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Module SeriesForm FactorKey Features
TEM00053.1 x 5.6

TE0722 - DIPFORTy1.8 x 5.1 cm


TEI0001 - MAX10002.5 x 6.1 cm


TEI0003 - CYC10002.5 x 6.1 cm


TEL0001 - LXO20002.5 x 6.1 cm


TEM0001 - SFM20002.5 x 6.1 cm


TEI0010 - AnalogMax2.5 x 6.1 cm


TEC0117 - LittleBee2.5 x 6.1 cm


TEI0015 - AnalogMAX DAQ12.5 x 8.65 cm


TEI0016 - AnalogMAX DAQ22.5 x 8.65 cm


TEI0023 - AnalogMAX DAQ32.5 x 8.65 cm


TE0890 - S7 Mini2.7 x 5.2 cm


TE0876 - IceZero3.05 x 6.5cm


TE0727 - ZynqBerryZero3.05 x 6.5cm

TE0725

3.5 x 7.3 cm


TE0725LP3.5 x 7.3 cm


TEM00083.8 x 5.6 cm


TE07144 x 3 cm


TE06004 x 5 cm


TE07104 x 5 cm


TE07114 x 5 cm


TE07124 x 5 cm


TE07134 x 5 cm


TE07154 x 5 cm

TE0720 - GigaZee4 x 5 cm


TE07414 x 5 cm


TE08204 x 5 cm


TE08214 x 5 cm


TE08234 x 5 cm


TE08414 x 5 cm


TEM00074 x 5 cm


TE07244 x 6 cm


TE07295.2 x 7.6 cm


TE07455.2 x 7.6 cm


TE0803 - UltraSoM+5.2 x 7.6 cm

TE0807 - UltraSoM+5.2 x 7.6 cm

TE0808 - UltraSoM+5.2 x 7.6 cm

TE07165.5 x 6.5 cm


TE07286 x 6 cm


TEI00066 x 8 cm


TE08356.5 x 9


TE07828.5 x 8.5 cm


TE07838.5 x 8.5 cm


TE07848.5 x 8.5 cm


TE0723 - ArduZynqlike Arduino Board


TE0726 - ZynqBerrylike RPI2 Board

TEM0002 - SmartBerrylike RPI2 Board

TE0887 - icoBoard5.7 x 6.5 cm

TEI0180

COM-HPC

Server Size D

16 x 16 cm

  • SoC/FPGA (Agilex F-Series)
    • Package: R24A(2486A)
    • Device: AGF012,AGF014*
      • with/without HPS*
    • Speed:
      • Transceiver: -1, -2,-3*, **
      • Core: -1, -2,-3,-4*, **
    • Temperature: I, E*, **
  • RAM/Storage
    • DDR4  SODIMM   (4 times)
      • 72-Bit DDR4 with ECC per SODIMM
      • Size: NA*
      • Speed: NA*
    • eMMC
      • Data width: 8Bit
      • size: def. 8GB  (up tp 64 possible)*
    • QSPI boot Flash in single mode (size depends on assembly version)
      • Data width: 4bit
      • size: def. 128MB (up to 256MB possible)*
    • MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48)
  • On Board
    • SC CPLD and SIP
      • MAX10: 10M08
      • OSD32MP15x: STM32MP15x(Dual Cortex-A7 and Cortex-M4)  with 512MB DDR3 (16Bit)
    • PLL SI5345
    • Gigabit ETH PHY (Marvell Alaska 88E1512)
    • USB2 HUB
    • USB2 PHY
  • Interface (2 x 400pin COM-HPC connectors by Samtec)
    • PCIe up to  16 lane ( 16x P-Tile (32 Gb/s) +8x E-Tiles (no PCIe))****
    • KR Ethernet (8x E-Tile (29,8 Gb/s))
    • Gbit Ethernet 1x
    • USB2 4x
    • SPI 1x
    • I2C SMB 1x
    • I2C 3x
    • UART 2x (1x Agilex, 1x SC STM32)
    • GPIO 12x (JTAG over GPIO)
  • Power
    • 12V Main
    • 5V Standby
    • 2.0-3.3V RTC
  • Dimension
    • COM-HPC  Client module Size B (120x120mm)
  • Notes
    • * depends on assembly version
    • ** not all combinations are possible
    • *** depends on used U+ Zynq and DDR4 combination
    • **** uses is limited by  U+ Zynq specification
TE0830

COM-HPC

Client Size B

12 x 12 cm

  • SoC/FPGA (UltraScale+ Zynq)
    • Package: FFVC1760
    • Device: ZU11, ZU17, ZU19*
    • Engine: EG
    • Speed: -1, -2,-3*, **
    • Temperature: I, E, (Q, M)*, **
  • RAM/Storage
    • DDR4  (PS connected)
      • Data width: 72bit with ECC
      • Size: def. 4GB (up to 8GB possible)*
      • Speed:***
    • DDR4  SODIMM  (PL connected)
      • 72-Bit DDR4 with ECC
      • Size: max 16GB*
      • Speed: NA*
    • eMMC
      • Data width: 8Bit
      • size: def. 8GB  (up tp 64 possible)*
    • QSPI boot Flash in dual parallel mode (size depends on assembly version)
      • Data width: 8bit
      • size: def. 128MB (up to 512MB possible)*
    • QDDRII (optional, default not assembled)
      • size:18Mbit*
    • MAC address serial EEPROM with EUI-48™ node identity (Microchip 24AA025E48)
  • On Board
    • SC CPLD and SoC
      • MAX10: 10M08
      • 7 Series Zynq: XC7Z010 with 128MB QSPI and 512MB DDR3 (16Bit)
    • PLL SI5345
    • Gigabit ETH PHY (Marvell Alaska 88E1512)
    • USB2 HUB
    • USB2 PHY
  • Interface (2 x 400pin COM-HPC connectors)
    • PCIe SMB 1x (ZynqMP PS GTR)
    • PCIe up to  48 lane ( 16x GTY(32.75 Gb/s)  and 32x GTH (16.3 Gb/s) )**** 
    • Gbit Ethernet 1x
    • USB2 4x
    • USB3 1x (ZynqMP PS GTR)
    • DDI (DP) 1x (ZynqMP PS GTR)
    • SATA 1x (ZynqMP PS GTR)
    • SPI 1x
    • I2C SMB 1x
    • I2C 3x
    • UART 2x (1x ZynqMP, 1x SC Zynq)
    • GPIO 12x (JTAG over GPIO)
    •  PL HP IOs  x32 (15 diff)  over COM-HPC CSI Interface
  • Power
    • 12V Main
    • 5V Standby
    • 2.0-3.3V RTC
  • Dimension
    • COM-HPC  Client module Size B (120x120mm)
  • Notes
    • * depends on assembly version
    • ** not all combinations are possible
    • *** depends on used U+ Zynq and DDR4 combination
    • **** uses is limited by  U+ Zynq specification

SeriesKey Features
TEB0911 - UltraRack+

TEB0912

SeriesKey Features
TEF1001 PCIe FMC Carrier


TEC0330 PCIe FMC Carrier


TEF1002 PCIe FMC Carrier


SeriesKey Features
TEF0003


TEF0007


TEF0008


TEF0010


Series

Key Features

TEC0850


Series

Key Features

CR00010


CR00140


TEB0707


TEMB0005


SeriesKey Features
TE0790 - XMOD

...

TEI0004 - Arrow USB Programmer2

...

TEI0005 - FPGA Programmer2 SMD

...


SeriesKey Features

TEP0001 CAN-FD

...

TEP0002

...

TEP0003

...

TEP0005

...

TEP0006

...


SeriesKey Features

EDDP-EDPS Evaluation Platform


TEI0009 - C10LP RefKit


TE0802 Development Board


TEI0022









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