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Table of Contents
Overview
The Trenz Electronic TEB0724-01 is a developement carrier board for the TE0724 and compatible modules. It facilitates easy access to all on the module available features.
Key Features
- Samtec 160 pin board to board connector for 4,0 cm x 6,0 cm module
- 10x 2x6 Pin Pmods, (8 usable as dual Pmods, 1x single Pmod, 1x I2C compatible Pmod)
- MicroUSB to JTAG/UART bridge
- CAN screw terminal
- RJ45 Gigabit Ethernet MagJack connector
- 6x LED, 2x Push Buttons on FPGA
- 1 LED and 1 Push Button on PS
- Power and Reset Push Buttons
- On-board Power Protection Circuit and Power on LED
Block Diagram
Figure 1: TEB0724 block diagram
Main Components
draw.io
Figure 2: TEB0724 main components
Table 1: TE0724-01 main components.
- Module connector for 4,0x6.0 cm module
- Pmods usabel as dual Pmods, J10, J11, J12, J13, J14, J15, J16, J17
- Pmod (single), J20
- I2C Pmod, J21
- CAN screw terminal, J2
- 5V 2.1mm input jack, J18
- microUSB J4
- USB to JTAG/UART bridge FT2232H, U1
- Configuration EEPROM U3
- RJ45 Gigabit Ehternet Jack, J3
- Power Button, S1
- Reset Button, S3
- User Button PS, S5
- User LED (green) PS, D8
- 2x User Button PL, S2, S4
- 6x User LEDs (red) PL, D2-D7
- Power LED (green), D36
- 2x10 Pin header for Boot and Programming options, J6
- microSD Card Slot, J5
Initial Delivery State
Not programmed.
Storage device name | Content | Notes |
|---|---|---|
| FTDI Configuration EEPROM U3 | Empty | Not programmed. |
Table 2: Initial delivery state of programmable devices on the baseboard.
Boot Process
The boot device is selected by the mode jumpers on pin header J6. Placing a jumper at pin 13-14 sets Mode0 to low level. Mode1 is set to low level by jumper on over pin 15-16. Boot modes are further described at the corresponding section of the modules, e.g. Table 2, Boot mode selection of TE0724 TRM. Default with no jumpers is boot from SD-Card.
Signals, Interfaces and Pins
Board to Board (B2B) I/Os
I/O signals connected to the B2B connector:
| B2B Connector | Interfaces | Count of IO's | Notes |
|---|---|---|---|
| J1 | User IO | 72 single ended or 36 differential | 9x Pmod |
| 6 LED | red | ||
| 2 Push Button | - | ||
| 7 MIO | J7 (not assembled), TE0724: 3.3V | ||
| 2 MIO | J9 (not assembled), TE0724: 1.8V | ||
| 1 MIO LED | green | ||
| 1 MIO Push Button | - | ||
| I²C | 2 | 1x Pmod | |
| SD IO | 7 | - | |
| UART | 2 | - | |
| CAN | 2 | - | |
| GbE PHY_MDIO + PHY_LEDs | 10 | - | |
| JTAG | 4 | - | |
| Power GPIO | 2 | - | |
| Power/Reset/Fuse programming | 3 | - | |
| Bootmode | 2 | - |
Table 3: General overview of PL I/O signals and SoM's interfaces connected to the B2B connectors.
The TEB0724 carrier board supplies the attached module with 5V DC. All power rails on the module and the baseboard are generated from this at the module and routed back the carrier. For detailed information about the pin out, please refer to the Pin-out Tables.
JTAG Interface
There is no device with JTAG port on the baseboard. JTAG access to the module is provided through B2B connector J1. This is routed to the USB to JTAG/UART bridge.
JTAG Signal | B2B Connector Pin |
|---|---|
| TCK | J1-147 |
| TDI | J1-151 |
| TDO | J1-145 |
| TMS | J1-149 |
Table 4: JTAG interface signals.
System Control I/O Pins
| Pin Name | Mode | Function | B2B Connector Pin | Default Configuration |
|---|---|---|---|---|
Table 5: System Controller CPLD I/O pins.
SD Card Interface
| Connected To | Signal Name | Notes |
|---|---|---|
| J1-34 | SD-CD | Card detect switch |
| J1-24 | SD-D0 | |
| J1-22 | SD-CMD | |
| J1-20 | SD-CCLK | |
| J1-26 | SD-D1 | |
| J1-28 | SD-D2 | |
| J1-30 | SD-D3 |
Table 6: SD Card interface signals and connections.
Ethernet Interface
On board Gigabit Ethernet PHY is provided with ...
Ethernet PHY connection
| PHY Pin | PS | PL | B2B | Notes |
|---|---|---|---|---|
Table x: ...
I2C Interface
On-board I2C bus is connected to the following pins:
| SDA | SCL | Notes |
|---|---|---|
| J1-144 | J1-142 | B2B |
| J6-7 | J6-5 | In-Circuit Programming |
| J21-10, J21-4 | J21-9, J21-3 | PMOD |
Table x: I2C slave device addresses.
On-board Peripherals
Gigabit Ethernet PHY
On-board Gigabit Ethernet PHY (U7) is provided with Marvell Alaska 88E1512 IC (U8). The Ethernet PHY RGMII interface is connected to the Zynq Ethernet0 PS GEM0. I/O voltage is fixed at 1.8V for HSTL signaling. The reference clock input of the PHY is supplied from an on-board 25.000000 MHz oscillator (U9), the 125MHz output clock signal CLK_125MHZ is connected to the pin J2-150 of B2B connector J2.
Oscillators
The module has following reference clock signals provided by on-board oscillators and external source from carrier board:
| Clock Source | Schematic Name | Frequency | Clock Destination |
|---|---|---|---|
| .. | .. | .. | .. |
| SiTime SiT8008BI oscillator, U21 | - | 25.000000 MHz | Quad PLL clock generator U16, pin 3. |
Table : Reference clock signals.
On-board LEDs
| LED | Color | Signal | Description and Notes |
|---|---|---|---|
| D1 | green | VIN | power indicator |
| D2-D7 | red | ULED1..6 | User LED |
| D8 | green | MIO9 | MIO user LED |
Table : On-board LEDs.
Power and Power-On Sequence
Power Consumption
The maximum power consumption of a module mainly depends on the design running on the FPGA.
Xilinx provide a power estimator excel sheets to calculate power consumption. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.
| Power Input | Typical Current |
|---|---|
| VIN | TBD* |
| 3.3VIN | TBD* |
Table : Typical power consumption.
* TBD - To Be Determined soon with reference design setup.
Power supply with minimum current capability of ...A for system startup is recommended.
For the lowest power consumption and highest efficiency of the on-board DC-DC regulators it is recommended to power the module from one single 3.3V supply. All input power supplies have a nominal value of 3.3V. Although the input power supplies can be powered up in any order, it is recommended to power them up simultaneously.
The on-board voltages of the TE07xx SoC module will be powered-up in order of a determined sequence after the external voltages '...', '...' and '...' are available. All those power-rails can be powered up, with 3.3V power sources, also shared. <-- What?
To avoid any damage to the module, check for stabilized on-board voltages should be carried out(i.e. power good and enable signals) before powering up any SoC's I/O bank voltages VCCO_x. All I/Os should be tri-stated during power-on sequence.
Power Distribution Dependencies
Regulator dependencies and max. current.
Put power distribution diagram here...
Figure : Module power distribution diagram.
See Xilinx data sheet ... for additional information. User should also check related base board documentation when intending base board design for TE07xx module.
Power-On Sequence
The TE07xx SoM meets the recommended criteria to power up the Xilinx Zynq MPSoC properly by keeping a specific sequence of enabling the on-board DC-DC converters dedicated to the particular functional units of the Zynq chip and powering up the on-board voltages.
Following diagram clarifies the sequence of enabling the particular on-board voltages, which will power-up in descending order as listed in the blocks of the diagram:
Put power-on diagram here...
Figure : Module power-on diagram.
Power Rails
NB! Following table with examples is valid for most of the 4 x 5 cm modules but depending on the module model and specific design, number and names of power rails connected to the B2B connectors may vary.
Power Rail Name | B2B JM1 Pins | B2B JM2 Pins | Direction | Notes |
|---|---|---|---|---|
| VIN | 1, 3, 5 | 2, 4, 6, 8 | Input | Main supply voltage from the carrier board. |
| 3.3V | - | 10, 12, 91 | Output | Module on-board 3.3V voltage supply. (would be good to add max. current allowed here if possible) |
| B64_VCO | 9, 11 | - | Input | HR (High Range) bank voltage supply from the carrier board. |
VBAT_IN | 79 | - | Input | RTC battery supply voltage from the carrier board. |
| ... | ... | ... | ... | ... |
Table : Module power rails.
Different modules (not just 4 x 5 cm ones) have different type of connectors with different specifications. Following note is for Samtec Razor Beam™ LSHM connectors only, but we should consider adding such note into included file in Board to Board Connectors section instead of here.
Current rating of Samtec Razor Beam™ LSHM B2B connectors is 2.0A per pin (2 adjacent pins powered).
Board to Board Connectors
The TEB0724 base board has two 160-pin double-row REF-189019-02 connectors on the bottom side.
Order | REF Number | Samtec Number | Type | Mated Height | Data sheet | Comment |
|---|---|---|---|---|---|---|
| - | REF-192552-01 | SS5-80-3.50-L-D-K-TR | Baseboard connector | 4 mm | http://suddendocs.samtec.com/catalog_english/ss5.pdf | Standard connector used on board |
| 27220 | REF-192552-02 | ST5-80-1.50-L-D-P-TR | Module connector | 4 mm | http://suddendocs.samtec.com/catalog_english/st5.pdf | Standard connector used on module |
Table 15: Connectors for module and baseboard.
Variants Currently In Production
| Trenz shop TEB0724 overview page | |
|---|---|
| English page | |
Technical Specifications
Absolute Maximum Ratings
Parameter | Min | Max | Units | Reference Document |
|---|---|---|---|---|
VIN supply voltage | V | - | ||
Storage temperature | °C | - |
Table : Board absolute maximum ratings.
Assembly variants for higher storage temperature range are available on request.
Recommended Operating Conditions
| Parameter | Min | Max | Units | Reference Document |
|---|---|---|---|---|
| VIN supply voltage | ||||
| Operating temperature |
Table : Board recommended operating conditions.
Please check Xilinx datasheet ... for complete list of absolute maximum and recommended operating ratings.
Operating Temperature Ranges
Commercial grade: 0°C to +70°C.
Extended grade: 0°C to +85°C.
Industrial grade: -40°C to +85°C.
Module operating temperature range depends also on customer design and cooling solution. Please contact us for options.
Physical Dimensions
Module size: 105 mm × 100 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 4 mm.
PCB thickness: 1.6 mm.
Highest part on PCB: approx. 13.5 mm. Please download the step model for exact numbers.
All dimensions are given in millimeters.
Figure 4: Module physical dimensions drawing.
Revision History
Hardware Revision History
| Date | Revision | Notes | PCN | Documentation Link |
|---|---|---|---|---|
| - | 01 | Prototypes |
Table : Module hardware revision history.
Hardware revision number can be found on the PCB board together with the module model number separated by the dash.
Figure 5: Module hardware revision number.
Document Change History
Date | Revision | Contributors | Description |
|---|---|---|---|
2018-07-02 | v.1 | Initial document. |
Table : Document change history.
Disclaimer
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Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.
Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.
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