TEB0724 TRM

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Table of Contents

Overview

The Trenz Electronic TEB0724-01 is a developement carrier board for the TE0724 and compatible modules. It facilitates easy access to all on the module available features.

Key Features

Samtec 160 pin board to board connector for 4,0 cm x 6,0 cm module
10x 2x6 Pin Pmods, (8 usable as dual Pmods, 1x single Pmod, 1x I²C compatible Pmod)
MicroUSB to JTAG/UART bridge
CAN screw terminal
RJ45 Gigabit Ethernet MagJack connector
6x LED, 2x Push Buttons on FPGA
1 LED and 1 Push Button on PS
Power and Reset Push Buttons
On-board Power Protection Circuit and Power on LED

Block Diagram

Figure 1: TEB0724 block diagram

Main Components

Figure 2: TEB0724 main components

Table 1: TE0724-01 main components.

Module connector for 4,0x6.0 cm module
Pmods usabel as dual Pmods, J10, J11, J12, J13, J14, J15, J16, J17
Pmod (single), J20
I2C Pmod, J21
CAN screw terminal, J2
5V 2.1mm input jack, J18
microUSB J4
USB to JTAG/UART bridge FT2232H, U1
Configuration EEPROM U3
RJ45 Gigabit Ehternet Jack, J3
Power Button, S1
Reset Button, S3
User Button PS, S5
User LED (green) PS, D8
2x User Button PL, S2, S4
6x User LEDs (red) PL, D2-D7
Power LED (green), D36
2x10 Pin header for Boot and Programming options, J6
2x6 Pin header for jumper setting of CAN bus termination resistors, J22
microSD Card Slot, J5

Initial Delivery State

Not programmed.

Storage device name	Content	Notes
FTDI Configuration EEPROM U3	Empty	Not programmed.

Table 2: Initial delivery state of programmable devices on the baseboard.

Boot Process

The boot device is selected by the mode jumpers on pin header J6. Placing a jumper at pin 13-14 sets Mode0 to low level. Mode1 is set to low level by jumper on over pin 15-16. Boot modes are further described at the corresponding section of the modules, e.g. Table 2, Boot mode selection of TE0724 TRM. Default with no jumpers is boot from SD-Card.

Signals, Interfaces and Pins

Board to Board (B2B) I/Os

I/O signals connected to the B2B connector:

B2B Connector	Interfaces	Count of IO's	Notes
J1	User IO	72 single ended or 36 differential	9x Pmod
		6 LED	red
		2 Push Button	-
		7 MIO	J7 (not assembled), TE0724: 3.3V
		2 MIO	J9 (not assembled), TE0724: 1.8V
		1 MIO LED	green
		1 MIO Push Button	-
	I²C	2	1x Pmod
	SD IO	7	-
	UART	2	-
	CAN	2	-
	GbE PHY_MDIO + PHY_LEDs	10	-
	JTAG	4	-
	Power GPIO	2	-
	Power/Reset/Fuse programming	3	-
	Bootmode	2	-

Table 3: General overview of PL I/O signals and SoM's interfaces connected to the B2B connectors.

The TEB0724 carrier board supplies the attached module with 5V DC. All power rails on the module and the baseboard are generated from this at the module and routed back the carrier. For detailed information about the pin out, please refer to the Pin-out Tables.

JTAG Interface

There is no device with JTAG port on the baseboard. JTAG access to the module is provided through B2B connector J1. This is routed to the carriers USB to JTAG/UART bridge.

JTAG Signal	B2B Connector Pin
TCK	J1-147
TDI	J1-151
TDO	J1-145
TMS	J1-149

Table 4: JTAG interface signals.

System Control I/O Pins

Pin Name	Function	Routed to	B2B Connector Pin	Note
Mode0	bootdevice selection	jumper pins J6-13 J6-14	J1-4	TE0724: pulled up at module
Mode1	bootdevice selection	jumper pins J6-15 J6-16	J1-2	TE0724: pulled up at module
ONKEY	module power signal	push button S1 and pin J6-9	J1-148	TE0724: pulled up at module
RESETREQ	module reset	push button S3 and pin J6-12	J1-150	TE0724: pulled up at module
PWR_GPIO2	-	J6-8	J1-143	User power sequenzing IO
PWR_GPIO4	-	J6-10	J1-141	User power sequenzing IO

Table 5: System Control I/O pins.

SD Card Interface

Connected To	Signal Name	Notes
J1-34	SD-CD	Card detect switch
J1-24	SD-D0
J1-22	SD-CMD
J1-20	SD-CCLK
J1-26	SD-D1
J1-28	SD-D2
J1-30	SD-D3

Table 6: SD Card interface signals and connections.

Ethernet Interface

The TEB0724 Carrier Board has a RJ45 Gigabit Ethernet MagJack (J3) with two LEDs. On-board Ethernet MagJack pins are routed to B2B connector J1 via MDI. LEDs are also routed to the B2B connector.

Ethernet PHY connection

MagJack	Signal	B2B
J3-2	PHY_MDI0_P	J1-7
J3-3	PHY_MDI0_N	J1-9
J3-4	PHY_MDI1_P	J1-13
J3-5	PHY_MDI1_N	J1-15
J3-6	PHY_MDI2_P	J1-19
J3-7	PHY_MDI2_N	J1-21
J3-8	PHY_MDI3_P	J1-25
J3-9	PHY_MDI3_N	J1-27
J3B	PHY_LED0	J1-10
J3C	PHY_LED1	J1-12

Table 7: Ethernet MagJack

I2C Interface

On-board I²C bus is accaessable with the following pins:

SDA	SCL	Notes
J1-144	J1-142	B2B
J6-7	J6-5	In-Circuit Programming
J21-10, J21-4	J21-9, J21-3	Pmod

Table 8: I²C pins.

There are no I2C devices on the base board. Pullup resistors have to be provided by the module.

On-board Peripherals

Pmods

The GPIOs of the 10 Pmods (J10 to J17, J20, J21) are connected with 100 Ohm differential routing to the B2B connector. J21 is a pure I²C compatible Pmod, without additional signals. The other 9 are GPIO Pmods where despite J20 all others can be used as dual Pmods. By default VCCIO_35 is connected with a 0 Ohm resistor to 3.3V. De-soldering this resistor and using not fitted pin header J19 instead, the variable bank power VCCIO_35 for the Pmods J10, J11, J12, J13, J14, J16 can be selected.

	J10		J11		J12		J13		J14		J15		J16		J17		J20		J21
PIN	Signal	B2B	Signal	B2B	Signal	B2B	Signal	B2B	Signal	B2B	Signal	B2B	Signal	B2B	Signal	B2B	Signal	B2B	Signal	B2B
1	PA0_P	J1-56	PB2_N	J1-70	PC2_P	J1-57	PD2_P	J1-77	PE2_N	J1-90	PG2_N	J1-110	PF2_P	J1-97	PH2_P	J1-115	PI2_P	J1-133	NC	-
2	PA0_N	J1-58	PB2_P	J1-72	PC2_N	J1-55	PD2_N	J1-75	PE2_P	J1-92	PG2_P	J1-112	PF2_N	J1-95	PH2_N	J1-113	PI2_N	J1-131	NC	-
3	PA3_P	J1-46	PB0_N	J1-76	PC0_P	J1-51	PD0_P	J1-71	PE0_N	J1-96	PG0_P	J1-114	PF0_P	J1-91	PH0_P	J1-111	PI0_P	J1-129	I2C_SCL	J1-142
4	PA3_N	J1-48	PB0_P	J1-78	PC0_N	J1-49	PD0_N	J1-69	PE0_P	J1-98	PG0_N	J1-116	PF0_N	J1-89	PH0_N	J1-109	PI0_N	J1-127	I2C_SDA	J1-144
5	GND	-	GND	-	GND	-	GND	-	GND	-	GND	-	GND	-	GND	-	GND	-	GND	-
6	VCCIO_35	J1-54	VCCIO_35	J1-54	VCCIO_35	J1-54	VCCIO_35	J1-54	VCCIO_35	J1-54	3.3V	J1-74, J1- 43	VCCIO_35	J1-54	3.3V	J1-74, J1- 43	3.3V	J1-74, J1- 43	3.3V	J1-74, J1- 43
7	PA1_N	J1-62	PB3_P	J1-68	PC3_N	J1-59	PD3_N	J1-79	PE3_P	J1-88	PG3_P	J1-108	PF3_N	J1-99	PH3_N	J1-117	PI3_N	J1-135	NC	-
8	PA1_P	J1-60	PB3_N	J1-66	PC3_P	J1-61	PD3_P	J1-81	PE3_N	J1-86	PG3_N	J1-106	PF3_P	J1-101	PH3_P	J1-119	PI3_P	J1-137	NC	-
9	PA2_N	J1-52	PB1_P	J1-82	PC1_N	J1-45	PD1_N	J1-65	PE1_P	J1-102	PG1_N	J1-120	PF1_N	J1-85	PH1_N	J1-105	PI1_N	J1-123	I2C_SCL	J1-142
10	PA2_P	J1-50	PB1_N	J1-80	PC1_P	J1-47	PD1_P	J1-67	PE1_N	J1-100	PG1_P	J1-121	PF1_P	J1-87	PH1_P	J1-107	PI1_P	J1-125	I2C_SDA	J1-144
11	GND	-	GND	-	GND	-	GND	-	GND	-	GND	-	GND	-	GND	-	GND	-	GND	-
12	VCCIO_35	J1-54	VCCIO_35	J1-54	VCCIO_35	J1-54	VCCIO_35	J1-54	VCCIO_35	J1-54	3.3V	J1-74, J1- 43	VCCIO_35	J1-54	3.3V	J1-74, J1- 43	3.3V	J1-74, J1- 43	3.3V	J1-74, J1- 43

Table 9: Pmod connections.

USB to JTAG/UART bridge

The TEB0724 carrier board has on-board microUSB 2.0 (J4) high-speed to UART/FIFO IC FT2232H (U1) from FTDI. Channel A can be used as JTAG Interface (MPSSE) to program on module JTAG devices. Channel B can be used as UART Interface routed to via a level shifter to the 1.8V section of the B2B connector, usually connected to the PS of the SoM. There is also a 256-byte serial EEPROM connected to the FT2232H chip pre-programmed with license code to support Xilinx programming tools.

Do not access the FT2232H EEPROM using FTDI programming tools, doing so will erase normally invisible user EEPROM content and invalidate stored Xilinx JTAG license. Without this license the on-board JTAG will not be accessible any more with any Xilinx tools. Software tools from FTDI website do not warn or ask for confirmation before erasing user EEPROM content.

CAN Screw Terminal

The CAN bus is routed to screw terminal J2.

PIN	Signal	B2B
J2-1	CAN0_N	J1-1
J2-2	GND
J2-3	CAN0_P	J1-3

Table 10: CAN bus connection.

Jumpers on J22-1 to J22-3 and J22-2 to J22-4 connect proper split termination resistors to the CAN bus.

Oscillators

The module has the following reference clock signals provided by on-board oscillators:

Clock Source	Schematic Name	Frequency	Clock Destination
SiTime SiT8008AI oscillator, U4	OSCI	12.000000 MHz	U1, pin 3.

Table 11: Reference clock signals.

On-board LEDs

LED	Color	Signal	Description and Notes
D1	green	VIN	power indicator
D2-D7	red	ULED1..6	User LED
D8	green	MIO9	MIO user LED
J3B	green	PHY_LED0	Ethernet status
J3C	yellow	PHY_LED1	Ethernet status

Table 12: On-board LEDs.

On-board Push Buttons

Button	Signal	B2B	Description and Notes
S1	ONKEY	J1-148	Power Button, pulled up, on push de-asserted
S3	RESETREQ	J1-150	User LED pulled up, on push de-asserted
S2	S2	J1-124	PL user button, pulled up, on push de-asserted
S4	S4	J1-126	PL user button, pulled up, on push de-asserted
S5	MIO51	J1-42	PS MIO user button, pulled up, on push de-asserted

Table 13: On-board Push Buttons.

Pin Header

Pin Header J6 provides access to power functions, bootmode selection and PMIC In-Circuit Programming.

PIN	Signal	B2B
J6-1	VIN	J1-154, J1-156, J1-158, J1-160
J6-2	VIN	J1-154, J1-156, J1-158, J1-160
J6-3	GND
J6-4	GND
J6-5	I2C_SCL	J1-142
J6-6	VBAT	J1-152
J6-7	I2C_SDA	J1-144
J6-8	PWR_GPIO2	J1-143
J6-9	ONKEY	J1-148
J6-10	PWR_GPIO4	J1-141
J6-11	PWR_TP	J1-146
J6-12	RESETREQ	J1-150
J6-13	MODE0	J1-2
J6-14	GND
J6-15	MODE1	J1-4
J6-16	GND

Table 14: Pin Header J6.

For voltage selection VCCIO_35 (SoM TE0724, Bank 35) other than 3.3V the header J19 can optionaly assembled. Therefore 0 Ohm resistor R45 has to be removed!

PIN	Signal	B2B
J19-1	VLDO1	J1-83
J19-2	GND
J19-3	VCCIO_35	J1-54
J19-4	VLDO2	J1-94
J19-5	VLDO34	J1-53
J19-6	GND

Table 15: Optional Pin Header J19.

Optional fitted headers J7, J8 and J9 are to provide full access to the Pins at the B2B connector, especially for testing and extension purposes. Description follows below.

PL Button and LED IOs are additionally routed to optionally assembled pin header J8.

PIN	Signal	B2B
J8-1	3.3V	J1-43, J1-74
J8-2	GND
J8-3	S4	J1-126
J8-4	S2	J1-124
J8-5	ULED5	J1-130
J8-6	ULED6	J1-128
J8-7	ULED3	J1-134
J8-8	ULED4	J1-132
J8-9	ULED1	J1-138
J8-10	ULED2	J1-136

Table 16: Optional Pin Header J8.

Optional pin header J7 gives access to otherwise not used PS MIO IOs at a 3.3V bank.

PIN	Signal	B2B
J7-1	3.3V	43, 74
J7-2	GND
J7-3	GND
J7-4	MIO8	J1-14
J7-5	MIO10	J1-31
J7-6	MIO11	J1-33
J7-7	MIO12	J1-35
J7-8	MIO13	J1-37
J7-9	MIO14	J1-39
J7-10	MIO15	J1-41

Table 17: Optional Pin Header J7.

Optional pin header J9 gives access to otherwise not used PS MIO IOs at a 1.8V bank.

PIN	Signal	B2B
J9-1	1.8V	J1-63
J9-2	GND
J9-3	GND
J9-4	MIO_46	J1-32
J9-5	MIO_50	J1-40
J9-6	MIO_PB	J1-42

Table 18: Optional Pin Header J9.

Power and Power-On Sequence

Power Consumption

The maximum power consumption depends on the attached module the design running on the module and additional peripherals.

Xilinx provide a power estimator excel sheets to calculate power consumption for FPGAs. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.

Power Input	Typical Current
VIN	TBD*

Table 19: Typical power consumption.

* TBD - To Be Determined soon with reference design setup.

Power supply with minimum current capability of 3A for system startup is recommended.

To avoid any damage to the base board and attached module, check for stabilized voltages should be carried out (i.e. power good and enable signals) before powering up any SoC's I/O bank voltages VCCO_x. All I/Os should be tri-stated during power-on sequence.

Power Distribution Dependencies

Figure 3: Module power distribution diagram.

User should also check related module documentation and Xilinx data sheet, respectively.

Power-On Sequence

The power-on sequence is solely controlled by the attached module. Optional sequenzing signals for integration of additional hardware are PWR_GPIO2 and PWR_GPIO4. If the attached module uses the adjustable bank power VCCIO_35, this has to be powered up after the modules SOCs powerrails are up and before any other signal is applied to the bank IOs. The 1.8V and 3.3V power rails are used for the SD Card level shifter U13. The datasheet states to first power up 1.8V and then 3.3V, this has to be taken into account when reconfiguring the power circuit of the attached SoM.

Power Rails

Power Rail Name	B2B J1 Pins	Direction on B2B	Notes
VIN	154, 156, 158, 160	Output	External main supply voltage.
3.3V	43, 74	Input
1.8V	63	Input
VCCIO_35	54	Output
VLDO1	83	Input
VLDO2	94	Input	Used to enable UART level shifter. Therefore fix at 1.8V.
VLDO34	53	Input
VBAT	152	Input/Output	Reserved for PMIC backup battery and charger.

Table 20 : Board power rails.

Board to Board Connectors

The TEB0724 base board has a 160-pin double-row REF-192552-01 connector on the top side.

Order number	REF Number	Samtec Number	Type	Mated Height	Data sheet	Comment
-	REF-192552-01	SS5-80-3.50-L-D-K-TR	Baseboard connector	4 mm	http://suddendocs.samtec.com/catalog_english/ss5.pdf	Standard connector used on board
27220	REF-192552-02	ST5-80-1.50-L-D-P-TR	Module connector	4 mm	http://suddendocs.samtec.com/catalog_english/st5.pdf	Standard connector used on module

Table 21: Connectors for module and base board.

Variants Currently In Production

Trenz shop TEB0724 overview page
English page	German page

Technical Specifications

Absolute Maximum Ratings

Parameter	Min	Max	Units	Reference Document
VIN supply voltage	-0.3	5.5	V	Depends mostly on attached SoM, values here are for TE0724 PMIC, da9062_3v4.pdf.
Storage temperature	-30	80	°C	Push buttons datasheet.

Table 20: Board absolute maximum ratings.

Assembly variants for higher storage temperature range are available on request.

Recommended Operating Conditions

Parameter	Min	Max	Units	Reference Document
VIN supply voltage	0	5.5	V	Depends mostly on attached SoM, values here are for TE0724 PMIC, da9062_3v4.pdf.
Operating temperature	-25	70	°C	Push buttons datasheet.

Table 21: Board recommended operating conditions.

Please check also the attached SOMs datasheet for complete list of absolute maximum and recommended operating ratings.

Operating Temperature Ranges

Commercial grade: 0°C to +70°C.

Extended grade: 0°C to +85°C.

Industrial grade: -40°C to +85°C.

Module operating temperature range depends also on customer design and cooling solution. Please contact us for options.

Physical Dimensions

Module size: 105 mm × 100 mm. Please download the assembly diagram for exact numbers.
Mating height with standard connectors: 4 mm.
PCB thickness: 1.6 mm.
Highest part on PCB: approx. 13.5 mm. Please download the step model for exact numbers.

All dimensions are given in millimeters.

Figure 4: Module physical dimensions drawing.

Revision History

Hardware Revision History

Date	Revision	Notes	PCN	Documentation Link
-	01	Prototypes

Table 22: Module hardware revision history.

Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

Figure 5: Module hardware revision number.

Document Change History

Date	Revision	Contributors	Description
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2018-07-02	v.1	Martin Rohrmüller	Initial document.

Table 23: Document change history.

Disclaimer

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The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.

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Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.

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02 Sept 2017

Trenz Electronic Documentation