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Template Revision 2.15

Template Change history:

  • 2.14 to 2.15
    • add excerpt macro to key features
  • 2.13 to 2.14
    • add fix table of content
    • add table size as macro
  • 2.12 to 2.13
    • Changed controller Signals section
  • Module: TRM Name always "TE Series Name" +TRM
    Example: "TE0728 TRM"
  • Carrier: TRM Name usually "TEB Series Name" +TRM
    Example: "TEB0728 TRM"

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Important General Note:

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Important General Note:

  • If some section is configurable and depends on Firmware, please refer to the addition page (for example CPLD). If not available, add note, that this part is configurable
  • Designate all graphics and pictures with a number and a description, Use "Scroll Title" macro

    • Use "Scroll Title" macro for pictures and table labels. Figure number must be set manually at the moment (automatically enumeration is planned by scrollPDF)
      • Figure template:

        Scroll Title
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        titleText


        Scroll Ignore

        Create DrawIO object here: Attention if you copy from other page, objects are only linked.


        Scroll Only

        image link to the generate DrawIO PNG file of this page. This is a workaround until scroll pdf export bug is fixed



      • Table template:

        • Layout macro can be use for landscape of large tables

      • Scroll Title
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        titleText

        Scroll Table Layout
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        ExampleComment
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    • The anchors of the Scroll Title should be named consistant across TRMs. A incomplete list of examples is given below

      • <type>_<main section>_<name>

        • type: Figure, Table
        • main section:
          • "OV" for Overview
          • "SIP" for Signal Interfaces and Pins,
          • "OBP" for On board Peripherals,
          • "PWR" for Power and Power-On Sequence,
          • "B2B" for Board to Board Connector,
          • "TS" for Technical Specification
          • "VCP" for Variants Currently in Production
          •  "RH" for Revision History
        • name: custom, some fix names, see below
      • Fix names:
        • "Figure_OV_BD" for Block Diagram

        • "Figure_OV_MC" for Main Components

        • "Table_OV_IDS" for Initial Delivery State

        • "Table_PWR_PC" for Power Consumption

        • "Figure_PWR_PD" for Power Distribution
        • "Figure_PWR_PS" for Power Sequence
        • "Figure_PWR_PM" for Power Monitoring
        • "Table_PWR_PR" for Power Rails
        • "Table_PWR_BV" for Bank Voltages
        • "Table_TS_AMR" for Absolute_Maximum_Ratings

        • "Table_TS_ROC" for Recommended_Operating_Conditions

        • "Figure_TS_PD" for Physical_Dimensions
        • "Table_VCP_SO" for TE_Shop_Overview
        • "Table_RH_HRH" for Hardware_Revision_History

        • "Figure_RH_HRN" for Hardware_Revision_Number
        • "Table_RH_DCH" for Document_Change_History
    • Use Anchor in the document: add link macro and add "#<anchorname>
    • Refer to Anchror from external : <page url>#<pagename without space characters>-<anchorname>



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Note for Download Link of the Scroll ignore macro:


Scroll Ignore

Download PDF version of this document.

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Table of Contents

Table of Contents

Overview

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Overview

The Trenz Electronic TE0835 is an extended-grade module based on Xilinx

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Zynq UltraScale+ RFSoC.  The module is equipped with 4x 8Gb DDR4 SDRAM Memory, 2x 512Mb SPI Flash Memory, USB2.0, Ethernet Transceiver and 2x Samtec Razor Beam Borard to Board (B2B) Connectors. The system controller CPLD is provided by Lattice MachXO2.

The Zynq UltraScale+ RFSoC family integrates key subsystems for multiband, multi-mode cellular radios and cable infrastructure (DOCSIS) into an SoC platform that contains a feature-rich 64-bitquad-core Arm Cortex-A53 and dual-core Arm Cortex-R5 based processing system

Refer to http://trenz.org/te0835-info for the current online version of this manual and other available documentation.


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Notes :

Key Features

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Note:
 'description: Important components and connector or other Features of the module
→ please sort and indicate assembly options

Key Features'  must be split into 6 main groups for modules and mainboards:

  • SoC/FPGA
    • Package: SFVC784
    • Device: ZU2...ZU5*
    • Engine: CG, EG, EV*
    • Speed: -1LI, -2LE,*, **
    • Temperature: I, E,*, **
  • RAM/Storage
    • Low Power DDR4 on PS
      • Data width: 32bit
      • Size: def. 2GB*
      • Speed:***
    • eMMC
      • Data width: 8Bit
      • size: def. 8GB *
    • QSPI boot Flash in dual parallel mode (size depends on assembly version)
      • Data width: 8bit
      • size: def. 128MB *
    • HyperRAM/Flash (optional, default not assembled)
      • size:*
    • MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48)
  • On Board
    • Lattice LCMXO2
    • PLL SI5338
    • Gigabit Ethernet transceiver PHY (Marvell Alaska 88E1512)
    • Hi-speed USB2 ULPI transceiver with full OTG support (Microchip USB3320C)
  • Interface
    • 132 x HP PL I/Os (3 banks)
    • ETH
    • USB
    • 4 GTR (for USB3, Sata, PCIe, DP)
    • MIO for UART
    • MIO for SD
    • MIO for PJTAG
    • JTAG
    • Ctrl
  • Power
    • 3.3V-5V Main Input
    • 3.3V Controller Input
    • Variable Bank IO Power Input
  • Dimension
    • 4 cm x 5 cm
  • Notes
    • * depends on assembly version
    • ** also non low power assembly options possible
    • *** depends on used U+ Zynq and DDR4 combination


Key Features'  must be split into 6 main groups for carrier:

  • Modules
    • TE0808

...

  • E.g. SDRAM, SPI

...

  • E.g. CPLD, PLL

...

  • E.g. ETH, USB, B2B, Display port

...

  • E.g. Input supply voltage

...

    • , TE807, TE0803,...
  • RAM/Storage

    ...

      • E.g. SDRAM, SPI
    • On Board
    • Lattice MachXO2  CPLD
    • Programmable Clock Generator
    • 3x Oscillators

    ...

    • 2x Samtec ST5 (2x80 pol) Board to Board Connectors

    ...

    • 5V Input Supply Voltage

    ...

    • 90 x 65 mm
      • E.g. CPLD, PLL
    • Interface
      • E.g. ETH, USB, B2B, Display port
    • Power
      • E.g. Input supply voltage
    • Dimension



    Excerpt
    • SoC/FPGA
      • Package: FFVE1156, FSVE1156
      • Device: ZU25, ZU27, ZU28, ZU43, ZU47, ZU48*
      • Engine: DR
      • Speed: -1, -L1, -2, -L2
      • Temperature: E, I*
    • RAM/Storage
      • 4x 8Gb DDR4 
      • 2x 512Mb SPI Flash
      • 2k I2C EEPROM
    • On Board
      • Lattice MachXO2  CPLD
      • Programmable Clock Generator
      • USB2.0 Transceiver
      • Gigabit Ethernet Transceiver
      • 3x Oscillators
      • 4x User LEDs
    • Interface
      • 2x Samtec Razor Beam ST5 (2x80 pol) Board to Board Connectors
    • Power
      • 5V Input Supply Voltage
    • Dimension
      • 90 x 65 mm
    • Note
      • * Different packages, speed and temperature range are available on assembly options

    Block Diagram

    Block Diagram

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    Note

    For more information regarding how to draw a diagram, Please refer to "Diagram Drawing Guidline" .

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    titleTE0835 block diagram

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    Notes :

    • Picture of the PCB (top and bottom side) with labels of important components
    • Add List below

    add drawIO object here.

    Note

    For more information regarding how to

    ...

    draw a diagram, Please refer to "Diagram Drawing Guidline" .



    Scroll Title
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    BD
    titleTE0835

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    block diagram


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    2x SPI Flash

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    Configuration Signals

    640


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    1. Xilinx UltraScale+ RFSoC XCZU25DR, U1
    2. 8Gb DDR4 SDRAM, U2,U3,U5,U9
    3. Voltage Regulators, U4,U6,U7
    4. Programmable Glock Generator, U15
    5. Lattice MachXO2 CPLD, U31
    6. Dual SPI Flash, U24-U25
    7. USB2.0 Transceiver, U11
    8. Pin Header 3x1, J3 (not Soldered)
    9. Gigabit Ethernet Transceiver, U20
    10. EEPROM, U23
    11. B2B Connector, J2
    12. B2B Connector, J1

    Initial Delivery State

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    Notes :

    Only components like EEPROM, QSPI flash can be initialized by default at manufacture.

    If there is no components which might have initial data ( possible on carrier) you must keep the table empty

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    anchorTable_OV_IDS
    titleInitial delivery state of programmable devices on the module

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    Storage device name

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    Content

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    Notes

    Image Added


    Main Components

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    Notes :

    • Picture of the PCB (top and bottom side) with labels of important components
    • Add List below


    Note

    For more information regarding how to add board photoes, Please refer to "Diagram Drawing Guidline" .



    Scroll Title
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    titleTE0835 main components


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    1. Xilinx UltraScale+ RFSoC, U1
    2. 8Gb DDR4 SDRAM, U2,U3,U5,U9
    3. Voltage Regulators, U4,U6,U7
    4. User Red LEDs, D2...5
    5. Error/Status Red LEDs, D6...7
    6. Programmable Glock Generator, U15
    7. Lattice MachXO2 CPLD, U31
    8. Dual SPI Flash, U24-U25
    9. USB2.0 Transceiver, U11
    10. Pin Header 3x1, J3 (not Soldered)
    11. Green LED, D1
    12. Gigabit Ethernet Transceiver, U20
    13. EEPROM, U23
    14. B2B Connectors, J1
    15. B2B Connectors, J2

    Initial Delivery State

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    ...

    • Overview of Boot Mode, Reset, Enables.

    ...

    Notes :

    Only components like EEPROM, QSPI flash can be initialized by default at manufacture.

    If there is no components which might have initial data ( possible on carrier) you must keep the table empty


    Scroll Title
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    title

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    Initial delivery state of programmable devices on the module

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    MODE[0:3]

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    0000

    ...

    PS_JTAG

    ...

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    Storage device name

    Content

    Notes

    2x SPI Flash

    Not Programmed


    System Controller CPLDProgrammed
    EEPROMNot Programmed
    4x DDR4 SDRAMNot Programmed
    Programmable Clock GeneratorNot Programmed


    Configuration Signals

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    • Overview of Boot Mode, Reset, Enables.

    Configuration must be set through CPLD,U31 by setting MODE0...3 signals.

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    MODE[3:0]

    Boot ModeNote

    0000

    PS_JTAG

    Refer to CPLD Page
    0001Quad SPI FlashRefer to CPLD Page
    0101SD CardRefer to CPLD Page


    The reset pin is active low.

    Scroll Title
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    titleReset process.

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    Signal

    B2BI/ONote

    RESETN

    J1-36InputPulled up to 3.3V_CPLD


    Signals, Interfaces and Pins

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    Notes :

    • For carrier or stand-alone boards use subsection for every connector type (add designator on description, not on the subsection title), for example:
      • SD
      • USB
      • ETH
      • FMC
      • ...
    • For modules which needs carrier use only classes and refer to B2B connector if more than one is used, for example
      • JTAG
      • UART
      • I2C
      • MGT
      • ...

    Board to Board (B2B) I/Os

    FPGA bank number and number of I/O signals connected to the B2B connector:

    Scroll Title
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    FPGA BankB2B ConnectorNumber of I/OsVoltage Level Notes
    Bank 500J112x Single Ended1.8VMIO14...25
    Bank 501J120x Single Ended1.8VMIO26...51
    Bank 505J118x Single Ended, 9x Differential pairs0.85VEXT_CLKIN_PSMGT, RX/TX0...3
    Bank 128J1

    ...

    2x Differnetial CLK Input,

    8x Differential Transceiver

    --B128_CLK, RX/TX0...3
    Bank 129J1

    2x Differnetial CLK Input

    8x Differential Transceiver

    --B129

    ...

    _CLK, RX/TX0...

    ...

    3
    Bank 65J224x Single Ended, 12x Differential pairs1.8VHP Bank
    Bank 88J216x Single Ended, 8x Differential pairs3.3VHD Bank
    ADCJ2

    16x Single Ended, 8x Differential pairs

    4x Differential Clocks

    Variable
    DACJ2

    16x Single Ended, 8x Differential pairs

    3x Differential Clocks

    Variable



    JTAG Interface

    JTAG access to the Xilinx UltraScale+ MPSoC is through B2B connector JM1. JTAG signals routed directly through the CPLD to FPGA. Access between CPLD and FPGA can be multiplexed via JTAGEN (logical one for CPLD, logical zero for FPGA) on B2B. When the CPLD_JTAGEN is 0 or off, it provides FPGA access and when it is 1 or ON, it provides CPLD access.

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    titleJTAG pins connection

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    JTAG Signal

    B2B Connector

    JTAG_TMSJ1-24
    JTAG_TDIJ1-20
    JTAG_TDOJ1-18
    JTAG_TCK

    J1-22


    MIO Pins

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    you must fill the table below with group of MIOs which are connected to a specific components or peripherals, you do not have to specify pins in B2B, Just mention which B2B is connected to MIOs. The rest is clear in the Schematic.

    Example:

    MIO PinConnected toB2BNotes
    MIO12...14

    SPI_CS , SPI_DQ0... SPI_DQ3

    SPI_SCK

    J2QSPI



    Scroll Title
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    titleMIOs pins

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    MIO PinConnected toB2BNotes
    MIO0...12SPI FLash, U24-U25-Dual SPI FLash
    MIO13LED Green, D1-3.3V_CPLD
    MIO14...25FPGA Bank 500,U1J1PSMIO
    MIO26...27FPGA Bank 501,U1J1PSMIO
    MIO28...29CPLD, U31-

    UART_TX, UART_RX

    MIO30...31FPGA Bank 501, U1J1PSMIO
    MIO32...33EEPROM,U23-I2C_SCL, I2C_SDA
    MIO34...35FPGA Bank 501,U1J1PSMIO
    MIO36Gigabit ETH, U20-ETH_RST
    MIO37USB2.0, U11-USB_RST
    MIO38...51FPGA Bank 501, U1J1PSMIO
    MIO52...62USB2.0, U11-USB
    MIO63...77Gigabit ETH, U20-ETH


    Test Points

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    you must fill the table below with group of Test Point which are indicated as TP in a schematic. If there is no Test Point remarked in the schematic, delet the Test Point section.

    Example:

    Test PointSignalB2BNotes
    10PWR_PL_OKJ2-120



    Scroll Title
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    titleTest Points Information

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    Test PointSignalConnected toNotes
    TP1CLKOUTVoltage Regulator, U7
    TP2PLL_RSTNProgrammable Clock Generator, U15

    ...

    ...


    TP4CPLD_JTAGEN

    B2B, J1

    CPLD, U31


    TP5JTAG_TDO

    B2B, J1

    CPLD, U31


    TP6JTAG_TDI

    B2B, J1

    CPLD, U31


    TP7JTAG_TCK

    B2B, J1

    CPLD, U31


    TP8JTAG_TMS

    B2B, J1

    CPLD, U31


    TP9GNDGND
    TP10...11

    IO_L1P_AD15P_88, 

    O_L4N_AD12N_88

    FPGA Bank 88, U1
    TP12VINB2B, J1
    TP13...14GNDGND
    TP15...16MIO32-MIO33

    EEPROM,U23

    FPGA Bank 501, U1


    TP17GNDGND
    TP18ADC_AVCCLDO Voltage Regulator, U8
    TP19ADC_AVCCAUXLDO Voltage Regulator,

    ...

    U10
    TP203.3V_CPLD

    CPLD, U31

    B2B, J1


    T21CPLD_JT AGEN

    B2B, J1

    CPLD, U31




    On-board Peripherals

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    Notes :

    • add subsection for every component which is important for design, for example:
      • Two 100 Mbit Ethernet Transciever PHY
      • USB PHY
      • Programmable Clock Generator
      • Oscillators
      • eMMCs
      • RTC
      • FTDI
      • ...
      • DIP-Switches
      • Buttons
      • LEDs


    Page properties
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    Notes :

    In the on-board peripheral table "chip/Interface" must be linked to the corresponding chapter or subsection


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    Chip/InterfaceDesignatorNotes

    ...


    Quad SPI Flash Memory

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    Notes :

    Minimum and Maximum density of quad SPI flash must be mentioned for other assembly options.

    The TE0835 is a Dual SPI Flash module equipped with two SPI Flash U24, U25 connecfted to PSMIO FPGA bank 500.

    Scroll Title
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    titleQuad SPI interface MIOs and pins

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    MIO PinSchematicU24 PinU25 PinNotes
    MIO0MIO0_QSPICLK-
    MIO1MIO1_QSPIDO-
    MIO2MIO2_QSPInWP-
    MIO3MIO3_QSPInHOLD-
    MIO4MIO4_QSPIDI-
    MIO5MIO5_QSPInCS-
    MIO7MIO5_QSPI-nCS
    MIO8MIO5_QSPI-DI
    MIO9MIO5_QSPI-DO
    MIO10MIO5_QSPI-nWP
    MIO11MIO5_QSPI-nHOLD

    ...

    System Controller CPLD

    The System Controller CPLD (U31) is provided by Lattice Semiconductor LCMXO2-460HC. The  SC-CPLD is the central system management unit where essential control signals are logically linked by the implemented logic in CPLD firmware, which generates output signals to control the system, the on-board peripherals and the interfaces. Interfaces like JTAG / UART and I2C between the on-board peripherals and the attached module are by-passed, forwarded and controlled by the System Controller CPLD.

    ...


    MIO12MIO5_QSPI-CLK


    System Controller CPLD

    The System Controller CPLD (U31) is provided by Lattice Semiconductor LCMXO2-460HC. The  CPLD provides JTAG routing, boot mode, User IOs, LEDs, firmware and power management access. For more information please refer to the TE0835 CPLD page. 

    Scroll Title
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    titleUSB2.0 interface connections and pins

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    Schematic/PinConnected toDescriptionNote
    MODE0...3FPGA Bank 503, U1Boot Mode
    POR_BFPGA Bank 503, U1Programming StatusPulled up
    PORG_BFPGA Bank 503, U1Programming StatusPulled up
    INIT_BFPGA Bank 503, U1Configuration initializationPulled up
    DONEFPGA Bank 503, U1Configuration Done StatusPulled up
    F_TCKFPGA Bank 503, U1FPGA JTAG
    F_TDIFPGA Bank 503, U1FPGA JTAG
    F_TMSFPGA Bank 503, U1FPGA JTAG
    F_TDOFPGA Bank 503, U1FPGA JTAG
    JTAG_TDOB2B, J1CPLD JTAG
    JTAG_TMSB2B, J1CPLD JTAG
    JTAG_TDIB2B, J1CPLD JTAG
    JTAG_TCKB2B, J1CPLD JTAG
    CPLD_JTAGENB2B, J1CPLD JTAG Enable
    CPLDIO0...3B2B, J1CPLD IOs
    RESETNB2B, J1Reset
    MIO13LED Green, D13.3V_CPLD
    MIO28FPGA Bank 501, U1UART_TX
    MIO29FPGA Bank 501, U1UART_RX
    FPGA_IO0...1FPGA Bank 65, U1IOs
    EN_PS_PLVoltage Regulators, U6, U7, U29PS/PL Enable SignalsPulled Down
    EN_GR1Voltage Regulators, U19, U27, U28MGTAVTT, PSLL Pulled Down
    EN_GR2Voltage Regulators, U38, U18, U38PS_MGTRAVTT, 3.3, DDR2.5VPulled Down
    EN_RF_ADCVoltage Regulators, U8Enable ADCPulled Down
    PG_RF_DACVoltage Regulators, U17ADC Power Good Status Pulled Down
    PG_PS_PLVoltage Regulators, U6, U7, U29PS/PL Power Good Status Pulled Down
    EN_RF_DACVoltage Regulators, U13Enable DACPulled Down
    PG_RF_DACVoltage Regulators, U10DAC Power Good Status Pulled Down


    USB2.0

    The TE0835 is equipped with a USB2.0, U11. 

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    U11 PinSchematicConnected toNotes
    RESETBUSB0_RSTFPGA Bank 501, U1
    VDDIO1.8V1.8V
    CPENUSB0_CPEB2B, J1
    VBUSUSB0_VBUSB2B, J1
    IDUSB0_IDB2B, J1
    DPUSB0_D_PB2B, J1
    DMUSB0_D_NB2B, J1
    REFCLKUSB_CLKOschillator, U12
    STPUSB0_STPFPGA Bank 502, U1
    NXTUSB0_NXTFPGA Bank 502, U1
    DIRUSB0_DIRFPGA Bank 502, U1
    CLKOUTUSB_CLKOschillator, U12
    DATA0...7USB0_DATA0...8FPGA Bank 502, U1


    Ethernet

    The module TE0835 is equipped with a Gigabit Ethernet Transceiver, U20.

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    U20 PinSignal NameConnected toSignal DescriptionNote
    MDIOETH_MDIOFPGA Bank 502, U1Data Management
    MDCETH_MDCFPGA Bank 502, U1Data Management clock reference for the serial interface
    TX_CLKETH_TXCKFPGA Bank 502, U1Transmit Clock
    TX_CTRLETH_TXCTLFPGA Bank 502, U1Transmit Control
    TXD0...3ETH_TXD0...3FPGA Bank 502, U1Transmit Data
    RX_CLKETH_RXCKFPGA Bank 502, U1Receive Clock
    RX_CTRLETH_RXCTLFPGA Bank 502, U1Receive Control
    RXD0...3ETH_RXD0...3FPGA Bank 502, U1Receive Data
    RESETnETH_RSTFPGA Bank 501, U1Ethernet reset, Active low.
    XTAL_INETH_XTAL_INOscillator, U21Reference Clock

    MDI0...3

    PHY_MDI0...3B2B, J1Media Dependent Interface 0...3
    LED0...1PHY_LED0...1B2B, J1LED output
    LED/INTPHY_LED2B2B, J1LED interrupt


    EEPROM

    The module TE0835 has an EEPROM IC (U23) connected to PSMIO FPGA Bank 501.

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    MIO PinSchematicU23 PinNotes
    MIO32MIO32_I2C1_SCLSCL
    MIO33MIO33_I2C1_SDASDA



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    titleI2C address for EEPROM

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    MIO PinI2C AddressDesignatorNotes
    MIO32...330xA1U23


    LEDs

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    DesignatorColorConnected toActive LevelNote
    D1GreenMIO13Active High3.3V CPLD
    D2...5RedDBG_LED0...3Active

    ...

    LowUser LED
    D6RedERR_OUTActive High
    D7RedERR_STATUSActive High


    DDR4 SDRAM

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    Notes :

    Minimum and Maximum density of DDR3 SDRAM must be mentioned for other assembly options. (pay attention to supported address length for DDR3)

    The TE0835 SoM has 4x 1 Gigabyte volatile DDR4 SDRAM IC for storing user application code and data.

    • Part number: K4A8G165WB
    • Supply voltage: 1.2 V
    • Speed: 2400 Mbps

    • Temperature: -40 ~ 95 °C

    Clock Sources

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    Oscillators

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    DesignatorDescriptionFrequencyNote
    U14, U21MEMS Oscillator25MHz
    U22MEMS Oscillator33.33 MHz
    Y1Crystal Oscillator54 MHz
    U12MEMS Oscillator52MHz
    U15Programmable Clock GeneratorVariable


    Programmable Clock Generator

    There is a Silicon Labs I2C programmable clock generator on-board (U10) in order to generate reference clocks for the module. Programming can be done using I2C via PIN header J3.  The I2C Address is 0x69.

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    U15 Pin
    SignalConnected toDirectionNote

    IN0

    IN0_P

    Oscillator, U14Input
    IN1-N.C-
    IN2EXT_CLK_IN1B2B,J2Input
    IN3-N.C

    nRST

    PLL_RSTN

    FPGA Bank 65,U1Input
    SCLMIO32_I2C1_SCLPin Header, J3InputI2C
    SDAMIO33_I2C1_SDAPin Header,

    ...

    J3InputI2C
    OUT0

    CLKC

    B2B,J2Output

    Differential Clock

    OUT1CLKBB2B,J2OutputDifferential Clock
    OUT2CLKAB2B,J2OutputDifferential Clock
    OUT3CLKDB2B,J2OutputDifferential Clock
    OUT4CLKEB2B,J2OutputDifferential Clock
    OUT5CLKF

    ...

    B2B,J2Output

    ...

    Differential

    ...

    Clock
    OUT6B128_CLK0FPGA Bank 128,U1Output
    OUT7B129_CLK0FPGA Bank 129,U1Output
    OUT8CLK8FPGA Bank 65,U1Output
    OUT9PSMGT_100MHZFPGA Bank 505,U1Output
    OUT9ACLK0A_100MHZB2B, J1Output


    Power and Power-On Sequence

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    In 'Power and Power-on Sequence' section there are three important digrams which must be drawn:

    • Power on-sequence
    • Power distribution
    • Voltage monitoring circuit


    Note

    For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .


    Power Supply

    Power supply with minimum current capability of 2.5A for system startup is recommended.

    Power Consumption

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    Power Input PinTypical Current
    VIN (5V)TBD*


    * TBD - To Be Determined

    Power Distribution Dependencies

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    titlePower Distribution


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    Power Rails

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    Power Rail Name

    B2B Connector

    ...

    B2B  J1 Pin

    B2B Connector

    B2B  J2 Pin

    DirectionNotes
    VIN1,2,3,4,5,6,8-Input
    PSBATT14-Input
    3.3V_CPLD16-Output


    Bank Voltages

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    titleZynq SoC bank voltages.

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    Bank          

    Schematic Name

    Voltage

    Notes
    Bank 65 HPVCCO_651.8V
    Bank 503 PSCONFIG

    VCCO_PSIO3_503

    1.8V
    Bank 88 HDVCCO_883.3V

    ...


    Bank 128

    ...

    GTYMGTAVCC0.9V

    ...


    Bank 129 GTYMGTAVCC0.9V

    ...


    Bank 500 PSMIOVCCO_PSIO0_5001.8V

    ...


    Bank 501 PSMIOVCCO_PSIO0_5011.8V

    ...


    Bank 502VCCO_PSIO0_5021.8V

    ...


    Bank 504 PSDDRVCCO_PSDDR_5041.2V

    ...


    Bank 505 PSGTRPS_MGTRAVCC0.85V



    Board to Board Connectors

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    • This section is optional and only for modules.
    • use "include page" macro and link to the general B2B connector page of the module series,

      For example: 6 x 6 SoM LSHM B2B Connectors

      Include Page

    ...

    • 6 x 6 SoM LSHM B2B Connectors

    ...

    • 6 x 6 SoM LSHM B2B Connectors

    The TE0835 has two Samtec Razor Beam on the bottom side.

    Include Page

    ...

    DRAFT:6.5 x

    ...

    9 SoM SS5/ST5 B2B Connectors

    ...

    DRAFT:

    ...

    6.5 x

    ...

    9 SoM SS5/ST5 B2B Connectors

    Technical Specifications

    Absolute Maximum Ratings

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    titlePS absolute maximum ratings

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    SymbolsDescriptionMinMaxUnit
    VINInput Supply Voltage05V
    T_STGStorage Temperature-40

    ...

    95°C


    Recommended Operating Conditions

    Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

    Scroll Title
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    ParameterMinMaxUnitsReference Document
    VIN4.55.5VSee Schematic

    ...

    T_OPR

    ...

    -4085°C

    See

    ...

    USB2.0 Datasheet

    see USB3320  Datasheet


    Physical Dimensions

    • Module size: 90 mm × 65 mm.  Please download the assembly diagram for exact numbers.

    • Mating height with standard connectors: 7 mm.

    PCB thickness: 1.65 mm.

    Page properties
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    In 'Physical Dimension' section, top and bottom view of module must be inserted, information regarding physical dimensions can be obtained through webpage for product in Shop.Trenz, (Download> Documents> Assembly part) for every SoM.

    For Example: for Module TE0728, Physical Dimension information can be captured by snipping tools from the link below:

    https://www.trenz-electronic.de/fileadmin/docs/Trenz_Electronic/Modules_and_Module_Carriers/5.2x7.6/TE0745/REV02/Documents/AD-TE0745-02-30-1I.PDF

    Note

    For more information regarding how to draw diagram, Please refer to "Diagram Drawing Guidline" .



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    titlePhysical Dimension


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    Currently Offered Variants 

    Page properties
    hiddentrue
    idComments

    Set correct link to the shop page overview table of the product on English and German.

    Example for TE0728:

        ENG Page: https://shop.trenz-electronic.de/en/Products/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/

        DEU Page: https://shop.trenz-electronic.de/de/Produkte/Trenz-Electronic/TE07XX-Zynq-SoC/TE0728-Zynq-SoC/

    For Baseboards or modules, where no overview page is available (and revision number is coded in the direct link) use shop search link, e.g. TE0706:

        ENG Page: https://shop.trenz-electronic.de/en/search?sSearch=TE0706

       DEU Page: https://shop.trenz-electronic.de/de/search?sSearch=TE0706


    Scroll Title
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    titleTrenz Electronic Shop Overview

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    Trenz shop TE0835 overview page
    English pageGerman page


    Revision History

    Hardware Revision History

    Page properties
    hiddentrue
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    Set correct links to download  arrier, e.g. TE0706 REV02:

      TE0706-02  ->   https://shop.trenz-electronic.de/Download/?path=Trenz_Electronic/Modules_and_Module_Carriers/4x5/4x5_Carriers/TE0706/REV02/Documents

    Note:

    • Date format:  YYYY-MM-DD


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    titleHardware Revision History

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    DateRevisionChangesDocumentation Link
    2019-11-05REV01Initial ReleaseREV01
    2020-06-17REV02

    1. Added a VRP resistor on bank 65;

    2. LDO U33 is changed on ADP7102ACPZ;

    3. Signal FPGA IO0 is connected on AE18 pin of FPGA;

    4. Signal DBG_LED3 is connected on AD18 pin of FPGA;

    5. Signal MIO13_25 connected to J1 pin 33 instead MIO25.

    6. Resistor R84 is removed;

    7. LED D1 moved on edge of PCB;

    8. Added THT testpoints J4 on CPLD_JTAGEN, R76 was removed;

    9. Signals B49_XX_X are renamed in B88_XX_X;

    10. C241 is changed on 1nF;

    11. Length of CLK signals on RFADC and RFDAC are adjusted;

    12. Wrong connection on U8 is fixed (PCB);

    13. Wrong connection PGOOD1 pin of U7 is fixed;

    14. R17 is changed from 35,5K to 33K for VCC_PL_PS correction.

    REV02



    Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

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    titleBoard hardware revision number.


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    Document Change History

    Page properties
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    • Note this list must be only updated, if the document is online on public doc!
    • It's semi automatically, so do following
      • Add new row below first

      • Copy "Page Information Macro(date)" Macro-Preview, Metadata Version number, Author Name and description to the empty row. Important Revision number must be the same as the Wiki document revision number Update Metadata = "Page Information Macro (current-version)" Preview+1 and add Author and change description. --> this point is will be deleted on newer pdf export template

      • Metadata is only used of compatibility of older exports


    Scroll Title
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    titleDocument change history.

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    DateRevisionContributorDescription

    Page info
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    ...

    • Bugfix Overview Picture
    2021-12-21v.58John Hartfiel
    • Bugfix B2B section
    • Replace GTH with GTY
    2021-05-28v.55John Hartfiel
    • Style update

    • Bugfix PDF Link
    • Key features update
    2020-11-23v.51Pedram Babakhani
    • Update to REV02

    --

    all

    Page info
    infoTypeModified users
    typeFlat
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    • --


    Disclaimer

    Include Page
    IN:Legal Notices
    IN:Legal Notices


    Custom_fix_page_content


    Scroll pdf ignore

    Table of Contents

    Table of Contents