Refer to http://trenz.org/te0808-info for the current online version of this manual and other available documentation.
Date | Vivado | Project Built | Authors | Description |
---|---|---|---|---|
2024-05-29 | 2023.2 | TE0808-test_board-vivado_2023.2-build_4_20240528102532.zip TE0808-test_board_noprebuilt-vivado_2023.2-build_4_20240528102532.zip | Manuela Strücker |
|
2024-03-13 | 2023.2 | TE0808-test_board-vivado_2023.2-build_4_20240313130413.zip TE0808-test_board_noprebuilt-vivado_2023.2-build_4_20240313130413.zip | Manuela Strücker |
|
2023-06-01 | 2022.2 | TE0808-test_board-vivado_2022.2-build_1_20230601101432.zip TE0808-test_board_noprebuilt-vivado_2022.2-build_1_20230601101432.zip | Manuela Strücker |
|
2023-04-13 | 2021.2.1 | TE0808-test_board-vivado_2021.2-build_20_20230413090245.zip TE0808-test_board_noprebuilt-vivado_2021.2-build_20_20230413090245.zip | Manuela Strücker |
|
2022-09-29 | 2021.2.1 | TE0808-test_board-vivado_2021.2-build_17_20220928203325.zip TE0808-test_board_noprebuilt-vivado_2021.2-build_17_20220928203325.zip | Manuela Strücker |
|
2022-09-12 | 2021.2.1 | TE0808-test_board-vivado_2021.2-build_15_20220912090608.zip TE0808-test_board_noprebuilt-vivado_2021.2-build_15_20220912090608.zip | Manuela Strücker |
|
2022-03-21 | 2021.2 | TE0808-test_board-vivado_2021.2-build_11_20220321063547.zip TE0808-test_board_noprebuilt-vivado_2021.2-build_11_20220321063547.zip | John Hartfiel |
|
2022-03-16 | 2021.2 | TE0808-test_board-vivado_2021.2-build_11_20220316091917.zip TE0808-test_board_noprebuilt-vivado_2021.2-build_11_20220316091917.zip | Manuela Strücker |
|
2021-05-12 | 2020.2 | TE0808-test_board-vivado_2020.2-build_5_20210512133121.zip TE0808-test_board_noprebuilt-vivado_2020.2-build_5_20210512133137.zip | John Hartfiel |
|
2021-02-05 | 2020.2 | TE0808-test_board-vivado_2020.2-build_0_20210204141911.zip TE0808-test_board_noprebuilt-vivado_2020.2-build_1_20210204142855.zip | John Hartfiel |
|
2020-09-29 | 2019.2 | TE0808-test_board_noprebuilt-vivado_2019.2-build_15_20200929070740.zip TE0808-test_board-vivado_2019.2-build_15_20200929070725 | John Hartfiel |
|
2020-09-22 | 2019.2 | TE0808-test_board_noprebuilt-vivado_2019.2-build_14_20200922073159.zip TE0808-test_board-vivado_2019.2-build_14_20200922073144.zip | John Hartfiel |
|
2020-03-25 | 2019.2 | TE0808-test_board_noprebuilt-vivado_2019.2-build_8_20200325083246.zip TE0808-test_board-vivado_2019.2-build_8_20200325083204.zip | John Hartfiel |
|
2020-01-22 | 2019.2 | TE0808-test_board_noprebuilt-vivado_2019.2-build_3_20200122142231.zip TE0808-test_board-vivado_2019.2-build_3_20200122142208.zip | John Hartfiel |
|
2019-08-09 | 2018.3 | TE0808-test_board_noprebuilt-vivado_2018.3-build_07_20190809131546.zip TE0808-test_board-vivado_2018.3-build_07_20190809131522.zip | John Hartfiel |
|
2019-05-06 | 2018.3 | TE0808-test_board_noprebuilt-vivado_2018.3-build_05_20190507124141.zip TE0808-test_board-vivado_2018.3-build_05_20190507124130.zip | John Hartfiel |
|
2018-07-11 | 2018.2 | TE0808-test_board_noprebuilt-vivado_2018.2-build_02_20180711143743.zip TE0808-test_board-vivado_2018.2-build_02_20180711143702.zip | John Hartfiel |
|
2018-03-29 | 2017.4 | TE0808-test_board-vivado_2017.4-build_07_20180329151341.zip TE0808-test_board_noprebuilt-vivado_2017.4-build_07_20180329151355.zip | John Hartfiel |
|
2018-01-16 | 2017.4 | TE0808-test_board-vivado_2017.4-build_04_20180116144644.zip TE0808-test_board_noprebuilt-vivado_2017.4-build_04_20180116144657.zip | John Hartfiel |
|
2018-01-15 | 2017.4 | TE0808-test_board-vivado_2017.4-build_03_20180115084954.zip TE0808-test_board_noprebuilt-vivado_2017.4-build_03_20180115085020.zip | John Hartfiel |
|
2017-12-20 | 2017.2 | TE0808-test_board-vivado_2017.2-build_07_20171220192501.zip | John Hartfiel |
|
2017-11-22 | 2017.2 | TE0808-test_board-vivado_2017.2-build_05_20171122080211.zip TE0808-test_board_noprebuilt-vivado_2017.2-build_05_20171122080228.zip | John Hartfiel |
|
2017-11-16 | 2017.2 | TE0808-test_board-vivado_2017.2-build_05_20171116151545.zip | John Hartfiel |
|
2017-11-13 | 2017.2 | TE0808-test_board-vivado_2017.2-build_05_20171113140954.zip TE0808-test_board_noprebuilt-vivado_2017.2-build_05_20171113141908.zip | John Hartfiel |
|
Issues | Description | Workaround | To be fixed version |
---|---|---|---|
QSPI Flash | Flash programming is not supported with boot mode QSPI or SD. | If flash programming fails, configure device for JTAG boot mode and try again or use older Vivado Versions for programming. (Vivado 2020.2 or 2019.2) | -- |
Software | Version | Note |
---|---|---|
Vitis | 2023.2 | needed, Vivado is included into Vitis installation |
Complete List is available on "<project folder>\board_files\*_board_files.csv"
Design supports following modules:
Module Model | Board Part Short Name | PCB Revision Support | DDR | QSPI Flash | EMMC | Others | Notes |
---|---|---|---|---|---|---|---|
es1_2gb | REV03|REV02 | 2GB | 64MB | NA | NA | Not longer supported by vivado | |
es2_2gb | REV04|REV03 | 2GB | 64MB | NA | NA | Not longer supported by vivado | |
2es2_2gb | REV04|REV03 | 2GB | 64MB | NA | NA | Not longer supported by vivado | |
TE0808-04-06EG-1E3 | 6eg_1e_4gb | REV04 | 4GB | 128MB | NA | 1 mm connectors | NA |
TE0808-04-06EG-1EE | 6eg_1e_4gb | REV04 | 4GB | 128MB | NA | NA | NA |
TE0808-04-09EG-1EA | 9eg_1e_2gb | REV04 | 2GB | 64MB | NA | NA | NA |
TE0808-04-09EG-1EB | 9eg_1e_4gb | REV04 | 4GB | 64MB | NA | NA | NA |
TE0808-04-09EG-1ED | 9eg_1e_4gb | REV04 | 4GB | 64MB | NA | 1 mm connectors | NA |
TE0808-04-09EG-1EE | 9eg_1e_4gb | REV04 | 4GB | 128MB | NA | NA | NA |
TE0808-04-09EG-1EL | 9eg_1e_4gb | REV04 | 4GB | 128MB | NA | 1 mm connectors | NA |
TE0808-04-09EG-2IB | 9eg_2i_4gb | REV04 | 4GB | 64MB | NA | NA | NA |
TE0808-04-09EG-2IE | 9eg_2i_4gb | REV04 | 4GB | 128MB | NA | NA | NA |
TE0808-04-6BE21-A | 6eg_1e_4gb | REV04 | 4GB | 128MB | NA | NA | NA |
TE0808-04-6BE21-L | 6eg_1e_4gb | REV04 | 4GB | 128MB | NA | 1 mm connectors | NA |
TE0808-04-6BI21-A | 6eg_1i_4gb | REV04 | 4GB | 128MB | NA | NA | NA |
TE0808-04-6BI21-X | 6eg_1i_4gb | REV04 | 4GB | 128MB | NA | NA | U41 replaced with schottky diodes |
TE0808-04-6GI21-L | 6eg_2i_4gb | REV04 | 4GB | 128MB | NA | 1 mm connectors | NA |
TE0808-04-9BE21-A | 9eg_1e_4gb | REV04 | 4GB | 128MB | NA | NA | NA |
TE0808-04-9BE21-L | 9eg_1e_4gb | REV04 | 4GB | 128MB | NA | 1 mm connectors | NA |
TE0808-04-9GI21-A | 9eg_2i_4gb | REV04 | 4GB | 128MB | NA | NA | NA |
TE0808-04-15EG-1EB | 15eg_1e_4gb | REV04 | 4GB | 64MB | NA | NA | NA |
TE0808-04-15EG-1EE | 15eg_1e_4gb | REV04 | 4GB | 128MB | NA | NA | NA |
TE0808-04-BBE21-A | 15eg_1e_4gb | REV04 | 4GB | 128MB | NA | NA | NA |
TE0808-05-6BE21-A | 6eg_1e_4gb | REV05 | 4GB | 128MB | NA | NA | NA |
TE0808-05-6BE21-F | 6eg_1e_4gb | REV05 | 4GB | 128MB | NA | NA | NA |
TE0808-05-6BE21-AK | 6eg_1e_4gb | REV05 | 4GB | 128MB | NA | NA | NA |
TE0808-05-6BE21-L | 6eg_1e_4gb | REV05 | 4GB | 128MB | NA | 1 mm connectors | NA |
TE0808-05-6BI21-D | 6eg_1i_4gb | REV05 | 4GB | 128MB | NA | 1 mm connectors | SoC without encryption |
TE0808-05-6BI21-X | 6eg_1i_4gb | REV05 | 4GB | 128MB | NA | NA | U41 replaced with schottky diodes |
TE0808-05-6BI41-X | 6eg_1i_8gb | REV05 | 8GB | 128MB | NA | NA | Single Die DDR; U41 replaced with schottky diodes |
TE0808-05-9BE21-A | 9eg_1e_4gb | REV05 | 4GB | 128MB | NA | NA | NA |
TE0808-05-9BE21-AK | 9eg_1e_4gb | REV05 | 4GB | 128MB | NA | 1 mm connectors | NA |
TE0808-05-9BE21-AZ | 9eg_1e_4gb | REV05 | 4GB | 128MB | NA | 1 mm connectors | NA |
TE0808-05-9BE21-E | 9eg_1e_4gb | REV05 | 4GB | 128MB | NA | NA | NA |
TE0808-05-9BE21-F | 9eg_1e_4gb | REV05 | 4GB | 128MB | NA | 1 mm connectors | NA |
TE0808-05-9BE21-KZ | 9eg_1e_4gb | REV05 | 4GB | 128MB | NA | 1 mm connectors | NA |
TE0808-05-9BE21-L | 9eg_1e_4gb | REV05 | 4GB | 128MB | NA | 1 mm connectors | NA |
TE0808-05-9BE21-LK | 9eg_1e_4gb | REV05 | 4GB | 128MB | NA | 1 mm connectors | NA |
TE0808-05-9BE21-LZ | 9eg_1e_4gb | REV05 | 4GB | 128MB | NA | 1 mm connectors | NA |
TE0808-05-9BE81-A | 9eg_1e_4gb | REV05 | 4GB | 128MB | NA | NA | NA |
TE0808-05-9BI41-X | 9eg_1i_8gb | REV05 | 8GB | 128MB | NA | NA | Single Die DDR; U41 replaced with schottky diodes |
TE0808-05-9GI21-A | 9eg_2i_4gb | REV05 | 4GB | 128MB | NA | NA | NA |
TE0808-05-9GI21-AK | 9eg_2i_4gb | REV05 | 4GB | 128MB | NA | NA | NA |
TE0808-05-9GI21-AZ | 9eg_2i_4gb | REV05 | 4GB | 128MB | NA | NA | NA |
TE0808-05-9GI21-C | 9eg_2i_4gb | REV05 | 4GB | 128MB | NA | NA | SoC without encryption |
TE0808-05-9GI21-E | 9eg_2i_4gb | REV05 | 4GB | 128MB | NA | NA | NA |
TE0808-05-9GI21-KZ | 9eg_2i_4gb | REV05 | 4GB | 128MB | NA | CAO | CAO |
TE0808-05-BBE21-A | 15eg_1e_4gb | REV05 | 4GB | 128MB | NA | NA | NA |
TE0808-05-BBE21-AK | 15eg_1e_4gb | REV05 | 4GB | 128MB | NA | NA | NA |
TE0808-05-BBE21-AZ | 15eg_1e_4gb | REV05 | 4GB | 128MB | NA | NA | NA |
TE0808-05-BBE21-E | 15eg_1e_4gb | REV05 | 4GB | 128MB | NA | NA | NA |
TE0808-05-BBE21-L | 15eg_1e_4gb | REV05 | 4GB | 128MB | NA | 1 mm connectors | NA |
TE0808-05-BBE81-A | 15eg_1e_4gb | REV05 | 4GB | 128MB | NA | NA | NA |
TE0808-05-BBE81-E | 15eg_1e_4gb | REV05 | 4GB | 128MB | NA | NA | NA |
TE0808-05-BBE81-EK | 15eg_1e_4gb | REV05 | 4GB | 128MB | NA | NA | NA |
TE0808-05-S001 | 9eg_1e_8gb_D | REV05 | 8GB | 128MB | NA | CAO | CAO;Single Die DDR |
TE0808-05-S002 | 15eg_1e_4gb | REV05 | 4GB | 128MB | NA | CAO | CAO |
TE0808-05-S003 | 15eg_1e_4gb | REV05 | 4GB | 128MB | NA | CAO | CAO |
TE0808-05-S004 | 9eg_2i_4gb | REV05 | 4GB | 128MB | NA | CAO | CAO |
TE0808-05-S005 | 9eg_2i_4gb | REV05 | 4GB | 128MB | NA | CAO | CAO |
TE0808-05-S006 | 9eg_2i_4gb | REV05 | 4GB | 128MB | NA | CAO | CAO |
TE0808-05-S007 | 9eg_1e_4gb | REV05 | 4GB | 128MB | NA | NA | CAO |
TE0808-05-S014 | 9eg_1e_4gb | REV05 | 4GB | 128MB | NA | NA | CAO |
TE0808-05-S016 | 9eg_1e_4gb | REV05 | 4GB | 128MB | NA | CAO | CAO |
TE0808-05-S018 | 9eg_2e_4gb | REV05 | 4GB | 128MB | NA | CAO | CAO |
TE0808-05-S019 | 9eg_2e_4gb | REV05 | 4GB | 128MB | NA | CAO | CAO |
TE0808-05-S020 | 9eg_2i_4gb | REV05 | 4GB | 128MB | NA | CAO | CAO |
TE0808-05-S021 | 9eg_2i_4gb | REV05 | 4GB | 128MB | NA | CAO | CAO |
TE0808-05-S022 | 6cg_1e_4gb | REV05 | 4GB | 128MB | NA | CAO | CAO |
TE0808-05-S025 | 6eg_1e_4gb_D | REV05 | 4GB | 128MB | NA | CAO | CAO |
TE0808-05-S026 | 9eg_2i_4gb | REV05 | 4GB | 128MB | NA | CAO:Si5345 not assembled | CAO: without PLL |
TE0808-05-S027 | 9eg_2i_4gb | REV05 | 4GB | 128MB | NA | CAO | CAO |
TE0808-05-S029 | 9eg_2i_4gb | REV05 | 4GB | 128MB | NA | CAO | CAO |
TE0808-05-S033 | 15eg_1e_4gb | REV05 | 4GB | 128MB | NA | NA | CAO |
TE0808-05-S035 | 15eg_1e_4gb | REV05 | 4GB | 128MB | NA | CAO | CAO |
TE0808-05-S036 | 15eg_1e_4gb | REV05 | 4GB | 128MB | NA | CAO | CAO |
TE0808-05-S038 | 9eg_1e_4gb | REV05 | 4GB | 128MB | NA | CAO | CAO |
TE0808-05-S039 | 6eg_1e_4gb | REV05 | 4GB | 128MB | NA | CAO | CAO: without PLL |
TE0808-05-S041 | 6eg_1e_4gb_D | REV05 | 4GB | 128MB | NA | CAO | CAO |
*used as reference
Note: Design contains also Board Part Files for TE0808+TEBF0808 configuration, this board part files are not used for this reference design.
Design supports following carriers:
Carrier Model | Notes |
---|---|
Custom PCB | use simple Board Part files, if MIO connected is different to TEBF0808 |
TEBF0808* | Used as reference carrier. |
TEBT0808-01 | Change UART0 to UART1 (MIO68...69) and regenerate design |
*used as reference
Additional HW Requirements:
Additional Hardware | Notes |
---|---|
--- | --- |
*used as reference
Type | Location | Notes |
---|---|---|
Vivado | <project folder>\block_design <project folder>\constraints <project folder>\ip_lib <project folder>\board_files | Vivado Project will be generated by TE Scripts |
Vitis | <project folder>\sw_lib | Additional Software Template for Vitis and apps_list.csv with settings automatically for Vitis app generation |
Type | Location | Notes |
---|---|---|
--- | --- | --- |
File | File-Extension | Description |
---|---|---|
BIF-File | *.bif | File with description to generate Bin-File |
BIN-File | *.bin | Flash Configuration File with Boot-Image (Zynq-FPGAs) |
BIT-File | *.bit | FPGA (PL Part) Configuration File |
Diverse Reports | --- | Report files in different formats |
Hardware-Platform-Description-File | *.xsa | Exported Vivado hardware description file for Vitis and PetaLinux |
LabTools Project-File | *.lpr | Vivado Labtools Project File |
Software-Application-File | *.elf | Software Application for Zynq or MicroBlaze Processor Systems |
Reference Design is only usable with the specified Vivado/Vitis/PetaLinux version. Do never use different Versions of Xilinx Software for the same Project.
Reference Design is available on:Reference Design is available with and without prebuilt files. It's recommended to use TE prebuilt files for first launch.
See also:
The Trenz Electronic FPGA Reference Designs are TCL-script based project. Command files for execution will be generated with "_create_win_setup.cmd" on Windows OS and "_create_linux_setup.sh" on Linux OS.
TE Scripts are only needed to generate the vivado project, all other additional steps are optional and can also executed by Xilinx Vivado/Vitis GUI. For currently Scripts limitations on Win and Linux OS see: Project Delivery Currently limitations of functionality
Caution! Win OS has a 260 character limit for path lengths which can affect the Vivado tools. To avoid this issue, use Virtual Drive or the shortest possible names and directory locations for the reference design (for example "x:\<project folder>")
Run _create_win_setup.cmd/_create_linux_setup.sh and follow instructions on shell:
------------------------Set design paths---------------------------- -- Run Design with: _create_win_setup -- Use Design Path: <absolute project path> -------------------------------------------------------------------- -------------------------TE Reference Design--------------------------- -------------------------------------------------------------------- -- (0) Module selection guide, project creation...prebuilt export... -- (1) Create minimum setup of CMD-Files and exit Batch -- (2) Create maximum setup of CMD-Files and exit Batch -- (3) (internal only) Dev -- (4) (internal only) Prod -- (c) Go to CMD-File Generation (Manual setup) -- (d) Go to Documentation (Web Documentation) -- (g) Install Board Files from Xilinx Board Store (beta) -- (a) Start design with unsupported Vivado Version (beta) -- (x) Exit Batch (nothing is done!) ---- Select (ex.:'0' for module selection guide):
optional for manual changes: Select correct device and Xilinx install path on "design_basic_settings.cmd" and create Vivado project with "vivado_create_project_guimode.cmd"
Note: Select correct one, see also Vivado Board Part Flow
Important: Use Board Part Files, which did not end with *_tebf0808
Create hardware description file (.xsa file) and export to prebuilt folder
TE::hw_build_design -export_prebuilt
Using Vivado GUI is the same, except file export to prebuilt folder.
Generate Programming Files with Vitis
TE::sw_run_vitis -all TE::sw_run_vitis (optional; Start Vitis from Vivado GUI or start with TE Scripts on Vivado TCL)
TCL scripts generate also platform project, this must be done manually in case GUI is used. See Vitis
Check Module and Carrier TRMs for proper HW configuration before you try any design.
Reference Design is also available with prebuilt files. It's recommended to use TE prebuilt files for first launch.
Xilinx documentation for programming and debugging: Vivado/Vitis/SDSoC-Xilinx Software Programming and Debugging
Select create and open delivery binary folder
Note: Folder "<project folder>\_binaries_<Article Name>" with subfolder "boot_<app name>" for different applications will be generated
Open Vivado Project with "vivado_open_existing_project_guimode.cmd" or if not created, create with "vivado_create_project_guimode.cmd"
TE::pr_program_flash -swapp hello_te0808
This does not work, because SD controller is not selected on PS.
Load configuration and Application with Vitis Debugger into device
QSPI Boot:
Select QSPI as Boot Mode
Note: See TRM of the Carrier, which is used.
Power On PCB
1. ZynqMP Boot ROM FSBL from QSPI into OCM,
2. FSBL init the PS, programs the PL using the bitstream and loads PMU, ATF and U-boot from QSPI into DDR
Type | Note |
---|---|
DDR | |
QSPI | MIO |
UART0 | MIO, please select other one, if you have connected UART to second controller or other MIO |
SWDT0..1 | |
TTC0..3 |
set_property BITSTREAM.GENERAL.COMPRESS TRUE [current_design] set_property BITSTREAM.CONFIG.UNUSEDPIN PULLNONE [current_design]
Not needed.
TE modified 2023.2 FSBL
General:
Hello TE0808 is a Xilinx Hello World example as endless loop instead of one console output.
To get content of older revision go to "Change History" of this page and select older document revision number.
Date | Document Revision | Authors | Description |
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Error rendering macro 'page-info' Ambiguous method overloading for method jdk.proxy244.$Proxy3578#hasContentLevelPermission. Cannot resolve which method to invoke for [null, class java.lang.String, class com.atlassian.confluence.pages.Page] due to overlapping prototypes between: [interface com.atlassian.confluence.user.ConfluenceUser, class java.lang.String, class com.atlassian.confluence.core.ContentEntityObject] [interface com.atlassian.user.User, class java.lang.String, class com.atlassian.confluence.core.ContentEntityObject] | Error rendering macro 'page-info' Ambiguous method overloading for method jdk.proxy244.$Proxy3578#hasContentLevelPermission. Cannot resolve which method to invoke for [null, class java.lang.String, class com.atlassian.confluence.pages.Page] due to overlapping prototypes between: [interface com.atlassian.confluence.user.ConfluenceUser, class java.lang.String, class com.atlassian.confluence.core.ContentEntityObject] [interface com.atlassian.user.User, class java.lang.String, class com.atlassian.confluence.core.ContentEntityObject] | Error rendering macro 'page-info' Ambiguous method overloading for method jdk.proxy244.$Proxy3578#hasContentLevelPermission. Cannot resolve which method to invoke for [null, class java.lang.String, class com.atlassian.confluence.pages.Page] due to overlapping prototypes between: [interface com.atlassian.confluence.user.ConfluenceUser, class java.lang.String, class com.atlassian.confluence.core.ContentEntityObject] [interface com.atlassian.user.User, class java.lang.String, class com.atlassian.confluence.core.ContentEntityObject] |
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2024-03-14 | v.46 | Manuela Strücker |
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2023-06-14 | v.45 | Manuela Strücker |
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2023-04-13 | v.43 | Manuela Strücker |
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2022-09-29 | v.41 | Manuela Strücker |
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2022-09-12 | v.40 | Manuela Strücker |
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2022-09-06 | v.38 | Manuela Strücker |
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2022-03-16 | v.36 | Manuela Strücker |
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2021-05-25 | v.35 | Manuela Strücker |
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2021-05-12 | v.34 | John Hartfiel |
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2021-02-05 | v.33 | John Hartfiel |
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2021-02-05 | v.31 | John Hartfiel |
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2020-03-25 | v.28 | John Hartfiel |
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2020-01-27 | v.27 | John Hartfiel |
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2020-01-22 | v.26 | John Hartfiel |
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2019-08-09 | v.24 | John Hartfiel |
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2019-05-07 | v.22 | John Hartfiel |
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2018-07-11 | v.21 | John Hartfiel |
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2018-03-29 | v.20 | John Hartfiel |
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2018-02-08 | v.19 | John Hartfiel |
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2017-12-20 | v.14 | John Hartfiel |
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2017-11-22 | v.10 | John Hartfiel |
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2017-11-14 | v.6 | John Hartfiel |
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-- | all | Error rendering macro 'page-info' Ambiguous method overloading for method jdk.proxy244.$Proxy3578#hasContentLevelPermission. Cannot resolve which method to invoke for [null, class java.lang.String, class com.atlassian.confluence.pages.Page] due to overlapping prototypes between: [interface com.atlassian.confluence.user.ConfluenceUser, class java.lang.String, class com.atlassian.confluence.core.ContentEntityObject] [interface com.atlassian.user.User, class java.lang.String, class com.atlassian.confluence.core.ContentEntityObject] | -- |
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The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.
In no event will Trenz Electronic, its suppliers, or other third parties mentioned in this document be liable for any damages whatsoever (including, without limitation, those resulting from lost profits, lost data or business interruption) arising out of the use, inability to use, or the results of use of this document, any documents linked to this document, or the materials or information contained at any or all such documents. If your use of the materials or information from this document results in the need for servicing, repair or correction of equipment or data, you assume all costs thereof.
No part of this manual may be reproduced in any form or by any means (including electronic storage and retrieval or translation into a foreign language) without prior agreement and written consent from Trenz Electronic.
The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.
To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.
REACH
Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).
RoHS
Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.
WEEE
Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).
Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.
Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.
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