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Overview

The Trenz Electronic TE0706 Carrier Board provides functionalities for testing, evaluation and development purposes of Trenz's 4 x 5 cm SoMs. The Carrier Board is equipped with various components and connectors for different configuration setups and needs. The interfaces of the SoM's functional units and PL I/O-banks are connected via board-to-board connectors to the Carrier Board's components and connectors for easy user access.

Refer to 4 x 5 SoM Carriers page for more information about supported 4 x 5 cm SoMs.

Refer to http://trenz.org/te0706-info for current online available documentation.

Key Features

  • On Board
    • Gigabit-Ethernet PHY
    • SDIO port level converter
    • 4x DIP switch to set SoM's control signals 1)
    • User-push button connected to SoM 1)
    • 3x header to set the SoM's I/O-bank voltages
    • 1x header to supply the SoM's real time clock
    • 1x header to select the SDIO voltage (3.3 V or 1.8 V)
  • Interface
    • Trenz 4 x 5 SoM socket: 3 x Samtec LSHM series high-speed connectors
    • VG96 connector 96 pin (optional) 2)
    • IDC connector 50 pin (optional)
    • USB Type A or Micro USB connector for SoM USB-OTG connection 3)
    • XMOD header for an JTAG/UART to USB adapter 4)
    • 2x RJ45 Gigabit-Ethernet MagJacks
    • Micro SD card socket with SDIO voltage converter (3.3 V or 1.8 V)
  • Power
    • Overvoltage-, undervoltage- and reversed- supply-voltage-protection
    • Barrel jack (Ø 2.1 mm) for 5V power supply input
  • Dimension
    • 100 mm × 64.5 mm
  • Notes
    1) SoM firmware dependent. For more information refer to SoM firmware description, SoM TRM, 4 x 5 SoM Integration Guide and 4 x 5 series pinout tracelength.
    2) Needs to be ordered seperately. Refer to PCN-20231106 TE0706-03 BOM Change for more information.
    3) Depends on assembly variant.
    4) Refer to TE0790 TRM for more information.

Block Diagram

TE0706 block diagram

Main Components

TE0706 main components
  1. SDIO level shifter, U4
  2. Gbit Ethernet PHY, U6
  3. Oscillator 25 MHz, U7
  4. +5V DC power barrel Jack, J1
  5. DC power supply protection controller, U9
  6. DCDC, U1, U3
  7. USB VBus switch, U5
  8. 4x DIP switch, S1
  9. Reset switch, S2
  10. Bank IO voltages selection jumpers, J10, J11, J12
  11. MicroSD Card IO voltage selection jumper, J13
  12. B2B Samtec Razor Beam LSHM connectors, JB1, JB2, JB3
  13. IDC connector 50 pin assembly option, J5
  14. VG96 connector 96 pin assembly option, J6
  15. Micro SD card socket with card detect, J4
  16. USB connector, USB Type A, J7 or Micro USB Type B, J8
  17. RJ45 Ethernet jack, J2, J3
  18. XMOD USB-to-JTAG/UART adapter, JX1

Initial Delivery State

Storage device name

Content

Notes

-

-



Initial delivery state of programmable devices on the module

Signals, Interfaces and Pins

Connectors

Connector TypeDesignatorInterfaceIO CNTNotes
B2BJB1IO14 SE / 7 DIFFConnected to J5.
B2BJB1IO34 SE / 17 DIFFConnected to J6.
B2BJB1ETH / MDI8
B2BJB1SDIO6
microSD Card socketJ4SDIO6
microSD Card socketJ4
SD card detect1

MIO0

B2BJB1
SD card detect1

MIO0

IDCJ5
SD card detect1

MIO0

B2BJB1IO
5

MIO9 ... MIO13

IDCJ5IO18 SE / 9 DIFF
IDCJ5IO14 SE / 7 DIFF
IDCJ5IO
5

MIO9 ... MIO13

IDCJ5ETH / LED4
RJ45 EthernetJ2ETH / MDI8
RJ45 EthernetJ3ETH / MDI8
B2BJB3ETH / RGMII19
B2BJB3USB3Data, ID
B2BJB2ETH / LED4
B2BJB2Reset1
B2BJB2IO18 SE / 9 DIFF
B2BJB2IO48 SE / 24 DIFF
VG96J6IO48 SE / 24 DIFF
VG96J6IO34 SE / 17 DIFF
B2BJB1

UART

2MIO14 / MIO15
IDCJ5

UART

2MIO14 / MIO15
XMODJX1

UART

2MIO14 / MIO15
B2BJB2

JTAG

4TCK_B / TDO_B / TDI_B / TMS_B
XMODJX1

JTAG

4TCK_B / TDO_B / TDI_B / TMS_B
Board Connectors


Test Points

Test PointSignalNotes
TP13.3V
TP2PG_1.8V
TP31.8V
TP43.3V
TP51.8V
TP65VIN
TP75VIN
TP8VIN
TP9VIN


Test Points Information

On-board Peripherals

Chip/InterfaceDesignatorConnected ToNotes

TE0790

JX1
  • B2B connector JB1
  • B2B connector JB2

See TE0790 TRM for further information.

ETH PHY

U6
  • B2B connector JB3
  • Ethernet jack J2

Oscillator

U7
  • ETH PHY U6
25 MHz

USB Vbus switch

U5
  • B2B connector JB3

SD-IO level shifter

U4
  • B2B connector JB1
  • microSD card socket J4
  • SD-IO voltage jumper J13

Dip switches

S1
  • PGOOD (S1A; dip 1) 
  • PROGMODE (S1B; dip 2)
  • MODE (S1C, dip 3)
  • EN1 (S1D; dip 4)

Signals are 'low' (GND) when dip is closed (ON).
Default DIP Settings 1):

DIPPositionDescription
S1-1OFFBoot Mode QSPI
S1-3OFF
S1-2ONFPGA in JTAG chain
S1-4OFFModul power enabled

 

Push button

S2
  • RESIN
Active low.

Bank voltage selection Jumpers

J10
J11
J12

  • VCCIOA
  • VCCIOC
  • VCCIOD

Jumper on pins:  2)
1-2 selects 1.8V 
2-3 selects 3.3V (M3.3VOUT)

SD IO voltage selection Jumper

J13

  • SD_VCCA

Jumper on pins:  2)
1-2 selects 1.8V (M1.8VOUT)
2-3 selects 3.3V (M3.3VOUT)

1) Function SoM dependent. Refer to 4 x 5 SoM Integration Guide and SoM documentation for further information
2) Refer to 4 x 5 SoM Integration Guide and SoM documentation for allowed settings.

On board peripherals

Configuration and System Control Signals

Signal Name

Connector.Pin

Direction1)Description
MIO0JB1.88OUTSD card detect
VBUS_V_ENJB3.54INUSB voltage enable
USB-VBUSJB3.56OUTUSB voltage present signal
RESINS2 / JB2.17OUTReset signal 2)
PGOODS2.1 / JB1.29 / J6.A30OUT

Power Good signal 2)

PROGMODES2.2 / JB1.90OUTJTAG Chain multiplexer 2)
MODES2.3 / JB1.31OUTBoot Mode selection 2)
EN1S2.4 / JB1.27OUTModule power 2)
NOSEQJB1.8 / J6.A31INOUTModule Power management 2)
SD_VCCAJ13.2INSD IO voltage select jumper 3)
MIO14 / MIO15

JB1.91 / JB1.86

J5.32 / J5.31

JX1.7 / JX1.3

Signal dependentUART
TCK_B / TDO_B / TDI_B / TMS_B

JB2.94 / JB2.96 / JB2.98 / JB2.100 

JX1.4 / JX1.8 / JX1.10 / JX1.12

Signal dependentJTAG

1) Direction:

    • IN: Input from the point of view of this board.
    • OUT: Output from the point of view of this board.

2) SoM dependent. Refer to 4 x 5 SoM Integration Guide and SoM documentation for further information.

3) Select 1.8 V or 3.3 V via jumper. Refer to 4 x 5 SoM Integration Guide for further information.

Controller signal.

Power and Power-On Sequence

Power Rails

Power Rail Name/ Schematic NameConnector.PinDirection1)Notes

5VIN

J1.1IN

Main Board power supply.

5VIN

J6.A1 / J6.A2OUT
USB-VBUS_R

J7.1 / J8.1

OUT
USB-VBUS

JB3.56

OUT
3.3V

JB1.2 / JB1.4 / JB1.6 / JB1.14 / JB1.16

JB2.1 / JB2.3 / JB2.5 / JB2.7

J5.6 / J5.45 / J6.C31 / JX1.5

OUTMain SoM power supply.
3.3V_SD

J4.4

OUT
1.8V

JB2.2 / JB2.4

J10.1 / J11.1 /12.1

OUT
M3.3VOUT

JB2.9 / JB2.11

INSupplied by SoM.
M3.3VOUT

J5.5 / J5.46 / J6.C32

J10.3 / J11.3 /12.3 / J13.3

OUT
M1.8VOUTJB1.40 INSupplied by SoM.
M1.8VOUTJ13.1OUT
VBATJ9.1IN
VBATJB1.80OUT
VCCIOAJ10.2INSoM IO Bank supply. 2)
VCCIOAJB1.10 / JB1.12 / J6.B32OUTSoM IO Bank supply. 2)
VCCIOCJ11.2INSoM IO Bank supply. 2)
VCCIOCJB2.6OUTSoM IO Bank supply. 2)
VCCIODJ12.2INSoM IO Bank supply. 2)
VCCIODJB2.8 / JB2.10 / J6.B1OUTSoM IO Bank supply. 2)
SD_VCCAJ13.2INVoltage for SD Level Shifter. 2)
VCCJTAGJB2.92IN
ETH-VCCJB1.13IN

1) Direction:

    • IN: Input from the point of view of this board.
    • OUT: Output from the point of view of this board.

2) Select 1.8 V or 3.3 V via jumper. Refer to 4 x 5 SoM Integration Guide for further information.

Module power rails.

Recommended Power up Sequencing


SequenceNet nameRecommended Voltage RangePull-up/downDescriptionNotes
 0---Configuration signal setup.

See Configuration and System Control Signals.

15VIN- 1)-Main Power supply.

Carrier and SoM power supply.

Power consumption depends mainly on design and cooling solution.

2M3.3VOUT / M1.8VOUT- 1)-

SoM generated voltages.

These voltages can be used

  • to supply bank voltages,
  • to supply periphery and/or
  • as power good signal to enable external power regulators.

Important: Consider maximum power consumption.

3---Apply voltages to Carrier powered external IO 
when voltages M3.3VOUT and/or M1.8VOUT are present.

1) Refer to Recommended Operating Conditions.

Baseboard Design Hints

Board to Board Connectors

These connectors are hermaphroditic. Odd pin numbers on the module are connected to even pin numbers on the baseboard and vice versa.

4 x 5 modules use two or three Samtec Razor Beam LSHM connectors on the bottom side.

  • 2 x REF-189016-02 (compatible to LSHM-150-04.0-L-DV-A-S-K-TR), (100 pins, "50" per row)
  • 1 x REF-189017-02 (compatible to LSHM-130-04.0-L-DV-A-S-K-TR), (60 pins, "30" per row) (depending on module)
Connector Mating height

When using the same type on baseboard, the mating height is 8mm. Other mating heights are possible by using connectors with a different height

Order numberConnector on baseboardcompatible toMating height
23836REF-189016-01LSHM-150-02.5-L-DV-A-S-K-TR6.5 mm

LSHM-150-03.0-L-DV-A-S-K-TRLSHM-150-03.0-L-DV-A-S-K-TR7.0 mm
23838REF-189016-02LSHM-150-04.0-L-DV-A-S-K-TR8.0 mm

LSHM-150-06.0-L-DV-A-S-K-TRLSHM-150-06.0-L-DV-A-S-K-TR10.0mm
26125REF-189017-01LSHM-130-02.5-L-DV-A-S-K-TR6.5 mm

LSHM-130-03.0-L-DV-A-S-K-TRLSHM-130-03.0-L-DV-A-S-K-TR7.0 mm
24903 REF-189017-02LSHM-130-04.0-L-DV-A-S-K-TR8.0 mm

LSHM-130-06.0-L-DV-A-S-K-TRLSHM-130-06.0-L-DV-A-S-K-TR10.0mm
Connectors.

The module can be manufactured using other connectors upon request.

Connector Speed Ratings

The LSHM connector speed rating depends on the stacking height; please see the following table:

Stacking heightSpeed rating
12 mm, Single-Ended7.5 GHz / 15 Gbps
12 mm, Differential

6.5 GHz / 13 Gbps

5 mm, Single-Ended11.5 GHz / 23 Gbps
5 mm, Differential7.0 GHz / 14 Gbps
Speed rating.
Current Rating

Current rating of  Samtec Razor Beam™ LSHM B2B connectors is 2.0A per pin (2 adjacent pins powered).

Connector Mechanical Ratings
  • Shock: 100G, 6 ms Sine
  • Vibration: 7.5G random, 2 hours per axis, 3 axes total


Manufacturer Documentation

  File Modified
PDF File hsc-report_lshm-lshm-05mm_web.pdf High speed test report Apr 07, 2016 by Thorsten Trenz
PDF File lshm_dv.pdf LSHM catalog page Apr 07, 2016 by Thorsten Trenz
PDF File LSHM-1XX-XX.X-X-DV-A-X-X-TR-FOOTPRINT(1).pdf Recommended layout and stencil drawing Apr 07, 2016 by Thorsten Trenz
PDF File LSHM-1XX-XX.X-XX-DV-A-X-X-TR-MKT.pdf Technical drawing Apr 07, 2016 by Thorsten Trenz
PDF File REF-189016-01.pdf Technical Drawing Apr 07, 2016 by Thorsten Trenz
PDF File REF-189016-02.pdf Technical Drawing Apr 07, 2016 by Thorsten Trenz
PDF File REF-189017-01.pdf Technical Drawing Apr 07, 2016 by Thorsten Trenz
PDF File REF-189017-02.pdf Technical Drawing Apr 07, 2016 by Thorsten Trenz
PDF File TC0923--2523_report_Rev_2_qua.pdf Design qualification test report Apr 07, 2016 by Thorsten Trenz
PDF File tc0929--2611_qua(1).pdf Shock and vibration report Apr 07, 2016 by Thorsten Trenz



Technical Specifications

The values for Absolute Maximum Ratings and Recommended Ratings refers only to this carrier board. These values represent the capabilities of this Carrier Series in general. Assembly variants may differ from this values.

The combination of a carrier and a SoM might have different requirements. Customer devices connected to the carrier are not considered.

Absolute Maximum Ratings *)

Power Rail Name/ Schematic NameDescriptionMinMaxUnit

5VIN

Carrier power.-4060V
M3.3VOUTSoM power rail.-0.36.3V
M1.8VOUTSoM power rail.-0.34.6V
VBATBattery supply.--V
VCCIOAIO Bank supply for SoM.--V
VCCIOCIO Bank supply for SoM.--V
VCCIODIO Bank supply for SoM.--V
VCCJTAGJTAG reference voltage.- 1)- 1)V

1) Refer to TE0790 TRM for XMOD usage.

Absolute maximum ratings

*) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum rated conditions for extended periods may affect device reliability.

Recommended Operating Conditions

This TRM is generic for all variants. Temperature range can be different depending on the assembly version. Voltage range is mostly the same during variants (exceptions are possible, depending on custom request).

Temperature range

The carrier board components are capable of being operated at industrial-grade temperatures, which cover at least the range of -40 °C to +85 °C.

Operating temperature range depends also on customer design and cooling solution.

Voltage rails

ParameterMinMaxUnitsReference Document

5VIN

4.755.25V
M3.3VOUT3.153.45V
M1.8VOUT1.711.89V
VBAT--V
VCCIOA--V
VCCIOC--V
VCCIOD--V
VCCJTAG- 1)- 1)V

1) Refer to TE0790 TRM for XMOD usage.

Recommended operating conditions.


Physical Dimensions

  • Module size: 100 mm × 64.5 mm.  Please download the assembly diagram for exact numbers.

  • PCB thickness: 1.71 mm ±10 %
  • B2B mating height with standard connectors: 8 mm.

All dimensions are given in millimeters.

Physical Dimension

Currently Offered Variants 

Trenz shop TE0706 overview page
English pageGerman page

 

Trenz Electronic Shop Overview

Revision History

Hardware Revision History

The hardware revision number is located on the PCB adjacent to the module identifier, separated by a dash.

Board hardware revision number.


DateRevisionChangesDocumentation Link
2024-0504

1. EOL component U3 EN5311QI was replaced with MPM3834CGPA-Z.
2. EOL component U1 EN6347QI was replaced with MPM3860GQW-Z.
3. Q1 TPS27081ADDCR was replaced with MP5077GG-Z.
4. L3, L5 Ferrite beads BKP0603HS121-T replaced with MPZ0603S121HT000.
5. EOL SMD component J9 was replaced with THT.
6. SMD Pin Headers J10 - J13 were replaced with THT.
7. Added Diode D1, D2 for USB ESD protection.
8. ETH PHY power supply modified: L1, R27 removed from schematic; for U6 DVDD supply used internal LDOs.
9. EOL component J4 micro SD Card was replaced.
10. Added series terminator R27 to avoid ringing effect.
11. Added series terminators R50 ... R55 to avoid ringing effect.
12. Added pull-up resistor R57 on RESIN. Not all 4x5 modules have an internal pull-up resistor for this pin on the module.
13. PGOOD connected to S1-1 DIP Switch and pulled-up by resistor R56 to 3.3V.
14. The signals were renamed: - VCCIOB ---> VCCIOC - VCCIOC ---> VCCIOD according to Trenz Module Connection Table.
15. Added testpoints TP1 - TP9.
16. Added mechanical components:
       - Screw M3x6 (2 pcs.);
       - Standoff M3x10;
       - U2 - TE0790-03 XMOD FTDI JTAG Adapter;
       - J14 - J18 - Jumpers 2.54 mm Pitch.
17. In assembly variant A resistor R39 is installed according to USB PHY specification.
18. Removed track-it traceability pad S/N.
19. Changed fiducials to standard fiducial type.
20. Components updated from the library.
21. Updated Trenz address.
22. Added UKCA- and RoHS-logo.
23. Added legal notices, block and power diagram. Updated revision history. Updated page count and order.

REV04

PCN

2018-1203

1. MicroSD card connector (J3) changed to industrial.
2. Changed PB (S2) to industrial.
3. Replaced input power protection.
4. Added jumper (J13) to select SD level shifter voltage on FPGA side. 
5. Added power switch for SD level shifter supply voltages to ensure power sequenzing of level shifter.
6. Replaced R5 and VBUS capacitors, add 0 Ohm resistors to OTG-ID. 
7. Replaced jumpers by SMD versions. 
8. Set VBAT pin header to assembled.

9. Replaced R34 by 953 kOhm and R38 by 147 kOhm.

10. Removed VG96 connector (J6) from BOM.

REV03

PCN
PCN
PCN

2016-0602

1. Added support for 1.8 V IO TE0715-30 (added 3-pin headers for variable voltage banks). 
2. PWR connector type changed THT->SMD.
3. Swapped xmod RX <>TX.
4. Added 0 Ohm to disconnect CLK125 for GT module compatibility.
5. Changed micro-USB.
6. Added ferrite beads L1.
7. Components updated from the library. 
8. Added serial number (tracebility pad).
9. Added thermal vias to mounting holes.
10. Changed RJ45 connectors.
11. Improved SD_CLK signal.
12. Improved power input protection.
13. Improved power good handling.
14. Improved MDIO interface handling.
15. Updated clock revision.
16. Set VBAT pin header to not assembled.

17. U8 MP5010ADQ-LF-Z replaced to MP5010BDQ-LF-Z.

REV02

PCN

2015-0601Initial revision

REV01

Hardware Revision History

Document Change History

Date

Revision

Contributors

Description

  • Added DIP Switch default setting to On board peripherals.

2025-08-27

v.89

Martin Rohrmüller 

  • Added S1, S2, J10, J11, J12, J13 with function and description to On board peripherals.
  • Corrected typos


2025-05-13


v.87

Kilian Jahn

  • Updated note 1) within section Key Features
  • Fixed Inter Page Links
  • Updated PDF & PDF-Web Link

2025-04-04

v.81

Kilian Jahn

  • Updated to TRM version 4.3
  • Updated TRM to hardware revision 04
  • Adapted link "Download PDF version of this document"

2024-06-20

v.78

ED

  • Updated to PCN-20231106 more clearly.

2023-11-07

v.77

ED

  • Changed Xilinx to AMD.
  • Updated to PCN-20231106.

2021-02-19

v.76

John Hartfiel

  • Note to PHY connection
2010-07-16v.74John Hartfiel
  • update Physical Dimensions
2019-05-27v.73Martin Rohrmüller
  • Updated to REV03
  • Updated to TRM v28
2018-06-03v.66John Hartfiel
  • Add note to DIP settings
2017-11-10

v.64

John Hartfiel
  • Replace B2B connector section
2017-11-09v.60Ali Naseri
  • TRM revision to new common style

2017-07-06

v.52
Ali Naseri, Jan Kumann
  • Hardware revision 02 specific changes.
2017-01-06v.1Ali Naseri
  • initial document to board revision 02
---all
  • ---
Document change history.

Disclaimer

Data Privacy

Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy

Document Warranty

The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.

Limitation of Liability

In no event will Trenz Electronic, its suppliers, or other third parties mentioned in this document be liable for any damages whatsoever (including, without limitation, those resulting from lost profits, lost data or business interruption) arising out of the use, inability to use, or the results of use of this document, any documents linked to this document, or the materials or information contained at any or all such documents. If your use of the materials or information from this document results in the need for servicing, repair or correction of equipment or data, you assume all costs thereof.

Product Disclaimer

Products (incl. Software and Firmware) are exclusively designed, manufactured, and distributed for industrial applications. They are not intended, authorized, or certified for use in critical safety applications, medical devices, aerospace, nuclear, life-support, traffic-control, military, or other environments where malfunction or failure could result in personal injury, death, or significant property or environmental damage.

Trenz Electronic GmbH (“Manufacturer”) excludes any liability for inappropriate use in such contexts. The Customer bears all responsibility for verifying suitability and compliance with applicable regulations when deploying in any critical-use scenario. The Customer also agrees to indemnify and hold harmless the Manufacturer from any third-party claims or liabilities arising from such use.

Copyright Notice

No part of this manual may be reproduced in any form or by any means (including electronic storage and retrieval or translation into a foreign language) without prior agreement and written consent from Trenz Electronic.

Technology Licenses

The hardware / firmware / software described in this document are furnished under a license and may be used /modified / copied only in accordance with the terms of such license.

Environmental Protection

To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.

REACH, RoHS and WEEE

REACH

Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA).

RoHS

Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.

WEEE

Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676.






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