- Created by John Hartfiel, last modified by Manuela Strücker on 14 09, 2023
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Overview
Design Example with minimum PS Setup (DDR, QSPI, UART0) only for custom boards or easier debug via Vitis.
Refer to http://trenz.org/te0803-info for the current online version of this manual and other available documentation.
Key Features
Vitis/Vivado 2022.2
QSPI
Custom Carrier (minimum PS Design with available module components only)
Modified FSBL (some additional outputs only)
Revision History
Date | Vivado | Project Built | Authors | Description |
---|---|---|---|---|
2023-09-14 | 2022.2 | TE0803-test_board-vivado_2022.2-build_8_20230914124756.zip TE0803-test_board_noprebuilt-vivado_2022.2-build_8_20230914124756.zip | Manuela Strücker |
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2022-10-17 | 2021.2.1 | TE0803-test_board-vivado_2021.2-build_18_20221017093148.zip TE0803-test_board_noprebuilt-vivado_2021.2-build_18_20221017093148.zip | Manuela Strücker |
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2022-08-30 | 2021.2.1 | TE0803-test_board-vivado_2021.2-build_15_20220830131430.zip TE0803-test_board_noprebuilt-vivado_2021.2-build_15_20220830131430.zip | Manuela Strücker |
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2022-04-05 | 2021.2 | TE0803-test_board-vivado_2021.2-build_11_20220405100116.zip TE0803-test_board_noprebuilt-vivado_2021.2-build_11_20220405100116.zip | Manuela Strücker |
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2021-09-06 | 2020.2 | TE0803-test_board-vivado_2020.2-build_7_20210906104518.zip TE0803-test_board_noprebuilt-vivado_2020.2-build_7_20210906104536.zip | Manuela Strücker |
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2020-04-06 | 2019.2 | TE0803-test_board-vivado_2019.2-build_9_20200406081019.zip TE0803-test_board_noprebuilt-vivado_2019.2-build_9_20200406081036.zip | John Hartfiel |
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2020-03-25 | 2019.2 | TE0803-test_board-vivado_2019.2-build_8_20200325082253.zip TE0803-test_board_noprebuilt-vivado_2019.2-build_8_20200325082311.zip | John Hartfiel |
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2020-01-23 | 2019-2 | TE0803-test_board-vivado_2019.2-build_3_20200123070036.zip TE0803-test_board_noprebuilt-vivado_2019.2-build_3_20200123070049.zip | John Hartfiel |
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2019-5-06 | 2018.3 | TE0803-test_board_noprebuilt-vivado_2018.3-build_05_20190506161948.zip TE0803-test_board-vivado_2018.3-build_05_20190506161936.zip | John Hartfiel |
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2018-10-26 | 2018.2 | TE0803-test_board_noprebuilt-vivado_2018.2-build_03_20181026141705.zip TE0803-test_board-vivado_2018.2-build_03_20181026141651.zip | John Hartfiel |
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2018-08-14 | 2018.2 | TE0803-test_board_noprebuilt-vivado_2018.2-build_02_20180814103119.zip TE0803-test_board-vivado_2018.2-build_02_20180814103105.zip | John Hartfiel |
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2018-07-13 | 2018.2 | TE0803-test_board_noprebuilt-vivado_2018.2-build_02_20180713085721.zip TE0803-test_board-vivado_2018.2-build_02_20180713085704.zip | John Hartfiel |
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2018-05-17 | 2017.4 | TE0803-test_board_noprebuilt-vivado_2017.4-build_09_20180517152118.zip TE0803-test_board-vivado_2017.4-build_09_20180517152103.zip | John Hartfiel |
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2018-04-11 | 2017.4 | TE0803-test_board_noprebuilt-vivado_2017.4-build_07_20180411081821.zip TE0803-test_board-vivado_2017.4-build_07_20180411081757.zip | John Hartfiel |
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2018-02-13 | 2017.4 | TE0803-test_board_noprebuilt-vivado_2017.4-build_06_20180213120257.zip TE0803-test_board-vivado_2017.4-build_06_20180213120229.zip | John Hartfiel |
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2018-02-05 | 2017.4 | TE0803-test_board-vivado_2017.4-build_05_20180205101915.zip TE0803-test_board_noprebuilt-vivado_2017.4-build_05_20180205101943.zip | John Hartfiel |
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2018-01-31 | 2017.4 | TE0803-test_board-vivado_2017.4-build_05_20180131124202.zip TE0803-test_board_noprebuilt-vivado_2017.4-build_05_20180131124215.zip | John Hartfiel |
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2018-01-18 | 2017.4 | TE0803-test_board-vivado_2017.4-build_05_20180118160549.zip TE0803-test_board_noprebuilt-vivado_2017.4-build_05_20180118160604.zip | John Hartfiel |
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2017-11-16 | 2017.2 | TE0803-test_board-vivado_2017.2-build_05_20171116152716.zip TE0803-test_board_noprebuilt-vivado_2017.2-build_05_20171116154619.zip | John Hartfiel |
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2017-11-14 | 2017.2 | TE0803-test_board-vivado_2017.2-build_05_20171114090712.zip TE0803-test_board_noprebuilt-vivado_2017.2-build_05_20171114090725.zip | John Hartfiel |
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Release Notes and Know Issues
Issues | Description | Workaround | To be fixed version |
---|---|---|---|
Xilinx Software | Incompatibility of board files for ZynqMP with eMMC activated between 2021.2 and 2021.2.1 patch, see Xilinx Forum Request | use corresponding board files for the Vivado versions | -- |
QSPI Flash | Flash programming is not supported with boot mode QSPI or SD. | If flash programming fails, configure device for JTAG boot mode and try again or use older Vivado Versions for programming. (Vivado 2020.2 or 2019.2) | -- |
Requirements
Software
Software | Version | Note |
---|---|---|
Vitis | 2022.2 | needed, Vivado is included into Vitis installation |
Hardware
Basic description of TE Board Part Files is available on TE Board Part Files.Complete List is available on "<project folder>\board_files\*_board_files.csv"
Design supports following modules:
Module Model | Board Part Short Name | PCB Revision Support | DDR | QSPI Flash | EMMC | Others | Notes |
---|---|---|---|---|---|---|---|
TE0803-01-02EG-1E | 2eg_2gb | REV01 | 2GB | 64MB | NA | NA | NA |
TE0803-01-02CG-1E | 2cg_2gb | REV01 | 2GB | 64MB | NA | NA | NA |
TE0803-01-03EG-1E | 3eg_2gb | REV01 | 2GB | 64MB | NA | NA | NA |
TE0803-01-03CG-1E | 3cg_2gb | REV01 | 2GB | 64MB | NA | NA | NA |
TE0803-01-02EG-1EA | 2eg_2gb | REV01 | 2GB | 128MB | NA | NA | NA |
TE0803-01-02CG-1EA | 2cg_2gb | REV01 | 2GB | 128MB | NA | NA | NA |
TE0803-01-03EG-1EA | 3eg_2gb | REV01 | 2GB | 128MB | NA | NA | NA |
TE0803-01-03CG-1EA | 3cg_2gb | REV01 | 2GB | 128MB | NA | NA | NA |
TE0803-02-03EG-1EB | 3eg_4gb | REV02|REV01 | 4GB | 128MB | NA | NA | NA |
TE0803-01-04CG-1EA | 4cg_2gb | REV01 | 2GB | 128MB | NA | NA | NA |
TE0803-02-04EV-1EA | 4ev_2gb | REV02|REV01 | 2GB | 128MB | NA | NA | NA |
TE0803-01-04EV-1E3 | 4ev_2gb | REV01 | 2GB | 128MB | NA | 1 mm connectors | NA |
TE0803-01-04EG-1EA | 4eg_2gb | REV01 | 2GB | 128MB | NA | NA | NA |
TE0803-01-04CG-1EB | 4cg_2gb | REV01 | 2GB | 256MB | NA | NA | NA |
TE0803-01-05EV-1EA | 5ev_2gb | REV01 | 2GB | 128MB | NA | NA | NA |
TE0803-01-05EV-1IA | 5ev_i_2gb | REV01 | 2GB | 128MB | NA | NA | NA |
TE0803-02-04EV-1E3 | 4ev_4gb | REV02 | 4GB | 128MB | NA | 1 mm connectors | NA |
TE0803-02-04EG-1E3 | 4eg_4gb | REV02 | 4GB | 128MB | NA | 1 mm connectors | NA |
TE0803-03-2AE11-A | 2cg_2gb | REV03 | 2GB | 128MB | NA | NA | NA |
TE0803-03-2BE11-A | 2eg_2gb | REV03 | 2GB | 128MB | NA | NA | NA |
TE0803-03-3AE11-A | 3cg_2gb | REV03 | 2GB | 128MB | NA | NA | NA |
TE0803-03-3BE11-A | 3eg_2gb | REV03 | 2GB | 128MB | NA | NA | NA |
TE0803-03-4AE11-A | 4cg_2gb | REV03 | 2GB | 128MB | NA | NA | NA |
TE0803-03-4BE11-A | 4eg_2gb | REV03 | 2GB | 128MB | NA | NA | NA |
TE0803-03-4BE21-L | 4eg_4gb | REV03 | 4GB | 128MB | NA | 1 mm connectors | NA |
TE0803-03-4BI21-A | 4eg_i_4gb | REV03 | 4GB | 128MB | NA | NA | NA |
TE0803-03-4DE11-A | 4ev_2gb | REV03 | 2GB | 128MB | NA | NA | NA |
TE0803-03-4DE21-L | 4ev_4gb | REV03 | 4GB | 128MB | NA | 1 mm connectors | NA |
TE0803-03-4GE21-L | 4eg_2_4gb | REV03 | 4GB | 128MB | NA | 1 mm connectors | NA |
TE0803-03-5DE11-A | 5ev_2gb | REV03 | 2GB | 128MB | NA | NA | NA |
TE0803-03-5DI21-A | 5ev_i_4gb | REV03 | 4GB | 128MB | NA | NA | NA |
TE0803-03-3RI21-A | 3eg_li_4gb | REV03 | 4GB | 128MB | NA | NA | NA |
TE0803-03-3BI21-A | 3eg_i_4gb | REV03 | 4GB | 128MB | NA | NA | NA |
TE0803-03-4DI21-L | 4ev_i_4gb | REV03 | 4GB | 128MB | NA | 1 mm connectors | NA |
TE0803-03-4GI11-A | 4eg_2i_2gb | REV03 | 2GB | 128MB | NA | NA | NA |
TE0803-03-4GE11-A | 4eg_2_2gb | REV03 | 2GB | 128MB | NA | NA | NA |
TE0803-03-4GI21-A | 4eg_2i_4gb | REV03 | 4GB | 128MB | NA | NA | NA |
TE0803-03-5BE11-A | 5eg_2gb | REV03 | 2GB | 128MB | NA | NA | NA |
TE0803-03-5DI24-A | 5ev_i_4gb | REV03 | 4GB | 512MB | NA | NA | NA |
TE0803-03-4BI21-X | 4eg_i_4gb | REV03 | 4GB | 128MB | NA | NA | U41 replaced with diode |
TE0803-03-3BE21-A | 3eg_4gb | REV03 | 4GB | 128MB | NA | NA | NA |
TE0803-03-3BE31-A* | 3eg_8gb | REV03 | 8GB | 128MB | NA | NA | dual die ddr |
TE0803-04-2AE11-A | 2cg_2gb | REV04 | 2GB | 128MB | NA | NA | NA |
TE0803-04-2BE11-A | 2eg_2gb | REV04 | 2GB | 128MB | NA | NA | NA |
TE0803-04-3AE11-A | 3cg_2gb | REV04 | 2GB | 128MB | NA | NA | NA |
TE0803-04-3BE11-A | 3eg_2gb | REV04 | 2GB | 128MB | NA | NA | NA |
TE0803-04-4BE21-L | 4eg_4gb | REV04 | 4GB | 128MB | NA | 1 mm connectors | NA |
TE0803-04-4BI21-A | 4eg_i_4gb | REV04 | 4GB | 128MB | NA | NA | NA |
TE0803-04-4BI21-X | 4eg_i_4gb | REV04 | 4GB | 128MB | NA | NA | U41 replaced with diode |
TE0803-03-4BI61-A | 4eg_8gb | REV03 | 8GB | 128MB | NA | NA | dual die ddr |
TE0803-03-4BI61-X | 4eg_8gb | REV03 | 8GB | 128MB | NA | NA | dual die ddr |
TE0803-04-4BI61-A | 4eg_8gb | REV04 | 8GB | 128MB | NA | NA | dual die ddr |
TE0803-04-4BI61-X | 4eg_8gb | REV04 | 8GB | 128MB | NA | NA | dual die ddr |
TE0803-04-4DE11-A | 4ev_2gb | REV04 | 2GB | 128MB | NA | NA | NA |
TE0803-04-4DE21-L | 4ev_4gb | REV04 | 4GB | 128MB | NA | 1 mm connectors | NA |
TE0803-04-4DI21-L | 4ev_i_4gb | REV04 | 4GB | 128MB | NA | 1 mm connectors | NA |
TE0803-03-4DI21-D | 4ev_i_4gb | REV03 | 4GB | 128MB | NA | NA | NA |
TE0803-04-4DI21-D | 4ev_i_4gb | REV04 | 4GB | 128MB | NA | NA | NA |
TE0803-04-4GE21-L | 4eg_2_4gb | REV04 | 4GB | 128MB | NA | 1 mm connectors | NA |
TE0803-04-4GI21-A | 4eg_2i_4gb | REV04 | 4GB | 128MB | NA | NA | NA |
TE0803-04-5BE11-A | 5eg_2gb | REV04 | 2GB | 128MB | NA | NA | NA |
TE0803-04-5DE11-A | 5ev_2gb | REV04 | 2GB | 128MB | NA | NA | NA |
TE0803-04-5DI21-A | 5ev_i_4gb | REV04 | 4GB | 128MB | NA | NA | NA |
TE0803-03-S003 | 4ev_2gb | REV04 | 2GB | 128MB | NA | NA | CAO |
TE0803-03-S006 | 4ev_4gb | REV04 | 4GB | 128MB | NA | 1 mm connectors | CAO |
TE0803-04-4BE11-A | 4eg_2gb | REV04 | 2GB | 128MB | NA | NA | CAO |
TE0803-03-S005 | 4eg_2gb | REV03 | 2GB | 128MB | NA | NA | CAO: TE0803-03-4BI1?-A |
TE0803-04-S009 | 4eg_2_4gb | REV04 | 4GB | 128MB | NA | 1 mm connectors | CAO: TE0803-04-4GE21-L |
TE0803-04-S011 | 4eg_2_4gb | REV04 | 4GB | 64MB | NA | 1 mm connectors | CAO: TE0803-04-4GE25-L |
TE0803-04-4AE11-A | 4cg_2gb | REV04 | 2GB | 128MB | NA | NA | NA |
TE0803-04-S012 | 2cg_2gb | REV04 | 2GB | 128MB | NA | NA | CAO |
TE0803-03-4DE21-LZ | 4ev_4gb | REV03 | 4GB | 128MB | NA | 1 mm connectors | NA |
TE0803-03-3AE11-AK | 3cg_2gb | REV03 | 2GB | 128MB | NA | NA | NA |
TE0803-04-4AE11-AK | 4cg_2gb | REV04 | 2GB | 128MB | NA | NA | NA |
TE0803-04-4DE11-AZ | 4ev_2gb | REV04 | 2GB | 128MB | NA | NA | NA |
TE0803-04-S013 | 3cg_2gb | REV04 | 2GB | 128MB | NA | NA | NA |
TE0803-04-S014 | 4eg_2_4gb | REV04 | 4GB | 64MB | NA | 1 mm connectors | CAO: TE0803-04-4GE2?-LZ |
TE0803-04-S016 | 4cg_2gb | REV04 | 2GB | 128MB | NA | NA | NA |
TE0803-04-S017 | 2eg_2gb | REV04 | 2GB | 128MB | NA | NA | NA |
TE0803-04-S018 | 4eg_2_4gb | REV04 | 4GB | 128MB | NA | 1 mm connectors | NA |
TE0803-04-S020 | 4cg_2gb | REV04 | 2GB | 128MB | NA | NA | NA |
TE0803-04-3BE21-L | 3eg_4gb | REV04 | 4GB | 128MB | NA | NA | NA |
TE0803-04-4AE11-AZ | 4cg_2gb | REV04 | 2GB | 128MB | NA | NA | NA |
TE0803-04-4DE21-LZ | 4ev_4gb | REV04 | 4GB | 128MB | NA | 1 mm connectors | NA |
TE0803-04-3AE11-AK | 3cg_2gb | REV04 | 2GB | 128MB | NA | NA | NA |
TE0803-04-S022 | 4eg_2_4gb | REV04 | 4GB | 128MB | NA | 1 mm connectors | CAO: TE0803-04-4GE21-LZ |
TE0803-04-S023 | 4eg_2_4gb | REV04 | 4GB | 128MB | NA | 1 mm connectors | CAO: TE0803-04-4GE81-L |
TE0803-04-4BE11-AK | 4eg_2gb | REV04 | 2GB | 128MB | NA | NA | NA |
TE0803-04-S026 | 5ev_i_4gb | REV04 | 4GB | 128MB | NA | NA | CAO: TE0803-04-5DI21-A |
TE0803-04-2BE11-AK | 2eg_2gb | REV04 | 2GB | 128MB | NA | NA | NA |
TE0803-04-S010 | 5ev_2gb | REV04 | 2GB | 128MB | NA | NA | CAO: TE0803-04-5DE11-A |
*used as reference
Design supports following carriers:
Carrier Model | Notes |
---|---|
Custom PCB | use simple Board Part files, if MIO connected is different to TEBF0808 |
TEBF0808* | Used as reference carrier. Important: CPLD Firmware REV07 or newer is recommended |
TEBT0808-01 | Change UART0 to UART1 (MIO68...69) and regenerate design |
*used as reference
Additional HW Requirements:
Additional Hardware | Notes |
---|---|
--- | --- |
*used as reference
Content
For general structure and usage of the reference design, see Project Delivery - AMD devices
Design Sources
Type | Location | Notes |
---|---|---|
Vivado | <project folder>\block_design <project folder>\constraints <project folder>\ip_lib <project folder>\board_files | Vivado Project will be generated by TE Scripts |
Vitis | <project folder>\sw_lib | Additional Software Template for Vitis and apps_list.csv with settings automatically for Vitis app generation |
Additional Sources
Type | Location | Notes |
---|---|---|
--- | --- | --- |
Prebuilt
File | File-Extension | Description |
---|---|---|
BIF-File | *.bif | File with description to generate Bin-File |
BIN-File | *.bin | Flash Configuration File with Boot-Image (Zynq-FPGAs) |
BIT-File | *.bit | FPGA (PL Part) Configuration File |
Diverse Reports | --- | Report files in different formats |
Hardware-Platform-Description-File | *.xsa | Exported Vivado hardware description file for Vitis and PetaLinux |
LabTools Project-File | *.lpr | Vivado Labtools Project File |
Software-Application-File | *.elf | Software Application for Zynq or MicroBlaze Processor Systems |
Download
Reference Design is only usable with the specified Vivado/Vitis/PetaLinux version. Do never use different Versions of Xilinx Software for the same Project.
Reference Design is available on:
Design Flow
Reference Design is available with and without prebuilt files. It's recommended to use TE prebuilt files for first launch.
Trenz Electronic provides a tcl based built environment based on Xilinx Design Flow.
See also:
- AMD Development Tools#XilinxSoftware-BasicUserGuides
- Vivado Projects - TE Reference Design
- Project Delivery.
The Trenz Electronic FPGA Reference Designs are TCL-script based project. Command files for execution will be generated with "_create_win_setup.cmd" on Windows OS and "_create_linux_setup.sh" on Linux OS.
TE Scripts are only needed to generate the vivado project, all other additional steps are optional and can also executed by Xilinx Vivado/Vitis GUI. For currently Scripts limitations on Win and Linux OS see: Project Delivery Currently limitations of functionality
Caution! Win OS has a 260 character limit for path lengths which can affect the Vivado tools. To avoid this issue, use Virtual Drive or the shortest possible names and directory locations for the reference design (for example "x:\<project folder>")
Run _create_win_setup.cmd/_create_linux_setup.sh and follow instructions on shell:
_create_win_setup.cmd/_create_linux_setup.sh------------------------Set design paths---------------------------- -- Run Design with: _create_win_setup -- Use Design Path: <absolute project path> -------------------------------------------------------------------- -------------------------TE Reference Design--------------------------- -------------------------------------------------------------------- -- (0) Module selection guide, project creation...prebuilt export... -- (1) Create minimum setup of CMD-Files and exit Batch -- (2) Create maximum setup of CMD-Files and exit Batch -- (3) (internal only) Dev -- (4) (internal only) Prod -- (c) Go to CMD-File Generation (Manual setup) -- (d) Go to Documentation (Web Documentation) -- (g) Install Board Files from Xilinx Board Store (beta) -- (a) Start design with unsupported Vivado Version (beta) -- (x) Exit Batch (nothing is done!) ---- Select (ex.:'0' for module selection guide):
Press 0 and enter to start "Module Selection Guide"
- Create project and follow instructions of the product selection guide, settings file will be configured automatically during this process.
optional for manual changes: Select correct device and Xilinx install path on "design_basic_settings.cmd" and create Vivado project with "vivado_create_project_guimode.cmd"
Note: Select correct one, see also Vivado Board Part Flow
Important: Use Board Part Files, which did not ends with *_tebf0808
Create hardware description file (.xsa file) for PetaLinux project and export to prebuilt folder
run on Vivado TCL (Script generates design and export files into "<project folder>\prebuilt\hardware\<short name>")TE::hw_build_design -export_prebuilt
Using Vivado GUI is the same, except file export to prebuilt folder.
Generate Programming Files with Vitis
run on Vivado TCL (Script generates applications and bootable files, which are defined in "test_board\sw_lib\apps_list.csv")TE::sw_run_vitis -all TE::sw_run_vitis (optional; Start Vitis from Vivado GUI or start with TE Scripts on Vivado TCL)
TCL scripts generate also platform project, this must be done manually in case GUI is used. See Vitis
Launch
Programming
Check Module and Carrier TRMs for proper HW configuration before you try any design.
Reference Design is also available with prebuilt files. It's recommended to use TE prebuilt files for first launch.
Xilinx documentation for programming and debugging: Vivado/Vitis/SDSoC-Xilinx Software Programming and Debugging
Get prebuilt boot binaries
- Run _create_win_setup.cmd/_create_linux_setup.sh and follow instructions on shell
- Press 0 and enter to start "Module Selection Guide"
- Select assembly version
- Validate selection
Select create and open delivery binary folder
Note: Folder "<project folder>\_binaries_<Article Name>" with subfolder "boot_<app name>" for different applications will be generated
QSPI-Boot mode
- Connect JTAG and power on carrier with module
Open Vivado Project with "vivado_open_existing_project_guimode.cmd" or if not created, create with "vivado_create_project_guimode.cmd"
run on Vivado TCL (Script programs BOOT.bin on QSPI flash)TE::pr_program_flash -swapp hello_te0803
SD-Boot mode
This does not work, because SD controller is not selected on PS.
JTAG
Load configuration and Application with Vitis Debugger into device
Usage
QSPI Boot:
Prepare HW like described on section Programming
Connect UART USB (most cases same as JTAG)
Select QSPI as Boot Mode
Note: See TRM of the Carrier, which is used.
Power On PCB
1. ZynqMP Boot ROM loads FSBL from QSPI into OCM,
2. FSBL init the PS, programs the PL using the bitstream and loads PMU, ATF and U-boot from QSPI into DDR,
System Design - Vivado
Block Design
PS Interfaces
Activated interfaces:
Type | Note |
---|---|
DDR | |
QSPI | MIO |
UART0 | MIO, please select other one, if you have connected UART to second controller or other MIO |
SWDT0..1 | |
TTC0..3 |
Constrains
Basic module constrains
set_property BITSTREAM.GENERAL.COMPRESS TRUE [current_design] set_property BITSTREAM.CONFIG.UNUSEDPIN PULLNONE [current_design]
Design specific constrain
Not needed.
Software Design - Vitis
For Vitis project creation, follow instructions from:
Application
Template location: "<project folder>\sw_lib\sw_apps\"zynqmp_fsbl
TE modified 2022.2 FSBL
General:
- Modified Files: xfsbl_main.c, xfsbl_hooks.h/.c, xfsbl_board.h/.c (search for 'TE Mod' on source code)
- Add Files: te_xfsbl_hooks.h/.c (for hooks and board)
- General Changes:
- Display FSBL Banner and Device Name
hello_te0803
Hello TE0803 is a Xilinx Hello World example as endless loop instead of one console output.
Additional Software
No additional software is needed.
Appx. A: Change History and Legal Notices
Document Change History
To get content of older revision go to "Change History" of this page and select older document revision number.
Date | Document Revision | Authors | Description |
---|---|---|---|
Error rendering macro 'page-info' Ambiguous method overloading for method jdk.proxy244.$Proxy3557#hasContentLevelPermission. Cannot resolve which method to invoke for [null, class java.lang.String, class com.atlassian.confluence.pages.Page] due to overlapping prototypes between: [interface com.atlassian.confluence.user.ConfluenceUser, class java.lang.String, class com.atlassian.confluence.core.ContentEntityObject] [interface com.atlassian.user.User, class java.lang.String, class com.atlassian.confluence.core.ContentEntityObject] | Error rendering macro 'page-info' Ambiguous method overloading for method jdk.proxy244.$Proxy3557#hasContentLevelPermission. Cannot resolve which method to invoke for [null, class java.lang.String, class com.atlassian.confluence.pages.Page] due to overlapping prototypes between: [interface com.atlassian.confluence.user.ConfluenceUser, class java.lang.String, class com.atlassian.confluence.core.ContentEntityObject] [interface com.atlassian.user.User, class java.lang.String, class com.atlassian.confluence.core.ContentEntityObject] | Error rendering macro 'page-info' Ambiguous method overloading for method jdk.proxy244.$Proxy3557#hasContentLevelPermission. Cannot resolve which method to invoke for [null, class java.lang.String, class com.atlassian.confluence.pages.Page] due to overlapping prototypes between: [interface com.atlassian.confluence.user.ConfluenceUser, class java.lang.String, class com.atlassian.confluence.core.ContentEntityObject] [interface com.atlassian.user.User, class java.lang.String, class com.atlassian.confluence.core.ContentEntityObject] |
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2022-10-17 | v.33 | Manuela Strücker |
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2022-09-06 | v.32 | Manuela Strücker |
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2022-07-15 | v.30 | Manuela Strücker |
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2021-09-09 | v.25 | Manuela Strücker |
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2020-04-06 | v.24 | John Hartfiel |
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2020-03-25 | v.23 | John Hartfiel |
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2020-01-23 | v.22 | John Hartfiel |
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2019-05-07 | v.21 | John Hartfiel |
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2018-10-26 | v.18 | John Hartfiel |
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2018-08-14 | v.16 | John Hartfiel |
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2018-07-13 | v.15 | John Hartfiel |
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2018-05-18 | v.14 | John Hartfiel |
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2018-04-11 | v.13 | John Hartfiel |
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2018-04-03 | v.11 | John Hartfiel |
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2018-01-18 | v.6 | John Hartfiel |
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2017-11-16 | v.4 | John Hartfiel |
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2017-11-14 | v.3 | John Hartfiel |
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All | Error rendering macro 'page-info' Ambiguous method overloading for method jdk.proxy244.$Proxy3557#hasContentLevelPermission. Cannot resolve which method to invoke for [null, class java.lang.String, class com.atlassian.confluence.pages.Page] due to overlapping prototypes between: [interface com.atlassian.confluence.user.ConfluenceUser, class java.lang.String, class com.atlassian.confluence.core.ContentEntityObject] [interface com.atlassian.user.User, class java.lang.String, class com.atlassian.confluence.core.ContentEntityObject] |
Legal Notices
Data Privacy
Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy
Document Warranty
The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.
Limitation of Liability
In no event will Trenz Electronic, its suppliers, or other third parties mentioned in this document be liable for any damages whatsoever (including, without limitation, those resulting from lost profits, lost data or business interruption) arising out of the use, inability to use, or the results of use of this document, any documents linked to this document, or the materials or information contained at any or all such documents. If your use of the materials or information from this document results in the need for servicing, repair or correction of equipment or data, you assume all costs thereof.
Copyright Notice
No part of this manual may be reproduced in any form or by any means (including electronic storage and retrieval or translation into a foreign language) without prior agreement and written consent from Trenz Electronic.
Technology Licenses
The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.
Environmental Protection
To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.
REACH, RoHS and WEEE
REACH
Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).
RoHS
Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.
WEEE
Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).
Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.
Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.
Error rendering macro 'page-info'
Ambiguous method overloading for method jdk.proxy244.$Proxy3557#hasContentLevelPermission. Cannot resolve which method to invoke for [null, class java.lang.String, class com.atlassian.confluence.pages.Page] due to overlapping prototypes between: [interface com.atlassian.confluence.user.ConfluenceUser, class java.lang.String, class com.atlassian.confluence.core.ContentEntityObject] [interface com.atlassian.user.User, class java.lang.String, class com.atlassian.confluence.core.ContentEntityObject]
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