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Table of Contents
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Overview
The Trenz Electronic TEP0003 is is a Pmod compatible motor driver board and good for developing BLCD or CD motor driving software.
Refer to http://trenz.org/tep0003-info for the current online version of this manual and other available documentation.
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Note: Key Features' must be split into 6 main groups for modues:
Key Features' must be split into 6 main groups for carrier:
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- Modules/ SoC FPGA
- TE0808, TE807, TE0803,...
Compatible with Digilent's Pmod interfaces
- TE0808, TE807, TE0803,...
- RAM/Storage
- E.g. SDRAM, SPI
- On Board
- E.g. CPLD, PLL
- Interface
- E.g. ETH, USB, B2B, Display port
- Power
- E.g. Input supply voltage
30A 0-24V BLDC motor driver board
Supply current and voltage monitoring
- Synchronous DC/DC Converter
- CSD97394 power stage
- Interface
- Low power push-pull output comparator for monitoring driver channels
- Power
- Low 3,3V power draw from Pmod
- Dimension
- 40 mm x 40 mm
Block Diagram
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add drawIO object here.
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- Pmod Pin Header, J1
- Pmod Pin Header, J2
- Synchronous DC/DC Converter, U7
- Terminal Block, J3
- Terminal Block, J4
- Low-Power Push-Pull Output Comparator, U9
Initial Delivery Stat
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Notes : Only components like EEPROM, QSPI flash can be initialized by default at manufacture. If there is no components which might have initial data ( possible on carrier) you must keep the table empty |
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Configuration Signals
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orientation | portrait | |||
sortDirection | ASC | |||
repeatTableHeaders | default | style | widths | |
sortByColumn | 1 | |||
sortEnabled | false | |||
cellHighlighting | true | MODE Signal State | Boot Mode
Signals, Interfaces and Pins
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Notes :
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Pmod Connectors
TEP0003 is equipped with two Pmod Connectors.
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Signal
B2B | I/O | Note | |
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MIO Pins
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Notes :
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Board to Board (B2B) I/Os
FPGA bank number and number of I/O signals connected to the B2B connector:
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anchor | Table_SIP_B2B |
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title | General PL I/O to B2B connectors information |
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JTAG access to the TExxxx SoM through B2B connector JMX.
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anchor | Table_SIP_JTG |
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title | JTAG pins connection |
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JTAG Signal
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B2B Connector
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MIO Pins
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id | Comments |
you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.
Example:
you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic. Example:
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SPI_CS , SPI_DQ0... SPI_DQ3
SPI_SCK
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anchor | Table_OBP_MIOs |
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title | MIOs pins |
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Notes :
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Notes : In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection |
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anchor | Table_OBP |
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title | On board peripherals |
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Quad SPI Flash Memory
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Notes : Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options. |
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anchor | Table_OBP_SPI |
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title | Quad SPI interface MIOs and pins |
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anchor | Table_OBP_RTC |
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title | I2C interface MIOs and pins |
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anchor | Table_OBP_I2C_RTC |
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title | I2C Address for RTC |
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anchor | Table_OBP_EEP |
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title | I2C EEPROM interface MIOs and pins |
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anchor | Table_OBP_I2C_EEPROM |
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title | I2C address for EEPROM |
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LEDs
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anchor | Table_OBP_LED |
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title | On-board LEDs |
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DDR3 SDRAM
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Notes : Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3) |
The TE???? SoM has ??? GByte volatile DDR3 SDRAM IC for storing user application code and data.
- Part number:
- Supply voltage:
- Speed:
- NOR Flash
- Temperature:
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Bank | Signal Name | ETH1 | ETH2 | Signal Description |
CAN Transceiver
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anchor | Table_OBP_CAN |
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title | CAN Tranciever interface MIOs |
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On-board Peripherals
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Notes :
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Notes : In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection |
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Description | Frequency | Note | MHz | MHz | KHz
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Power and Power-On Sequence
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