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titleFigure 1: TE0841-02 block diagram
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Main Components

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titleFigure 2: TE0841-02 main components
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Photo shows similar TE0841-01

  1. Xilinx Kintex UltraScale FPGA, U1
  2. Ultra performance oscillator @25.000000 MHz, U3
  3. 12A PowerSoC DC-DC converter (0.95V), U14
  4. 12A PowerSoC DC-DC converter (0.95V), U7
  5. Low-jitter precision LVDS oscillator @200.0000 MHz, U11

  6. Low-dropout (LDO) linear regulator (MGTAVTT 1.20V), U8
  7. Low-dropout (LDO) linear regulator (MGTAVCC 1.02V), U12
  8. Samtec Razor Beam™ LSHM-150 B2B connector, JM1
  9. Samtec Razor Beam™ LSHM-150 B2B connector, JM2
  10. Samtec Razor Beam™ LSHM-130 B2B connector, JM3
  11. Programmable quad clock generator, U2
  12. 64 MByte QSPI Flash, U6
  13. 8 Gbit DDR4 SDRAM, U4
  14. 8 Gbit DDR4 SDRAM, U5
  15. System Controller CPLD, U18
  16. Low-dropout (LDO) linear regulator (MGTAUX), U9
  17. Ultra-low power low-dropout (LDO) regulator (VBATT), U19

Initial Delivery State

Storage device name

Content

Notes

System Controller CPLD

Default firmware-
OTP Flash areaEmptyNot programmed
Quad clock generator OTP areaEmptyNot programmed

Table 1: TE0841-02 module initial delivery state of programmable on-board devices

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I/O signals connected to the SoCs I/O bank and B2B connector:

FPGA BankTypeB2B ConnectorI/O Signal CountBank VCCO VoltageNotes
64HRJM148 IO's, 24 LVDS pairsB64_VCCOSupplied by the carrier board
65HRJM18 IO's3.3VOn-module power supply
65HRJM34 IO's3.3VOn-module power supply
66HPJM316 IO's, 8 LVDS pairsB66_VCCOSupplied by the carrier board
67HPJM248 IO's, 24 LVDS pairsB67_VCCOSupplied by the carrier board
67HPJM22 IO'sB67_VCCOSupplied by the carrier board
68HPJM218 IO's, 9 LVDS pairsB68_VCCOSupplied by the carrier board

Table 2: General overview of FPGA's PL I/O signals connected to the B2B connectors

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MGT (Multi Gigabit Transceiver) lane consists of one transmit and one receive (TX/RX) differential pairs, two signals each or four signals total per one MGT lane. Following table lists lane number, MGT bank number, transceiver type, signal schematic name, board-to-board pin connection and FPGA pins connection:

LaneBankTypeSignal NameB2B PinFPGA Pin
0225GTH
  • MGT_RX0_P
  • MGT_RX0_N
  • MGT_TX0_P
  • MGT_TX0_N
  • JM3-8
  • JM3-10
  • JM3-7
  • JM3-9
  • MGTHRXP0_225, Y2
  • MGTHRXN0_225, Y1
  • MGTHTXP0_225, AA4
  • MGTHTXN0_225, AA3
1225GTH
  • MGT_RX1_P
  • MGT_RX1_N
  • MGT_TX1_P
  • MGT_TX1_N
  • JM3-14
  • JM3-16
  • JM3-13
  • JM3-15
  • MGTHRXP1_225, V2
  • MGTHRXN1_225, V1
  • MGTHTXP1_225, W4
  • MGTHTXN1_225, W3
2225GTH
  • MGT_RX2_P
  • MGT_RX2_N
  • MGT_TX2_P
  • MGT_TX2_N
  • JM3-20
  • JM3-22
  • JM3-19
  • JM3-21
  • MGTHRXP2_225, T2
  • MGTHRXN2_225, T1
  • MGTHTXP2_225, U4
  • MGTHTXN2_225, U3
3225GTH
  • MGT_RX3_P
  • MGT_RX3_N
  • MGT_TX3_P
  • MGT_TX3_N
  • JM3-26
  • JM3-28
  • JM3-25
  • JM3-27
  • MGTHRXP3_225, P2
  • MGTHRXN3_225, P1
  • MGTHTXP3_225, R4
  • MGTHTXN3_225, R3
4224GTH
  • MGT_RX4_P
  • MGT_RX4_N
  • MGT_TX4_P
  • MGT_TX4_N
  • JM1-12
  • JM1-10
  • JM1-6
  • JM1-4
  • MGTHRXP0_224, AH2
  • MGTHRXN0_224, AH1
  • MGTHTXP0_224, AG4
  • MGTHTXN0_224, AG3
5224GTH
  • MGT_RX5_P
  • MGT_RX5_N
  • MGT_TX5_P
  • MGT_TX5_N
  • JM1-24
  • JM1-22
  • JM1-18
  • JM1-16
  • MGTHRXP1_224, AF2
  • MGTHRXN1_224, AF1
  • MGTHTXP1_224, AF6
  • MGTHTXN1_224, AF5
6224GTH
  • MGT_RX6_P
  • MGT_RX6_N
  • MGT_TX6_P
  • MGT_TX6_N
  • JM1-27
  • JM1-25
  • JM1-19
  • JM1-17
  • MGTHRXP2_224, AD2
  • MGTHRXN2_224, AD1
  • MGTHTXP2_224, AE4
  • MGTHTXN2_224, AE3
7224GTH
  • MGT_RX7_P
  • MGT_RX7_N
  • MGT_TX7_P
  • MGT_TX7_N
  • JM3-2
  • JM3-4
  • JM3-1
  • JM3-3
  • MGTHRXP3_224, AB2
  • MGTHRXN3_224, AB1
  • MGTHTXP3_224, AC4
  • MGTHTXN3_224, AC3

Table 3: FPGA to B2B connectors routed MGT lanes overview

Below are listed MGT banks reference clock sources:

Clock signalBankSourceFPGA PinNotes
MGT_CLK0_P225B2B, JM3-33MGTREFCLK0P_225, Y6Supplied by the carrier board.
MGT_CLK0_NB2B, JM3-31MGTREFCLK0N_225, Y5
MGT_CLK1_P225U2, CLK1BMGTREFCLK1P_225, V6On-board Si5338A.
MGT_CLK1_NU2, CLK1AMGTREFCLK1N_225, V5
MGT_CLK2_P224B2B, JM3-34MGTREFCLK2P_224, AD6Supplied by the carrier board.
MGT_CLK2_NB2B, JM3-32MGTREFCLK2N_224, AD5
MGT_CLK3_P224U2, CLK2BMGTREFCLK3P_224, AB6On-board Si5338A.
MGT_CLK3_NU2, CLK2BMGTREFCLK3N_224, AB5

Table 4: MGT reference clock sources

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JTAG access to the Xilinx Kintex UltraScale FPGA is available through B2B connector JM2.

JTAG Signal

B2B Connector Pin

TMSJM2-93
TDIJM2-95
TDOJM2-97
TCKJM2-99

Table 5: JTAG interface signals

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Special purpose pins are connected to the System Controller CPLD and have following default configuration:

Pin NameSC CPLD DirectionFunctionDefault Configuration
JTAGMODEInputJTAG selectLow for normal operation.
nRST_SC0InputResetLow active board reset input
SC1--not currently used ('BOOTMODE' in default B2B pin out')
SC2Input / Output-Power good signal ('PGOOD' in default B2B pin out)
SC3Input-Power enable pin ('EN1' in default B2B pin out)
SC4--not currently used ('NOSEQ' in default B2B pin out')
F_TCKOutput

JTAG signals between
SC CPLD and FPGA



B2B JTAG signals are forwarded to the FPGA through SC CPLD.
F_TMSOutput
F_TDIOutput
F_TDOInput
TCKInputJTAG signals between
SC CPLD and B2B connector

Program FPGA or SC CPLD depending on pin JTAGMODE.

TMSInput
TDIInput
TDOOutput
PROG_BOutputFPGA configurationPL configuration reset signal.
DONEInputFPGA configuration donePL configuration completed.
PUDC_BOutputPull up during configuration

PL I/O's are 3-stated until configuration of the FPGA completes.

INIT_BInputInitialization done

Low active FPGA initialization pin or configuration error signal.

EN_PLInputEnable PL Power DC-DC convertersSet to contant logical high.
CPLD_IOOutputuser I/OConnected to FPGA Bank 45, pin P28.

Table 6: System Controller CPLD I/O pins

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Quad SPI interface is connected to the FPGA configuration bank 0.

Signal NameQSPI Flash Memory U6 PinFPGA Pin
SPI_CSC2RDWR_FCS_B_0, AH7
SPI_D0D3D00_MOSI_0, AA7
SPI_D1D2D01_DIN_0, Y7
SPI_D2C4D02_0, U7
SPI_D3D4D03_0, V7
SPI_CLKB2CCLK_0, V11

Table 7: Quad SPI interface signals and connections

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On-module I²C interface is routed  from PL bank 65 I/O pins (PLL_SCL and PLL_SDA) to the I²C interface of Si5338 PLL quad clock generator U2, also two further pins of bank 65 can be used as external I²C interface of the modue:

I²C InterfaceSchematic net namesConnected toI²C AddressNotes
PL bank 65 I/O

'PLL_SCL', pin AB20

'PLL_SDA' pin AB19

Si5338 U2, pin 12

Si5338 U2, pin 19

0x70default address
PL bank 65 I/O

'B65_SCL', pin Y19

'B65_SDA', pin AA19

B2B JM1, pin 95

B2B JM1, pin 93

-

Table 8: I2C slave device addresses

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There is a Silicon Labs I2C programmable quad PLL clock generator on-board (Si5338A, U2) to generate various reference clocks for the module.

Si5338A Pin
Signal Name / Description
Connected toDirectionNote

IN1

-

not connectedInput

not used

IN2-GNDInputnot used

IN3

Reference input clock

U3, pin 3Input25.000000 MHz oscillator, Si8208AI

IN4

-GNDInputI2C slave device address LSB.

IN5

-

not connectedInputnot used
IN6-GNDInputnot used

CLK0A

CLK1_P

U1, R23Output

FPGA bank 45, default 100MHz*

CLK0BCLK1_NU1, P23
CLK1AMGT_CLK1_NU1, V5Output

FPGA MGT bank 225 reference clock, default 125MHz*

CLK1BMGT_CLK1_PU1, V6
CLK2AMGT_CLK3_NU1, AB5OutputFPGA MGT bank 224 reference clock, default 156,25MHz*
CLK2BMGT_CLK3_PU1, AB6
CLK3A

CLK0_P

U1, pin T24Output

FPGA bank 45, default 156,25MHz*

CLK3BCLK0_NU1, pin T25

 Table 9: Programmable quad PLL clock generator inputs and outputs, *PCB REV01 is not programmed

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The FPGA module has following reference clocking signals provided by external baseboard sources and on-board oscillators:

Clock SourceFrequencySignal NameClock DestinationNotes
U3, SiT8208AI25.000000 MHzCLKSi5338A PLL U2, pin 3 (IN3)-
U11, DSC1123DL5200.0000 MHzCLK200M_PFPGA bank 45, pin R25

Enable by FPGA bank 65, pin AF24

Signal: 'ENOSC'

CLK200M_NFPGA bank 45, pin R26

Table 10: Reference clock signals

On-board LEDs

LEDColorConnected toDescription and Notes
D1GreenSystem Controller CPLD, bank 3Exact function is defined by SC CPLD firmware.

Table 11: On-board LEDs

Power and Power-On Sequence

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Xilinx provide a power estimator excel sheets to calculate power consumption. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.

Power InputTypical Current
VINTBD*
3.3VINTBD*

Table 12: Typical power consumption

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titleFigure 3: TE0841-02 Power Distribution Diagram
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See also Xilinx datasheet DS892 for additional information. User should also check related base board documentation when intending base board design for TE0841 module.

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titleFigure 4: TE0841-02 Power-On Sequence Diagram
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Power Rails

Power Rail Name

B2B JM1 Pins

B2B JM2 Pins

Input/Output

Notes
VIN1, 3, 52, 4, 6, 8InputSupply voltage.
3.3VIN13, 15-InputSupply voltage.
B64_VCO9, 11-InputHR (High Range) bank voltage.
B66_VCO-1, 3InputHP (High Performance) bank voltage.
B67_VCO-7, 9InputHP (High Performance) bank voltage.
B68_VCO-5InputHP (High Performance) bank voltage.

VBAT_IN

79-InputRTC battery supply voltage.
3.3V-10, 12, 91OutputModule on-board 3.3V voltage level.

Table 13: Module power rails

Note

Current rating of  Samtec Razor Beam™ LSHM B2B connectors is 2.0A per pin (2 adjacent pins powered).

Bank Voltages

Bank

Schematic Name

Voltage

Voltage Range

0 (config)

PL_1.8V

1.8V

-
44 HPDDR_1V21.2VHP: 1.2V to 1.8V
45 HPPL_1.8V1.8VHP: 1.2V to 1.8V
46 HPDDR_1V21.2VHP: 1.2V to 1.8V
64 HRB64_VCOuserHR: 1.2V to 3.3V
65 HR3.3V3.3VHR: 1.2V to 3.3V
66 HPB66_VCOuserHP: 1.2V to 1.8V
67 HPB67_VCOuserHP: 1.2V to 1.8V
68 HPB68_VCOuserHP: 1.2V to 1.8V

Table 14: Module PL I/O bank voltages

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See also the current available variants on the Trenz Electronic shop page

Trenz shop TE0841 overview page
English pageGerman page

Technical Specifications

Absolute Maximum Ratings

Parameter

MinMax

Units

Reference Document

VIN supply voltage

-0.36.0

V

EN63A0QI, TPS74401RGW datasheets
3.3VIN supply voltage-0.13.4VXilinx datasheet DS892 (HR Bank VCCO)
VBAT_IN-0.36.0VTPS780xx datasheet
Supply voltage for HR I/O banks (VCCO)

-0.500

3.400

VXilinx datasheet DS892

Supply voltage for HP I/O banks (VCCO)

-0.500

2.000VXilinx datasheet DS892
I/O input voltage for HR I/O banks

-0.400

VCCO + 0.550

VXilinx datasheet DS892

I/O input voltage for HP I/O banks

-0.550

VCCO + 0.550

VXilinx datasheet DS892
GTH and GTY transceiver reference clocks absolute input voltage (MGT_CLK0, MGT_CLK2)-0.5001.320VXilinx datasheet DS892

GTH and GTY transceiver receiver (RXP/RXN) and transmitter (TXP/TXN) absolute input voltage

-0.500

1.260

VXilinx datasheet DS892

Storage temperature

-40

+100

°C

SML-P11 LED datasheet

Table 16: Module absolute maximum ratings

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Recommended Operating Conditions

ParameterMinMaxUnitsReference Document
VIN supply voltage3.35.5VTPS82085SIL, TPS74401RGW datasheet
3.3VIN supply voltage3.33.4VXilinx datasheet DS892 (HR Bank VCCO)
VBAT_IN2.25.5VTPS780xx datasheet
Supply voltage for HR I/O banks (VCCO)1.140

3.400

VXilinx datasheet DS892

Supply voltage for HP I/O banks (VCCO)

0.950

1.890

VXilinx datasheet DS892

I/O input voltage for HR I/O banks

–0.200

VCCO + 0.20VXilinx datasheet DS892
I/O input voltage for HP I/O banks–0.200VCCO + 0.20VXilinx datasheet DS892
I/O input voltage for SC CPLD U18-0.33.6VLCMXO2-256HC datasheet

Industrial Module Operating Temperature Range

-4085°CXilinx datasheet DS892
Commercial Module Operating Temperature Range085
Xilinx DS892, Silicon Labs Si5338 datasheet

Table 17: Module recommended operating conditions

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Hardware Revision History

DateRevision

Notes

PCNDocumentation Link
2018-05-1102current available board revisionPCN-20180511TE0841-02
2015-12-09

01

First production release

-TE0841-01

Table 18: Module hardware revision history

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