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Warning

TE0715-xx-30 has several HP banks on B2B connectors. Those banks have maximum voltage tolerance of 1.8V. Please check special instructions for the baseboard to be used with TE0715-xx-30.

Power

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Power supply with minimum current capability of 3A for system startup is recommended.

Power Consumption

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Consumption

The maximum power consumption of a module mainly depends on the design running on the FPGA.

Xilinx provides a power estimator excel sheets to calculate power consumption. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.

Power Input PinTypical Current
VINTBD*
3.3VINTBD*

Table 15: Typical power consumption.

 

 * TBD - To Be Determined.

Power supply with minimum current capability of 3A for system startup is recommended.

Power Distribution Dependencies

Image Added

Figure 3: Module power distribution diagram

Table 15: Power consumption.

 * TBD - To Be Determined.

Lowest power consumption is achieved when powering the module from single 3.3V supply. When using split 3.3V/5V supplies the power consumption (and heat dissipation) will rise due to the DC-DC converter efficiency (it decreases when VIN/VOUT ratio rises). Typical module power consumption is between 2-3W.

Power-On Sequence

For highest efficiency of on board DC/-DC regulators, it is recommended to use same 3.3V power source for both VIN and 3.3VIN power rails. Although VIN and 3.3VIN can be powered up in any order, it is recommended to power them up simultaneously.

It is important that all baseboard I/Os are 3-stated at power-on until System Controller CPLD sets PGOOD signal high (B2B connector JM1, pin 30), or 3.3V is present on B2B connector JM2 pins 10 and 12, meaning that all on-module voltages have become stable and module is properly powered up.

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Recommended Operating Conditions

ParameterMinMaxUnitsNotesReference Document
VIN supply voltage2.55.5V  
3.3VIN supply voltage3.1353.465V  
VBAT_IN supply voltage2.75.5V  

PL I/O bank supply voltage for HR

I/O banks (VCCO)

1.143.465V Xilinx datasheet DS191

PL I/O bank supply voltage for HP

I/O banks (VCCO)

1.141.89V

TE0715-xx-15 does not have

HP banks

Xilinx datasheet DS191
I/O input voltage for HR I/O banks(*)(*)V(*) Check datasheet

Xilinx datasheet DS191

or DS187

I/O input voltage for HP I/O banks(*)(*)V

TE0715-xx-15 does not have

HP banks

(*) Check datasheet

Xilinx datasheet DS191
Voltage on Module JTAG pins3.1353.465VVCCO_0 is 3.3 V nominal 

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