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Table of Contents
Overview
The Trenz Electronic TEB0724-01 is a developement carrier board for the TE0724 and compatible modules. It facilitates easy access to all on the module available features.
Key Features
- Samtec 160 pin board to board connector for 4,0 cm x 6,0 cm module
- 10x 2x6 Pin Pmods, (8 usable as dual Pmods, 1x single Pmod, 1x I2C compatible Pmod)
- MicroUSB to JTAG/UART bridge
- CAN screw terminal
- RJ45 Gigabit Ethernet MagJack connector
- 6x LED, 2x Push Buttons on FPGA
- 1 LED and 1 Push Button on PS
- Power and Reset Push Buttons
- On-board Power Protection Circuit and Power on LED
Block Diagram
Figure 1: TEB0724 block diagram
Main Components
draw.io
Figure 2: TEB0724 main components
Table 1: TE0724-01 main components.
- Module connector for 4,0x6.0 cm module
- Pmods usabel as dual Pmods, J10, J11, J12, J13, J14, J15, J16, J17
- Pmod (single), J20
- I2C Pmod, J21
- CAN screw terminal, J2
- 5V 2.1mm input jack, J18
- microUSB J4
- USB to JTAG/UART bridge FT2232H, U1
- Configuration EEPROM U3
- RJ45 Gigabit Ehternet Jack, J3
- Power Button, S1
- Reset Button, S3
- User Button PS, S5
- User LED (green) PS, D8
- 2x User Button PL, S2, S4
- 6x User LEDs (red) PL, D2-D7
- Power LED (green), D36
- 2x10 Pin header for Boot and Programming options, J6
- microSD Card Slot, J5
Initial Delivery State
Not programmed.
Storage device name | Content | Notes |
|---|---|---|
| FTDI Configuration EEPROM U3 | Empty | Not programmed. |
Table 2: Initial delivery state of programmable devices on the baseboard.
Boot Process
The boot device is selected by the mode jumpers on pin header J6. Placing a jumper at pin 13-14 sets Mode0 to low level. Mode1 is set to low level by jumper on over pin 15-16. Boot modes are further described at the corresponding section of the modules, e.g. Table 2, Boot mode selection of TE0724 TRM. Default with no jumpers is boot from SD-Card.
Signals, Interfaces and Pins
Board to Board (B2B) I/Os
I/O signals connected to the B2B connector:
| B2B Connector | Interfaces | Count of IO's | Notes |
|---|---|---|---|
| J1 | User IO | 72 single ended or 36 differential | 9x Pmod |
| 6 LED | red | ||
| 2 Push Button | - | ||
| 7 MIO | J7 (not assembled), TE0724: 3.3V | ||
| 2 MIO | J9 (not assembled), TE0724: 1.8V | ||
| 1 MIO LED | green | ||
| 1 MIO Push Button | - | ||
| I²C | 2 | 1x Pmod | |
| SD IO | 7 | - | |
| UART | 2 | - | |
| CAN | 2 | - | |
| GbE PHY_MDIO + PHY_LEDs | 10 | - | |
| JTAG | 4 | - | |
| Power GPIO | 2 | - | |
| Power/Reset/Fuse programming | 3 | - | |
| Bootmode | 2 | - |
Table 3: General overview of PL I/O signals and SoM's interfaces connected to the B2B connectors.
The TEB0724 carrier board supplies the attached module with 5V DC. All power rails on the module and the baseboard are generated from this at the module and routed back the carrier. For detailed information about the pin out, please refer to the Pin-out Tables.
JTAG Interface
There is no device with JTAG port on the baseboard. JTAG access to the module is provided through B2B connector J1. This is routed to the carriers USB to JTAG/UART bridge.
JTAG Signal | B2B Connector Pin |
|---|---|
| TCK | J1-147 |
| TDI | J1-151 |
| TDO | J1-145 |
| TMS | J1-149 |
Table 4: JTAG interface signals.
System Control I/O Pins
| Pin Name | Function | Routed to | B2B Connector Pin | Note |
|---|---|---|---|---|
| Mode0 | bootdevice selection | jumper pins J6-13 J6-14 | J1-4 | TE0724: pulled up at module |
| Mode1 | bootdevice selection | jumper pins J6-15 J6-16 | J1-2 | TE0724: pulled up at module |
| ONKEY | module power signal | push button S1 and pin J6-9 | J1-148 | TE0724: pulled up at module |
| RESETREQ | module reset | push button S3 and pin J6-12 | J1-150 | TE0724: pulled up at module |
| PWR_GPIO2 | - | J6-8 | J1-143 | User power sequenzing IO |
| PWR_GPIO4 | - | J6-10 | J1-141 | User power sequenzing IO |
Table 5: System Control I/O pins.
SD Card Interface
| Connected To | Signal Name | Notes |
|---|---|---|
| J1-34 | SD-CD | Card detect switch |
| J1-24 | SD-D0 | |
| J1-22 | SD-CMD | |
| J1-20 | SD-CCLK | |
| J1-26 | SD-D1 | |
| J1-28 | SD-D2 | |
| J1-30 | SD-D3 |
Table 6: SD Card interface signals and connections.
Ethernet Interface
The TEB0724 Carrier Board has a RJ45 Gigabit Ethernet MagJack (J3) with two LEDs. On-board Ethernet MagJack pins are routed to B2B connector J1 via MDI. LEDs are also routed to the B2B connector.
Ethernet PHY connection
| MagJack | Signal | B2B |
|---|---|---|
| J3-2 | PHY_MDI0_P | J1-7 |
| J3-3 | PHY_MDI0_N | J1-9 |
| J3-4 | PHY_MDI1_P | J1-13 |
| J3-5 | PHY_MDI1_N | J1-15 |
| J3-6 | PHY_MDI2_P | J1-19 |
| J3-7 | PHY_MDI2_N | J1-21 |
| J3-8 | PHY_MDI3_P | J1-25 |
| J3-9 | PHY_MDI3_N | J1-27 |
| J3B | PHY_LED0 | J1-10 |
| J3C | PHY_LED1 | J1-12 |
Table 7: Ethernet MagJack
I2C Interface
On-board I2C bus is accaessable with the following pins:
| SDA | SCL | Notes |
|---|---|---|
| J1-144 | J1-142 | B2B |
| J6-7 | J6-5 | In-Circuit Programming |
| J21-10, J21-4 | J21-9, J21-3 | Pmod |
Table 8: I2C pins.
On-board Peripherals
Oscillators
The module has the following reference clock signals provided by on-board oscillators:
| Clock Source | Schematic Name | Frequency | Clock Destination |
|---|---|---|---|
| SiTime SiT8008AI oscillator, U4 | OSCI | 12.000000 MHz | U1, pin 3. |
Table 9: Reference clock signals.
On-board LEDs
| LED | Color | Signal | Description and Notes |
|---|---|---|---|
| D1 | green | VIN | power indicator |
| D2-D7 | red | ULED1..6 | User LED |
| D8 | green | MIO9 | MIO user LED |
| J3B | green | PHY_LED0 | Ethernet status |
| J3C | yellow | PHY_LED1 | Ethernet status |
Table 10: On-board LEDs.
On-board Push Buttons
| Button | Signal | B2B | Description and Notes |
|---|---|---|---|
| S1 | ONKEY | J1-148 | Power Button, pulled up, on push de-asserted |
| S3 | RESETREQ | J1-150 | User LED pulled up, on push de-asserted |
S2 | S2 | J1-124 | PL user button, pulled up, on push de-asserted |
| S4 | S4 | J1-126 | PL user button, pulled up, on push de-asserted |
| S5 | MIO51 | J1-42 | PS MIO user button, pulled up, on push de-asserted |
Table 11: On-board Push Buttons.
Pin Header
Pin Header J6
J6-2
| PIN | Signal | B2B | Description and Notes |
|---|---|---|---|
| J6-1 | ONKEY | J1-148 | Power Button, pulled up, on push de-asserted |
| J6-2 | RESETREQ | J1-150 | User LED pulled up, on push de-asserted |
| J6-2 | S2 | J1-124 | PL user button, pulled up, on push de-asserted |
| S4 | J1-126 | PL user button, pulled up, on push de-asserted | |
| S5 | MIO51 | J1-42 | PS MIO user button, pulled up, on push de-asserted |
For voltage selection VCCIO_35 of Bank 35 other than 3.3V the header J19 can optionaly assambled. Therefore 0 Ohm resistor R45 has to be removed!
Optional fitted headers J7, J8 and J9 are to provide full access to the Pins at the B2B, especially for testing and extension purposes.
Power and Power-On Sequence
Power Consumption
The maximum power consumption depends on the attached module the design running on the module and additional peripherals.
Xilinx provide a power estimator excel sheets to calculate power consumption for FPGAs. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.
| Power Input | Typical Current |
|---|---|
| VIN | TBD* |
Table 12: Typical power consumption.
* TBD - To Be Determined soon with reference design setup.
Power supply with minimum current capability of 3A for system startup is recommended.
To avoid any damage to the base board and attached module, check for stabilized voltages should be carried out (i.e. power good and enable signals) before powering up any SoC's I/O bank voltages VCCO_x. All I/Os should be tri-stated during power-on sequence.
Power Distribution Dependencies
Figure 3: Module power distribution diagram.
User should also check related module documentation and Xilinx data sheet, respectively.
Power-On Sequence
The power-on sequence is solely controlled by the attached module. Optional sequenzing signals for integration of additional hardware are PWR_GPIO2 and PWR_GPIO4. If the attached module uses the adjustable bank power VCCIO_35, this has to be powered up after the modules SOCs powerrails are up and before any other signal is applied to the bank IOs.
The 1.8V and 3.3V power rails are used for the SD Card level shifter U13. The Datasheet states to first power up 1.8V and then 3.3V.
Power Rails
Power Rail Name | B2B J1 Pins | Direction on B2B | Notes |
|---|---|---|---|
| VIN | 154, 156, 158, 160 | Output | External main supply voltage. |
| 3.3V | 43, 74 | Input | |
1.8V | 63 | Input | |
| VCCIO_35 | 54 | Output | |
VLDO1 | 83 | Input | |
| VLDO2 | 94 | Input | Used to enable UART level shifter. Therefore fix at 1.8V. |
| VLDO34 | 53 | Input | |
VBAT | 152 | Input/Output | Reserved for PMIC backup battery and charger. |
Table 12 : Board power rails.
Board to Board Connectors
The TEB0724 base board has a 160-pin double-row REF-192552-01 connector on the top side.
Order | REF Number | Samtec Number | Type | Mated Height | Data sheet | Comment |
|---|---|---|---|---|---|---|
| - | REF-192552-01 | SS5-80-3.50-L-D-K-TR | Baseboard connector | 4 mm | http://suddendocs.samtec.com/catalog_english/ss5.pdf | Standard connector used on board |
| 27220 | REF-192552-02 | ST5-80-1.50-L-D-P-TR | Module connector | 4 mm | http://suddendocs.samtec.com/catalog_english/st5.pdf | Standard connector used on module |
Table 15: Connectors for module and base board.
Variants Currently In Production
| Trenz shop TEB0724 overview page | |
|---|---|
| English page | |
Technical Specifications
Absolute Maximum Ratings
Parameter | Min | Max | Units | Reference Document |
|---|---|---|---|---|
VIN supply voltage | V | - | ||
Storage temperature | °C | - |
Table : Board absolute maximum ratings.
Assembly variants for higher storage temperature range are available on request.
Recommended Operating Conditions
| Parameter | Min | Max | Units | Reference Document |
|---|---|---|---|---|
| VIN supply voltage | ||||
| Operating temperature |
Table : Board recommended operating conditions.
Please check Xilinx datasheet ... for complete list of absolute maximum and recommended operating ratings.
Operating Temperature Ranges
Commercial grade: 0°C to +70°C.
Extended grade: 0°C to +85°C.
Industrial grade: -40°C to +85°C.
Module operating temperature range depends also on customer design and cooling solution. Please contact us for options.
Physical Dimensions
Module size: 105 mm × 100 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 4 mm.
PCB thickness: 1.6 mm.
Highest part on PCB: approx. 13.5 mm. Please download the step model for exact numbers.
All dimensions are given in millimeters.
Figure 4: Module physical dimensions drawing.
Revision History
Hardware Revision History
| Date | Revision | Notes | PCN | Documentation Link |
|---|---|---|---|---|
| - | 01 | Prototypes |
Table : Module hardware revision history.
Hardware revision number can be found on the PCB board together with the module model number separated by the dash.
Figure 5: Module hardware revision number.
Document Change History
Date | Revision | Contributors | Description |
|---|---|---|---|
2018-07-02 | v.1 | Initial document. |
Table : Document change history.
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Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.
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