directly with the Ethernet PHY, as the SGMII pins are available on the B2B connector JM3.

The reference clock input of the PHY is supplied from an onboard 25MHz oscillator (U9), the 125MHz output clock is connected to IN5 of the PLL chip (U10).  

PHY connection:

Note: LED1 is connected to PL via level-shifter implemented in system controller CPLD.

USB

The USB PHY USB3320 from Microchip is used on the TE0715. The ULPI interface is conected to the Zynq PS USB0. The I/O Voltage is fixed at 1.8V.

The reference clock input of the PHY is supplied from an onboard 52MHz oscillator (U15).  

PHY connection:

The schematic for the USB connector and required components is different depending on the USB usage. USB standard A or B connectors can be used for Host or Device modes. A Mini USB connector can be used for USB Device mode. A USB Micro connector can be used for Device mode, OTG Mode or Host Mode.

RTC

An Intersil temperature compensated real time clock IC ISL12020M is used for timekeeping (U16). Battery voltage must be supplied to the module from the main board.

Battery backed registers are accessed at I2C slave address 0x6F.

General purpose RAM is accessed at I2C slave address 0x57.

This RTC IC is supported in Linux so it can be used as hwclock device.

PLL

A Silicon Labs I2C-programmable clock generator Si5338A (U10) is populated on the module. The Si5338 can be programmed using the I2C-bus, to change the frequency on its outputs. It is accessible on the I2C slave address 0x70.

PLL connection:

MAC-Address EEPROM

A Microchip 24AA025E48 EEPROM (U19) is used on the TE0715. It has a globally unique 48-bit node address, that is compatible with EUI-48(TM) and EUI-64(TM). The device is organized as two blocks of 128 x 8-bit memory. One of the blocks stores the 48-bit node address and is write protected, the other block is available for application use. It is accessible through the I2C slave address 0x50.

Power

For startup, a power supply with minimum current capability of 3A is recommended.

Power Supplies

Bank Voltages

System Controller I/O Pins

Special purpose pins used by TE0720 are also available on TE0715 they are connected to smaller System Controller CPLD and have different or no function in default configuration.

Bootmodes

By default the TE-0715 supports QSPI and SD bootmodes.

Two bootmodes are controlled by the MODE signal on the board to board (B2B) connector:

Clocking

Initial Delivery state

Hardware Revision History

Technical Specification

Absolute Maximum Ratings

 Physical Dimensions

• Module size: 50 mm × 40 mm.  Please download the assembly diagram for exact numbers.

• Mating height with standard connectors: 8mm

• PCB thickness: 1.6mm

• Highest part on PCB: approx. 2.5mm. Please download the step model for exact numbers.

All dimensions are shown in mm.

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 Temperature Ranges

Commercial grade modules

All parts are at least commercial temperature range of 0°C to +70°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Industrial grade moduels

All parts are at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Weight

Disclaimer

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 Document Change History

Block Diagram

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Figure 1: TE0715 block diagram.

Main Components

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Figure 2: TE0715 main components.

• 1. Xilinx Zynq-7000 all programmable SoC, U5
• 2. System Controller CPLD, U26
• 3. Programmable quad clock generator , U10
• 4. 10/100/1000 Mbps Ethernet PHY, U7
• 5. 2 x 4-Gbit DDR3L SDRAM (1.35 V), U12 and U13
• 6. Hi-speed USB 2.0 ULPI transceiver, U6
  
• 7a. B2B connector Samtec Razor Beam™ LSHM-150, JM1
• 7b. B2B connector Samtec Razor Beam™ LSHM-150, JM2
• 7c. B2B connector Samtec Razor Beam™ LSHM-130, JM3
• 8. 32-MByte quad SPI Flash memory, U14
• 9. Low-power RTC with battery backed SRAM, U16
• 10. 4A PowerSoC DC-DC converter, U1
• 11. Green LED (DONE), D2
• 12. Red LED (SC), D3
• 13. Green LED (MIO7), D4
• 14. 2-bit bidirectional 1-MHz I²C bus voltage-level translator, U20

Initial Delivery State

Table 1: Initial delivery state of programmable devices on the module.

Boot Process

By default the TE-0715 supports quad SPI and SD Card boot modes which is controlled by the MODE input signal from the B2B JM1 connector.

Table 2: Boot MODE signal description.

Signals, Interfaces and Pins

Board to Board (B2B) I/Os

I/O signals connected to the SoC's I/O bank and B2B connector: 

Table 3: General overview of board to board I/O signals.

For detailed information about the pin-out, please refer to the Pin-out Table. 

MGT Lanes

MGT (Multi Gigabit Transceiver) lane consists of one transmit and one receive (TX/RX) differential pairs, four signals total per one MGT lane. Following table lists lane number, MGT bank number, transceiver type, signal schematic name, board-to-board connector connection and Zynq SoC pin connection:

Table 4: MGT lanes overview.

Below are listed MGT bank reference clock sources.

Table 5: MGT reference clock sources.

JTAG Interface

JTAG access to the Xilinx Zynq SoC is provided through B2B connector JM2. 

Table 6: JTAG interface signals.

System Controller CPLD I/O Pins

Special purpose pins are connected to System Controller CPLD and have following default configuration:

Table 7: System Controller CPLD I/O pins.

Quad SPI Interface

Quad SPI Flash (U14) is connected to the Zynq PS QSPI0 interface via PS MIO bank 500, pins MIO1 ... MIO6.

Table 8: Quad SPI interface signals and connections.

SD Card Interface

SD Card interface is connected form the Zynq SoC's PS MIO bank 501 to the B2B connector JM1, signals MIO40 .. MIO45.

Ethernet Interface

On-board Gigabit Ethernet PHY is provided with Marvell Alaska 88E1512 IC (U7). The Ethernet PHY RGMII interface is connected to the Zynq Ethernet0 PS GEM0. I/O voltage is fixed at 1.8V for HSTL signalling. SGMII (SFP copper or fiber) can be used directly with the Ethernet PHY, as the SGMII pins are available on the B2B connector JM3. The reference clock input of the PHY is supplied from an on-board 25.000000 MHz oscillator (U9), the 125MHz output clock signal CLK_125MHZ is connected to the IN5 pin of the PLL chip (U10).

Ethernet PHY connection

Table 9: Ethernet interface.

USB Interface

USB PHY is provided by USB3320 from Microchip. The ULPI interface is connected to the Zynq PS USB0. The I/O Voltage is fixed at 1.8V. The reference clock input of the PHY is supplied from an on-board 52.000000 MHz oscillator (U15).

USB PHY connection

Table 10: USB interface.

The schematics for the USB connector and required components is different depending on the USB usage. USB standard A or B connectors can be used for host or device modes. A mini-USB connector can be used for USB device mode. A micro-USB connector can be used for device mode, OTG mode or host mode.

I2C Interface

On-board I²C devices are connected to the Zynq SoC's PS bank 501 MIO48 (SCL) and MIO49 (SDA) which is configured as I2C1 by default. As bank 501 VCC_MIO1_501 is fixed to 1.8V, there is a bi-directional voltage-level translator used to connect 3.3V I²C slave devices to the bus. Table below lists I²C slave device addresses and functions:

Table 11: Slave devices connected to the I²C interface.

On-board Peripherals

System Controller CPLD

The System Controller CPLD (U26) is provided by Lattice Semiconductor LCMXO2-256HC (MachXO2 product family). It is the central system management unit with module specific firmware installed to monitor and control various signals of the FPGA, on-board peripherals, I/O interfaces and module as a whole.

DDR Memory

TE0715 module has up to 1 GBytes of DDR3L SDRAM arranged into 32-bit wide memory bus. Different memory sizes are available optionally.

Quad SPI Flash Memory

On-board quad SPI Flash memory S25FL256S (U14) is used to store initial FPGA configuration. Besides FPGA configuration, remaining free flash memory can be used for user application and data storage. All four SPI data lines are connected to the FPGA allowing x1, x2 or x4 data bus widths. Maximum data rate depends on the selected bus width and clock frequency used.

Gigabit Ethernet PHY

On-board Gigabit Ethernet PHY (U7) is provided with Marvell Alaska 88E1512. The Ethernet PHY RGMII interface is connected to the Zynq SoC's PS bank 501 pins MIO16 .. MIO27. Reference clock input of the PHY is supplied from the on-board 25.000000 MHz oscillator (U9), the 125MHz output clock signal CLK_125MHZ is connected to the programmable clock generator (U10) pin IN5.

High-speed USB ULPI PHY

Hi-speed USB ULPI PHY (U6) is provided with USB3320 from Microchip. The ULPI interface is connected to the Zynq SoC's PS bank 501 pins MIO28 .. 39. Reference clock input is supplied from the on-board 52.000000 MHz oscillator (U15).

MAC Address EEPROM

A Microchip 24AA025E48 EEPROM (U19) is used which contains a globally unique 48-bit node address compatible with EUI-48TM specification. The device is organized as two blocks of 128 x 8-bit memory. One of the blocks stores the 48-bit node address and is write protected, the other block is available for application use. It is accessible through the I²C slave device address 0x50.

RTC - Real Time Clock

An temperature compensated Intersil ISL12020M is used for Real Time Clock (U16). Battery voltage must be supplied to the module from the baseboard. Battery backed registers can be accessed over I²C bus at slave address of 0x6F. General purpose RAM is at I²C slave address 0x57. RTC IC is supported by Linux so it can be used as hwclock device.

Programmable Clock Generator

There is a Silicon Labs programmable clock generator Si5338A (U10) chip on the module. It's output frequencies can be programmed via the I²C bus, slave device address is 0x70.

Table 12: Programmable clock generator I/Os.

Oscillators

The module has following reference clock signals provided by on-board oscillators:

Table 13: Reference clock signals.

On-board LEDs

Table 14: On-board LEDs.

Power and Power-On Sequence

Power Consumption

Power supply with minimum current capability of 3A for system startup is recommended. Maximum power consumption of a module mainly depends on the design running on the FPGA. Xilinx provides power estimator excel sheets to calculate power consumption. It is also possible to evaluate the power consumption of the design with Vivado. See also Trenz Electronic Wiki FAQ.

Table 15: Typical power consumption.

Power Distribution Dependencies

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Figure 3: Module power distribution diagram.

Power-On Sequence

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Figure 4: TE0820-02 power-on sequence diagram.

For highest efficiency of the on-board DC-DC regulators, it is recommended to use same 3.3V power source for both VIN and 3.3VIN power rails. Although VIN and 3.3VIN can be powered up in any order, it is recommended to power them up simultaneously.

See Xilinx datasheet DS187 (for XC7Z015) or DS191 (for XC7Z030) for additional information. User should also check related baseboard documentation when choosing baseboard design for TE0715 module.

Power Rails

Table 16: TE0715 power rails.

Bank Voltages

Table 17: TE0715 bank voltages.

Board to Board Connectors

Variants Currently in Production

Table 18: TE0715 variants currently in production.

Technical Specifications

Absolute Maximum Ratings

Table 19: TE0715 module absolute maximum ratings.

Recommended Operating Conditions

Table 20: TE0715 module recommended operating conditions.

Operating Temperature Ranges

Commercial grade: 0°C to +70°C.

Industrial and extended grade: -40°C to +85°C.

The module operating temperature range depends also on customer design and cooling solution. Please contact us for options.

Physical Dimensions

• Module size: 50 mm × 40 mm.  Please download the assembly diagram for exact numbers

• Mating height with standard connectors: 8mm

• PCB thickness: 1.6mm

• Highest part on PCB: approx. 2.5mm. Please download the step model for exact numbers

 All dimensions are given in millimeters.

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Figure 5: TE0715 physical dimensions.

Revision History

Hardware Revision History

Table 21: TE0715 module hardware revision history.

Hardware revision number is printed on the PCB board together with the module model number separated by the dash.

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Figure 6: TE0715 hardware revision number.

Document Change History

Table 22: Document change history.

Disclaimer

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date

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revision

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authors

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description

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2016-03-31

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