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Table of Contents

Table of Contents
maxLevel5

Overview

 

Scroll Only (inline)
On https://wiki.trenz-electronic.de/display/PD/TE0715 the onlineOnline version of this manual and other related documents can be found at https://wiki.trenz-electronic.de/display/PD/TE0715
 

The Trenz Electronic TE0715 is an industrial-grade SoM (System on Module) based on Xilinx Zynq-7000 SoC (

...

XC7Z015 or

...

XC7Z030)

...

with 1GB of DDR3 SDRAM, 32MB of SPI flash memory, gigabit Ethernet PHY transceiver

...

, a USB PHY transceiver and powerful

...

switching-mode power supplies for all on-board voltages. A large number of configurable I/Os is provided via rugged high-speed stacking strips.

...

 

Block diagram

Image RemovedImage Added

...

Main components

Image Removed                     Image Removed          

 

Main Components:

...

Zynq-7000 All Programmable SoC

...

System Controller CPLD

...

Programmable clock generator

Image Added Image Added

   1. Zynq-7000 all programmable SoC.

   2. System controller CPLD.

   3. Programmable clock generator.

   4. 10/100/1000 Mbps

...

Ethernet PHY.

   5. DDR3-SDRAM.

   6. Hi-Speed USB 2.0 ULPI

...

transceiver.

...

B2B-Connector

  1. JM1

  2. JM2

  3. JM3

   7a. B2B connector JM1.

   7b. B2B connector JM2.

   7c. B2B connector JM3.

   8. 256 Mbit (32 Mbyte) 3.0V SPI flash memory.

   9. Low power RTC with battery backed SRAM.

   10. PowerSoC DC-DC converter.

Key features

...

  • Industrial-grade Xilinx Zynq-7000 (

...

  • XC7Z015, XC7Z030) SoM

  • Rugged for shock and high vibration
  • 2 × ARM Cortex-A9
  • 10/100/1000 tri-speed gigabit Ethernet transceiver PHY
  • MAC

...

  • address EEPROM
  • 32-Bit wide

...

  • 1GB DDR3 SDRAM
  • 32 MByte QSPI

...

  • flash memory
  • Programmable

...

  • clock generator
    • Transceiver

...

    • clock (default 125 MHz)
  • Plug-on module with 2 × 100-pin and 1 × 60-pin high-speed hermaphroditic strips
  • 132 FPGA I/Os (65 LVDS pairs possible) and 14 PS MIO available on

...

  • B2B connectors
  • 4 GTP/GTX (high-performance transceiver) lanes
    • GTP/GTX (high-performance transceiver) clock input
  • USB 2.0 high-speed ULPI transceiver
  • On-board high-efficiency DC-DC converters
    • 4.0 A x 1.0 V power rail
    • 1.5 A x 1.5 V power rail
    • 1.5 A x 1.8 V power rail
  • System management
  • eFUSE bit-stream encryption
  • AES bit-stream encryption
  • Temperature compensated RTC (real-time clock)
  • User LED
  • Evenly-spread supply pins for good signal integrity

...

Additional assembly options are available for cost or performance optimization

...

upon request.

Signals, Interfaces and Pins

System Controller I/O Pins

Special purpose pins used by TE0720 are also available on TE0715 they are connected to smaller System Controller CPLD and have different or no function in default configuration.

NameNote
EN1No hard wired function on PCB, when forced low pulls POR_B low to emulate power on reset
PGOODDriven low by System Controller if power supply power fail detected
NOSEQNo function
RESIN

Active low reset, gated to POR_B

JTAGENLow for normal operation

Boot Modes

By default the TE-0715 supports QSPI and SD boot modes.

Two boot modes are controlled by the MODE signal on the board to board (B2B) connector:

MODE signal

Boot Mode

high or open

SD Card

low or ground

QSPI

JTAG

JTAG access to the Xilinx Zynq-7000 device is provided through connector JM2. 

Signal
B2B Pin
TCKJM2: 99
TDIJM2: 95
TDOJM2: 97
 TMS JM2: 93 

 

Note
JTAGEN pin in JM1 should be kept low or grounded for normal operation.

Clocking

Clock

Frequency

IC

FPGA

Notes

PS CLK

33.3333 Mhz

U11

PS_CLK

PS Subsystem main clock

ETH PHY reference

25 MHz

U9

-

 

USB PHY reference

52 MHz

U15

-

 

PLL reference

25 MHz

U18

-

 

GT REFCLK0

-

B2B

U9/V9

Externally supplied from base

GT REFCLK1

125 Mhz

U10 Si5338

U5/V5

Default clock is 125 MHz

Processing System (PS) Peripherals

 ICDesignatorPS7MIONotes
SPI FlashS25FL256SAGBHI20U14QSPI0MIO1..MIO6 
EEPROM I2C24AA025E48U19I2C1MIO48, MIO49EEPROM for MAC Address
RTCISL2020U16I2C1MIO48, MIO49

Temperature compensated real time clock

RTC InterruptISL2020U16GPIOMIO47Real Time Clock Interrupt
Clock PLLSi5338U10I2C1MIO48, MIO49Low jitter phase locked loop
LED D4GPIOMIO7 
USBUSB3320U6USB0MIO28..MIO39 
USB Reset  GPIOMIO51 
Ethernet88E1512U7ETH0MIO16..MIO27 
Ethernet Reset  GPIOMIO50 

Default MIO mapping:

Initial Delivery State

Storage device name

Content

Notes

24AA025E48 EEPROM

User content not programmed

Valid MAC Address from manufacturer.

SPI Flash OTP Area

Empty, not programmed

Except serial number programmed by flash vendor.

SPI Flash Quad Enable bit

Programmed

-

SPI Flash main array

Demo design

-

EFUSE USER

Not programmed

-

EFUSE Security

Not programmed

-

Interfaces and Pins

Board to Board (B2B) I/O's

I/O signals connected to the SoC's I/O bank and B2B connector: 

BankTypeB2B ConnectorI/O Signal CountVoltageNotes

13

HR

JM1

48

User

-

34

HR/HP

JM2

18

User

1.8V max with XC7Z030!

35

HR/HP

JM2

50

User

1.8V max with XC7Z030!

34

HR/HP

JM3

16

User

1.8V max with XC7Z030!

500

MIO

JM1

8

3.3V

-

501

MIO

JM1

6

1.8V

-

112

GT

JM3

4 Lanes

N/A

-

112

GT CLK

JM3

One Differential Input

N/A

NB! AC coupling capacitors

on baseboard required.

For detailed information about the pin out, please refer to the Master Pinout Table. 

Default MIO Mapping

MIOFunctionB2B PinNotes MIOFunctionB2B PinNotes
0GPIOJM1-87B2B 16..27ETH0-RGMII
1QSPI0-SPI Flash-CS 28..39USB0-ULPI
2QSPI0-SPI Flash-DQ0 40SDIO0JM1-27B2B
3QSPI0-SPI Flash-DQ1 41SDIO0JM1-25B2B
4QSPI0-SPI Flash-DQ2 42SDIO0JM1-23B2B
5QSPI0-SPI Flash-DQ3 43SDIO0JM1-21B2B
6QSPI0-SPI Flash-SCK 44SDIO0JM1-19B2B
7GPIO-Green LED D4 45SDIO0JM1-17B2B
8QSPI0-SPI Flash-SCKFB 46GPIO-

Ethernet PHY LED2

INTn Signal.

9 JM1-91B2B 47GPIO-RTC Interrupt
10 JM1-95B2B 48I2C1-SCL on-board I2C
11 JM1-93B2B 49I2C1-SDA on-board I2C
12 JM1-99B2B 50GPIO-ETH0 Reset
13 JM1-97B2B 51GPIO-USB Reset
14UART0JM1-92B2B 52ETH0-MDC
MIOConfigured asB2BNotes
0GPIOJM1-87B2B
1QSPI0 -SPI Flash-CS
2QSPI0 -SPI Flash-DQ0
3QSPI0 -SPI Flash-DQ1
4QSPI0 -SPI Flash-DQ2
5QSPI0 -SPI Flash-DQ3
6QSPI0 -SPI Flash-SCK
7GPIO -Green LED D4
8QSPI0 -SPI Flash-SCKFB
9 JM1-91 B2B
10 JM1-95 B2B
11 JM1-93 B2B
12 JM1-99 B2B
13 JM1-97 B2B
14UART0JM1-92 B2B
15UART0JM1-85 B2B16..27ETH0 RGMII
28..39USB0 ULPI
40SDIO0JM1-27 B2B
41SDIO0JM1-25 B2B
42SDIO0JM1-23 B2B
43SDIO0JM1-21 B2B
44SDIO0JM1-19 B2B
45SDIO0JM1-17 B2B
46GPIO - Ethernet PHY LED2/INTn Signal
47GPIO -RTC Interrupt
48I2C1 -SCL on-board I2C
49I2C1 -SDA on-board I2C
50GPIO -ETH0 Reset
51GPIO -USB Reset
52ETH0 -MDC

53

ETH0 -MDIO

I2C Interface

The on-board I2C components are connected to MIO48 and MIO49 and configured as I2C1 by default.

I2C addresses for on-board components:

53ETH0-MDIO

Gigabit Ethernet

On board Gigabit Ethernet PHY is provided with Marvell Alaska 88E1512 IC. The Ethernet PHY RGMII Interface is connected to the Zynq Ethernet0 PS GEM0. I/O voltage is fixed at 1.8V for HSTL signaling. SGMII (SFP copper or fiber) can be used directly with the Ethernet PHY, as the SGMII pins are available on the B2B connector JM3. The reference clock input of the PHY is supplied from an onboard 25MHz oscillator (U9), the 125MHz output clock is connected to IN5 of the PLL chip (U10).

Ethernet PHY connection

PHY PinZYNQ PSZYNQ PLNotes
MDC/MDIOMIO52, MIO53--
LED0-J3Can be routed via PL to any free PL I/O pin in B2B connector.
LED1-K8

Can be routed via PL to any free PL I/O pin in B2B connector.

This LED is connected to PL via level-shifter implemented in

system controller CPLD.

LED2/InterruptMIO46--
CONFIG--

By default the PHY address is strapped to 0x00, alternate

configuration is possible.

RESETnMIO50--
RGMIIMIO16..MIO27--
SGMII--on B2B.
MDI--on B2B.

USB Interface

USB PHY is provided by USB3320 from Microchip. The ULPI interface is connected to the Zynq PS USB0. The I/O Voltage is fixed at 1.8V. The reference clock input of the PHY is supplied from an onboard 52MHz oscillator (U15).

USB PHY connection

PHY PinZYNQ PinB2B NameNotes
ULPIMIO28..39-Zynq USB0 MIO pins are connected to the PHY.
REFCLK--52MHz from on board oscillator (U15).
REFSEL[0..2]--Reference clock frequency select, all set to GND selects 52MHz.
RESETBMIO51-Active low reset.
CLKOUTMIO36-Connected to 1.8V, selects reference clock operation mode.
DP, DM-OTG_D_P, OTG_D_NUSB data lines.
CPEN-VBUS_V_ENExternal USB power switch active high enable signal.
VBUS-USB_VBUSConnect to USB VBUS via a series of resistors, see reference schematics.
ID-OTG_IDFor an A-Device connect to ground, for a B-Device left floating.

The schematics for the USB connector and required components is different depending on the USB usage. USB standard A or B connectors can be used for Host or Device modes. A Mini USB connector can be used for USB Device mode. A USB Micro connector can be used for Device mode, OTG Mode or Host Mode.

I2C Interface

On-board I2C devices are connected to MIO48 and MIO49 which are configured as I2C1 by default. I2C addresses for on-board devices are listed in the table below:

I2C-Address
I2C DeviceI2C AdressDeviceNotes
EEPROM0x50 
RTC0x6F 
Battery backed RAM0x57integrated in Integrated into RTC.

PLL

0x70 

B2B I/O

Number of I/O's connected to the SoC's I/O bank and B2B connector: 

Bank

Type

JMx

IO Count

IO Voltage

Notes

13

HR

1

48

User

 

34

HR/HP

2

18

User

1.8V max with Z7030

35

HR/HP

2

50

User

1.8V max with Z7030

34

HR/HP

3

16

User

1.8V max with Z7030

500

MIO

1

8

3.3V

 

501

MIO

1

6

1.8V

 

112

GT

3

4 Lanes

n/a

 

112

GT CLK

3

one differential input

n/a

AC coupling capacitors on base required

 For detailed information about the pin out, please refer to the Master Pinout Table.

Peripherals

LED's

...

JTAG Interface

JTAG access to the Xilinx Zynq-7000 is provided through B2B connector JM2. 

JTAG Signal

B2B Connector Pin

TCKJM2-99
TDIJM2-95
TDOJM2-97
TMSJM2-93 
Note
JTAGEN pin in B2B connector JM1 should be kept low or grounded for normal operation.

System Controller I/O Pins

Special purpose pins are connected to smaller System Controller CPLD and have following default configuration:

Pin NameModeFunctionDefault Configuration
EN1InputPower Enable

No hard wired function on PCB, when forced low pulls POR_B low to

emulate power on reset.

PGOODOutputPower GoodActive high when all on-module power supplies are working properly.
NOSEQ--No function.
RESINInputReset

Active low reset, gated to POR_B.

JTAGENInputJTAG SelectLow for normal operation.

Boot Mode Pin

By default the TE-0715 supports QSPI and SD Card boot modes which is controlled by the MODE input signal from the B2B connector.

MODE Signal State

Boot Mode

high or open

SD Card

low or ground

QSPI

LED's

LEDColorConnected toDescription and Notes

D2

greenGreen

DONE

Inverted Reflects inverted DONE signal, ON when FPGA is not configured

D3

red

SC

Global status LED

D4

green

MIO7

OFF when PS7 not booted and not controlling MIO7 by software, else user controlled

...

OFF

...

as soon as PL is configured.

This LED will not operate if the SC can not power on the 3.3V output

...

Ethernet

The TE0715 is populated with a Marvell Alaska 88E1512 Gigabit Ethernet PHY. The Ethernet PHY RGMII Interface is connected to the Zynq Ethernet0 PS GEM0. The I/O Voltage is fixed at 1.8V for HSTL signaling. 

SGMII (SFP copper or fiber) can be used directly with the Ethernet PHY, as the SGMII pins are available on the B2B connector JM3.

The reference clock input of the PHY is supplied from an on board 25MHz oscillator (U9), the 125MHz output clock is connected to IN5 of the PLL chip (U10).  

PHY connection:

PHY PIN
ZYNQ PS
ZYNQ PL
Notes
MDC/MDIOMIO52, MIO53--
LED0-J3can be routed via PL to any free PL I/O pin in B2B connector
LED1-K8can be routed via PL to any free PL I/O pin in B2B connector
LED2/InterruptMIO46--
CONFIG--By default the PHY Address is strapped to 0x00 alternate configuration is possible
RESETnMIO50--
RGMIIMIO16..MIO27--
SGMII--on B2B
MDI--on B2B

Note: LED1 is connected to PL via level-shifter implemented in system controller CPLD.

USB

The USB PHY USB3320 from Microchip is used on the TE0715. The ULPI interface is connected to the Zynq PS USB0. The I/O Voltage is fixed at 1.8V.

The reference clock input of the PHY is supplied from an on board 52MHz oscillator (U15).  

PHY connection:

PHY Pin
Zynq Pin
B2B Name
Notes
ULPIMIO28..39-Zynq USB0 MIO pins are connected to the PHY
REFCLK--52MHz from on board oscillator (U15)
REFSEL[0..2]--000 GND, select 52MHz reference Clock
RESETBMIO51-Active low reset
CLKOUTMIO36-Connected to 1.8V selects reference clock operation mode
DP,DM-OTG_D_P, OTG_D_NUSB Data lines
CPEN-VBUS_V_ENExternal USB power switch active high enable signal
VBUS-USB_VBUSConnect to USB VBUS via a series resistor. Check reference schematic
ID-OTG_IDFor an A-Device connect to ground, for a B-Device left floating

The schematic for the USB connector and required components is different depending on the USB usage. USB standard A or B connectors can be used for Host or Device modes. A Mini USB connector can be used for USB Device mode. A USB Micro connector can be used for Device mode, OTG Mode or Host Mode.

RTC

An Intersil temperature compensated real time clock IC ISL12020M is used for timekeeping (U16). Battery voltage must be supplied to the module from the main board.

Battery backed registers are accessed at I2C slave address 0x6F.

General purpose RAM is accessed at I2C slave address 0x57.

This RTC IC is supported in Linux so it can be used as hwclock device.

PLL

A Silicon Labs I2C-programmable clock generator Si5338A (U10) is populated on the module. The Si5338 can be programmed using the I2C-bus, to change the frequency on its outputs. It is accessible on the I2C slave address 0x70.

PLL connection:

Input/Output

Default Frequency

Notes

IN1/IN2

Externally supplied

need decoupling on base board

IN3

25MHz

Fixed input clock

IN4

-

not available and not used

IN5/IN6

125MHz

Ethernet PHY output clock

CLK0

-

not used, disabled

CLK1

-

not used, disabled

CLK2 A/B

125MHz

MGT reference clock 1

CLK3A

125MHz

Bank 34 clock input

CLK3B

-

not used, disabled

MAC-Address EEPROM

A Microchip 24AA025E48 EEPROM (U19) is used on the TE0715. It contains a globally unique 48-bit node address, that is compatible with EUI-48(TM) and EUI-64(TM). The device is organized as two blocks of 128 x 8-bit memory. One of the blocks stores the 48-bit node address and is write protected, the other block is available for application use. It is accessible through the I2C slave address 0x50.

Power

Warning

TE0715-xx-30 has several HP banks on B2B Connectors, those banks have maximal Voltage tolerance of 1.8V please check special instructions for the Baseboard use with TE0715-xx-30

For startup, a power supply with minimum current capability of 3A is recommended.

Note

VIN and 3.3VIN can be connected to the same source (3.3 V).

Power Supplies

...

Vin

...

3.3 V to 5.5 V

...

Typical 200 mA, depending on customer design and connections

rail that also powers the 3.3V circuitry on the module.

D3

Red

SC

System main status LED.

D4

Green

MIO7

User controlled, default OFF (when PS7 has not been booted).

Onboard Peripherals

Processing System (PS) Peripherals

NameICIDPS7MIONotes
SPI FlashS25FL256SAGBHI20U14QSPI0MIO1..MIO6 
EEPROM I2C24AA025E48U19I2C1MIO48, MIO49EEPROM for MAC Address.
RTCISL2020U16I2C1MIO48, MIO49

Temperature compensated RTC.

RTC InterruptISL2020U16GPIOMIO47Real Time Clock Interrupt.
Clock PLLSi5338U10I2C1MIO48, MIO49Low jitter phase locked loop.
LED-D4GPIOMIO7 
USBUSB3320U6USB0MIO28..MIO39 
USB Reset--GPIOMIO51 
Ethernet88E1512U7ETH0MIO16..MIO27 
Ethernet Reset--GPIOMIO50 

Clocking

ClockFrequencyICFPGANotes

PS CLK

33.3333 Mhz

U11

PS_CLK

PS subsystem main clock.

ETH PHY reference

25 MHz

U9

-

-

USB PHY reference

52 MHz

U15

-

-

PLL reference

25 MHz

U18

-

-

GT REFCLK0

-

B2B

U9/V9

Externally supplied from baseboard.

GT REFCLK1

125 Mhz

U10 Si5338

U5/V5

Default clock is 125 MHz.

RTC - Real Time Clock

An temperature compensated Intersil ISL12020M is used for Real Time Clock (U16). Battery voltage must be supplied to the module from the main board. Battery backed registers can be accessed over I2C bus at slave address of 0x6F. General purpose RAM is at I2C slave address 0x57. RTC IC is supported by Linux so it can be used as hwclock device.

PLL - Phase-Locked Loop

There is a Silicon Labs I2C programmable clock generator Si5338A (U10) chip on the module. It's output frequencies can be programmed using the I2C bus address 0x70.

PLL connection

I/ODefault FrequencyNotes

IN1/IN2

Externally supplied

Needs decoupling on base board.

IN3

25MHz

Fixed input clock.

IN4

-

-

IN5/IN6

125MHz

Ethernet PHY output clock.

CLK0

-

Not used, disabled.

CLK1

-

Not used, disabled.

CLK2 A/B

125MHz

MGT reference clock 1.

CLK3A

125MHz

Bank 34 clock input.

CLK3B

-

Not used, disabled.

MAC-Address EEPROM

A Microchip 24AA025E48 EEPROM (U19) is used which contains a globally unique 48-bit node address, that is compatible with EUI-48(TM) and EUI-64(TM) specification. The device is organized as two blocks of 128 x 8-bit memory. One of the blocks stores the 48-bit node address and is write protected, the other block is available for application use. It is accessible through the I2C slave address 0x50.

Power and Power-On Sequence

Warning

TE0715-xx-30 has several HP banks on B2B connectors. Those banks have maximum voltage tolerance of 1.8V. Please check special instructions for the baseboard to be used with TE0715-xx-30.

Power Supply

Power supply with minimum current capability of 3A for system startup is recommended.

Power Consumption

Power Input PinMax Current
VINTBD*
3.3VINTBD*

 * TBD - To Be Determined soon with reference design setup.

Lowest power consumption is achieved when powering the module from single 3.3V supply. When using split 3.3V/5V supplies the power consumption (and heat dissipation) will rise, this is due to the DC/DC converter efficiency (it decreases when VIN/VOUT ratio rises). Typical power consumption is between 2-3W.

Power-On Sequence

For highest efficiency of on board DC/DC regulators, it is recommended to use same 3.3V power source for both VIN and 3.3VIN power rails. Although VIN and 3.3VIN can be powered up in any order, it is recommended to power them up simultaneously.

It is important that all baseboard I/O's are 3-stated at power-on until System Controller sets PGOOD signal high (B2B connector JM1, pin 30), or 3.3V is present on B2B connector JM2 pins 10 and 12, meaning that all on-module voltages have become stable and module is properly powered up.

See Xilinx datasheet DS187 (for XC7Z015) or DS191 (for XC7Z030) for additional information. User should also check related baseboard documentation when choosing baseboard design for TE0715 module.

...

Vin 3.3V

...

3.3 V

...

Bank Voltages

    

Bank

Voltage

TE0715-xx-15

TE0715-xx-30

500 MIO0

3.3V

 
--

501 MIO1

1.8V

 
--

502 DDR

1.5V

 
--

0 Config

3.3V

 
--

13 HR

User

Max 3.3V

Max 3.3V

34 HR/HP

User

Max 3.3V

Max 1.8V

35 HR/HP

User

Max 3.3V

Max 1.8V

Initial Delivery state

Storage device name

Content

Notes

24AA025E48 EEPROM

User content not programmed

Valid MAC Address from manufacturer

SPI Flash OTP Area

Empty, not programmed

Except serial number programmed by flash vendor

SPI Flash Quad Enable bit

Programmed

 

SPI Flash main array

demo design

 

EFUSE USER

Not programmed

 

EFUSE Security

Not programmed

 

Hardware Revision History

 Revision

Changes                                   

01

Prototypes

02Prototypes
03First production release

Technical Specification

Absolute Maximum Ratings

Parameter

MinMax

Units

Notes

Vin supply voltage

-0.3

6.0

V

 

Vin33 supply voltage

-0.4

3.6

V

 
VBat supply voltage-16.0V 
PL IO Bank supply voltage for HR I/O banks (VCCO)-0.53.6V 

PL IO Bank supply voltage for HP I/O banks (VCCO)

-0.52.0VTE0715-xx-15 does not have HP banks
I/O input voltage for HR I/O banks-0.4VCCO_X+0.55V 
I/O input voltage for HP I/O banks-0.55VCCO_X+0.55VTE0715-xx-15 does not have HP banks
GT Receiver (RXP/RXN) and Transmitter (TXP/TXN)-0.51.26V 

Voltage on Module JTAG pins

-0.4

VCCO_0+0.55

V

VCCO_0 is 3.3V nominal

Storage Temperature

-40

+85

C

 
Storage Temperature without the ISL12020MIRZ-55+100C 
Note
Assembly variants for higher storage temperature range on request
Note
Please check Xilinx Datasheet for complete list of Absolute maximum and recommended operating ratings for the Zynq device (DS181 Artix or DS182 Kintex).

Recommended Operating Conditions

ParameterMinMaxUnitsNotesReference document
Vin supply voltage2.55.5V  
Vin33 supply voltage3.1353.465V  
VBat supply voltage2.75.5V  
PL IO Bank supply voltage for HR I/O banks (VCCO)1.143.465V Xilinx document DS191
PL IO Bank supply voltage for HP I/O banks (VCCO)1.141.89V

TE0715-xx-15 does not have HP banks.

Xilinx document DS191
I/O input voltage for HR I/O banks(*)(*)V(*) Check datasheetXilinx document DS191 and DS187
I/O input voltage for HP I/O banks(*)(*)V

TE0715-xx-15 does not have HP banks.

(*) Check datasheet

Xilinx document DS191
Voltage on Module JTAG pins3.1353.465VVCCO_0 is 3.3 V nominal 

Physical Dimensions

  • Module size: 50 mm × 40 mm.  Please download the assembly diagram for exact numbers.

  • Mating height with standard connectors: 8mm

  • PCB thickness: 1.6mm

  • Highest part on PCB: approx. 2.5mm. Please download the step model for exact numbers.

All dimensions are shown in mm.

 

Image RemovedImage Removed

Temperature Ranges

Commercial grade modules

All parts are at least commercial temperature range of 0°C to +70°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Industrial grade modules

All parts are at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Weight

26 g

Plain module

8.8 g

Set of bolts and nuts

Document Change History

...

date

...

revision

...

authors

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description

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Emmanuel Vassilakis

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Technical Specifications

Absolute Maximum Ratings

Parameter

MinMax

Units

Notes

VIN supply voltage

-0.3

6.0

V

-

3.3VIN supply voltage

-0.4

3.6

V

-
VBat supply voltage-16.0V-
PL IO bank supply voltage for HR I/O banks (VCCO)-0.53.6V-

PL IO bank supply voltage for HP I/O banks (VCCO)

-0.52.0VTE0715-xx-15 does not have HP banks.
I/O input voltage for HR I/O banks-0.4VCCO_X+0.55V-
I/O input voltage for HP I/O banks-0.55VCCO_X+0.55VTE0715-xx-15 does not have HP banks.
GT receiver (RXP/RXN) and transmitter (TXP/TXN)-0.51.26V-

Voltage on module JTAG pins

-0.4

VCCO_0+0.55

V

VCCO_0 is 3.3V nominal.

Storage temperature

-40

+85

Co

-
Storage temperature without the ISL12020MIRZ-55+100Co-
Note
Assembly variants for higher storage temperature range are available on request.
Note
Please check Xilinx datasheet DS187 (for XC7Z015) or DS191 (for XC7Z030) for complete list of absolute maximum and recommended operating ratings.

Recommended Operating Conditions

ParameterMinMaxUnitsNotesReference Document
VIN supply voltage2.55.5V  
3.3VIN supply voltage3.1353.465V  
VBAT_IN supply voltage2.75.5V  

PL I/O bank supply voltage for HR

I/O banks (VCCO)

1.143.465V Xilinx datasheet DS191

PL I/O bank supply voltage for HP

I/O banks (VCCO)

1.141.89V

TE0715-xx-15 does not have

HP banks

Xilinx datasheet DS191
I/O input voltage for HR I/O banks(*)(*)V(*) Check datasheet

Xilinx datasheet DS191

or DS187

I/O input voltage for HP I/O banks(*)(*)V

TE0715-xx-15 does not have

HP banks

(*) Check datasheet

Xilinx datasheet DS191
Voltage on Module JTAG pins3.1353.465VVCCO_0 is 3.3 V nominal 

Physical Dimensions

  • Module size: 50 mm × 40 mm.  Please download the assembly diagram for exact numbers

  • Mating height with standard connectors: 8mm

  • PCB thickness: 1.6mm

  • Highest part on PCB: approx. 2.5mm. Please download the step model for exact numbers

 All dimensions are given in mm.

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Operating Temperature Ranges

Commercial grade: 0°C to +70°C.

Industrial grade: -40°C to +85°C.

The module operating temperature range depends also on customer design and cooling solution. Please contact us for options.

Weight

26 g - Plain module

8.8 g - Set of bolts and nuts

Document Change History

Date

Rrevision

Contributors

Description

2016-06-28

New overall document layout with shorter table of contents.

Revision 01 PCB pictures replaced with the revision 03 ones.

Fixed link to Master Pinout Table.

New default MIO mapping table design.

Revised Power-on section.

Added links to related Xilinx online documents.

Physical dimensions pictures revised.

Revision number picture with explanation added.

2016-04-27V33

Philipp Bernhardt, Antti Lukats,

Thorsten Trenz, Emmanuel Vassilakis

Added the table "Recommended Operating Conditions"

Storage Temperature edited.

2016-03-31V10

Philipp Bernhardt, Antti Lukats,

Thorsten Trenz

Initial version.

Hardware Revision History

DateRevision

Notes

PCN
-

01

Prototypes

 
-02Prototypes 
-03First production release 
2016-06-2104Second production releaseClick to see PCN

Hardware revision number is printed on the PCB board together with the module model number separated by the dash.

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2016-03-31

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Disclaimer

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Disclaimer


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