Page History

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Overview

The Trenz Electronic TE0706 Carrier Board provides functionalities for testing, evaluation and development purposes of company's 4 x 5 cm SoMs. The Carrier Board is equipped with various components and connectors for different configuration setups and needs. The interfaces of the SoM's functional units and PL I/O-banks are connected via board-to-board connectors to the Carrier Board's components and connectors for easy user access.

See "4 x 5 SoM Carriers" page for more information about supported 4 x 5 cm SoMs.

Refer to http://trenz.org/te0706-info for the current online version of this manual and other available documentation.

Key Features

• 3 x Samtec LSHM Series Board to Board Connectors
• VG96 connector (mounting holes and solder pads, J6) and 50-pin IDC male connector socket (J5) for access to PL I/O-bank pins
• USB2.0 type A connector, or optionally Micro USB 2.0 connector
• 1 x RJ45 GbE MagJack (J3), connected via MDI to B2B connector JB1
• 1 x Marvell Alaska 88E1512 GbE PHY, providing Ethernet interface in conjunction with RJ45 GbE MagJack (J2)
• 4 A High-Efficiency Power SoC DC-DC Step-Down Converter (Enpirion EN6347) for 3.3V power supply
• XMOD JTAG- / UART-header JX1
• Micro SD card socket
• SDIO port expander with voltage-level translation and jumper (J13) for selection of SDIO voltage on SoM side
• DIP-switches S1 to set SoM's control signals
• 1 x user-push button (S2), by default configured as system reset button
• 3 x VCCIO selection jumper J10, J11 and J12 to set SoM's PL I/O-bank voltages
• 5V power supply barrel jack

Additional assembly options are available for cost or performance optimization upon request.

Block Diagram

Main Components

1. 5V power connector jack, J1
2. Reset switch, S2
3. USB2.0 type A receptacle, J7
4. Micro SD card socket with Card Detect, J4
5. 50 pin IDC male connector, J5
6. 1000Base-T Gigabit RJ45 Ethernet MagJack, J3
7. 1000Base-T Gigabit RJ45 Ethernet MagJack, J2
8. XMOD JTAG- / UART-header, JX1
9. User DIP-switch, S1
10. VCCIO selection jumper block, J10 - J12
11. External connector (VG96) placeholder, J6
12. Samtec Razor Beam™ LSHM-150 B2B connector, JB1
13. Samtec Razor Beam™ LSHM-150 B2B connector, JB2
14. Samtec Razor Beam™ LSHM-130 B2B connector, JB3
15. SoM SDIO voltage selection jumper, J13

Initial Delivery State

There is no hardware component to be programmed on the carrier.

Board is shipped in following configuration:

• VCCIO voltage selection jumpers are all set to 1.8 V.
• S2 switch configured as reset button.

Different delivery configurations are available upon request.

Configuration Signals

There is a user push button which is used for RESET signal.

Signals, Interfaces and Pins

Board to Board (B2B) I/Os

With the TE0706 Carrier Board's Board-to-Board Connectors (B2B) the MIO- and PL I/O-bank's pins and further interfaces of the mounted SoM can be accessed. A large quantity of these I/Os are also usable as LVDS-pairs. The connectors provide also VCCIO voltages to operate the I/Os properly.

Following table gives a summary of the available I/Os, interfaces and LVDS-pairs of the B2B connectors JB1, JB2 and JB3:

On-board Connector

The TE0706 Carrier Board has a 50-pin IDC male connector J5 and soldering pads as place-holder to mount a VG96 connectors J6 to get access the PL I/O-bank's pins and further interfaces of the mounted SoM. With these connectors, SoM's PL-I/Os are available to the user, a large quantity of these I/Os are also usable as  differential pairs.

Following table gives a summary of the pin-assignment, available interfaces and functional I/Os of the connectors J5 and J6:

JTAG/UART Interface Base

JTAG/UART access to the TE0706 carrier is available through XMOD header JX1, which has a 'XMOD FTDI JTAG Adapter'-compatible pin-assignment. This header provides also a UART interface, usually established by MIO-pins of the PS-bank of the mounted SoM's Zynq device. XMOD USB2.0 to JTAG/UART adapter TE0790 is provided by Trenz Electronic. More information is available here. Devices of the mounted SoM can be programed via USB2.0 interface.

When using XMOD FTDI JTAG Adapter TE0790, the adapter-board's VIO will be sourced by the mounted SoM's 'VCCJTAG' (pin JB2-92). Set the DIP-switch with the setting:

SD Card Socket

The SD Socket is routed to the on-board Texas Instruments TXS02612 SDIO port expander U4. This IC provides a necessary VDD/VCCIO translation between the MicroSD Card socket J4 (3.3V) and the SoM's Zynq device MIO-bank (1.8V/3.3V depending on Module, compare jumper J13 ):

USB2.0 connector

TE0706-03 board has one physical USB2.0 type A socket J7, the differential data signals of the USB2.0 socket are routed to the B2B connector JB3, where they can be accessed by the corresponding USB2.0 PHY transceiver of the mounted SoM.

There is also the option to equip the board with a Micro USB 2.0 type B (receptacle) socket (J8) to the board as alternative fitting option. With this fitting option (Micro USB2.0 type B), the USB2.0 interface can also be used for Device mode, OTG and Host Modes.

For USB2.0 Host mode, the Carrier Board is additionally equipped with a power distribution switch U5 to provide the USB2.0 interface with the USB supply voltage USB-VBUS with nominal value of 5V. OTG mode is not available with USB2.0 Type A socket.

Following table gives an overview of the USB2.0 connector signals:

RJ45 Gigabit Ethernet Connectors

The TE0706 Carrier Board is equipped with two Gigabit Ethernet ports. One of them (J2) is routed to Marvell Alaska 88E1512 Gigabit Ethernet PHY (U6). The GbE MegJack J2 has two integrated LEDs (both green), its signals are routed as MDI (Media Dependent Interface) to the GbE PHY. The MegJack J3 is connected via MDI directly to the B2B connector JB1. There is usually a corresponding Gigabit Ethernet PHY on 4 x 5 SoMs (e.g. TE0715 or TE0720), which can be used in conjunction with the baseboard MagJack J3.

MIO Pins

On-board Peripherals

4-bit DIP-switch

Table below describes DIP-switch S1 settings for configuration of the mounted SoM:

VCC Selection Jumpers

The Carrier Board VCCIO for the PL I/O-banks of the mounted SoM are selectable by the jumpers J10, J11 and J12.

Following table describes how to configure the VCCIO of the SoM's PL I/O-banks with jumpers:

Only one supply-source is allowed to configure the base-board supply-voltages, either by jumper, by 0-Ohm-resistor or by connector J6. If a supply-voltage is configured by 0-Ohm-resistor or connector J6, then the corresponding configuration-jumper has to be removed. There aren't 0-Ohm-resistors and supply-voltages by connector J6 allowed if the corresponding base-board supply-voltage is configured by jumper. Vice versa jumpers and 0-Ohm-resistors have to be removed if supplying corresponding base-board supply-voltage by connector J6.

Note: If supplying base-board supply-voltages by connector J6, the module's internal 3.3V voltage-level on pins 9 and 11 of B2B-connector JB2 has to be reached stable state.

The SDIO voltage on the SoM side can be selected by jumper J13.

RTC Buffer Voltage Supply Header

The buffer voltage of the SoM's RTC can be supplied through the header J9 (VBAT-pin). Refer to the SoM's TRM for recommended voltage range and absolute maximum ratings.

Push Button

The Carrier Board's push button S2 is connected to the 'RESIN' signal, the function of the button is to trigger a reset of the mounted SoM by driving the reset-signal 'RESIN' to ground.

Gigabit Ethernet PHY

The TE0706 Carrier Board is equipped with a Marvell Alaska 88E1512 Gigabit Ethernet PHY (U6), which provides in conjunction with the Gigabit Ethernet MagJack J2 a 1000Base-T Ethernet (GbE) interface. The Ethernet PHY RGMII interface is connected to the B2B connector JB3, where they can be accessed by the mounted SoM's PS bank. The I/O Voltage is fixed at 1.8V. Reference clock input of the PHY is supplied from the on-board 25.000000 MHz oscillator (U7), the 125MHz output clock signal *CLK125' is connected to the B2B connector pin JB3-32.

SDIO Port Expander

The TE0706 Carrier Board is equipped with a Texas Instruments TXS02612 SDIO Port Expander, which is needed for voltage translation due to different voltage levels of the Micro SD Card and the PS MIO-bank of the Zynq device of the mounted SoM. The Micro SD Card has 3.3V signal voltage level, but the PS MIO-bank on the AMD Zynq module has VCCIO of 1.8V or 3.3V depending on the attached module. This has to be selected by J13.

Power and Power-On Sequence

Power Supply

Power supply with minimum current capability of 3A for system startup is recommended.

Power Consumption

The maximum power consumption of the Carrier Board depends mainly on the mounted SoM's FPGA design running on the Zynq device.

AMD provide a power estimator excel sheets to calculate power consumption. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ.

 * TBD - To Be Determined.

Power supply with minimum current capability of 3A for system startup is recommended.

Power Distribution Dependencies

The Carrier Board needs one single power supply voltage with a nominal value of 5V. Following diagram shows the distribution of the input voltage '5VIN' to the on-board components on the mounted SoM:

Power Rails

The voltage direction of the power rails is directed at on-board connectors' view:

Board to Board Connectors

Technical Specifications

Absolute Maximum Ratings

Recommended Operating Conditions

Operating temperature range depends also on customer design and cooling solution. Please contact us for options.

The TE0706 Carrier Board itself is capable to be operated at industrial grade temperature range (-40 °C ..+85 °C).

Please check the operating temperature range of the mounted SoM, which determine the relevant operating temperature range of the overall system.

Physical Dimensions

• Board size:  PCB 100mm ×  64.5mm. Notice that the USB type A socket on the left and the Ethernet RJ-45 jacks on the right are hanging slightly over the edge of the PCB making the total width of the longer side approximately 106mm. Please download the assembly diagram for exact numbers.

• Mating height of the module with standard connectors: 8mm

• PCB thickness: 1.65mm

• Highest parts on the PCB are USB type A socket and the Ethernet RJ-45 jacks, approximately 15mm. Please download the step model for exact numbers.

 All dimensions are given in millimeters.

Currently Offered Variants 

Revision History

Hardware Revision History

List of online PCNs can be found here.

Hardware revision number can be found on the PCB board together with the module model number separated by the dash.

Document Change History

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Download PDF version of this document.

Overview

Refer to https://shop.trenz-electronic.de/en/Download/?path=Trenz_Electronic/carrier_boards/TE0706 for downloadable version of this manual and additional technical documentation of the product.

The Trenz Electronic TE0706 Carrier Board is a base-board for 4 x 5 SoMs, which exposes the module's B2B-connector-pins to accessible connectors and provides a whole range of on-board components to test and evaluate TE 4 x 5 SoMs.

See page "4 x 5 cm carriers" for information about the SoMs supported by the TE0706.

Block Diagram

Image Removed

Main Components

Image Removed

1. 5V power connector jack, J1
2. Reset switch, S2
3. USB type A receptacle, J7
4. Micro SD card socket with detect switch, J4
5. 50 pin IDC male connector, J5
6. 1000Base-T Gigabit RJ45 Ethernet MagJack, J3
7. 1000Base-T Gigabit RJ45 Ethernet MagJack, J2
8. JTAG Connector, JX1
9. User DIP switch block, S1
10. VCCIO voltage selection jumper block, J10 - J12
11. External connector (VG96) placeholder, J6
12. Samtec Razor Beam™ LSHM-150 B2B connector, JB1
13. Samtec Razor Beam™ LSHM-150 B2B connector, JB2
14. Samtec Razor Beam™ LSHM-130 B2B connector, JB3

Key Features

• VG96 backplane connector (mounting holes and solder pads, J6) and 50-pin IDC male connector socket (J5) to access FPGA bank's I/O-pins
• SDIO port expander with voltage-level translation
• Micro SD card socket, routed to B2B-connector JB1
• USB type A connector (OTG mode), routed to B2B-connecor JB3
• 1 x user-push button S2, routed to RESIN-pin on B2B-connector JB2. By default it is configured as system reset button.
• 1 x RJ45 Gigabit Ethernet MagJack J3, PHY_MDI interface routed to B2B-connector JB1.
• 1 x Marvell Alaska 88E1512 Ethernet PHY, routed to B2B-connector JB3 and accessible via RJ45 Gigabit Ethernet MagJack J2
• Barrel jack for 5 V Power Supply input
• 4 A High-Efficiency Power SoC DC-DC Step-Down Converter (Enpirion EN6347) for 3.3 V Power Supply
• Trenz 4 x 5 Module Socket (3 x Samtec LSHM series connectors)
• JTAG pins on 12-pin header JX1, routed to B2B-connector JB2
• user configurable DIP switch S1 to set System Controller CPLD signals on SoM
• 3 x  VCCIO selection jumper J10, J11 and J12 to set SoM s bank voltages

Initial Delivery State

Board is shipped in following configuration:

• VCCIO voltage selection jumpers are all set to 1.8 V.
• S2 switch configured as reset button.
• One VG96 backplane connector is not soldered to the board, but is included in the package as separate component.

Different delivery configurations are available upon request.

Signals, Interfaces and Pins

Board to Board (B2B) I/Os

For detailed information about the B2B pin out, please refer to the Master Pin-out Table. 

JTAG Interface

JTAG access to the SoMs Xilinx Zynq chip on the SoM is provided via 12-pin header JX1 and controlled by DIP switch S1-2. JTAG pins are routed to the JB2 and JX1 connectors as follows:

...

JTAG Signal

...

B2B Connector

...

Micro SD Card Socket

Micro SD Card socket is not directly wired to the B2B connector pins, but through a Texas Instruments TXS02612 SDIO port expander, which is needed for voltage translation due to the different voltage levels of the Micro SD Card and MIO bank 501 of the Xilinx Zynq 7000 chip. The Micro SD Card has 3.3 V signal voltage-level, but the MIO Bank 501 on the Xilinx Zynq 7000 chip is set to 1.8 V.

Ethernet

The TE0706-02 is equipped with a Marvell Alaska 88E1512 Gigabit Ethernet PHY (U6) connected to the B2B connector JB3. The I/O Voltage is fixed at 1.8V. The reference clock input of the PHY is supplied by on-board 25MHz oscillator (U7).

PHY (U6) interface connections: 

...

JB3-47,

...

RJ45 Gigabit Ethernet MagJack J3

The TE0706-02 carrier board is also equipped with a second Gigabit-Ethernet MagJack J3, which is connected via MDI to the B2B connector JB1.

There is usually a corresponding Gigabit Ethernet PHY on 4 x 5 SoMs (e.g. TE0715 or TE0720), which can be used in conjunction with the baseboard MagJack J3.

USB Interface

TE0706-02 board has one physical USB type A socket J7 routed to B2B connector JB3. The corresponding USB-transceiver on 4 x 5 SoMs varies in order of the used SoM model. 

There is also the option to equip a micro USB 2.0 type B receptacle socket (J8) to the board as alternative.

DIP switch S1

...

Boot mode configuration, if supported by SoM. (Depends also on SoM's SC CPLD firmware).

...

Usually used to enable/disable FPGA core-voltage supply. (Depends also on SoM's SC CPLD firmware).

Note: Power-on sequence will be intermitted when S1-4 is set to OFF and functionality is supported by SoM.

Power and Power-On Sequence

Power supply with minimum current capability of 3A for system startup is recommended.

Power Supply

TE0706-02 needs one single power supply with nominal of 5V.

Power Consumption

...

The power-consumption of TE0706-02 in conjunction with different 4 x 5 SoMs under certain configurations are depending on the used model of the 4 x 5 SoM and the custom-made FPGA-design on this SoM. Please refer to the TRM of the mounted 4 x 5 SoM to get information about the typical power consumption.

Power-On Sequence

It is not allowed to feed any voltage to any external I/O pin before there is no power indication on M3.3VOUT pins. Presence of 3.3V on B2B JB2 connector pins 9 and 11 indicates that module is properly powered up and ready. The 1.8V voltage-level on base-board for supplying  PL I/O bank supply-voltages will be powered up after the module's 3.3V voltage-level has reached stable state and M3.3VOUT is available on the B2B-connector JB2, pins 9 and 11.

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If VCCIOA or VCCIOC  will be powered through the dedicated pins of external connector J6, then corresponding VCCIO jumpers J10 and J12 should be removed.

Base-board supply-voltage configuration

Refer to the 4 x 5 Module Integration Guide for VCCIO voltage options.

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Base-board supply-voltages (VCCIOA, VCCIOB, VCCIOC) selection-jumpers.

Following table shows how to configure the voltage-levels of base-board supply-voltages VCCIOA, VCCIOB and VCCIOC by jumper, 0-Ohm-resistor or by feeding the supply voltage through connector J6:

...

Jumper-Notification: 'Jx: 1-2, 3' means pins 1 and 2 are connected, 3 is open. 'Jx: 1, 2-3' means pins 2 and 3 are connected, 1 is open.

Only one supply-source is allowed to configure the base-board supply-voltages, either by jumper, by 0-Ohm-resistor or by connector J6. If a supply-voltage is configured by 0-Ohm-resistor or connector J6, then the corresponding configuration-jumper has to be removed. There aren't 0-Ohm-resistors and supply-voltages by connector J6 allowed if the corresponding base-board supply-voltage is configured by jumper. Vice versa jumpers and 0-Ohm-resistors have to be removed if supplying corresponding base-board supply-voltage by connector J6.

Note: If supplying base-board supply-voltages by connector J6, the module's internal 3.3V voltage-level on pins 9 and 11 of B2B-connector JB2 has to be reached stable state.

Technical Specifications

Absolute Maximum Ratings

...

Parameter

...

Units

...

Supply voltage VIN

...

...

V

...

EN6347QI / EN5311QI datasheet.

Note: USB-VBUS = VIN, if enabled.

...

Storage temperature

...

-55

...

+125

...

°C

...

Recommended Operating Conditions

...

Parameter

...

Units

...

Supply Voltage Vin

...

4.75

...

5.25

...

V

...

0

...

+70

...

°C

...

Physical Dimensions

• Board size:  PCB 100mm ×  64.5mm. Notice that the USB type A socket on the left and the Ethernet RJ-45 jacks on the right are hanging slightly over the edge of the PCB making the total width of the longer side approximately 106mm. Please download the assembly diagram for exact numbers.

• Mating height of the module with standard connectors: 8mm

• PCB thickness: 1.65mm

• Highest parts on the PCB are USB type A socket and the Ethernet RJ-45 jacks, approximately 15mm. Please download the step model for exact numbers.

 All dimensions are given in millimeters.

...

Operating Temperature Ranges

Commercial grade: 0°C to +70°C.

Industrial grade: -40°C to +85°C.

Board operating temperature range depends also on customer design and cooling solution. Please contact us for options.

Weight

115g - Plain baseboard.

13g - VG96 connector.

Revision History

Hardware Revision History

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Revision

...

Notes

...

PCN

...

02

...

First production revision

...

-

...

-

...

01

...

Prototypes

...

-

...

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Hardware revision number is printed on the PCB board next to the module model number separated by the dash.

Document Change History

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Date

...

Revision

...

Contributors

...

Description

...

...

...

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Disclaimer