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The Trenz Electronic TE0701 Carrier Board is a baseboard for 4 x 5 SoMs, which exposes the module's B2B connector pins to accessible connectors and provides a whole range of on-board components to test and evaluate TE 4 x 5 SoMs.

See page "4 x 5 cm carriers" to get information about the SoMs supported by the TE0701 carrier board.

Block Diagram

Figure 1: TE0701-06 block diagram.

Main Components

Figure 2: 4 x 5 SoM carrier board TE0701-06.

  1. HDMI connector (1.4 HEAC support)
  2. Micro-USB connector (device, host or OTG modes)
  3. Pmod connector for access to Zynq module's PL IO-bank pins (4 LVDS pairs, max. VCCIO voltage: VIOTA)

  4. Pmod connector for access to Zynq module's PL IO-bank pins (4 LVDS pairs, max. VCCIO voltage: FMC_VADJ)
  5. User push-button S2 ("RESTART" button by default)
  6. User push-button S1 ("RESET" button by default)
  7. User LEDs (function mapping depends on firmware of System Controller CPLD)
  8. Mini-USB connector (USB JTAG and UART interface)
  9. User 4-bit DIP switch
  10. VITA 57.1 compliant FMC LPC connector with digitally programmable FMC VADJ power supply
  11. Barrel jack for 12V power supply
  12. ARM JTAG connector (DS-5 D-Stream) - PJTAG to EMIO multiplexing needed
  13. User 4-bit DIP switch (to adjust voltage of FMC_VADJ)
  14. Pmod connector (J1, max. VCCIO voltage: 3.3V): mapped to 8 Zynq PS MIO0 bank pins (MIO0, MIO9 to MIO15), 6 pins (MIO10 to MIO15) are additionally connected to TE0701 System Controller CPLD
  15. RJ45 Gigabit Ethernet connector
  16. SD Card connector, Zynq SDIO0 controller, can be used to boot system
  17. Pmod connector (J2, max. VCCIO voltage: 3.3V): 6 pins (PX0 to PX5) can be multiplexed by Texas Instruments TXS02612RTWR SDIO Port Expander to MIO pins of Zynq module, 2 pins are connected to TE0701 System Controller CPLD (PX6 and PX7)
  18. Jumper J18
  19. Mini Camera Link connector
  20. Battery holder for CR1220 (RTC backup voltage)
  21. Trenz Electronic 4 x 5 modules high-speed connector strips (3x Samtec LSHM series connectors)
  22. Jumper J16, J17, J21
  23. Jumper J9, J19, J20

Key Features

  • Overvoltage-, undervoltage- and reversed- supply-voltage-protection
  • Barrel jack for 12V power supply
  • Carrier board System Controller CPLD Lattice MachXO2 1200HC, programmable via Mini-USB JTAG Interface J7
  • Zynq module programmable via ARM JTAG interface connector (J15) or by System Controller CPLD via Mini-USB JTAG interface J7 or JTAG interface on FMC connector J10
  • Mini Camera Link
  • RJ45 Gigabit Ethernet MagJack with 2 integrated LEDs.
  • FPGA Mezzanine Card (FMC) Connector J10 for access to Zynq module's LVDS pairs, operable with adjustable IO voltage FMC_VADJ
  • USB JTAG and UART interface (FTDI FT2232HQ) with Mini-USB connector J7
  • ADV7511 HDMI transmitter with HDMI connector J4
  • 8 x red user LEDs routed to System Controller CPLD
  • 2 x user push-button routed to System Controller CPLD. By default configured as system "RESET" and "RESTART" button (depends on CPLD firmware)
  • 2 x 4-bit DIP switch for baseboard configuration (3 switches routed to System Controller CPLD, 3 switches to set voltage of FMC_VADJ, 1 switch routed to Zynq module (MIO0), 1 switch enables Mini-USB JTAG interface J7)
  • Pmod connectors to access Zynq Module's LVDS pairs and MIO pins
  • Micro SD card socket, can be used to boot system
  • Micro-USB interface (J12) connected to Zynq module (device, host or OTG modes)
  • Trenz Electronic 4 x 5 modules high-speed connector strips (3x Samtec LSHM series connectors)

Interfaces and Pins

Micro SD Card Socket

Micro SD Card socket is not directly wired to the B2B connector pins, but through a Texas Instruments TXS02612 SDIO Port Expander, which is needed for voltage translation due to different voltage levels of the Micro SD Card and MIO-bank of the Xilinx Zynq module. The Micro SD Card has 3.3V signal voltage level, but the MIO-bank on the Xilinx Zynq module has VCCIO of 1.8V.

With SD_SEL signal connected to the Texas Instruments TXS02612 SDIO Port Expander user can choose which port is accessible. Port B0 is connected to the Micro SD Card connector and B1 is connected to the Pmod J2 connector. SD_SEL signal can be controlled by the System Controller CPLD firmware.

Dual channel USB to UART/FIFO

The TE0701 carrier board has on-board high-speed USB 2.0 to UART/FIFO IC FT2232HQ from FTDI. Channel A can be used as JTAG interface (MPSSE) to program the System Controller CPLD. Channel B can be used as UART interface routed to CPLD. Also 6 additional bus-lanes are connected to the System Controller CPLD and available for user-specific use.

There is also a 256-byte serial EEPROM connected to the FT2232H chip pre-programmed with license code to support Xilinx programming tools.

Do not access the FT2232H EEPROM using FTDI programming tools, doing so will erase normally invisible user EEPROM content and invalidate stored Xilinx JTAG license. Without this license the on-board JTAG will not be accessible any more with any Xilinx tools. Software tools from FTDI website do not warn or ask for confirmation before erasing user EEPROM content.

USB Interface

The TE0701 carrier board has two physical USB connectors:

  • Mini-USB connector J7 wired to on-board FTDI FT2232HQ chip.
  • Micro-USB connector J12 wired to B2B connector JB3 (most of the TE 4 x 5 cm SoMs have USB transceiver on-board).

JTAG Interface

JTAG access to the System Controller CPLD and Xilinx Zynq module is provided via mini-USB JTAG interface J7 (FTDI FT2232H) and controlled by DIP switch S3-3.

The JTAG port of the System Controller CPLD is enabled by setting switch S3-3 ENJTAG to the OFF position.


There are eight LEDs (ULED1 to ULED8) available to the user. All LEDs are red colored and connected to the on-board System Controller CPLD. Their function ls programmable and depend on the firmware of the System Controller CPLD. For detailed information, please refer to the documentation of the TE0701 System Controller CPLD.

LED5 (D5) to LED8 (D8) are operating only when the corresponding power supply VIOTB (i.e., bank 1 of the on-board System Controller CPLD) is switched on. This can be accomplished by connecting the FMC power supply FMC_VADJ to VIOTB (J21: 1,2-3), which is the default option, or by connecting either 2.5V (J17: 1,2-3) or 3.3V (J17: 1-2,3) to VIOTB (J21: 1-2,3). Please note that for the first default option, the FMC power supply voltage must be set by the user. For detailed information how to set the voltage FMC_VADJ via I2C, please refer to the documentation of the TE0701 System Controller CPLD.

Green LED D22 indicates presence of 3.3V power from the SoM attached.

4-bit DIP-switch S3

There is a 4-bit DIP-switch S3 with following default settings:

S3-1CM1: Mode pin 1 (routed to System Controller CPLD).
S3-2CM0: Mode pin 0 (routed to System Controller CPLD).
S3-3JTAGEN: Set to ON for normal JTAG operation. Has to be set to OFF position for System Controller CPLD JTAG access.
S3-4 MIO0: Pin from/to JB1-88 and PMOD (J1) connector. Direction depends on Module FPGA/SoC configuration.

Table 1: DIP-switch S3 settings.

User Push-buttons

On the TE0701 Carrier Board there are two push-buttons (S1 and S2) and are routed to the System Controller CPLD and available to the user. The default mapping of the push-buttons is as follows:

NameDefault Mapping:
S1Custom Button functionality CPLD Firmware dependent.

If S2 is pushed, the active-high Power ON (PON) signal (that is internally pulled-up) will be de-asserted, which can be considered as a "RESTART" function as all on-module power supplies will be switched off (except 3.3VIN) on button push and back on again on button release.

The active-high PON signal is directly mapped to the active-high EN1 signal which is routed to the module's System Controller CPLD (e.g., on the TE0720) and directly used as a mandatory active-high enable signal to the power FET switch, enabling on-module 3.3V power supply output as well as all other DC-DC converters on the module.

Table 2: Description of default functions of user push-buttons S1 and S2.

The function of the push-buttons depend on the System Controller CPLD firmware. For detailed information of the function of the push-buttons, please refer to the documentation of the TE0701 System Controller CPLD.


The TE0701 Carrier Board has a RJ45 Gigabit Ethernet MagJack (J14) with two LEDs. On-board Ethernet MagJack J14 pins are routed to B2B connector JB1 via MDI. The center tap of the magnetics is not connected to module's B2B connector. PHY LEDs are not connected directly to the module's B2B connectors as the 4 x 5 module have no dedicated PHY LED pins assigned. PHY LEDs are connected to the TE0701 System Controller CPLD and can be routed to some of the module's I/O pins with firmware.

See documentation of the TE0701 System Controller CPLD to get information of the function of the PHY LEDs.

Pmod Slots

J5 and J6 Pmod signal routing is done as differential pairs for pins 1-2, 3-4, 7-8 and 9-10.

Please use Master Pin-out Table table as primary reference for the pin mapping information.

J5 and J6 are incompatible with dual PMODs, because they have different PMOD connector offset and variable (different) VCCIO voltage.


Power Supply

Power supply with minimum current capability of 3A at 12V for system startup is recommended.

Power-On Sequence

The on-board voltages 3.3V and 5.0V of the carrier board will be brought up simultaneously when 12V power supply is connected to the barrel jack J10.

The on-board voltages 1.8V and 2.5V will be brought up when module's 3.3V voltage level has become stable and 3.3VOUT is available on the B2B connector JB2 pins 9 and 11.

The PL IO-bank supply voltage FMC_VADJ will be available after the output of the 5.0V DC-DC converter is active and the pin EN_FMC of the System Controller CPLD is asserted.


Figure 3: TE0701-06 power-up sequence diagram.

TE0701 jumper and DIP switch overview

On the TE0701 carrier board different VCCIO configurations can be chosen by 7 jumpers and one dedicated 4-bit DIP-switch S4. Settings of the jumpers and the DIP-switch S4 are explained below.

Configuring VCCIO voltage for PL IO-bank of mounted 4 x 5 SoM

The baseboard supply voltages for the PL IO-banks of the SoM are selectable by the jumpers J16, J17 and J21. The DIP-switch S4 sets the adjustable baseboard supply-voltage FMC_VADJ.

There is also option to select fixed voltage of FMC_VADJ with DIP-switch S4. In this case there is no need to configure the 8-bit control register of the I2C-to-GPIO-module of the System Controller CPLD.

Switch S4 is also routed to the System Controller CPLD, hence the VCCIO configuration can be registered by the CPLD. Switch S4-4 is not dedicated for FMC_VADJ setting, the function of this switch depends on the System Controller CPLD firmware.

Table 3 below describes switch S4 settings for different FMC_VADJ voltages.



OFFOFFOFFAttention: Set VADJ to S3-M1 and S3-M2 control, read TE0701 System Controller CPLD description, before this mode is used!

Table 3: Switch S4 positions for fixed values of the FMC_VADJ voltage.

The supply-voltage FMC_VADJ is user programmable via I2C. Configuration of the adjustable voltage FMC_VADJ is done over dedicated I2C bus (lines HDMI_SCL and HDMI_SDA). A control byte has to be sent to the 8-bit control register of the I2C-to-GPIO module of the System Controller CPLD. This modules I2C address is 0x22. To enable FMC_VADJ on TE0701, bit 7 of the control register should be set to 1. Note that the I2C bus is shared with the I2C interface of the HDMI Controller.

For detailed information how to set the voltage FMC_VADJ via I2C, please refer to the documentation of the TE0701 System Controller CPLD.

Configuring 12V Power Supply Pin on the Camera Link Connector

12V power supply can be connected to pin 26 of the CameraLink by closing J18. However, this option is disabled by default (J18: OPEN).

Configuring Power Supply of the Micro-USB Connector (device, host or OTG modes) 

The TE0701 carrier board can be configured as a USB host. Hence, it must provide from 5.25V to 4.75V to the board side of the downstream connection (micro-USB port on J12; 13). To provide sufficient power, a TPS2051 power distribution switch is located on the carrier board in between the 5V power supply and the VBUS signal of the USB downstream port interface. If the output load exceeds the current-limit threshold, the TPS2051 limits the output current and pulls the over-current logic output (OC_n) low, which is routed to the on-board CPLD. The TPS2051 is put into operation by setting J19 CLOSED. J20 provides an extra 100µF decoupling capacitor (in addition to 10µF) to further stabilize the output signal. Moreover, a series terminating resistor of either 1K (J9: 1-2, 3) or 10K (J9: 1, 2-3) is selectable on the "USB-VBUS" signal. Both signals, USB-VBUS and VBUS_V_EN (that enables the TPS2051 on "high") are routed (as well as the corresponding D+/- data lines) via the on-board connector directly to the USB 2.0 high-speed transceiver PHY on the mounted SoM, which is, in turn, connected to the Zynq FPGA. In summary, the default jumper settings are the following: J9: 1-2, 3 (1K series terminating resistor); J19: CLOSED (TPS2051 in operation); J20: CLOSED (100 µF added).

Additionally, the TE0701 carrier board is equipped with a second mini-USB port (J7) which is connected to a USB to multi-purpose UART/FIFO IC from FTDI (FT2232HQ) and provides a USB to JTAG interface between a host PC and the TE0701 carrier board and the Zynq module. Because it acts as a USB function device, no power switch is required (and only a ESD protection must be provided) in this case.

Summary of VCCIO configuration via jumpers

There are two baseboard supply voltages VIOTA and VIOTB connected to the 4 x 5 SoM's PL IO-bank. The supply-voltages have following pin assignments on B2B-connectors:

Baseboard supply voltages

Baseboard B2B connector-pins

Standard assignment of PL IO-bank supply voltages on TE 4 x 5 module's B2B connectors

Baseboard voltages and signals connected with

VIOTBJB1-10, JB1-12, JB2-8, JB2-10VCCIOA (JM1-9, JM1-11) / VCCIOD (JM2-7, JM2-9)VCCIO1 (System Controller CPLD pin 55, 73)

Table 4: Baseboard supply-voltages VIOTA and VIOTB

Note: The corresponding PL IO-voltage supply voltages of the 4 x 5 SoM to the selectable baseboard voltages VIOTA and VIOTB are depending on the mounted 4 x 5 SoM and varying in order of the used model.

Refer to SoM's schematics for more information about the specific pin assignment on module's B2B-connectors regarding PL IO-bank supply voltages and to the 4 x 5 Module integration Guide for VCCIO voltage options.

Following table describes how to configure the baseboard supply voltages with jumpers.

Baseboard supply voltages

vs voltage levels

3V3J17: 1-2, 3 & J16: openJ17: 1-2, 3 & J16: open & J21: 1-2, 3--
2V5J17: 1, 2-3 & J16: openJ17: 1, 2-3 & J16: open & J21: 1-2, 3--
FMC_VADJJ17: open & J16: 1-2J21: 1, 2-3--
5V0 intern--

J9: 1-2, 3 & J19: 1-2

(J20: 1-2: additional decoupling-capacitor 100 µF)

VBUS extern--J9: 1, 2-3 & J19: open-
12V_LC---J18: 1-2

Table 5: Configuration of baseboard supply-voltages via jumpers. 'Jx: 1-2, 3' means pins 1 and 2 are closed, pin 3 is open. 'Jx: 1, 2-3' means pins 2 and 3 are closed, pin 1 is open.

Figure 4: VCCIO jumper pin location (PCB-REV06), top view.

Take care of the VCCO voltage ranges of the  particular PL IO-banks (HR, HP) of the mounted SoM, otherwise damages may occur to the FPGA. Therefore, refer to the TRM of the mounted SoM to get the specific information of the voltage ranges.

It is recommended to set and measure the PL IO-bank supply-voltages before mounting of TE 4 x 5 module to avoid failures and damages to the functionality of the mounted SoM.

Board to Board Connectors

These connectors are hermaphroditic. Odd pin numbers on the module are connected to even pin numbers on the baseboard and vice versa.

4 x 5 modules use two or three Samtec Razor Beam LSHM connectors on the bottom side.

  • 2 x REF-189016-02 (compatible to LSHM-150-04.0-L-DV-A-S-K-TR), (100 pins, "50" per row)
  • 1 x REF-189017-02 (compatible to LSHM-130-04.0-L-DV-A-S-K-TR), (60 pins, "30" per row) (depending on module)
Connector Mating height

When using the same type on baseboard, the mating height is 8mm. Other mating heights are possible by using connectors with a different height

Order numberConnector on baseboardcompatible toMating height
23836REF-189016-01LSHM-150-02.5-L-DV-A-S-K-TR6.5 mm

LSHM-150-03.0-L-DV-A-S-K-TRLSHM-150-03.0-L-DV-A-S-K-TR7.0 mm
23838REF-189016-02LSHM-150-04.0-L-DV-A-S-K-TR8.0 mm

26125REF-189017-01LSHM-130-02.5-L-DV-A-S-K-TR6.5 mm

LSHM-130-03.0-L-DV-A-S-K-TRLSHM-130-03.0-L-DV-A-S-K-TR7.0 mm
24903 REF-189017-02LSHM-130-04.0-L-DV-A-S-K-TR8.0 mm


The module can be manufactured using other connectors upon request.

Connector Speed Ratings

The LSHM connector speed rating depends on the stacking height; please see the following table:

Stacking heightSpeed rating
12 mm, Single-Ended7.5 GHz / 15 Gbps
12 mm, Differential

6.5 GHz / 13 Gbps

5 mm, Single-Ended11.5 GHz / 23 Gbps
5 mm, Differential7.0 GHz / 14 Gbps
Speed rating.
Current Rating

Current rating of  Samtec Razor Beam™ LSHM B2B connectors is 2.0A per pin (2 adjacent pins powered).

Connector Mechanical Ratings
  • Shock: 100G, 6 ms Sine
  • Vibration: 7.5G random, 2 hours per axis, 3 axes total

Manufacturer Documentation

  File Modified
PDF File hsc-report_lshm-lshm-05mm_web.pdf High speed test report 07 04, 2016 by Thorsten Trenz
PDF File lshm_dv.pdf LSHM catalog page 07 04, 2016 by Thorsten Trenz
PDF File LSHM-1XX-XX.X-X-DV-A-X-X-TR-FOOTPRINT(1).pdf Recommended layout and stencil drawing 07 04, 2016 by Thorsten Trenz
PDF File LSHM-1XX-XX.X-XX-DV-A-X-X-TR-MKT.pdf Technical drawing 07 04, 2016 by Thorsten Trenz
PDF File REF-189016-01.pdf Technical Drawing 07 04, 2016 by Thorsten Trenz
PDF File REF-189016-02.pdf Technical Drawing 07 04, 2016 by Thorsten Trenz
PDF File REF-189017-01.pdf Technical Drawing 07 04, 2016 by Thorsten Trenz
PDF File REF-189017-02.pdf Technical Drawing 07 04, 2016 by Thorsten Trenz
PDF File TC0923--2523_report_Rev_2_qua.pdf Design qualification test report 07 04, 2016 by Thorsten Trenz
PDF File tc0929--2611_qua(1).pdf Shock and vibration report 07 04, 2016 by Thorsten Trenz

Technical Specifications

Absolute Maximum Ratings


VIN supply voltage




ANSI/VITA 57.1 FPGA Mezzanine Card (FMC) standard

Storage temperature




Recommended Operating Conditions

VIN supply voltage11.412.6V-

Physical Dimensions

  • Board size:  PCB 170.4 mm ×  98 mm. Notice that some parts the are hanging slightly over the edge of the PCB like the mini-USB jacks (ca. 1.4 mm), the Ethernet RJ-45 jack (ca 2.2 mm)  and the mini CameraLink connector (ca. 7 mm), which determine the total physical dimensions of the carrier board. Please download the assembly diagram for exact numbers.

  • Mating height of the module with standard connectors is 8mm.

  • PCB thickness: ca. 1.65mm.

  • Highest part on the PCB is the Ethernet RJ-45 jack, which has an approximately 17 mm overall height. Please download the step model for exact numbers.

 All dimensions are given in millimeters.

Figure 5: Physical dimensions of the TE0701-06 carrier board.

Operating Temperature Ranges

Commercial grade: 0°C to +70°C.

Board operating temperature range depends also on customer design and cooling solution. Please contact us for options.


ca. 188 g - Plain board.

Document Change History


Ali Naseri
  • updated Power-on sequence diagram
John Hartfiel
  • Dual PMOD note
2017-11-09v.60John Hartfiel
  • add B2B connector section


John Hartfiel
  • Add VCCIO Jumper Pin location.
  • Updated VADJ description.
2017-08-14v.58John Hartfiel
  • Description correction.
2017-05-25v.56Jan Kumann
  • New physical dimensions drawing of the board.


Jan Kumann
  • A few overall improvements and corrections, new  block diagram.

Ali Naseri
  • added block diagram


Ali Naseri
  • added warning concerning the use of FTDI tools
2017-02-15v.40Ali Naseri
  • added power-on sequence diagram


Ali Naseri
  • correction of table 3 (switch-positions to adjust FMC_VADJ)
  • inserted hint to set and measure the PL IO-bank supply-voltages


Ali Naseri
  • added section for baseboard supply voltage configuration

Ali Naseri
  • TRM update due to new revision 06 of
  • the carrier board.

Ali Naseri

  • TRM adjustment to the newest
  • revision (05) of TE0701 Carrier Board.
Sven-Ole Voigt
  • TE0701-03 (REV3) updated


Sven-Ole Voigt
  • Initial release

AllSven-Ole Voigt, Ali Naseri

Hardware Revision History



PCNDocumentation link

Additional Jumper J16 and switch S4

for setting VCCIO FMC_VADJ.



-05Improved manufacturing

-03Changed DC/DC converters





Figure 5: Hardware revision number.

Hardware revision number is printed on the PCB board next to the module model number separated by the dash.


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Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant.


Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE).

Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment.

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