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Table of Contents
Overview
The Trenz Electronic TEC0850 is an industrial-grade MPSoC SoM integrating a Xilinx Zynq UltraScale+ MPSoC, with 64-bit wide SODIMM DDR4 SDRAM, max. Dual 512 MByte Flash memory for configuration and operation. 24 Gigabit transceivers on PL side and 4 PS side. Powerful switch-mode power supplies for all onboard voltages. A large number of configurable I/Os. 3U form factor.
Key Features
...
Block Diagram
Main Components
- ...
- ...
Initial Delivery State
Storage device name | Content | Notes |
---|---|---|
... | ... | .. |
Boot Process
Signals, Interfaces and Pins
USB-C
Front panel USB-C Interface connected to USB FIFO bridge chip FT601Q. 32-bit FIFO bridge provides a simple high-speed interface to Zynq UltraScale+ PL.
FT601Q Signal | FPGA Pin |
---|---|
FIFO_CLK | |
... |
See FT600Q-FT601Q IC Datasheet for interface details.
MicroUSB
Front panel Micro-USB Interface provides access to UART and JTAG functions via FTDI FT2232 chip. Use of this feature requires that USB driver is installed on your host PC. UART0 with MIO 22 .. 23 should be selected in "Zynq UltraScale+ MPSoC" configuration.
The Digilent plug-in software and cable drivers must be installed on your machine for you to be able to use JTAG interface.
SD
There are some limitations to use SD card Interface in Linux.
- Zynq UltraScale+ SD controller is working only in the 3.3V mode as it connected to SD card socket using 1.8V to 3.3V level shifter U10.
- Micro SD card socket has no "Write Protect" switch.
To force Linux driver not to use this features add following instructions to device tree file.
&sdhci1 {
no-1-8-v;
disable-wp;
};
RJ45 -Ethernet
cPCIe
...
MGT
The TEC0850 board has 30 MGT lines routed to backplane connectors.
Bank | Connector | Lanes |
---|---|---|
PL 128 | J4G and J4H | 4 |
PL 129 | J5A and J5B | 4 |
PL 130 | J5C and J5D | 4 |
PL 230 | J4G and J4H | 4 |
PL 229 | J5A and J5B | 4 |
PL 228 | J5C and J5D | 4 |
PS 505 | J1A | 4 |
MGT reference clocks are connected to banks 129, 229 and 505. Banks 128 and 130 should share clock from bank 129, banks 230 and 228 from bank 229.
USB Interface
Zynq UltraScale+ USB controller connected to backplane connector J1C via USB PHY chip U11.
DDR4 SODIMM Socket
The Zynq UltraScale+ DDRC hard memory controller is wired to the DDR4 SODIMM Socket U3.
Circular Push Pull Connector
PicoBlade Connector
Pin Heater 2,54mm (2x5)
Battery holder
On-board Peripherals
Zynq UltraScale XCZU15EG MPSoC
The TEC0850 board is populated with the Zynq UltraScale+ XCZU15EG-1FFVB1156E MPSoC.
Main IO interfaces are shown on the image below.
PS MIO Configuration
MIO | Interface |
---|---|
MIO 0...12 | QSPI Flash Memory |
MIO 20...21 | I2C 1 |
MIO 22...23 | UART 0 |
MIO 26...37 | GEM 0 |
MIO 46...51 | SD 1 |
MIO 52...63 | USB 0 |
MIO 64...75 | USB 1 |
MIO 76...77 | MDIO 0 |
Table 10: Default MIO Configuration
MAX10 System Controller
System controller chip is Intel MAX10 10M08SAU169C8G Chip with board control firmware.
Programmable Clock Generators
I2C
The onboard I2C bus is connected to MIO 20...21 pins. Devices on the bus shown in the table below.
I2C address | Chip | Description |
---|---|---|
0x69 | U14 Si5345 | Clock generator and distributor |
Oscillators
FTDIs
FT2232H
FT601Q-B-T
Quad-SPI Flash Memory
Board has two N25Q512A11G1240E connected in a dual parallel mode.
EEPROMs
I2C
The onboard I2C bus is connected to MIO 20...21 pins. Devices on the bus shown in the table below.
I2C address | Chip | Description |
---|---|---|
0x50 | U63 24AA128T-I/ST | 128K Serial EEPROM |
0x53 | U64 24AA025E48T-I/OT | 2K Serial EEPROM with EUI-48™ or EUI-64™ Node Identity |
USB PHY
Gigabit Ethernet PHY
Board has Marvell Alaska 88E1512 Ethernet PHY which use MDIO address 1.
8Bit DACs
Board has 4 8-bit parallel Texas Instruments THS5641 DACs with up to 100 MSPS Update Rate.
DIP-Switches
S1
Switch | Description |
---|---|
1 | Boot Mode 0 |
2 | Boot Mode 1 |
3 | Boot Mode 2 |
4 | Boot Mode 3 |
See Zynq UltraScale+ Device Technical Reference Manual page 236 for full boot modes description. Most common modes are
Boot Mode | SW1:4 | SW1:3 | SW1:2 | SW1:1 |
---|---|---|---|---|
JTAG Boot Mode | ON | ON | ON | ON |
Quad-SPI | ON | ON | ON | OFF |
SD Card | ON | ON | OFF | OFF |
S2
Switch | Description |
---|---|
1 | SC JTAGEN |
2 | EEPROM WP (Write protect) |
3 | FPGA PUDC |
4 | SC Switch (Reserved for future use) |
Buttons
LEDs
LED | Signal | Chip | Pin | Description |
---|---|---|---|---|
Front panel LED 1 (Red) | LED_FP_1 | FPGA U1 | AF15 | PL User defined LED |
Front panel LED 2 (Green) | LED_FP_2 | FPGA U1 | AG15 | PL User defined LED |
Front panel LED 3 (Green) | LED_FP_3 | FPGA U1 | AE15 | PL User defined LED |
Front panel LED 4 (Green) | LED_FP_4 | SC U18 | M4 | Power Good |
Power and Power-On Sequence
Power Consumption
The maximum power consumption of a module mainly depends on the design running on the FPGA.
Xilinx provide a power estimator excel sheets to calculate power consumption. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.
Power Input | Typical Current |
---|---|
TBD* |
Table : Typical power consumption.
Power Distribution Dependencies
Power-On Sequence
Power Rails
Bank Voltages
Variants Currently In Production
Trenz shop TE0C0850 overview page | |
---|---|
English page | German page |
Technical Specifications
Absolute Maximum Ratings
Parameter | Min | Max | Units | Reference Document |
---|---|---|---|---|
supply voltage... | V | - | ||
Storage temperature | °C | - |
Table : Module absolute maximum ratings.
Recommended Operating Conditions
Parameter | Min | Max | Units | Reference Document |
---|---|---|---|---|
supply voltage... | ||||
Operating temperature |
Table : Module recommended operating conditions.
Physical Dimensions
Board size: ...mm × ...mm. Please download the assembly diagram for exact numbers
PCB thickness: ca. ...mm
The board meets the ... Specification...
All dimensions are given in millimeters.
Revision History
Hardware Revision History
Date | Revision | Notes | PCN | Documentation Link |
---|---|---|---|---|
- | 02 | current available board revision | - | TEC0850-02 |
- | 01 | First production release | - | - |
Table 24: Module hardware revision history
Hardware revision number can be found on the PCB board together with the module model number separated by the dash.
Document Change History
Table 25: Document change history
Date | Revision | Contributors | Description |
---|---|---|---|
| |||
all |
Disclaimer
Data Privacy
Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy
Document Warranty
The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.
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Technology Licenses
The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.
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RoHS
Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.
WEEE
Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).
Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.
Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.