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Note:
Use 'Key Features' description in shoping page, for example: https://shop.trenz-electronic.de/de/TE0728-04-1Q-SoC-MicromodulModul-mit-XilinxAMD-Automotive-Zynq-7020-512-MByte-DDR3L-6-x-6-cm

  • 3 x Samtec LSHM Series Board to Board Connectors
  • VG96 connector (mounting holes and solder pads, J6) and 50-pin IDC male connector socket (J5) for access to PL I/O-bank pins
  • USB2.0 type A connector, or optionally Micro USB 2.0 connector
  • 1 x RJ45 GbE MagJack (J3), connected via MDI to B2B connector JB1
  • 1 x Marvell Alaska 88E1512 GbE PHY, providing Ethernet interface in conjunction with RJ45 GbE MagJack (J2)
  • 4 A High-Efficiency Power SoC DC-DC Step-Down Converter (Enpirion EN6347) for 3.3V power supply
  • XMOD JTAG- / UART-header JX1
  • Micro SD card socket
  • SDIO port expander with voltage-level translation and jumper (J13) for selection of SDIO voltage on SoM side
  • DIP-switches S1 to set SoM's control signals
  • 1 x user-push button (S2), by default configured as system reset button
  • 3 x VCCIO selection jumper J10, J11 and J12 to set SoM's PL I/O-bank voltages
  • 5V power supply barrel jack

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  • VCCIO voltage selection jumpers are all set to 1.8 V.
  • S2 switch configured as reset button.
  • One VG96 connector (not soldered to the board, but included in the package as separate component)

Different delivery configurations are available upon request.

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Scroll Title
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titleXMOD adapter board DIP-switch positions for voltage configuration

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XMOD DIP-switchesPosition
Switch 1ON
Switch 2OFF
Switch 3OFF
Switch 4ON



Note

Use Xilinx AMD compatible TE0790 adapter board (designation TE-0790-xx with out 'L') to program the Xilinx AMD Zynq devices.

The TE0790 adapter board's CPLD have to be configured with the Standard variant of the firmware. Refer to the TE0790 Resources Site for further information and firmware download.

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The SD Socket is routed to the on-board Texas Instruments TXS02612 SDIO port expander U4. This IC provides a necessary VDD/VCCIO translation between the MicroSD Card socket J4 (3.3V) and the SoM's Zynq device MIO-bank (1.8V/3.3V depending on Module, compare jumper J13 ):

Scroll Title
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titleSD IO interface signals

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SD IO Signal Schematic NameConnected toNote
eSD_DAT0U4-18SD IO data
eSD_DAT1U4-16SD IO data
eSD_DAT2U4-23SD IO data
eSD_DAT3U4-22SD IO data
eSD_CLKU4-19SD IO clock
eSD_CMDU4-20SD IO command
MIO0J5-29Card Detect signal


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Scroll Title
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titleDIP-switch SoM configuration settings

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SwitchSignal NameONOFFNotes
S1-1---Not connected.
S1-2PROGMODEJTAG enabled for programing mounted SoM's Zynq-SoC.JTAG enabled for programing mounted SoM's SC-CPLD.-
S1-3MODEDrive SoM SC CPLD pin 'MODE' low. (SD-Boot)Leave SoM SC CPLD pin 'MODE' open. (QSPI-Boot)

Boot mode configuration, if supported by SoM. (Depends also on SoM's SC-CPLD firmware).

S1-4EN1Drive SoM SC CPLD pin 'EN1' low.Drive SoM SC CPLD pin 'EN1' high.

Usually used to enable/disable FPGA core-voltage supply. (Depends also on SoM's SC CPLD firmware).

Note: Power-on sequence will be intermitted if S1-4 is set to OFF and if functionality is supported by SoM.



Note

Note: Compared to the former revision 02 of this board, the DIP-switch is rotated by 180° due to routing issues.


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titleUser DIP-switch S1


VCC Selection

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Jumpers

Note

Note: The corresponding PL I/O-bank supply-voltages of the 4 x 5 SoM to the selectable base-board voltages VCCIOA, VCCIOB and VCCIOC are depending on the mounted 4 x 5 SoM and varying in order of the used model.

Refer to the SoM's schematic for information about the specific pin assignments on module's B2B-connectors regarding the PL I/O-bank supply-voltages and to the 4 x 5 Module integration Guide for VCCIO voltage options.

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Scroll Title
anchorFigure_OBP_VCCIOJumpers
titleBase-board supply-voltages (VCCIOA, VCCIOB, VCCIOC, SD_VCCA) selection jumpers

RTC Buffer Voltage Supply Header

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The Carrier Board's push button S2 is connected to the 'RESIN' signal, the function of the button is to trigger a reset of the mounted SoM by driving the reset-signal 'RESIN' to ground.

Gigabit Ethernet PHY

The TE0706 Carrier Board is equipped with a Marvell Alaska 88E1512 Gigabit Ethernet PHY (U6), which provides in conjunction with the Gigabit Ethernet MagJack J2 a 1000Base-T Ethernet (GbE) interface. The Ethernet PHY RGMII interface is connected to the B2B connector JB3, where they can be accessed by the mounted SoM's PS bank. The I/O Voltage is fixed at 1.8V. Reference clock input of the PHY is supplied from the on-board 25.000000 MHz oscillator (U7), the 125MHz output clock signal *CLK125' is connected to the B2B connector pin JB3-32.

Scroll Title
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titleRJ45 connectors

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PHY U6 pinsB2B-pinNotes
ETH-MDC/ETH-MDIOJB3-49, JB3-51-
PHY_LED0-Connected to GbE MagJack J2 LED0 (green). Also connected to J5-24 (PHY_LED0_CON).
PHY_LED1-Connected to GbE MagJack J2 LED1 (green). Also connected to J5-23 (PHY_LED1_CON).
PHY_INTJB3-33-
CONFIGJB3-60-
CLK125JB3-32PHY Clock (125 MHz) output.
ETH-RSTJB3-53-
RGMIIJB3-31
JB3-37 - JB-44,
JB3-47,
JB3-57 - JB-59

Reduced Gigabit Media Independent Interface.

12 pins.

SGMII
Note

ETH-RXCK is connected via 0Ohm to JB3-31 (R18)and JB3-58 (R19). Usage depends on Module and AMD IP restrictions
In case of performance  problems remove 0Ohm resistor from the unused Pin.


SGMII-

Serial Gigabit Media Independent Interface.

Not connected.

MDI-

Media Dependent Interface

-

Serial Gigabit Media Independent Interface.

Not connected.

MDI-

Media Dependent Interface.

Connected to Gigabit Ethernet MagJack J2.


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The TE0706 Carrier Board is equipped with a Texas Instruments TXS02612 SDIO SDIO Port Expander, which is needed for voltage translation due to different voltage levels of the Micro SD Card and the PS MIO-bank of the Zynq device of the mounted SoM. The Micro SD Card has 3.3V signal voltage level, but the PS MIO-bank on the Xilinx AMD Zynq module has VCCIO of 1.8V or 3.3V depending on the attached module. this This has to beselected be selected by J13.

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titleSDIO Port Expander

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SD-Card Signal Schematic NameSD-Card Connected to Connected toSD IO Signal Schematic NameB2BNote
eSD_DAT0U4-18U4-6SD_DAT0JB1-24SD IO data
eSD_DAT1U4-16U4-7SD_DAT1JB1-22SD IO data
eSD_DAT2U4-23U4-1SD_DAT2JB1-20SD IO data
eSD_DAT3U4-22U4-3SD_DAT3JB1-18SD IO data
eSD_CLKU4-19U4-9SD_CLKJB1-28SD IO clock
eSD_CMDU4-20U4-4SD_CMDJB1-26SD IO command
MIO0---JB1-88Card Detect signal


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The maximum power consumption of the Carrier Board depends mainly on the mounted SoM's FPGA design running on the Zynq device.

Xilinx AMD provide a power estimator excel sheets to calculate power consumption. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.

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titlePhysical Dimension


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revision3


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Currently Offered Variants 

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Set correct link to the shop page overview Set correct link to the shop page overview table of the product on English and German.

Example for TE0728:

ENG Page: https://shop.trenz-electronic.de/en/Products/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/

DEU Page: https://shop.trenz-electronic.de/de/Produkte/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/

if not available, set.

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Scroll Title
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titleDocument change history.

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Date

Revision

Contributors

Description

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modified-date
modified-date
dateFormatyyyy-MM-dd

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infoTypeCurrent version
prefixv.
typeFlat
showVersionsfalse

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infoTypeModified by
typeFlat
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  • Changed Xilinx to AMD.
  • Updated to PCN-20231106.

2021-02-19

v.76

John Hartfiel

  • Note to PHY connection
2010-07-16v.74John Hartfiel
  • update Physical Dimensions
2019-05-27v.73Martin Rohrmüller
  • Updated to REV03
  • Updated to TRM v28
2018-06-03v.66John Hartfiel
  • Add note to DIP settings
2017-11-10

v.64

John Hartfiel
  • Replace B2B connector section
2017-11-09v.60Ali Naseri
  • TRM revision to new common style

2017-07-06

v.52
Ali Naseri, Jan Kumann
  • Hardware revision 02 specific changes.
2017-01-06v.1Ali Naseri
  • initial document to board revision 02
---all

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infoTypeModified users
typeFlat
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