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The Trenz Electronic TE0706 Carrier Board provides functionalities for testing, evaluation and development purposes of Trenz's 4 x 5 cm SoMs. The Carrier Board is equipped with various components and connectors for different configuration setups and needs. The interfaces of the SoM's functional units and PL I/O-banks are connected via board-to-board connectors to the Carrier Board's components and connectors for easy user access.
Refer to 4 x 5 SoM Carriers page for more information about supported 4 x 5 cm SoMs.
Refer to http://trenz.org/te0706-info for current online available documentation.
Storage device name | Content | Notes |
|---|---|---|
- | - |
| Connector Type | Designator | Interface | IO CNT | Notes |
|---|---|---|---|---|
| B2B | JB1 | IO | 14 SE / 7 DIFF | Connected to J5. |
| B2B | JB1 | IO | 34 SE / 17 DIFF | Connected to J6. |
| B2B | JB1 | ETH / MDI | 8 | |
| B2B | JB1 | SDIO | 6 | |
| microSD Card socket | J4 | SDIO | 6 | |
| microSD Card socket | J4 | SD card detect | 1 | MIO0 |
| B2B | JB1 | SD card detect | 1 | MIO0 |
| IDC | J5 | SD card detect | 1 | MIO0 |
| B2B | JB1 | IO | 5 | MIO9 ... MIO13 |
| IDC | J5 | IO | 18 SE / 9 DIFF | |
| IDC | J5 | IO | 14 SE / 7 DIFF | |
| IDC | J5 | IO | 5 | MIO9 ... MIO13 |
| IDC | J5 | ETH / LED | 4 | |
| RJ45 Ethernet | J2 | ETH / MDI | 8 | |
| RJ45 Ethernet | J3 | ETH / MDI | 8 | |
| B2B | JB3 | ETH / RGMII | 19 | |
| B2B | JB3 | USB | 3 | Data, ID |
| B2B | JB2 | ETH / LED | 4 | |
| B2B | JB2 | Reset | 1 | |
| B2B | JB2 | IO | 18 SE / 9 DIFF | |
| B2B | JB2 | IO | 48 SE / 24 DIFF | |
| VG96 | J6 | IO | 48 SE / 24 DIFF | |
| VG96 | J6 | IO | 34 SE / 17 DIFF | |
| B2B | JB1 | UART | 2 | MIO14 / MIO15 |
| IDC | J5 | UART | 2 | MIO14 / MIO15 |
| XMOD | JX1 | UART | 2 | MIO14 / MIO15 |
| B2B | JB2 | JTAG | 4 | TCK_B / TDO_B / TDI_B / TMS_B |
| XMOD | JX1 | JTAG | 4 | TCK_B / TDO_B / TDI_B / TMS_B |
| Test Point | Signal | Notes |
|---|---|---|
| TP1 | 3.3V | |
| TP2 | PG_1.8V | |
| TP3 | 1.8V | |
| TP4 | 3.3V | |
| TP5 | 1.8V | |
| TP6 | 5VIN | |
| TP7 | 5VIN | |
| TP8 | VIN | |
| TP9 | VIN |
| Chip/Interface | Designator | Connected To | Notes | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TE0790 | JX1 |
| See TE0790 TRM for further information. | ||||||||||||||
ETH PHY | U6 |
| |||||||||||||||
Oscillator | U7 |
| 25 MHz | ||||||||||||||
USB Vbus switch | U5 |
| |||||||||||||||
SD-IO level shifter | U4 |
| |||||||||||||||
Dip switches | S1 |
| Signals are 'low' (GND) when dip is closed (ON).
| ||||||||||||||
Push button | S2 |
| Active low. | ||||||||||||||
Bank voltage selection Jumpers | J10 |
| Jumper on pins: 2) | ||||||||||||||
SD IO voltage selection Jumper | J13 |
| Jumper on pins: 2) |
1) Function SoM dependent. Refer to 4 x 5 SoM Integration Guide and SoM documentation for further information
2) Refer to 4 x 5 SoM Integration Guide and SoM documentation for allowed settings.
| Signal Name | Connector.Pin | Direction1) | Description |
|---|---|---|---|
| MIO0 | JB1.88 | OUT | SD card detect |
| VBUS_V_EN | JB3.54 | IN | USB voltage enable |
| USB-VBUS | JB3.56 | OUT | USB voltage present signal |
| RESIN | S2 / JB2.17 | OUT | Reset signal 2) |
| PGOOD | S2.1 / JB1.29 / J6.A30 | OUT | Power Good signal 2) |
| PROGMODE | S2.2 / JB1.90 | OUT | JTAG Chain multiplexer 2) |
| MODE | S2.3 / JB1.31 | OUT | Boot Mode selection 2) |
| EN1 | S2.4 / JB1.27 | OUT | Module power 2) |
| NOSEQ | JB1.8 / J6.A31 | INOUT | Module Power management 2) |
| SD_VCCA | J13.2 | IN | SD IO voltage select jumper 3) |
| MIO14 / MIO15 | JB1.91 / JB1.86 J5.32 / J5.31 JX1.7 / JX1.3 | Signal dependent | UART |
| TCK_B / TDO_B / TDI_B / TMS_B | JB2.94 / JB2.96 / JB2.98 / JB2.100 JX1.4 / JX1.8 / JX1.10 / JX1.12 | Signal dependent | JTAG |
1) Direction:
2) SoM dependent. Refer to 4 x 5 SoM Integration Guide and SoM documentation for further information.
3) Select 1.8 V or 3.3 V via jumper. Refer to 4 x 5 SoM Integration Guide for further information.
| Power Rail Name/ Schematic Name | Connector.Pin | Direction1) | Notes |
|---|---|---|---|
5VIN | J1.1 | IN | Main Board power supply. |
5VIN | J6.A1 / J6.A2 | OUT | |
| USB-VBUS_R | J7.1 / J8.1 | OUT | |
| USB-VBUS | JB3.56 | OUT | |
| 3.3V | JB1.2 / JB1.4 / JB1.6 / JB1.14 / JB1.16 JB2.1 / JB2.3 / JB2.5 / JB2.7 J5.6 / J5.45 / J6.C31 / JX1.5 | OUT | Main SoM power supply. |
| 3.3V_SD | J4.4 | OUT | |
| 1.8V | JB2.2 / JB2.4 J10.1 / J11.1 /12.1 | OUT | |
| M3.3VOUT | JB2.9 / JB2.11 | IN | Supplied by SoM. |
| M3.3VOUT | J5.5 / J5.46 / J6.C32 J10.3 / J11.3 /12.3 / J13.3 | OUT | |
| M1.8VOUT | JB1.40 | IN | Supplied by SoM. |
| M1.8VOUT | J13.1 | OUT | |
| VBAT | J9.1 | IN | |
| VBAT | JB1.80 | OUT | |
| VCCIOA | J10.2 | IN | SoM IO Bank supply. 2) |
| VCCIOA | JB1.10 / JB1.12 / J6.B32 | OUT | SoM IO Bank supply. 2) |
| VCCIOC | J11.2 | IN | SoM IO Bank supply. 2) |
| VCCIOC | JB2.6 | OUT | SoM IO Bank supply. 2) |
| VCCIOD | J12.2 | IN | SoM IO Bank supply. 2) |
| VCCIOD | JB2.8 / JB2.10 / J6.B1 | OUT | SoM IO Bank supply. 2) |
| SD_VCCA | J13.2 | IN | Voltage for SD Level Shifter. 2) |
| VCCJTAG | JB2.92 | IN | |
| ETH-VCC | JB1.13 | IN |
1) Direction:
2) Select 1.8 V or 3.3 V via jumper. Refer to 4 x 5 SoM Integration Guide for further information.
| Sequence | Net name | Recommended Voltage Range | Pull-up/down | Description | Notes |
|---|---|---|---|---|---|
| 0 | - | - | - | Configuration signal setup. | |
| 1 | 5VIN | - 1) | - | Main Power supply. | Carrier and SoM power supply. Power consumption depends mainly on design and cooling solution. |
| 2 | M3.3VOUT / M1.8VOUT | - 1) | - | SoM generated voltages. | These voltages can be used
Important: Consider maximum power consumption. |
| 3 | - | - | - | Apply voltages to Carrier powered external IO when voltages M3.3VOUT and/or M1.8VOUT are present. |
1) Refer to Recommended Operating Conditions.
These connectors are hermaphroditic. Odd pin numbers on the module are connected to even pin numbers on the baseboard and vice versa.
4 x 5 modules use two or three Samtec Razor Beam LSHM connectors on the bottom side.
When using the same type on baseboard, the mating height is 8mm. Other mating heights are possible by using connectors with a different height
| Order number | Connector on baseboard | compatible to | Mating height |
|---|---|---|---|
| 23836 | REF-189016-01 | LSHM-150-02.5-L-DV-A-S-K-TR | 6.5 mm |
| LSHM-150-03.0-L-DV-A-S-K-TR | LSHM-150-03.0-L-DV-A-S-K-TR | 7.0 mm | |
| 23838 | REF-189016-02 | LSHM-150-04.0-L-DV-A-S-K-TR | 8.0 mm |
| LSHM-150-06.0-L-DV-A-S-K-TR | LSHM-150-06.0-L-DV-A-S-K-TR | 10.0mm | |
| 26125 | REF-189017-01 | LSHM-130-02.5-L-DV-A-S-K-TR | 6.5 mm |
| LSHM-130-03.0-L-DV-A-S-K-TR | LSHM-130-03.0-L-DV-A-S-K-TR | 7.0 mm | |
| 24903 | REF-189017-02 | LSHM-130-04.0-L-DV-A-S-K-TR | 8.0 mm |
| LSHM-130-06.0-L-DV-A-S-K-TR | LSHM-130-06.0-L-DV-A-S-K-TR | 10.0mm |
The module can be manufactured using other connectors upon request.
The LSHM connector speed rating depends on the stacking height; please see the following table:
| Stacking height | Speed rating |
|---|---|
| 12 mm, Single-Ended | 7.5 GHz / 15 Gbps |
| 12 mm, Differential | 6.5 GHz / 13 Gbps |
| 5 mm, Single-Ended | 11.5 GHz / 23 Gbps |
| 5 mm, Differential | 7.0 GHz / 14 Gbps |
Current rating of Samtec Razor Beam™ LSHM B2B connectors is 2.0A per pin (2 adjacent pins powered).
| File | Modified | |
|---|---|---|
| PDF File hsc-report_lshm-lshm-05mm_web.pdf High speed test report | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File lshm_dv.pdf LSHM catalog page | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File LSHM-1XX-XX.X-X-DV-A-X-X-TR-FOOTPRINT(1).pdf Recommended layout and stencil drawing | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File LSHM-1XX-XX.X-XX-DV-A-X-X-TR-MKT.pdf Technical drawing | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File REF-189016-01.pdf Technical Drawing | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File REF-189016-02.pdf Technical Drawing | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File REF-189017-01.pdf Technical Drawing | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File REF-189017-02.pdf Technical Drawing | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File TC0923--2523_report_Rev_2_qua.pdf Design qualification test report | Apr 07, 2016 by Thorsten Trenz | |
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| PDF File tc0929--2611_qua(1).pdf Shock and vibration report | Apr 07, 2016 by Thorsten Trenz | |
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The values for Absolute Maximum Ratings and Recommended Ratings refers only to this carrier board. These values represent the capabilities of this Carrier Series in general. Assembly variants may differ from this values.
The combination of a carrier and a SoM might have different requirements. Customer devices connected to the carrier are not considered.
| Power Rail Name/ Schematic Name | Description | Min | Max | Unit |
|---|---|---|---|---|
5VIN | Carrier power. | -40 | 60 | V |
| M3.3VOUT | SoM power rail. | -0.3 | 6.3 | V |
| M1.8VOUT | SoM power rail. | -0.3 | 4.6 | V |
| VBAT | Battery supply. | - | - | V |
| VCCIOA | IO Bank supply for SoM. | - | - | V |
| VCCIOC | IO Bank supply for SoM. | - | - | V |
| VCCIOD | IO Bank supply for SoM. | - | - | V |
| VCCJTAG | JTAG reference voltage. | - 1) | - 1) | V |
1) Refer to TE0790 TRM for XMOD usage.
*) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum rated conditions for extended periods may affect device reliability.
This TRM is generic for all variants. Temperature range can be different depending on the assembly version. Voltage range is mostly the same during variants (exceptions are possible, depending on custom request).
The carrier board components are capable of being operated at industrial-grade temperatures, which cover at least the range of -40 °C to +85 °C.
Operating temperature range depends also on customer design and cooling solution.
| Parameter | Min | Max | Units | Reference Document |
|---|---|---|---|---|
5VIN | 4.75 | 5.25 | V | |
| M3.3VOUT | 3.15 | 3.45 | V | |
| M1.8VOUT | 1.71 | 1.89 | V | |
| VBAT | - | - | V | |
| VCCIOA | - | - | V | |
| VCCIOC | - | - | V | |
| VCCIOD | - | - | V | |
| VCCJTAG | - 1) | - 1) | V |
1) Refer to TE0790 TRM for XMOD usage.
Module size: 100 mm × 64.5 mm. Please download the assembly diagram for exact numbers.
All dimensions are given in millimeters.
| Trenz shop TE0706 overview page | |
|---|---|
| English page | German page |
The hardware revision number is located on the PCB adjacent to the module identifier, separated by a dash.
| Date | Revision | Changes | Documentation Link |
|---|---|---|---|
| 2024-05 | 04 | 1. EOL component U3 EN5311QI was replaced with MPM3834CGPA-Z. | |
| 2018-12 | 03 | 1. MicroSD card connector (J3) changed to industrial. 9. Replaced R34 by 953 kOhm and R38 by 147 kOhm. 10. Removed VG96 connector (J6) from BOM. | |
| 2016-06 | 02 | 1. Added support for 1.8 V IO TE0715-30 (added 3-pin headers for variable voltage banks). 17. U8 MP5010ADQ-LF-Z replaced to MP5010BDQ-LF-Z. | |
| 2015-06 | 01 | Initial revision |
Date | Revision | Contributors | Description |
|---|---|---|---|
| |||
2025-08-27 | v.89 | Martin Rohrmüller |
|
2025-05-13 | v.87 | Kilian Jahn |
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2025-04-04 | v.81 | Kilian Jahn |
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2024-06-20 | v.78 | ED |
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2023-11-07 | v.77 | ED |
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2021-02-19 | v.76 | John Hartfiel |
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| 2010-07-16 | v.74 | John Hartfiel |
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| 2019-05-27 | v.73 | Martin Rohrmüller |
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| 2018-06-03 | v.66 | John Hartfiel |
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| 2017-11-10 | v.64 | John Hartfiel |
|
| 2017-11-09 | v.60 | Ali Naseri |
|
2017-07-06 | v.52 | Ali Naseri, Jan Kumann |
|
| 2017-01-06 | v.1 | Ali Naseri |
|
| --- | all |
|
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