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Overview

The TE0960 is a development board for AMD Versal AI Edge Gen 2 SoCs which supports three LPDDR5 chips, UFS storage and QSPI flash. It supports a M.2 M key device, a microSD card, two Ethernet PHYs via RJ45 connectors and offers three USB Type C for high speed data exchange, DisplayPort over USB, High Speed Debug Port and USB 2.0/OTG. 
Additional IOs are accessible via SFC / FPC connectors, Pmods and pin headers. It offers a PWM Fan header for cooling and multiple DIP switches, buttons and LEDs.

Refer to https://trenz.org/te0960-info for current online available documentation.

Key Features

  • SoC
    • AMD Versal AI Edge Gen 2 1): XC2VE3304 / XC2VE3358 / XC2VE3504 / XC2VE3558
    • Speedgrade 1):                        -1 / -2
    • Temperature Range 1):            E / I
    • Voltage 1) :                              -L / -M
    • Package 1):                              SSVA1440 / SFVA1440
  • RAM/Storage
    • 3x 32 GBit LPDDR5 SDRAM 2) 
    • up to 2 GBit QSPI Flash (with XiP support) 2) 
    • up to 512 GByte UFS storage 2) 
    • 3x EEPROM with unique EUI-48 ™ / MAC address
    • 128 Kbit EEPROM
    • EEPROM with FTDI programmer configuration
  • Interfaces
    • Programming / AMD HSDP
      • 1x USB Type C
      • High-Speed Debug Port (HSDP) / 1x MGT lane
      • USB 2.0 to JTAG/UART bridge
      • EEPROM for JTAG/UART bridge with programmer configuration
      • ESD protection on USB 2.0 and USB HSDP lines
      • LED status signalling - 2x UART / 1x voltage - all green
      • Shared oscillator with CLK generator
    • USB 3.x with DisplayPort support
      • 1x USB Type C
      • Port controller
      • Pin Header for I2C connection to USB 3.x port controller
      • ESD protection
    • USB 2.0/OTG
      • 1x USB Type C
      • Oscillator
      • 1x over current LED - red
      • ESD protection
      • 2x4 pin header for USB 3.x port controller I2C configuration
    • Ethernet Interfaces
      • 2x 10/100/1000 BASE-T/X ETH PHYs with IEEE 802.3 and 1588v2/PTP support
      • 2x RJ45 MagJack Ethernet with 2x status LEDs - all green
      • zSFP+ connector
    • Storage Media
      • MicroSD socket with voltage enable, selectable voltage and card detect
      • M.2 M key socket with PCIe x2
      • PCIe common oscillator for M.2 socket
    • Extension interfaces
      • CRUVI GTX - with LS and HS signals:
        • 24x SE / 12x DIFF
        • 8x SE
        • 4x control, I2C, 12 V and 3.3 V
      • CRUVI GTX - with LS / HS and GTX 3) signals:
        • 24x SE / 12x DIFF 3)
        • 4x MGT (RX/TX) and 1x CLK
        • 8x SE
        • 4x control, I2C, 12 V and 3.3 V
      • 2x / 4x 3) FFC/FPC connectors for CSI/DSI/MIPI with each:
        • 10x SE / 5x DIFF
        • 2x GPIO
        • I2C and 3.3 V
      • 2x Pmod for combined 16x SE / 8x DIFF 3) with ESD protection
      • CAN
        • 2x 2x5 box header for CAN
        • 2x CAN transceiver with fault flag and silent mode
        • ESD protection for signal lines
  • On Board
    • Trusted platform module 2.0 with presence/detection button
    • Clocks for SoC PL, SoC PS, LPDDR5, UFS storage, ETH PHYs, M.2
    • Programmable PLL with 2x Oscillators
    • 4x pin header for PLL I2C
    • 2x17 pin header - 20x SE / 10x DIFF 3)
    • LEDs:
      • 1x status 12.0 V supply - green
      • 3x status SoC
        • POR_B - LED - green
        • DONE - LED - green
        • ERROR_OUT - LED - red
      • 1x status M.2 activity - green
      • 4x User LED - green
    • Button:
      • 1x Reset
      • 2x User
    • DIP Switch:
      • 2x User
      • 1x Power Off
      • 4x Boot Mode Setup
    • Jumper for:
      • USB 3.x port controller I2C voltage setup
      • SoC Fuse Programming
      • CAN termination
  • Cooling
    • Programmable fan controller with ambient temperature sensor
    • 4x pin header for 12 V PWM fan
  • Power
    • Single Rail 12.0 V power supply - Molex Mini-Fit 6 pins 4)
    • Supply protection - Over- & Under- voltage, Reverse polarity and fuse
    • I2C interface for most DCDCs
    • Monitoring for most voltage rails
    • Current and voltage monitoring for LPDDR5 voltages
    • Backup battery holder - CR1220 / 3.0 V lithium
  • Dimension
    • 150.00 mm x 200.00 mm
    • Enclosure ready
  • Notes
    1) Available as assembly variant or upon request.
    2) Other pin/package-compatible sizes/devices upon request.
    3) Only for variants with XC2VE35xx.
    4) Consider to use proper pinout.


Block Diagram


TE0960 block diagram

Main Components

TE0960 main components
  1. AMD Versal AI Edge Gen 2 SoC, U1
  2. LPDDR5 SDRAM, U2, U3, U4
  3. NOR flash, U5
  4. UFS storage, U15
  5. TPM 2.0, U44
  6. Programmable PLL, U42
  7. Ethernet PHYs, U24, U28
  8. USB 2.0/OTG PHY, U31
  9. USB 3.x channel control logic, U14
  10. Fan controller, U47
  11. 4x user LEDs - green, D1, D2, D3, D4
  12. 1x status LED 12.0 V supply - green, D22
  13. 3x status LEDs SoC - POR_B, DONE and ERROR_OUT - 2x green and red, D7, D6, D5
  14. 3x status LEDs programmer: 2x UART - green / 1x voltage - green, D18, D19, D20
  15. 1x status LED USB 3.x over current - red, D9
  16. 1x status LED M.2 activity - green, D8
  17. MicroSD socket, J15
  18. M.2 M key socket with PCIe x2, U19
  19. zSFP+ 1xN connector, J5
  20. 2x RJ45 mag-jack ethernet with 2x status LEDs, J6, J7
  21. 1x USB type C for programming and debugging, J24
  22. 1x USB type C for data transfers and DisplayPort, J2
  23. 1x USB type C for data transfers / USB 2.0/OTG, J8
  24. 2x Pmod for combined 16x SE / 8x DIFF 1), J21, J22
  25. 2x17 pin header - 20x SE / 10x DIFF 1), J1
  26. CRUVI GTX - with LS / HS and GTX 1) signals, J9
  27. CRUVI GTX - with LS and HS signals, J10
  28. 2x / 4x 1) FFC/FPC connectors for CSI/DSI/MIPI, J11, J12, J13 1), J14 1)
  29. 2x5 box header for CAN, J16, J18
  30. 2x3 pin header for CAN termination, J17, J19
  31. 2x4 pin header for USB 3.x port controller I2C, J3
  32. 4x pin header for PLL I2C, J20
  33. 4x pin header for 12 V PWM fan, J23
  34. Button TPM presence detection, S8
  35. Buttons: 2x user definable, S3, S5
  36. Buttons: reset, S11
  37. DIP switches - 2x user definable, 1x module power, 1x not connected, S1
  38. Buttons for enclosure: 2x user definable, S4, S6
  39. Buttons for enclosure: reset, S10
  40. DIP switches for enclosure: 2x user definable, S2
  41. DIP switches for enclosure: 1x module power, 1x not connected, S9
  42. DIP switches - 4x boot mode, S7
  43. Jumper SoC OTP storage VCC_FUSE voltage, J4
  44. Molex Mini-Fit 6 pin socket - 12.0 V power supply, J25
  45. Backup battery holder, B1

Notes
1) Only on SoC 35xx variants

Initial Delivery State

Storage device name

Designator

Content

Notes

SoC

U1

Not programmed


UFS

U15

Not programmed


QSPI Flash

U22

Not programmed


TPM 2.0

U44

Firmware by the manufacturer.


Programmable PLL

U42

Programmed - I2C overwriting possible

OUT0 :  156¼ MHz
OUT1 :    26 MHz
OUT2 :    24 MHz
OUT3:   156¼ MHz
OUT4 :  156¼ MHz
OUT5 :  156¼ MHz

EEPROM with MAC

U23 / U25 / U29

MAC is burned-in by the manufacturer.


EEPROM

U6

Not programmed


EEPROM

U51

Programmer configuration.

Do not overwrite!

Initial delivery state of programmable devices

Signals, Interfaces and Pins

Connectors

Connector Type

Designator

Interface

IO count

Notes

2x17 pin header

J1

HDIO

6x SE / 3x DIFF

Only on 35xx SoC variants.

3.3 V - Bank 401.

2x17 pin header

J1

HDIO

14x SE / 7x DIFF

Only on 35xx SoC variants.

3.3 V - Bank 403

CRUVI GTX

J9

HS / X5IO

24x SE / 12x DIFF

Only on 35xx SoC variants.

1.2 V - Bank 706

FFC / FPC

J13

X5IO

10x SE / 5x DIFF / 5x MIPI lanes

Only on 35xx SoC variants.

1.2 V - Bank 707

FFC / FPC

J13

HDIO

2x SE

Only on 35xx SoC variants.

3.3 V - Bank 403

FFC / FPC

J13

I2C / HDIO

2x SE

Only on 35xx SoC variants.

3.3 V - Bank 403

FFC / FPC

J14

X5IO

10x SE / 5x DIFF / 5x MIPI lanes

Only on 35xx SoC variants.

1.2 V - Bank 707

FFC / FPC

J14

HDIO

2x SE

Only on 35xx SoC variants.

3.3 V - Bank 403

FFC / FPC

J14

I2C / HDIO

2x SE

Only on 35xx SoC variants.

3.3 V - Bank 403

Pmod

J21

HDIO

8x SE / 4x DIFF

Only on 35xx SoC variants.

3.3 V - Bank 401

Pmod

J22

HDIO

8x SE / 4x DIFF

Only on 35xx SoC variants.

3.3 V - Bank 401

USB type C

J2

USB 3.x / MGT

4x GTR (RX/TX)

Bank 504

USB type C

J2

USB 2.0

1x DIFF

Bank 504

USB type C

J2

USB SBU

2x SE

Bank 504

USB type C

J2

USB CC

2x SE

Bank 504

3x pin header

J4

FUSE programming

1x SE


zSFP+

J5

MGT

1x GTYP (RX/TX)

Bank 105

zSFP+

J5

I2C

2x SE


RJ45

J6

Ethernet

4x DIFF


RJ45

J7

Ethernet

4x DIFF


USB type C

J8

USB 2.0/MIO

1x DIFF


CRUVI GTX

J9

LS / HDIO

8x SE

3.3 V - Bank 401/402 1)

CRUVI GTX

J9

MGT

4x GTYP (RX/TX)

Bank 203/205

CRUVI GTX

J9

MGT CLK

1x DIFF

Bank 203/205

CRUVI GTX

J9

I2C / HDIO

2x SE

3.3 V - Bank 401/402 1)

CRUVI GTX

J10

HS/X5IO

24x SE / 12x DIFF

1.2 V - Bank 706/708 1)

CRUVI GTX

J10

LS / HDIO

8x SE

3.3 V - Bank 400

CRUVI GTX

J10

I2C / HDIO

2x SE

3.3 V - Bank 400

FFC / FPC

J11

X5IO

10x SE / 5x DIFF / 5x MIPI lanes

1.2 V - Bank 707/709 1)

FFC / FPC

J11

HDIO

2x SE

3.3 V - Bank 400

FFC / FPC

J11

I2C / HDIO

2x SE

3.3 V - Bank 400

FFC / FPC

J12

X5IO

10x SE / 5x DIFF / 5x MIPI lanes

1.2 V - Bank 707/709 1)

FFC / FPC

J12

HDIO

2x SE

Bank 400

FFC / FPC

J12

I2C / HDIO

2x SE

Bank 400

µSD socket

J15

SDIO

6x SE

Bank 500

2x5 box header

J16

CAN

1x DIFF

Bank 501

2x5 box header

J17

CAN

1x DIFF

Bank 501

M.2 M key

U19

PCIe

2x GTYP (RX/TX)

Bank 105

4x pin header

J23

PWM fan

GND / 12 V / Speed / PWM


USB type C

J24

HSDP / MGT

1x GTYP (RX/TX)

Bank 105

USB type C

J24

JTAG

USB 2.0

Bank 503

USB type C

J24

UART

USB 2.0

Bank 501

Notes
1) Bank number depends on SoC assembly variant.

Board connectors

Test Points

Test

Point

REV01


Top

Bottom

Signal

Notes

TP1

x


12V0_IN


TP2


x

12V0_IN


TP3

x


12V_IN_FUSED


TP4


x

12V_IN_FUSED


TP5

x


12V0


TP6


x

12V0


TP7

x


12V0_FAN


TP8


x

12V0_FAN


TP9

x


5V0


TP10


x

5V0


TP11

x


5V0_VIN_FTDI


TP12


x

5V0_VIN_FTDI


TP13

x


5V0_VBUS_FTDI


TP14


x

5V0_VBUS_FTDI


TP15

x


5V0_USB


TP16


x

5V0_USB


TP17

x


USB2_5V0


TP18


x

USB2_5V0


TP19

x


3V3_PS


TP20


x

3V3_PS


TP21

x


3V3_PL


TP22


x

3V3_PL


TP23

x


3V3_VDD_FTDI


TP24


x

3V3_VDD_FTDI


TP25

x


2V5


TP26


x

2V5


TP27

x


V_SD_IO


TP28


x

V_SD_IO


TP29

x


1V8


TP30


x

1V8


TP31

x


1V8_LPDDR5


TP32


x

1V8_LPDDR5


TP33

x


1V5


TP34


x

1V5


TP35

x


1V5_A


TP36


x

1V5_A


TP37

x


1V2


TP38


x

1V2


TP39

x


1V2_A


TP40


x

1V2_A


TP41

x


1V1


TP42


x

1V1


TP43

x


1V0XX_LPDDR5


TP44


x

1V0XX_LPDDR5


TP45

x


1V0


TP46


x

1V0


TP47

x


0V92


TP48


x

0V92


TP49

x


0V8_VCCRAM


TP50


x

0V8_VCCRAM


TP51

x


VCC_LPD


TP52


x

VCC_LPD


TP53

x


VCC_FPD


TP54


x

VCC_FPD


TP55

x


VCC_SOC


TP56


x

VCC_SOC


TP57

x


VCCINT


TP58


x

VCCINT


TP59

x


VCC_AIE


TP60


x

VCC_AIE


TP61

x


0V5_LPDDR5


TP62


x

0V5_LPDDR5


TP63

x


VCC_BATT


TP64


x

VCC_BATT


TP65

x


O2


TP66

x


O1


TP67

x


O3


TP68

x


SEL


TP69

x


CON_DET


TP70

x


F_UART_TX


TP71

x


F_UART_RX


TP72

x


FAULT_n


Test points information

On-board Peripherals

Chip / Interface

Designator

Connected to

Notes

SoC

U1

  • QSPI Flash U5
  • LPDDR5 U2, U3, U4
  • UFS storage U15
  • MicroSD socket J15
  • M.2 M key PCIe x2 socket U19
  • Ethernet PHYs U24, U28
  • zSFP+ slot J5
  • USB 3.x port controller U14
  • USB 2.0/OTG PHY U31
  • USB 2.0 to JTAG/UART bridge U49
  • USB type C for data and DisplayPort J2
  • PCIe common OSC U22
  • Programmable PLL U42
  • I2C switch U45
  • I2C / SMBUS switch U56
  • CAN transceivers U40, U41
  • Oscillators U7, U8
  • 4x user definable LEDs D1, D2, D3, D4
  • CRUVI GTX - with LS / HS and GTX 1) signals J9
  • CRUVI GTX - with LS and HS signals J10
  • 2x / 4x 1) FFC/FPC connectors for CSI/DSI/MIPI J11, J12, J13 1), J14 1)
  • Pmods 1) J21, J22
  • User buttons S3, S5 and S4, S5
  • 2x DIP switches user definable S1
  • 4x DIP switches boot mode S7
  • Jumper SoC FUSE Programming voltage J4

QSPI Flash

U5

  • SoC U1


LPDDR5

U2, U3, U4

  • SoC U1


UFS storage

U15

  • SoC U1
  • Clock Buffer U17 / Oscillator U18


µSD socket

J15

  • SoC U1
  • Power regulator U36
  • SDIO level shifter U37


USB 3.x port controller

U14

  • SoC U1 bank GTR 504
  • 2x4 pin header - I2C signals and voltage select J3
  • USB Type C J2


Ethernet PHYs

U24 / U28

  • SoC U1
  • Oscillator U26
  • RJ45 magnetic jack J6, J7


USB 2.0/OTG PHY

U31

  • SoC U1
  • Oscillator U32
  • VBUS current limiting switch U33
  • USB Type C J8


USB 2.0 to JTAG/UART bridge

U49

  • EEPROM U51
  • Oscillator U52
  • Level shifter U10 / SoC U1 bank 503 (JTAG)
  • Level shifter U50 / SoC U1 bank 501 (UART)
  • LEDs UART activity D18, D19
  • LED 3V3_VDD_FTDI D20
  • USB 3.x Type C J24


EEPROM

U6

  • I2C


EEPROM with MAC

U23 / U25 / U29

  • I2C


EEPROM for programmer

U51

  • USB 2.0 to JTAG/UART bridge U49


Programmable PLL

U42

  • SoC U1:
    • Bank X5IO 702
    • Bank 507
    • Bank GTR 504
    • Bank GTYP 105
    • Bank GTYP 203/205 2)
    • Bank X5IO 707/709 2)


156¼ MHz
  26 MHz
  24 MHz
156¼ MHz
156¼ MHz
156¼ MHz

PCIe common OSC

U22

  • SoC U1 GTYP bank 105
  • M.2 m key socket U19

Both 100 MHz

Oscillator

U52

  • Programmable PLL U42
  • USB 2.0 to JTAG/UART bridge U49

12 MHz

Oscillator

U43

  • Programmable PLL U42

24 MHz

Oscillator

U18

  • Clock Buffer U17 / UFS storage U15

26 MHz

Oscillator

U7

  • SoC bank 500

26 MHz

Oscillator

U8

  • SoC U1 bank 503

33⅓ MHz

Oscillator

U32

  • USB 2.0 PHY U31

52 MHz

Oscillator

U26

  • ETH PHYs U24/U28

25 MHz

Notes
1) Only on SoC 35xx variants
2) Bank number SoC variant dependent.  33xx / 35xx

On-board peripherals

Configuration and System Control Signals

Control signals represent hardware defined logic states, for final state consider the firmware and reference designs.

Control Signals and Buses

Signal Name

Connector.Pin

Direction 1)

Description

GTX_EN_EXT_PWR

J9.D14

OUT

External IO device power enable signal.

GTX_PG_EXT_PWR

J9.D15

IN

External IO device power good signal.

GTX_RFU1 / GTX_RFU2

J9.D16 / J9.C18

-

Reserved for future use. - Can be used as IO.

GTX_EN_EXT_PWR

J10.D14

OUT

External IO device power enable signal.

GTX_PG_EXT_PWR

J10.D15

IN

External IO device power good signal.

GTX_RFU1 / GTX_RFU2

J10.D16 / J10.C18

-

Reserved for future use. - Can be used as IO.

CAN ( CAN0_N / CAN0_P )

J16.3 / J16.4

INOUT


CAN ( CAN1_N / CAN1_P )

J17.3 / J17.4

INOUT


I2C ( PLL_I2C_SDA/I2C3_SDA / PLL_I2C_SCL/I2C3_SCL )

J20.3 / J20.1

Signal dependent

Pay attention to REV01 patch.

I2C ( I2C2_SDA / I2C2_SCL )

J3.4 / J3.2

Signal dependent


I2C ( GTX_SDA_LS / GTX_SCL_LS )

J9.C20 / J9.C19

Signal dependent


I2C ( CSI1_SDA / CSI1_SCL )

J11.2 / J11.3

Signal dependent


I2C ( CSI2_SDA / CSI2_SCL )

J12.2 / J12.3

Signal dependent


I2C ( CSI3_SDA / CSI3_SCL )

J13.2 / J13.3

Signal dependent


I2C ( CSI4_SDA / CSI4_SCL )

J14.2 / J14.3

Signal dependent


LEDs ( USER_LED1 / USER_LED2 / USER_LED3 / USER_LED4 ) / D1, D2, D3, D4

-

OUT

User definable, green

LED ( USB1_OC_n ) / D9

-

OUT

USB J8 bus over current signal, red.

LED ( 3V3_VDD_FTDI ) / D20

-

OUT

Power indication LED, green.

LEDs ( F_UART_RX_LED / F_UART_TX_LED ) / D18, D19

-

OUT

Receive / Transmit indication LEDs, green

LED ( 12V0 ) / D22

-

OUT

Board Main Power Indication LED, green.

LED ( ERROR_OUT ) / D5

-

OUT

SoC Error State Indication LED, red.

LED ( DONE ) / D6

-

OUT

SoC Boot Indication LED, green.

LED ( POR_B_n ) / D7

-

OUT

Power-On Reset Indication LED, green.

LED ( M2_LED ) / D8

-

OUT

M.2 Activity Indication LED, green.

1) Direction:

    • IN: Input from the point of view of this board.

    • OUT: Output from the point of view of this board.

    • INOUT: Bidirectional signal.
    • Signal dependent: The signal direction depends on the function within the bus.
Control signals and buses

Jumpers

Jumper

header

Net name / Connector.pin


Output

Input

Notes

J3

I2C_V / J3.3


Set I2C bus I2C2 voltage.


1V8 / J3.1

Set I2C2 bus voltage to 1.8 V.


3V3_PS / J3.5

Set I2C2 bus voltage to 3.3 V.

J4

VCC_FUSE / J4.2


Set the SoC voltage for eFUSE programming.


1V8 / J4.1

Enable eFUSE programming.


GND / J4.3

Disable eFUSE programming.

J18

CAN0_N / J18.3


Set CAN termination for signal CAN0_N.


No net name / J18.1

Connect to termination.

CAN0_P / J18.4


Set CAN termination fro signal CAN0_P.


No net name / J18.2

Connect to termination.

J19

CAN1_N / J19.3


Set CAN termination for signal CAN1_N.


No net name / J19.1

Connect to termination.

CAN1_P / J19.4


Set CAN termination for signal CAN1_P.


No net name / J19.2

Connect to termination.

Jumpers

Buttons



Voltage level


Button

Signal

Low

high

Function

S3/S4

USER_PB1

pressed

unpressed

User definable.

S5/S6

USER_PB2

pressed

unpressed

User definable.

S8

TPM_PP

unpressed

pressed

Trusted platform module 2.0 presence detection.

S10/S11

MR_RC_n

pressed

unpressed

Manuel board reset.

Buttons

DIP Switches

DIP switch group

DIP switch

Signal name / Connector.pin

Description

S1

S1A

PWR_OFF / S1.8

Disable module / assert U55 (Input protection) state.

S1B

USER_DIP2 / S1.7

S1B is parallel to S2B.

S1C is parallel to S2A.

User definable.

S1C

USER_DIP1 / S1.6

S1D

No net name / S1.5

Not connected / No function.

S2


S2A

USER_DIP1 / S2.4

S1B is parallel to S2B.

S1C is parallel to S2A.

User definable.

S2 intended for enclosure usage.

S2B

USER_DIP2 / S2.3

S7

S7A

BOOT_SEL0# / S7.1



Select SoC boot mode.

S7B

BOOT_SEL1# / S7.2

S7C

BOOT_SEL2# / S7.3

S7D

BOOT_SEL3# / S7.4

S9

S9A

PWR_OFF / S9.4

Disable module / assert U55 (Input protection) state.

S1A is parallel to S9A.

S9A intended for enclosure usage.

S9B

No net name / S9.3

Not connected / No function.

DIP switches

Power and Power-On Sequence

Power Rails


Power Rail Name / Schematic Name

Description

Connector.Pin

Direction 1)

Notes

12V0_in / 12V_IN_FUSED

Board Power Supply

J25.1 / J25.2 / J25.3

IN

Pay attention to connector pinout!

VBATT

Backup supply (CR1220 / 3.0 Lithium) for SoC RTC

B1

IN


12V0_FAN

Supply for 12 V PWM fan.

J23.2

OUT


3V3_PL

3.3 V for external IO devices/reference voltage.

J1.33 / J1.34 2)
J11.1 / J12.1
J13.1 / J14.1 2)
J21.6 / J21.12 / J22.6 / J22.12 2)

OUT


3V3_PS

3.3 V for external IO devices/reference voltage.

J3.5 / J20.4

OUT

Dependent on resistor R259 assembly.

Notes
1) Direction:

    • IN: Input from the point of view of this board.

    • OUT: Output from the point of view of this board.

2) Only on SoC 35xx variants.

Power rails

Recommended Power up Sequencing


SequenceNet nameRecommended Voltage RangePull-up/downDescriptionNotes
0---Configuration signal setup.See Configuration and System Control Signals.
112V0_IN

12.0 V (± 5 %)

-

Power supply. 

Carrier power supply.

2PWR_OFF

-

-

Release signal Power_OFF via DIP switch S1A or S9A.


Power sequencing

Board to Board Connectors

Technical Specifications

Absolute Maximum Ratings *)

Warning!

The listed values ONLY reflect this board. Connected Carriers / SoMs / Boards are not considered. 

Power Rail Name / Schematic Name

Description

Min

Max

Unit

Notes

12V0_IN / 12V_IN_FUSED

Board Power Supply.

-0.3

50

V


VBATT

Backup supply for SoC RTC.

–0.3

6.3

V


Absolute maximum ratings

*) Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under "Recommended Operating Condition". Exposure to absolute-maximum rated conditions for extended periods may affect device reliability.

Recommended Operating Conditions

Temperature range

Trenz Electronic classifies modules into temperature range categories by subsumption of its component data (PCB, ICs, connectors, passive components). The temperature ranges are values for ambient air temperature and do not reflect the junction temperature of individual components.

The categories are:

  • Modules with commercial (C) temperature grade are equipped with components that cover at least the ambient temperature range of 0 °C to 70 °C.
  • Modules with extended (E) temperature grade are equipped with components that cover at least the ambient temperature range of 0 °C to 85 °C.
  • Modules with industrial (I) temperature grade are equipped with components that cover at least the ambient temperature range of -40 °C to 85 °C.

These categories do not take into account the entire custom system consisting of:

  • Customer SoC design. The allowed main SoC temperature range is specified from the vendor by junction temperature using corresponding classes (C, E, I). See vendor documentation.
  • Cooling solution, active and or passive cooling.
  • Climate or environmental conditions besides ambient temperature range.
  • Module orientation, neighbouring assemblies, neither other heat sources nor the SoC as heat source to other components.

Classification of the module can be looked up here: Article Number Information i.e.: TExxxx-xx-xx'I'xx, the 'I' indicates that all components are at least in Industrial temperature class.

The temperature of individual components should not exceed the specified range due to self-heating or heating by adjacent components. The actual operating temperature range will depend on the customer design, usage, environment and cooling solution. Consult Cooling Solutions for more information.

Voltage rails

The following table aims to be generic for all variants. The voltage ranges are consistent across assembly variants, but exceptions are possible (custom request).

Power Rail Name / Schematic Name

Min

Max

Units

Notes

12V0_IN / 12V_IN_FUSED

11.4

12.6

V


VBATT

-

3.0

V


Recommended operating conditions

Physical Dimensions

  • Module size: 150.0 mm x 200.0 mm.  Please download the assembly diagram for exact numbers.

  • PCB thickness: 2.1 mm ±10 %.

Physical dimension

Currently Offered Variants

Trenz shop TE0960 overview page *

English page

German page

*)  Module article name encoding table: AMD Versal based modules

Trenz Electronic shop overview

Revision History

Hardware Revision History

The hardware revision number can be found on the PCB board together with the module's model number, separated by a dash.

Board hardware revision number

Date

Revision

Changes

Documentation Link

2026-09

01

Initial Release

REV01

Hardware revision history

Document Change History

DateRevisionContributorDescription

v.32

Kilian Jahn

  • Initial Release

--

all

ED , Kilian Jahn

  • --
Document change history

Disclaimer

Data Privacy

Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy

Document Warranty

The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.

Limitation of Liability

In no event will Trenz Electronic, its suppliers, or other third parties mentioned in this document be liable for any damages whatsoever (including, without limitation, those resulting from lost profits, lost data or business interruption) arising out of the use, inability to use, or the results of use of this document, any documents linked to this document, or the materials or information contained at any or all such documents. If your use of the materials or information from this document results in the need for servicing, repair or correction of equipment or data, you assume all costs thereof.

Product Disclaimer

Products (incl. Software and Firmware) are exclusively designed, manufactured, and distributed for industrial applications. They are not intended, authorized, or certified for use in critical safety applications, medical devices, aerospace, nuclear, life-support, traffic-control, military, or other environments where malfunction or failure could result in personal injury, death, or significant property or environmental damage.

Trenz Electronic GmbH (“Manufacturer”) excludes any liability for inappropriate use in such contexts. The Customer bears all responsibility for verifying suitability and compliance with applicable regulations when deploying in any critical-use scenario. The Customer also agrees to indemnify and hold harmless the Manufacturer from any third-party claims or liabilities arising from such use.

Copyright Notice

No part of this manual may be reproduced in any form or by any means (including electronic storage and retrieval or translation into a foreign language) without prior agreement and written consent from Trenz Electronic.

Technology Licenses

The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.

Environmental Protection

To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.

REACH, RoHS and WEEE

REACH

Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).

RoHS

Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.



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